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JPH055597B2 - - Google Patents
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JPH055597B2 - - Google Patents

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Publication number
JPH055597B2
JPH055597B2 JP33403989A JP33403989A JPH055597B2 JP H055597 B2 JPH055597 B2 JP H055597B2 JP 33403989 A JP33403989 A JP 33403989A JP 33403989 A JP33403989 A JP 33403989A JP H055597 B2 JPH055597 B2 JP H055597B2
Authority
JP
Japan
Prior art keywords
titanium
brazing
materials
soldering
filler metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP33403989A
Other languages
Japanese (ja)
Other versions
JPH03193292A (en
Inventor
Yoshiro Yagi
Masayoshi Iwasaki
Kazuyoshi Nakao
Toshiharu Okamoto
Isao Kajita
Norimichi Torii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KOBERUKO KAKEN KK
Original Assignee
KOBERUKO KAKEN KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KOBERUKO KAKEN KK filed Critical KOBERUKO KAKEN KK
Priority to JP33403989A priority Critical patent/JPH03193292A/en
Publication of JPH03193292A publication Critical patent/JPH03193292A/en
Publication of JPH055597B2 publication Critical patent/JPH055597B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Ceramic Products (AREA)
  • Dental Preparations (AREA)

Description

【発明の詳細な説明】[Detailed description of the invention]

