JPH0559078B2 - - Google Patents
Info
- Publication number
- JPH0559078B2 JPH0559078B2 JP34339689A JP34339689A JPH0559078B2 JP H0559078 B2 JPH0559078 B2 JP H0559078B2 JP 34339689 A JP34339689 A JP 34339689A JP 34339689 A JP34339689 A JP 34339689A JP H0559078 B2 JPH0559078 B2 JP H0559078B2
- Authority
- JP
- Japan
- Prior art keywords
- group
- polysilazane
- carbon atoms
- following formula
- substituted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000919 ceramic Substances 0.000 claims description 41
- 229920001709 polysilazane Polymers 0.000 claims description 37
- 125000004432 carbon atom Chemical group C* 0.000 claims description 28
- 238000000034 method Methods 0.000 claims description 23
- 239000002243 precursor Substances 0.000 claims description 21
- 125000000217 alkyl group Chemical group 0.000 claims description 18
- 239000000203 mixture Substances 0.000 claims description 17
- 239000002904 solvent Substances 0.000 claims description 14
- 238000005245 sintering Methods 0.000 claims description 10
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims description 7
- 125000003118 aryl group Chemical group 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 7
- 125000003545 alkoxy group Chemical group 0.000 claims description 6
- 125000004663 dialkyl amino group Chemical group 0.000 claims description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 4
- 239000001257 hydrogen Substances 0.000 claims description 4
- 229910052739 hydrogen Inorganic materials 0.000 claims description 4
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 238000010304 firing Methods 0.000 claims description 3
- 229910052581 Si3N4 Inorganic materials 0.000 claims 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims 2
- 229910010271 silicon carbide Inorganic materials 0.000 claims 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims 2
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims 1
- 239000000047 product Substances 0.000 description 14
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 10
- 238000006243 chemical reaction Methods 0.000 description 7
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 6
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 6
- NLKNQRATVPKPDG-UHFFFAOYSA-M potassium iodide Chemical compound [K+].[I-] NLKNQRATVPKPDG-UHFFFAOYSA-M 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 5
- 238000001746 injection moulding Methods 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 5
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 4
- 238000005452 bending Methods 0.000 description 4
- 239000012700 ceramic precursor Substances 0.000 description 4
- 238000004132 cross linking Methods 0.000 description 4
- -1 dibentylbenzene Chemical compound 0.000 description 4
- IIEWJVIFRVWJOD-UHFFFAOYSA-N ethylcyclohexane Chemical compound CCC1CCCCC1 IIEWJVIFRVWJOD-UHFFFAOYSA-N 0.000 description 4
- 239000012188 paraffin wax Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 229910001873 dinitrogen Inorganic materials 0.000 description 3
- SNRUBQQJIBEYMU-UHFFFAOYSA-N dodecane Chemical compound CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 3
- CXWXQJXEFPUFDZ-UHFFFAOYSA-N tetralin Chemical compound C1=CC=C2CCCCC2=C1 CXWXQJXEFPUFDZ-UHFFFAOYSA-N 0.000 description 3
- QPFMBZIOSGYJDE-UHFFFAOYSA-N 1,1,2,2-tetrachloroethane Chemical compound ClC(Cl)C(Cl)Cl QPFMBZIOSGYJDE-UHFFFAOYSA-N 0.000 description 2
- RELMFMZEBKVZJC-UHFFFAOYSA-N 1,2,3-trichlorobenzene Chemical compound ClC1=CC=CC(Cl)=C1Cl RELMFMZEBKVZJC-UHFFFAOYSA-N 0.000 description 2
- KVNYFPKFSJIPBJ-UHFFFAOYSA-N 1,2-diethylbenzene Chemical compound CCC1=CC=CC=C1CC KVNYFPKFSJIPBJ-UHFFFAOYSA-N 0.000 description 2
- JRZJOMJEPLMPRA-UHFFFAOYSA-N 1-nonene Chemical compound CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 2
- VQKFNUFAXTZWDK-UHFFFAOYSA-N 2-Methylfuran Chemical compound CC1=CC=CO1 VQKFNUFAXTZWDK-UHFFFAOYSA-N 0.000 description 2
- AFABGHUZZDYHJO-UHFFFAOYSA-N 2-Methylpentane Chemical compound CCCC(C)C AFABGHUZZDYHJO-UHFFFAOYSA-N 0.000 description 2
- YIWUKEYIRIRTPP-UHFFFAOYSA-N 2-ethylhexan-1-ol Chemical compound CCCCC(CC)CO YIWUKEYIRIRTPP-UHFFFAOYSA-N 0.000 description 2
- SYBYTAAJFKOIEJ-UHFFFAOYSA-N 3-Methylbutan-2-one Chemical compound CC(C)C(C)=O SYBYTAAJFKOIEJ-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N Butyraldehyde Chemical compound CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- YNQLUTRBYVCPMQ-UHFFFAOYSA-N Ethylbenzene Chemical compound CCC1=CC=CC=C1 YNQLUTRBYVCPMQ-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical compound CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 2
- PWATWSYOIIXYMA-UHFFFAOYSA-N Pentylbenzene Chemical compound CCCCCC1=CC=CC=C1 PWATWSYOIIXYMA-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 2
- XXROGKLTLUQVRX-UHFFFAOYSA-N allyl alcohol Chemical compound OCC=C XXROGKLTLUQVRX-UHFFFAOYSA-N 0.000 description 2
