JPH0553311B2 - - Google Patents

Abstract

PURPOSE:To eliminate the need for finishing and correction processes, and to facilitate and simplify preparation by a method wherein an external leading-out terminal assembly is thermocompression-bonded and connected, insulating resin powder is attached through electrostatic coating, one part of the powder is sucked and removed and the powder is melted and cured. CONSTITUTION:A plurality of ceramic electrostriction material layers 3, on one surfaces of which internal electrode layers 2 are formed respectively, are laminated, the end sections of the electrodes 2 exposed on both side faces as piezoelectric elements 1 are coated alternately with insulating layers 4 at every one layer, and external electrode layers 5 connecting the end sections of the electrodes 2 exposed are shaped. External leading-out terminal assemblies 6a, 6b are contact-bonded and connected at the central section of the layers 5 by the pushing of a heated pressure bar, both surfaces of the elements are masked with mask jigs, an outer circumference is coated electrostatically with resin powder to form a resin layer 9, and the resin powder of the terminal assemblies 6a, 6b is sucked and removed. When the layer 9 is melted and cured in a furnace, resin powder hardly adheres on the mask jigs, and ceramic laminate electronic components such as the piezoelectric elements are prepared easily and simply without finishing and correction processes.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method for manufacturing ceramic laminate electronic components such as piezoelectric elements, and particularly to a method for connecting external lead terminals and a method for packaging.

[Conventional technology]

FIG. 5 is a cross-sectional view of an example of a laminated piezoelectric element manufactured by a conventional method after resin hardening.

The conventional manufacturing method consists of an electrostrictive material layer 3 and an internal electrode layer 2.
A lead wire 11 is attached by soldering to an external electrode layer 5 formed on the side surface of a laminate in which
In addition, the piezoelectric element 1 is heated to approximately 100°C with the upper and lower surfaces of the piezoelectric element 1 sandwiched between the masking jig 8 to prevent the insulating exterior resin from adhering to the resin powder bath. It consisted of a process of attaching the exterior resin 12 by a fluidized dipping method in which it is immersed in powder (not shown), and a heat curing process to completely harden the exterior resin.

[Problem that the invention seeks to solve]

In the conventional manufacturing method described above, the masking jig 8
Another drawback is that the resin powder adheres to the lead wire 11 and hardens, and it takes a huge amount of time to remove the piezoelectric element, deburr the piezoelectric element, remove the resin attached to the lead wire, and clean the jig. Moreover, since the processing is complicated, it is difficult to automate the manufacturing process.

[Means for solving problems]

The method of manufacturing a ceramic laminate electronic component of the present invention includes the steps of connecting an external lead-out terminal plate made of a metal material to an external electrode layer by thermocompression bonding, and applying insulating resin powder to the outer periphery of the laminate by electrostatic coating. a step of suctioning and removing only the insulating resin powder adhering to the external lead-out terminal plate made of metal; and a step of melting and hardening the insulating resin powder.

[Effect]

In this way, among the insulating static resin powder that has adhered to the laminate by the electrostatic coating method, unnecessary powder that has adhered to the vicinity of the external lead terminal board can be easily removed by suctioning it with the suction nozzle, and then The masking jig is removed and the resin powder is cured, eliminating the need for subsequent finishing and modification processes for completed electronic components.

〔Example〕

Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a sectional view of a piezoelectric element manufactured by an embodiment of the method for manufacturing a ceramic laminate electronic component of the present invention, and FIGS. 2a and 2b are perspective views of the piezoelectric element in the process of connecting external lead terminals, respectively. Figure 3 is a cross-sectional view of the piezoelectric element (laminated body) immediately after a resin powder layer has been formed using the electrostatic coating method, and Figure 4 shows the resin powder adhering to the vicinity of the external lead terminals being removed using a suction nozzle. It is a sectional view of a subsequent piezoelectric element.

In the laminated piezoelectric element 1, internal electrode layers 2 and electrostrictive material layers 3 are alternately laminated, and the ends of the internal electrode layers 2 exposed on both opposing sides are covered with an insulating layer 4 every other layer. The ends of the internal electrode layer 2 that are not covered are covered with an external electrode layer 5 made of a conductive material.
External lead terminal plates 6a and 6b made of oxygen-free copper are connected to the external electrode layer 5. In this piezoelectric element 1, when a predetermined voltage is applied between the external lead terminal plates 6a and 6b, the voltage is applied to the upper and lower surfaces of each electrostrictive material layer 3, and the same strain is generated in each electrostrictive material layer 3. ,As a result,
A desired pressure is generated on the upper and lower surfaces of a piezoelectric element, and is used in printer heads and the like.