〔産業上の利用分野〕 本発明は、チタンまたはチタン合金材(以下単
にチタン材と言う)のろう接用ろう材に関し、特
には、チタン製の歯科技工品をろう接する際に使
用するろう材に関する。 〔従来の技術〕 チタン材は、その優れた特性のため航空機や、
原子力等を始め種々の工業分野で利用が進められ
ている。 一方近年になつて、このチタン材が耐蝕性や、
機械的強度に優れ且つ比重が小さい等の特性を有
する他、生体との親和性や、生体に無害な特性を
も併せ持つことが知られるようになつて、医療用
材料としての利用も進められている。そして、中
でも歯科技工品(歯冠、義歯床等)にチタン材を
利用することが積極的に進められている。 ところが、チタン材は、高温では活性が高く容
易に酸化するため、歯科技工品の製造のようにろ
う接を行う場合は、真空中あるいは不活性ガス雰
囲気中でろう接をしなければならず、このこと
が、チタン製歯科技工品の製造に大きな支障とな
つていた。このようなことから、本発明者等は、
先にチタン製歯科技工品のろう接に実用し得る赤
外線ろう接器を開発し、出願(実願昭62−148702
号)した。 〔発明が解決しようとする課題〕 ところで、上述の赤外線ろう接器を用い、市販
されている一般工業用のチタンろう接用ろう材と
フラツクスとを使用して、チタン材同士をろう接
したところ、ろう材やフラツクスに含有されてい
るZnやSnがヒユームとなつて発生し、これらヒ
ユーム等が赤外線ろう接器の内周面に付着するた
め良好なろう接作業がなし得なかつたり、チタン
材にろう材が溶け込み(母材へのろう材の食込
み)チタン製歯科技工品の形状を損なつて不合格
品となつたり、あるいは接合部に生成する化合物
等のためと思われるが安定した接合強度(30Kg
f/mm2以上)が得られなかつたりする不具合が
観られた。 そこで、本発明は、叙上の問題点に鑑み、フラ
ツクスを使用せずにろう接し得ると共に、近年生
体への有害性が問題になつているNiの使用を避
け、更にはZnやSn等の成分を極力含有しないTi
−Cu−Pdからなる三元系を基本成分とし、加え
て、ろう接による接合強度が30Kgf/mm2以上が
安定して得られ、且つ、チタン材に対し良好な流
ろう性を有する他、チタン材と略同色のチタン材
のろう接用ろう材を開発提供することを目的とす
るものである。 〔課題を解決するための手段〕 上記の目的を達成するために、本発明に係わる
チタン材のろう接用ろう材は、Ti:25〜50wt%、
Cu:15〜40wt%、Pd:15〜40wt%および不可避
的不純物とからなるものである。 そして、上記ろう材は、純Ti材またはTi−Pd
合金材とCu−Pd合金材とが積層された複合材か
らなつていてもよい。 〔作用〕 叙上の本発明に係わるチタン材のろう接用ろう
材は、チタン材に対し良好な流ろう性を有し、チ
タン材と略同色、且つ、生体に対し無害である。
また、ろう接に当たつては、フラツクスを使用せ
ずにろう接し得ると共に、安定して高強度の接合
部が得られる。 次に、各成分の特定理由を説明する。 TiはCuとPdとの組み合わせにおいて、25wt%
未満では、チタン材へのろう材の溶け込みは避け
られず、且つ、安定して高強度な接合部が得られ
ず、また、50wt%超では、流ろう性が著しく低
下する。 CuはTiとPdとの組み合わせにおいて、15wt%
未満では、流ろう性が低下し、また、40wt%超
では、逆に流ろう性が良すぎ所定の肉盛りが困難
となる他、チタン材との略同色系が薄れる。 PdはTiとCuとの組み合わせにおいて、15wt%
未満では、流ろう性が良すぎ所定の肉盛りが困難
となり、また、40wt%超では、逆に流ろう性が
低下する。 尚、本発明における不可避的不純物とは、ろう
材の製造上含有することが避けられない成分をさ
すが、これらとて、ろう接時のヒユームや生体へ
の影響等から、極力含有量を減少させる方が望ま
しい。 〔実施例〕 以下に、本発明の実施例について説明する。 純Cuおよび純Pdを原料に真空溶解して得たCu
−Pd合金鋳辺と、市販の純TiおよびTi−Pd合金
板とを種々の厚さのシート材に圧延すると共に、
圧延後のシート材を組合わせ、組合わせ後の材料
を、0.25mmの所定厚さまで積層圧延して下表に示
す成分の複合ろう材を得た。 これらのろう材を用いて、直径3mm×長さ50mm
の純チタン棒同士をアルゴン雰囲気中で差しろう
型式でろう接すると共に、ろう接時の流ろう性、
母材へのろう材の食込みおよび色調を観察した。
そして観察結果の良好のものについて、更にろう
接部の引張試験を実施した。これら観察結果およ
び引張試験結果を下表に併せて示す。
[Industrial Application Field] The present invention relates to a brazing filler metal for brazing titanium or titanium alloy materials (hereinafter simply referred to as titanium materials), and in particular to a brazing filler metal for use in brazing titanium dental instruments. Regarding. [Prior art] Due to its excellent properties, titanium material is used in aircraft,
Its use is progressing in various industrial fields including nuclear power. On the other hand, in recent years, this titanium material has improved its corrosion resistance,
It has become known that in addition to having excellent mechanical strength and low specific gravity, it also has compatibility with living organisms and properties that are harmless to living organisms, and its use as a medical material is progressing. There is. In particular, the use of titanium materials for dental technology (dental crowns, denture bases, etc.) is being actively promoted. However, titanium materials are highly active and easily oxidize at high temperatures, so when soldering is performed, such as in the manufacture of dental technology, it must be done in a vacuum or in an inert gas atmosphere. This has been a major hindrance to the manufacture of titanium dental instruments. For this reason, the present inventors
He first developed an infrared soldering device that could be put to practical use in soldering titanium dental instruments, and filed an application (Utility Application No. 148702, 1983).
No.). [Problems to be Solved by the Invention] By the way, titanium materials were brazed together using the above-mentioned infrared soldering device and a commercially available general industrial titanium brazing filler metal and flux. , Zn and Sn contained in the brazing filler metal and flux are generated as fumes, and these fumes adhere to the inner circumferential surface of the infrared soldering device, making it difficult to perform a good soldering job. The brazing filler metal melts (cutting into the base metal), damaging the shape of the titanium dental instrument and resulting in a rejected product, or it may be due to a compound forming at the joint, but the bond remains stable. Strength (30Kg
f/mm 2 or higher) was not obtained and the problem was observed. Therefore, in view of the above-mentioned problems, the present invention enables soldering without using flux, avoids the use of Ni, which has become a problem in recent years due to its toxicity to living organisms, and furthermore, uses materials such as Zn and Sn. Ti containing as few components as possible
The basic component is a ternary system consisting of -Cu-Pd, and in addition, it can stably achieve a joint strength of 30Kgf/mm2 or more by brazing, and has good flowability with respect to titanium materials. The purpose of this project is to develop and provide a brazing filler metal for titanium materials that has approximately the same color as titanium materials. [Means for Solving the Problem] In order to achieve the above object, the brazing filler metal for titanium material according to the present invention contains Ti: 25 to 50 wt%,
It consists of Cu: 15 to 40 wt%, Pd: 15 to 40 wt%, and inevitable impurities. The brazing filler metal is pure Ti material or Ti-Pd
It may be made of a composite material in which an alloy material and a Cu-Pd alloy material are laminated. [Function] The brazing filler metal for brazing titanium materials according to the present invention has good flow properties with respect to titanium materials, has substantially the same color as titanium materials, and is harmless to living organisms.
Further, in soldering, it is possible to perform soldering without using flux, and a stable and high-strength joint can be obtained. Next, the reason for specifying each component will be explained. Ti is 25wt% in combination with Cu and Pd
If it is less than 50 wt %, the melting of the brazing material into the titanium material is unavoidable, and a stable and high-strength joint cannot be obtained, and if it exceeds 50 wt %, the flowability will be significantly reduced. Cu is 15wt% in combination with Ti and Pd
If the content is less than 40 wt%, the flowability will decrease, and if it exceeds 40wt%, the flowability will be too good, making it difficult to build up the desired build-up, and the color will be less similar to that of the titanium material. Pd is 15wt% in combination with Ti and Cu
If it is less than 40wt%, the flowability will be too good and it will be difficult to build up the desired thickness, and if it exceeds 40wt%, the flowability will decrease. Incidentally, the unavoidable impurities in the present invention refer to components that are unavoidable in the production of the brazing material, but the content of these should be reduced as much as possible due to the effects on fumes and living organisms during soldering. It is preferable. [Examples] Examples of the present invention will be described below. Cu obtained by vacuum melting pure Cu and pure Pd as raw materials
- Rolling Pd alloy cast sides and commercially available pure Ti and Ti-Pd alloy plates into sheet materials of various thicknesses,
The rolled sheet materials were combined, and the combined materials were laminated and rolled to a predetermined thickness of 0.25 mm to obtain a composite brazing material having the components shown in the table below. Using these brazing materials, diameter 3mm x length 50mm
Pure titanium rods are soldered together in an argon atmosphere using a soldering method, and the flowability during soldering is improved.
The penetration of the brazing filler metal into the base metal and the color tone were observed.
For those with good observation results, a tensile test was further conducted on the brazed parts. These observation results and tensile test results are also shown in the table below.