- 150000001408 amides Chemical group 0.000 description 2
- OCKPCBLVNKHBMX-UHFFFAOYSA-N butylbenzene Chemical compound CCCCC1=CC=CC=C1 OCKPCBLVNKHBMX-UHFFFAOYSA-N 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 2
- HGCIXCUEYOPUTN-UHFFFAOYSA-N cyclohexene Chemical compound C1CCC=CC1 HGCIXCUEYOPUTN-UHFFFAOYSA-N 0.000 description 2
- NNBZCPXTIHJBJL-UHFFFAOYSA-N decalin Chemical compound C1CCCC2CCCCC21 NNBZCPXTIHJBJL-UHFFFAOYSA-N 0.000 description 2
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 2
- 150000002431 hydrogen Chemical class 0.000 description 2
- INQOMBQAUSQDDS-UHFFFAOYSA-N iodomethane Chemical compound IC INQOMBQAUSQDDS-UHFFFAOYSA-N 0.000 description 2
- PHTQWCKDNZKARW-UHFFFAOYSA-N isoamylol Chemical compound CC(C)CCO PHTQWCKDNZKARW-UHFFFAOYSA-N 0.000 description 2
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 description 2
- KQNPFQTWMSNSAP-UHFFFAOYSA-N isobutyric acid Chemical compound CC(C)C(O)=O KQNPFQTWMSNSAP-UHFFFAOYSA-N 0.000 description 2
- QWTDNUCVQCZILF-UHFFFAOYSA-N isopentane Chemical compound CCC(C)C QWTDNUCVQCZILF-UHFFFAOYSA-N 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052987 metal hydride Inorganic materials 0.000 description 2
- 150000004681 metal hydrides Chemical class 0.000 description 2
- UAEPNZWRGJTJPN-UHFFFAOYSA-N methylcyclohexane Chemical compound CC1CCCCC1 UAEPNZWRGJTJPN-UHFFFAOYSA-N 0.000 description 2
- ZGEGCLOFRBLKSE-UHFFFAOYSA-N methylene hexane Natural products CCCCCC=C ZGEGCLOFRBLKSE-UHFFFAOYSA-N 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- LQNUZADURLCDLV-UHFFFAOYSA-N nitrobenzene Chemical compound [O-][N+](=O)C1=CC=CC=C1 LQNUZADURLCDLV-UHFFFAOYSA-N 0.000 description 2
- BKIMMITUMNQMOS-UHFFFAOYSA-N nonane Chemical compound CCCCCCCCC BKIMMITUMNQMOS-UHFFFAOYSA-N 0.000 description 2
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- NTTOTNSKUYCDAV-UHFFFAOYSA-N potassium hydride Chemical compound [KH] NTTOTNSKUYCDAV-UHFFFAOYSA-N 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000011282 treatment Methods 0.000 description 2
- IIYFAKIEWZDVMP-UHFFFAOYSA-N tridecane Chemical compound CCCCCCCCCCCCC IIYFAKIEWZDVMP-UHFFFAOYSA-N 0.000 description 2
- CRSBERNSMYQZNG-UHFFFAOYSA-N 1 -dodecene Natural products CCCCCCCCCCC=C CRSBERNSMYQZNG-UHFFFAOYSA-N 0.000 description 1
- AVGQTJUPLKNPQP-UHFFFAOYSA-N 1,1,1-trichloropropane Chemical compound CCC(Cl)(Cl)Cl AVGQTJUPLKNPQP-UHFFFAOYSA-N 0.000 description 1
- KNKRKFALVUDBJE-UHFFFAOYSA-N 1,2-dichloropropane Chemical compound CC(Cl)CCl KNKRKFALVUDBJE-UHFFFAOYSA-N 0.000 description 1
- OCJBOOLMMGQPQU-UHFFFAOYSA-N 1,4-dichlorobenzene Chemical compound ClC1=CC=C(Cl)C=C1 OCJBOOLMMGQPQU-UHFFFAOYSA-N 0.000 description 1
- GDXHBFHOEYVPED-UHFFFAOYSA-N 1-(2-butoxyethoxy)butane Chemical compound CCCCOCCOCCCC GDXHBFHOEYVPED-UHFFFAOYSA-N 0.000 description 1
- CYNYIHKIEHGYOZ-UHFFFAOYSA-N 1-bromopropane Chemical compound CCCBr CYNYIHKIEHGYOZ-UHFFFAOYSA-N 0.000 description 1
- VFWCMGCRMGJXDK-UHFFFAOYSA-N 1-chlorobutane Chemical compound CCCCCl VFWCMGCRMGJXDK-UHFFFAOYSA-N 0.000 description 1
- SQCZQTSHSZLZIQ-UHFFFAOYSA-N 1-chloropentane Chemical compound CCCCCCl SQCZQTSHSZLZIQ-UHFFFAOYSA-N 0.000 description 1
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 1
- PSABUFWDVWCFDP-UHFFFAOYSA-N 2,2-dimethylheptane Chemical compound CCCCCC(C)(C)C PSABUFWDVWCFDP-UHFFFAOYSA-N 0.000 description 1
- PTTPXKJBFFKCEK-UHFFFAOYSA-N 2-Methyl-4-heptanone Chemical compound CC(C)CC(=O)CC(C)C PTTPXKJBFFKCEK-UHFFFAOYSA-N 0.000 description 1
- QQZOPKMRPOGIEB-UHFFFAOYSA-N 2-Oxohexane Chemical compound CCCCC(C)=O QQZOPKMRPOGIEB-UHFFFAOYSA-N 0.000 description 1
- CFVWNXQPGQOHRJ-UHFFFAOYSA-N 2-methylpropyl prop-2-enoate Chemical compound CC(C)COC(=O)C=C CFVWNXQPGQOHRJ-UHFFFAOYSA-N 0.000 description 1
- OSDWBNJEKMUWAV-UHFFFAOYSA-N Allyl chloride Chemical compound ClCC=C OSDWBNJEKMUWAV-UHFFFAOYSA-N 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- ZAFNJMIOTHYJRJ-UHFFFAOYSA-N Diisopropyl ether Chemical compound CC(C)OC(C)C ZAFNJMIOTHYJRJ-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- NHTMVDHEPJAVLT-UHFFFAOYSA-N Isooctane Chemical compound CC(C)CC(C)(C)C NHTMVDHEPJAVLT-UHFFFAOYSA-N 0.000 description 1
- 229910021193 La 2 O 3 Inorganic materials 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- WRQNANDWMGAFTP-UHFFFAOYSA-N Methylacetoacetic acid Chemical compound COC(=O)CC(C)=O WRQNANDWMGAFTP-UHFFFAOYSA-N 0.000 description 1
- 238000005481 NMR spectroscopy Methods 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- CYTYCFOTNPOANT-UHFFFAOYSA-N Perchloroethylene Chemical group ClC(Cl)=C(Cl)Cl CYTYCFOTNPOANT-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- DHXVGJBLRPWPCS-UHFFFAOYSA-N Tetrahydropyran Chemical compound C1CCOCC1 DHXVGJBLRPWPCS-UHFFFAOYSA-N 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- 125000002777 acetyl group Chemical class [H]C([H])([H])C(*)=O 0.000 description 1
- 235000019270 ammonium chloride Nutrition 0.000 description 1