Next, each process of this example will be explained.

First, a plurality of ceramic electrostrictive material layers 1 each having an internal electrode layer 2 formed on one side are bonded to the electrostrictive material layer 1.
The end portions of the internal electrode layers 2 exposed on both opposing sides of this stacked body are layered with insulating layers 4 alternately between each layer and both sides. An external electrode layer 5 made of a conductive material is formed to connect the exposed ends of the internal electrode layer 2. Next, by pressing with a force of 1 kg for 1 second using the crimping rod 7 heated to about 400°C, an L-shaped external lead-out terminal plate made of oxygen-free copper is attached approximately to the center of the external electrode layer 5. 6a,
6b (Fig. 2 a, b). Next, the upper and lower surfaces of the piezoelectric element 1 are sandwiched between masking jigs 8 made of synthetic resin, and placed in an electrostatic coating machine (not shown).
Resin powder charged with a 50 KV DC bias is blown up with air and adhered to the piezoelectric element 1, forming a resin powder layer 9 (FIG. 3). Next, the resin powder adhering to the external lead terminal boards 6a and 6b is removed by suction using the suction nozzle 10 (FIG. 4), the masking jig 8 is removed, and the external lead terminal boards 6a and 6b are removed by suction (FIG. 4).
The piezoelectric element 1 is suspended in an oven (not shown) at a and 6b, and the resin powder layer 9 is melted and hardened to form the resin layer 9 shown in FIG. 1, thereby obtaining the laminated piezoelectric element 1. Note that almost no resin powder adheres to the masking jig 8, and even a small amount of resin powder that adheres can be easily removed.

〔Effect of the invention〕

As explained above, the present invention heat-compresses an external lead terminal board to an external electrode layer, then masks the upper and lower surfaces with a masking jig and forms a resin powder layer using an electrostatic coating method. By completely removing the unnecessary parts of the resin powder on the top, and then applying the resin powder to the effect, (1) the external terminal board is connected to the external electrode layer by thermocompression instead of the lead wire, so the flux is reduced. No cleaning process required (2)
The resin attached to the masking jig is also in powder form,
Easily removed (3) Processes can be simplified by eliminating the need for finishing and modification processes for finished electronic components, making it possible to significantly reduce costs.
The effect is that automation of the production line for laminated electronic components can be achieved.

[Brief explanation of drawings]

FIG. 1 is a sectional view of a piezoelectric element manufactured by the method of manufacturing a ceramic laminate electronic component of the present invention, and FIGS. 2a and 2b are a perspective view and a sectional view of the piezoelectric element in the process of connecting external lead terminals, respectively. Third
The figure is a cross-sectional view of the piezoelectric element (laminated body) immediately after a resin powder layer has been formed using the electrostatic coating method, and Figure 4 is a cross-sectional view of the piezoelectric element after the resin powder adhering to the vicinity of the external lead terminal has been removed using a suction nozzle. FIG. 5 is a cross-sectional view of a conventional piezoelectric element after the resin is cured. 1... Laminated piezoelectric element, 2... Internal electrode layer,
3... Electrostrictive material layer, 4... Insulating layer, 5... External electrode layer, 6a, 6b... External lead terminal board, 7... Crimping rod, 8... Masking jig, 9... Resin powder layer (Resin layer), 10... Suction nozzle, 11... Lead wire, 12... Exterior resin.

Claims (1)

[Scope of Claims] 1. Ceramic layers and internal electrodes are alternately laminated to form a laminate, and an external electrode is connected to each of the opposing side surfaces of the laminate with the end portions of the internal electrodes every other layer. A method for manufacturing a ceramic laminate electronic component, which comprises forming an electrode layer, attaching an external lead terminal to the external electrode layer, and then covering the laminate with an insulating resin layer, wherein the external electrode layer is provided with an external layer made of a metal material. A process of connecting the lead-out terminal boards by thermocompression bonding, a process of adhering insulating resin powder to the outer periphery of the laminate by electrostatic coating, and sucking and removing only the insulating resin powder adhering to the external lead-out terminals. A method for manufacturing a ceramic laminate electronic component, comprising: a step of melting and hardening the insulating resin powder.