【表】【table】

〔発明の効果〕〔Effect of the invention〕

本発明は、上述のように、Ti−Cu−Pdからな
る三元系のチタン材のろう接用ろう材であるか
ら、チタン材に対し良好な流ろう性を有し、チタ
ン材へのろう材の溶込みがなく、チタン材と略同
色、且つ、Niを含有しない等生体に対し無害で
ある。また、ろう接に当たつては、フラツクスを
使用せずにろう接し得ると共に、安定して高強度
のろう接部が得られる利点を有するものである。
As mentioned above, the present invention is a ternary titanium brazing filler metal consisting of Ti-Cu-Pd, and therefore has good flowability to titanium materials and is suitable for soldering to titanium materials. It is harmless to living organisms, with no material penetration, almost the same color as titanium material, and no Ni content. Further, when soldering, it has the advantage that soldering can be performed without using flux, and a soldered part with high strength can be stably obtained.

Claims (1)

【特許請求の範囲】 1 Ti:25〜50wt% Cu:15〜40wt% Pd:15〜40wt% および不可避的不純物とからなることを特徴と
するチタンまたはチタン合金材のろう接用ろう
材。 2 純Ti材またはTi−Pd合金材とCu−Pd合金材
とが積層された複合材からなるとともに、この複
合材の成分組成の割合がTi:25〜50wt%、Cu:
15〜40wt%、Pd:15〜40wt%および不可避的不
純物とからなることを特徴とするチタンまたはチ
タン合金材のろう接用ろう材。
[Claims] 1. A brazing filler metal for brazing titanium or titanium alloy material, characterized by comprising: 1 Ti: 25 to 50 wt% Cu: 15 to 40 wt% Pd: 15 to 40 wt% and inevitable impurities. 2 Consists of a composite material in which pure Ti material or Ti-Pd alloy material and Cu-Pd alloy material are laminated, and the composition ratio of this composite material is Ti: 25 to 50 wt%, Cu:
A brazing filler metal for brazing titanium or titanium alloy material, characterized by comprising 15 to 40 wt% of Pd, 15 to 40 wt% of Pd, and inevitable impurities.
JP33403989A 1989-12-22 1989-12-22 Brazing material for brazing titanium or titanium alloy material Granted JPH03193292A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP33403989A JPH03193292A (en) 1989-12-22 1989-12-22 Brazing material for brazing titanium or titanium alloy material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33403989A JPH03193292A (en) 1989-12-22 1989-12-22 Brazing material for brazing titanium or titanium alloy material

Publications (2)

Publication Number Publication Date
JPH03193292A JPH03193292A (en) 1991-08-23
JPH055597B2 true JPH055597B2 (en) 1993-01-22

Family

ID=18272824

Family Applications (1)

Application Number Title Priority Date Filing Date
JP33403989A Granted JPH03193292A (en) 1989-12-22 1989-12-22 Brazing material for brazing titanium or titanium alloy material

Country Status (1)

Country Link
JP (1) JPH03193292A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7771838B1 (en) * 2004-10-12 2010-08-10 Boston Scientific Neuromodulation Corporation Hermetically bonding ceramic and titanium with a Ti-Pd braze interface
US8329314B1 (en) 2004-10-12 2012-12-11 Boston Scientific Neuromodulation Corporation Hermetically bonding ceramic and titanium with a palladium braze

Also Published As

Publication number Publication date
JPH03193292A (en) 1991-08-23

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