- 238000005915 ammonolysis reaction Methods 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- KCXMKQUNVWSEMD-UHFFFAOYSA-N benzyl chloride Chemical compound ClCC1=CC=CC=C1 KCXMKQUNVWSEMD-UHFFFAOYSA-N 0.000 description 1
- 229940073608 benzyl chloride Drugs 0.000 description 1
- 150000001721 carbon Chemical group 0.000 description 1
- 238000005119 centrifugation Methods 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000005056 compaction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 150000001923 cyclic compounds Chemical class 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- HHNHBFLGXIUXCM-GFCCVEGCSA-N cyclohexylbenzene Chemical compound [CH]1CCCC[C@@H]1C1=CC=CC=C1 HHNHBFLGXIUXCM-GFCCVEGCSA-N 0.000 description 1
- 229930007927 cymene Natural products 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- KTQYJQFGNYHXMB-UHFFFAOYSA-N dichloro(methyl)silicon Chemical compound C[Si](Cl)Cl KTQYJQFGNYHXMB-UHFFFAOYSA-N 0.000 description 1
- 229940117389 dichlorobenzene Drugs 0.000 description 1
- JVSWJIKNEAIKJW-UHFFFAOYSA-N dimethyl-hexane Natural products CCCCCC(C)C JVSWJIKNEAIKJW-UHFFFAOYSA-N 0.000 description 1
- 229940069096 dodecene Drugs 0.000 description 1
- KWKXNDCHNDYVRT-UHFFFAOYSA-N dodecylbenzene Chemical compound CCCCCCCCCCCCC1=CC=CC=C1 KWKXNDCHNDYVRT-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000921 elemental analysis Methods 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- XYIBRDXRRQCHLP-UHFFFAOYSA-N ethyl acetoacetate Chemical compound CCOC(=O)CC(C)=O XYIBRDXRRQCHLP-UHFFFAOYSA-N 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000000295 fuel oil Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000003502 gasoline Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 208000037584 hereditary sensory and autonomic neuropathy Diseases 0.000 description 1
- VHHHONWQHHHLTI-UHFFFAOYSA-N hexachloroethane Chemical compound ClC(Cl)(Cl)C(Cl)(Cl)Cl VHHHONWQHHHLTI-UHFFFAOYSA-N 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- JMMWKPVZQRWMSS-UHFFFAOYSA-N isopropyl acetate Chemical group CC(C)OC(C)=O JMMWKPVZQRWMSS-UHFFFAOYSA-N 0.000 description 1
- ULYZAYCEDJDHCC-UHFFFAOYSA-N isopropyl chloride Chemical compound CC(C)Cl ULYZAYCEDJDHCC-UHFFFAOYSA-N 0.000 description 1
- 239000003350 kerosene Substances 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000010721 machine oil Substances 0.000 description 1
- AUHZEENZYGFFBQ-UHFFFAOYSA-N mesitylene Substances CC1=CC(C)=CC(C)=C1 AUHZEENZYGFFBQ-UHFFFAOYSA-N 0.000 description 1
- 125000001827 mesitylenyl group Chemical group [H]C1=C(C(*)=C(C([H])=C1C([H])([H])[H])C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- GYNNXHKOJHMOHS-UHFFFAOYSA-N methyl-cycloheptane Natural products CC1CCCCCC1 GYNNXHKOJHMOHS-UHFFFAOYSA-N 0.000 description 1
- 239000005048 methyldichlorosilane Substances 0.000 description 1
- SNMVRZFUUCLYTO-UHFFFAOYSA-N n-propyl chloride Chemical compound CCCCl SNMVRZFUUCLYTO-UHFFFAOYSA-N 0.000 description 1
- MCSAJNNLRCFZED-UHFFFAOYSA-N nitroethane Chemical compound CC[N+]([O-])=O MCSAJNNLRCFZED-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- HFPZCAJZSCWRBC-UHFFFAOYSA-N p-cymene Chemical compound CC(C)C1=CC=C(C)C=C1 HFPZCAJZSCWRBC-UHFFFAOYSA-N 0.000 description 1
- CFJYNSNXFXLKNS-UHFFFAOYSA-N p-menthane Chemical compound CC(C)C1CCC(C)CC1 CFJYNSNXFXLKNS-UHFFFAOYSA-N 0.000 description 1
- BNIXVQGCZULYKV-UHFFFAOYSA-N pentachloroethane Chemical compound ClC(Cl)C(Cl)(Cl)Cl BNIXVQGCZULYKV-UHFFFAOYSA-N 0.000 description 1
- XNLICIUVMPYHGG-UHFFFAOYSA-N pentan-2-one Chemical compound CCCC(C)=O XNLICIUVMPYHGG-UHFFFAOYSA-N 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 229910000105 potassium hydride Inorganic materials 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229950011008 tetrachloroethylene Drugs 0.000 description 1
- 239000010723 turbine oil Substances 0.000 description 1
- HGBOYTHUEUWSSQ-UHFFFAOYSA-N valeric aldehyde Natural products CCCCC=O HGBOYTHUEUWSSQ-UHFFFAOYSA-N 0.000 description 1
- PXXNTAGJWPJAGM-UHFFFAOYSA-N vertaline Natural products C1C2C=3C=C(OC)C(OC)=CC=3OC(C=C3)=CC=C3CCC(=O)OC1CC1N2CCCC1 PXXNTAGJWPJAGM-UHFFFAOYSA-N 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Landscapes
- Ceramic Products (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はセラミツクス・ポリシラザン接合成形
体及び接合セラミツクス成形体に関し、更に詳し
くはセラミツクスとポリシラザンを含む組成物か
らなる2以上の成形体をポリシラザンの溶媒の存
在下で接合させたのち焼結して得られた酸化物系
及び非酸化物の新規な接合セラミツクス成形体に
関するものである。Detailed Description of the Invention [Field of Industrial Application] The present invention relates to a ceramic-polysilazane bonded molded product and a bonded ceramic molded product, and more specifically, the present invention relates to a ceramic-polysilazane bonded molded product and a bonded ceramic molded product. The present invention relates to a novel bonded ceramic molded body of oxide and non-oxide materials obtained by bonding and sintering in the presence of a solvent.
一般に、セラミツクス成形品を得るには、粉体
処理、成形、脱脂、焼成、加工の各行程を必要と
し、焼結体の切削加工によつて部品を先ず作製
し、ネジ止めや接着等の方法によつて複雑な形状
の接合品を得たり、ボウリング等の方法によつて
中空体を得ていた。しかしこれらの方法では得ら
れない形状のものもあつた。また、これらの方法
で作つた成形品は、接合部分の強度低下が極めて
大きいために、セラミツクスの本来持つ特性を生
かせないままに使用せざるを得なかつた。
Generally, obtaining ceramic molded products requires the following steps: powder treatment, molding, degreasing, firing, and processing.The parts are first manufactured by cutting a sintered body, and then screwed, bonded, etc. By this method, complex-shaped joined products were obtained, and by methods such as bowling, hollow bodies were obtained. However, there were some shapes that could not be obtained using these methods. In addition, molded products made by these methods have a very large decrease in strength at the joints, so they have had to be used without taking advantage of the inherent characteristics of ceramics.
また、単なる棒や板などの単純形状品のみを製
造することは、セラミツクス産業の発展性を阻止
する原因の一つにあげられていた。更に、複雑形
状のセラミツクスや中空セラミツクスを得ること
が可能である場合には極めて高価な製品となつて
しまい工業的、産業的な価値を失つている。 Furthermore, manufacturing only simple-shaped products such as rods and plates was cited as one of the reasons for inhibiting the development of the ceramics industry. Furthermore, when it is possible to obtain ceramics with complicated shapes or hollow ceramics, the products become extremely expensive and lose their industrial and industrial value.
本発明が解決しようとする課題は従来のセラミ
ツクス成形品及びその製造上の難点を解決し、セ
ラミツクスの本来持つ特性を生かし、複雑な形状
や中空体を有するセラミツクス成形体の新しい製
造方法を提供することである。
The problem to be solved by the present invention is to solve the difficulties in conventional ceramic molded products and their production, and to provide a new method for manufacturing ceramic molded products having complex shapes and hollow bodies by taking advantage of the inherent characteristics of ceramics. That's true.
本発明は、粉状又は繊維状のセラミツクスとポ
リシラザンを含む組成物から成る2以上の成形体
を前記ポリシラザンの溶媒の存在下に接合させ
て、セラミツクス・ポリシラザン接合成形体を製
造すること、更にはそのような成形体を焼成して
セラミツクス成形体(本明細書において、このセ
ラミツクス成形体を「接合セラミツクス成形体」
という。)を製造することに関する。
The present invention involves manufacturing a ceramic-polysilazane bonded molded product by bonding two or more molded products made of a composition containing powdered or fibrous ceramics and polysilazane in the presence of a solvent for the polysilazane; Such a molded body is fired to form a ceramic molded body (herein, this ceramic molded body is referred to as a "bonded ceramic molded body").
That's what it means. ).
前記組成物中のセラミツクスの材質としては、
Si3N4,SiC,A2O3,SiO2,B2O3,B4C,
BN,A4C3,AN,TiO2,TiC,TiN,
ZrO2,ZrC、グラフアイトを例示しうる。 The ceramic material in the composition includes:
Si 3 N 4 , SiC, A 2 O 3 , SiO 2 , B 2 O 3 , B 4 C,
BN, A 4 C 3 , AN, TiO 2 , TiC, TiN,
Examples include ZrO 2 , ZrC, and graphite.
前記ポリシラザンは、式(A)
の反復単位を有し、式(B)
(ここに、Rは互に独立に水素、炭素原子数1
〜6のアルキル基、炭素原子数1〜6のアルコキ
シ基、置換もしくは非置換のビニル基、置換もし
くは非置換のアリル基、炭素原子数6〜10のアリ
ール基、アルキル基の炭素原子数が1〜6のトリ
ーもしくはジ−アルキルシリル基又は炭素原子数
が1〜6のジアルキルアミノ基であり、nは1よ
り大きい整数を表す。)
で表わされるSi2N2橋によつて互に結合している
複数の先駆体残基より成るものである。 The polysilazane has the formula (A) has a repeating unit of formula (B) (Here, R is each independently hydrogen, carbon number 1
-6 alkyl group, alkoxy group having 1 to 6 carbon atoms, substituted or unsubstituted vinyl group, substituted or unsubstituted allyl group, aryl group having 6 to 10 carbon atoms, alkyl group having 1 carbon atom ~6 tri- or di-alkylsilyl groups or dialkylamino groups having 1 to 6 carbon atoms, and n represents an integer greater than 1. ) It consists of a plurality of precursor residues connected to each other by Si 2 N 2 bridges.
前記ポリシラザンは、例えば特開昭60−226890
号公報に記載の方法で製造することができる。こ
の方法では、無水アンモニアをRSiHX2と溶液中
で反応させて環状または直鎖状の先駆体を生成
し、この先駆体を、珪素原子に隣接する窒素原子
から水素を脱プロトン化する能力のある塩基性触
媒の存在下において反応させてSi2N2橋を形成さ
せることにより有機シラザン重合体を製造する。
これは例えば、メチルジクロロシランをジエチル
エーテル中で冷却しつつアンモニアガスを吹き込
んでアンモノリシスさせ、生成する塩化アンモニ
ウム沈殿を過し、液を減圧下にてエーテルを
留去し、式(C):
の骨格構造の繰返しで表わされる先駆体を得る。
そしてこのものは、数平均分子量が約300程度で
あることから、骨格構造の繰返しが平均してほぼ
5個の環状化合物であると考えられる。この先駆
体を、水素化カリウム(KH)を懸濁攪拌してい
るテトラヒドロフラン溶液中に滴下すると、水素
ガスを発生しつつ重合が起こる。この機構は、発
明者であるセイフアース(Seyferth)らによる
と、
の反応で先ずアミド官能基が生成し、次いでこの
ような官能基の一対が結合して4員のSi2N2環が
形成され金属水素化物が再生される。 The polysilazane is disclosed in, for example, Japanese Patent Application Laid-Open No. 60-226890.
It can be produced by the method described in the publication. In this method, anhydrous ammonia is reacted with RSiHX 2 in solution to produce a cyclic or linear precursor, which has the ability to deprotonate hydrogen from the nitrogen atom adjacent to the silicon atom. An organic silazane polymer is produced by reacting in the presence of a basic catalyst to form a Si 2 N 2 bridge.
For example, methyldichlorosilane is cooled in diethyl ether and ammonia gas is blown into it to cause ammonolysis, the resulting ammonium chloride precipitate is filtered out, and the ether is distilled off from the liquid under reduced pressure to obtain the formula (C): We obtain a precursor represented by a repeating skeletal structure.
Since this compound has a number average molecular weight of about 300, it is considered to be a cyclic compound with approximately five repeating skeleton structures on average. When this precursor is dropped into a tetrahydrofuran solution in which potassium hydride (KH) is suspended and stirred, polymerization occurs while generating hydrogen gas. According to the inventor, Seyferth et al. The reaction first generates an amide functional group, and then pairs of such functional groups combine to form a four-membered Si 2 N 2 ring to regenerate the metal hydride.
この反応が終了した後、ヨウ化メチル(CH3
I)を反応系に加えると、アミド官能基がヨウ化
メチルと反応してヨウ化カリウムの沈殿が生じ、
そのヨウ化カリウムを遠心分離で除去し、溶媒
を留去すると白色粉末状のポリマーが得られる。
このポリマーは、プロトン型NMRおよび元素分
析の結果から、凡そ
(CH3SiHNH)0.39(CH3SiHNCH3)0.04(CH3
SiN)0.57 (G)
の組成をもつことが判明した。このことはほぼ次
のようなモデルで表されることを意味している。
After this reaction is completed, methyl iodide ( CH3
When I) is added to the reaction system, the amide functional group reacts with methyl iodide to precipitate potassium iodide, The potassium iodide is removed by centrifugation and the solvent is distilled off to obtain a white powdery polymer.
Based on the results of proton type NMR and elemental analysis, this polymer has approximately (CH 3 SiHNH) 0.39 (CH 3 SiHNCH 3 ) 0.04 (CH 3
It was found to have a composition of SiN) 0.57 (G). This means that it can be roughly expressed by the following model.
〓内は先駆体残基ユニツトである。 The number inside is the precursor residue unit.
従つて、このプロセスでは、先駆体を金属水素
化物を触媒として重合させる場合、過度に架橋反
応が進み、生成するポリマーが不溶化してゼリー
状にゲル化してしまうことがある。そしてこの方
法は分子量のコントロールが難しく再現性に乏し
いばかりでなく、得られるポリマーは不安定で、
経時的に架橋が進み、不溶化するので保存性に乏
しく、さらに重合反応を例えばテトラヒドロフラ
ン還流温度(66℃)で行うと、極短時間でゲル化
してしまうので、どうしても低温(30℃以下)で
注意深く行う必要があり、望ましい分子量を得る
のに長時間を要するなどの問題点がある。 Therefore, in this process, when a precursor is polymerized using a metal hydride as a catalyst, the crosslinking reaction may proceed excessively, and the resulting polymer may become insolubilized and gelled into a jelly-like state. This method not only makes it difficult to control the molecular weight and has poor reproducibility, but also the resulting polymer is unstable.
Crosslinking progresses over time and the product becomes insolubilized, resulting in poor storage stability.Furthermore, if the polymerization reaction is carried out at, for example, the reflux temperature of tetrahydrofuran (66°C), it will turn into a gel in a very short time, so it must be carefully carried out at low temperatures (below 30°C). There are problems such as a long time required to obtain a desired molecular weight.
前記技術では先駆体中の架橋反応点が多過ぎる
ため前述した問題が生じる。そこで先駆体の架橋
反応点を減らすと、前述のような問題を克服する
ことができる。その方法として、第1に先駆体中
の反応点
(ここに示されたR1の意味は後述する。)
の一部を下記式()
(ここに示されたR2,R3及びR4の意味は後述
する。)
で示されるシラザンと反応させて下記式()
で示される構造に変えて不活性化する方法があ
る。 The above-mentioned problems arise in this technique because there are too many cross-linking reaction sites in the precursor. Therefore, by reducing the number of crosslinking reaction sites in the precursor, the above-mentioned problems can be overcome. As a method, firstly, the reaction point in the precursor is (The meaning of R 1 shown here will be explained later.) A part of is expressed as below () (The meanings of R 2 , R 3 and R 4 shown here will be explained later.) By reacting with the silazane represented by the following formula () There is a method to inactivate it by changing it to the structure shown in .
第2に、先駆体を製造する際に、R1HSiX2(こ
こに、Xはハロゲン原子である。)の他にR5R6
SiX2(ここに示されたR5及びR6の意味は後述す
る。)を混合使用する方法がある。 Second, when producing the precursor, in addition to R 1 HSiX 2 (where X is a halogen atom), R 5 R 6
There is a method of using a mixture of SiX 2 (the meanings of R 5 and R 6 shown here will be described later).
第3に前記第1及び第2の方法を併用する方法
がある。従つて本発明に使用する好ましいポリシ
ラザンは下記ポリシラザン(イ),(ロ)及び(ハ)の内の少
なくとも1つである。 A third method is to use the first and second methods together. Therefore, the preferred polysilazane used in the present invention is at least one of the following polysilazane (a), (b) and (c).
前記ポリシラザンイは、下記式()
で示されるくり返し単位からなる骨格構造を有
し、下記式()
で示されるくり返し単位からなる複数の先駆体
が、部分的に、下記式()
で示されるシラザンと共に、下記式()
で示される構造単位を形成し、また、部分的に先
駆体相互間で、下記式()
で示される構造単位を形成して互に連結すること
により構成されるものである。 The polysilazane is expressed by the following formula () It has a skeletal structure consisting of repeating units represented by the following formula () A plurality of precursors consisting of repeating units represented by are partially expressed by the following formula () Along with the silazane represented by the following formula () Forms a structural unit represented by the following formula (), and also partially between the precursors: It is constructed by forming structural units shown in and connecting them to each other.
(ここに、R1,R2及びR3は、水素、炭素原子
数1〜6のアルキル基、炭素原子数1〜6のアル
コキシ基、置換若しくは非置換のビニル基、置換
若しくは非置換のアリル基、炭素原子数6〜10の
置換若しくは非置換のアリール基、アルキル基の
炭素原子数が1〜6のトリー若しくはジ−アルキ
ルシリル基又はアルキル基の炭素原子数が1〜6
のジアルキルアミノ基を表わし、R4は炭素原子
数1〜6のアルキル基、炭素原子数1〜6のアル
コキシ基、置換若しくは非置換のビニル基、置換
もしくは非置換のアリル基、炭素原子数6〜10の
置換若しくは非置換のアリール基又はアルキル基
の炭素原子数が1〜6のトリー若しくはジ−アル
キルシリル基を表わし、R1,R2,R3及びR4は互
いに同じであつても異なつていてもよい。)
前記ポリシラザンロは、下記式()
で示されるくり返し単位からなる骨格構造を有
し、下記式()及び()
で示されるくり返し単位からなる複数の先駆体
が、相互間で下記式()
で示される構造単位を形成して互に連結すること
により構成されるものである。 (Here, R 1 , R 2 and R 3 are hydrogen, an alkyl group having 1 to 6 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, a substituted or unsubstituted vinyl group, a substituted or unsubstituted allyl group) group, a substituted or unsubstituted aryl group having 6 to 10 carbon atoms, a tri- or di-alkylsilyl group having an alkyl group having 1 to 6 carbon atoms, or an alkyl group having 1 to 6 carbon atoms.
represents a dialkylamino group, R 4 is an alkyl group having 1 to 6 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, a substituted or unsubstituted vinyl group, a substituted or unsubstituted allyl group, or a C 6 alkyl group. ~10 substituted or unsubstituted aryl groups or alkyl groups representing tri- or di-alkylsilyl groups having 1 to 6 carbon atoms, even if R 1 , R 2 , R 3 and R 4 are the same as each other; They can be different. ) The polysilazane has the following formula () It has a skeletal structure consisting of repeating units represented by the following formulas () and (). Multiple precursors consisting of repeating units represented by are mutually expressed by the following formula () It is constructed by forming structural units shown in and connecting them to each other.
(ここに、R1は前記と同じ意味を表わし、R5
及びR6は炭素原子数1〜6のアルキル基、炭素
原子数1〜6のアルコキシ基、置換若しくは非置
換のビニル基、置換若しくは非置換のアリル基、
炭素原子数6〜10の置換若しくは非置換のアリー
ル基、アルキル基の炭素原子数が1〜6のトリー
若しくはジ−アルキルシリル基、アルキル基の炭
素原子数が1〜6のジアルキルアミノ基を表わ
し、R1,R5及びR6は同じであつても異なつてい
てもよい。)
前記ポリシラザンハは、下記式()
で示されるくり返し単位からなる骨格構造を有
し、下記式()及び()
で示されるくり返し単位からなる複数の先駆体
が、部分的に、下記式()
で示されるシラザンと共に、下記式()
で示される構造を形成し、また、部分的に先駆体
相互間で、下記式()
で示される構造単位を形成して互に連結すること
により構成されるものである。 (Here, R 1 represents the same meaning as above, R 5
and R 6 is an alkyl group having 1 to 6 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, a substituted or unsubstituted vinyl group, a substituted or unsubstituted allyl group,
Represents a substituted or unsubstituted aryl group having 6 to 10 carbon atoms, a tri- or dialkylsilyl group having an alkyl group having 1 to 6 carbon atoms, and a dialkylamino group having an alkyl group having 1 to 6 carbon atoms. , R 1 , R 5 and R 6 may be the same or different. ) The polysilazane is expressed by the following formula () It has a skeletal structure consisting of repeating units represented by the following formulas () and (). A plurality of precursors consisting of repeating units represented by are partially expressed by the following formula () Along with the silazane represented by the following formula () and also partially between the precursors, the following formula () It is constructed by forming structural units shown in and connecting them to each other.
(ここに、R1,R2,R3,R4,R5及びR6は前記
と同じ意味を表わし、互に同じであつても異なつ
ていてもよい。)
前記組成物は前記粉状又は繊維状のセラミツク
スとポリシラザンの他に焼結助剤を含むことが好
ましい。焼結助剤としては、Y2O3,A2O3、マ
グネシヤ、AN,CaO,La2O3等公知のものを
使用することができる。 (Here, R 1 , R 2 , R 3 , R 4 , R 5 and R 6 have the same meanings as above and may be the same or different.) It is preferable to include a sintering aid in addition to the ceramic or fibrous ceramic and the polysilazane. As the sintering aid, known materials such as Y 2 O 3 , A 2 O 3 , magnesia, AN, CaO, La 2 O 3 and the like can be used.
前記組成物から成形体を作るには、圧粉成形、
圧粉成形の後CIP処理すること又は射出成形によ
ることができる。この際前記組成物を流動状態又
は可塑化状態にするためには、この組成物にポリ
シラザンの溶媒を含有させるか、この組成物を加
熱してポリシラザンを溶融させればよい。 To make a molded body from the composition, powder molding,
It is possible to perform CIP treatment after compaction or by injection molding. At this time, in order to bring the composition into a fluid or plasticized state, the composition may contain a solvent for polysilazane, or the composition may be heated to melt the polysilazane.
このようにして得た初期成形体をポリシラザン
の溶媒の存在下接合するには、前記初期成形体の
接合させるべき各面に溶媒を塗りもしくは吹き付
け、又は該各面を溶媒に浸漬し、その後それらの
面が乾燥する前に相互にはり合わせればよい。 In order to join the initial molded bodies obtained in this way in the presence of a polysilazane solvent, each surface of the initial molded body to be joined is coated or sprayed with a solvent, or each surface is immersed in a solvent, and then Just attach them to each other before the sides are dry.
本発明に使用する溶媒はセラミツクス前駆体で
あるところのポリシラザンを溶解する溶媒ならば
何でも良く、例えば、ガソリン、灯油、石油エー
テル、軽油、重油、n−デカン、2−メチルブタ
ン、2−メチルペンタン、ドデカン、ヘキサン、
ヘプタン、ペンタン、ノナン、トリメチルヘキサ
ン、ドデセン、ヘプテン、ヘキセン、1−ノネ
ン、航空潤滑油、マシン油、タービン油、n−ト
リデカン、イソオクタン、n−オクタン、アクリ
ル酸イソブチル、メチルメタクリレート、メタク
リル酸エチル、アセチルアセトン、アセト酢酸エ
チル、アセト酢酸メチル、アセトニトリル、アセ
トン、メタノール、エタノール、アリルアルコー
ル、イソアミルアルコール、イソプロピルアルコ
ール、イソプロピルエーテル、イソ酪酸、ジエチ
ルエーテル、2−エチルヘキサノール、エチレン
グリコール、ジエチレングリコール、酢酸エチ
ル、酢酸イソプロピル、酢酸ブチル、メチルエチ
ルケトン、メチルイソブチルケトン、メチルイソ
プロピルケトン、ブチルアルデヒド、イソタブタ
ノール、テトラヒドロフラン、メチルフラン、テ
トラヒドロピラン、1,2−ジブトキシエタン、
アセタール、ペンタノン、ヘキサノン、ジイソブ
チルケトン、炭酸プロピレン、ニトロエタン、ト
ルエン、ベンゼン、ピリジン、エチレンジアミ
ン、キシレン、ニトロベンゼン、トリクロロベン
ゼン、シクロヘキサン、シクロヘキセン、アニリ
ン、キユメン、シメン、ブチルベンゼン、メシチ
レン、テトラリン、シクロヘキシルベンゼン、ジ
エチルベンゼン、ペンチルベンゼン、ジベンチル
ベンゼン、ドデシルベンゼン、スチレン、メチル
シクロヘキサン、エチルシクロヘキサン、メンタ
ン、デカリン、ピネン、塩化ベンジル、エチルベ
ンゼン、エチルシクロヘキサン、ジクロロメタ
ン、ヘキサクロロエタン、塩化イソプロピル、塩
化プロピル、ジクロロプロパン、トリクロロプロ
パン、塩化アリル、塩化ブチル、クロロペンタ
ン、トリクロロベンゼン、トリクロロエチレン、
パークロロエチレン、ジクロロエタン、テトラク
ロロエタン、ペンタクロロエタン、ジクロロベン
ゼン、ジクロロエチレン、トリクロロエチレン、
臭化プロピル、テトラクロロエチレン、クロロベ
ンゼン、クロロホルムがある。 The solvent used in the present invention may be any solvent that dissolves polysilazane, which is a ceramic precursor, such as gasoline, kerosene, petroleum ether, light oil, heavy oil, n-decane, 2-methylbutane, 2-methylpentane, dodecane, hexane,
Heptane, pentane, nonane, trimethylhexane, dodecene, heptene, hexene, 1-nonene, aviation lubricant, machine oil, turbine oil, n-tridecane, isooctane, n-octane, isobutyl acrylate, methyl methacrylate, ethyl methacrylate, Acetylacetone, ethyl acetoacetate, methyl acetoacetate, acetonitrile, acetone, methanol, ethanol, allyl alcohol, isoamyl alcohol, isopropyl alcohol, isopropyl ether, isobutyric acid, diethyl ether, 2-ethylhexanol, ethylene glycol, diethylene glycol, ethyl acetate, acetic acid Isopropyl, butyl acetate, methyl ethyl ketone, methyl isobutyl ketone, methyl isopropyl ketone, butyraldehyde, isobutanol, tetrahydrofuran, methylfuran, tetrahydropyran, 1,2-dibutoxyethane,
Acetal, pentanone, hexanone, diisobutylketone, propylene carbonate, nitroethane, toluene, benzene, pyridine, ethylenediamine, xylene, nitrobenzene, trichlorobenzene, cyclohexane, cyclohexene, aniline, kyumene, cymene, butylbenzene, mesitylene, tetralin, cyclohexylbenzene, diethylbenzene , pentylbenzene, dibentylbenzene, dodecylbenzene, styrene, methylcyclohexane, ethylcyclohexane, menthane, decalin, pinene, benzyl chloride, ethylbenzene, ethylcyclohexane, dichloromethane, hexachloroethane, isopropyl chloride, propyl chloride, dichloropropane, trichloropropane , allyl chloride, butyl chloride, chloropentane, trichlorobenzene, trichloroethylene,
Perchlorethylene, dichloroethane, tetrachloroethane, pentachloroethane, dichlorobenzene, dichloroethylene, trichloroethylene,
These include propyl bromide, tetrachloroethylene, chlorobenzene, and chloroform.
本発明に使用する接合機器は用いても良く用い
なくても良く接合部分の溶媒が乾燥するまで保持
できれば良い。 The bonding equipment used in the present invention may or may not be used as long as it can hold the solvent at the bonded portion until it dries.
このようにして行われたセラミツクス・ポリシ
ラザン接合成形体を焼結することによつて、複雑
な形状や中空体を有する接合セラミツクス成形体
を容易に得ることができる。すなわち複雑な形状
を持つセラミツクス成形体は、予め単純形状のセ
ラミツクス・ポリシラザン組成物成形体に分割し
て成形し、この成形体を溶媒存在下で接合させ、
その後焼結して複雑な形状を持つ接合セラミツク
ス成形体を容易に得ることができる。この接合セ
ラミツクス成形体は、例えば曲がりくねつた中空
ラインを内部に有することは容易であるので、従
来は製造できなかつた部材のセラミツクス化が可
能になる。 By sintering the ceramic-polysilazane bonded body formed in this manner, a bonded ceramic body having a complex shape or a hollow body can be easily obtained. That is, a ceramic molded body having a complicated shape is divided into simple shaped ceramic polysilazane composition molded bodies and molded in advance, and these molded bodies are joined in the presence of a solvent.
Thereafter, by sintering, a bonded ceramic molded body having a complicated shape can be easily obtained. Since this bonded ceramic molded body can easily have, for example, a meandering hollow line inside, it becomes possible to use ceramics for members that could not be manufactured in the past.
次に、本発明を実施例に基づき説明するが、一
部の例を示すものであり、本発明はこれらになん
ら限定されるものではない。
Next, the present invention will be explained based on Examples, but these are just some examples, and the present invention is not limited to these in any way.
実施例 1
Si3N4粉体(電気化学製SN9S)81.4重量%、セ
ラミツクス前駆体であるポリシラザン(前記(イ)の
タイプ;分子量800)18.2重量%及びパラフイン
ワツクス0.4重量%の混合物をニーダーにて溶融
混練しコンパウンドを得、射出成形法で5mm×5
mm×50mmの柱状体を2つ成形した。この2つの成
形体の各一端をアセトンに浸漬し、直ちに引き上
げ、その端面同士を直ちに貼り合わせて接合した
後、溶媒を乾燥してセラミツクス・ポリシラザン
成形体を得た。これを3℃/mmで700℃まで昇温
し、更に15℃/mmで1100℃まで昇温後、1850℃の
窒素ガス中9.5Kg/cm2の加圧下で焼結して接合セ
ラミツクス成形体を得た。この成形体の曲げ強度
は20.7Kg/mm2という接合セラミツクスでの強度が
得られた。Example 1 A mixture of 81.4% by weight of Si 3 N 4 powder (SN9S manufactured by Denki Kagaku), 18.2% by weight of polysilazane (type (a) above; molecular weight 800) which is a ceramic precursor, and 0.4% by weight of paraffin wax was kneaded. Melt and knead the compound to obtain a compound, and use the injection molding method to form 5mm x 5
Two columnar bodies measuring mm x 50 mm were molded. One end of each of the two molded bodies was immersed in acetone, immediately pulled up, and the end surfaces were immediately bonded together, and the solvent was dried to obtain a ceramic polysilazane molded body. This was heated to 700°C at a rate of 3°C/mm, then further raised to 1100°C at a rate of 15°C/mm, and then sintered under a pressure of 9.5 kg/cm 2 in nitrogen gas at 1850°C to form a bonded ceramic molded body. I got it. The bending strength of this molded body was 20.7 Kg/mm 2 compared to bonded ceramics.
実施例 2
Si3N4粉体(電気化学製SN9S)71.4重量%、焼
結助材のY2O3(三菱化成工業イツトリヤ0.8μm)
5.0重量%、A2O3(岩谷化学工業アルミナBタ
イプ)5.0重量%、セラミツクス前駆体であるポ
リシラザン(前記(イ)のタイプ;分子量1100)18.2
重量%及びパラフインワツクス0.4重量%の混合
物をニーダーにて溶融混練しコンパウンドを得、
射出成形法で5mm×5mm×50mmの柱状体を2つ成
形し、これからトルエンを用いて実施例1と同様
にしてセラミツクス・ポリシラザン成形体を得、
これを3℃/mmで700℃まで昇温し、更に15℃/
mmで1100℃まで昇温後、1850℃の窒素ガス中9.5
Kg/cm2の加圧下で焼結して接合セラミツクス成形
体を得た。この成形体の曲げ強度は47.3Kg/mm2で
あつた。Example 2 Si 3 N 4 powder (SN9S made by Denki Kagaku) 71.4% by weight, sintering aid Y 2 O 3 (Mitsubishi Chemical Itriya 0.8 μm)
5.0% by weight, A 2 O 3 (Iwatani Chemical Alumina Type B) 5.0% by weight, polysilazane which is a ceramics precursor (type (a) above; molecular weight 1100) 18.2
A mixture of 0.4% by weight and 0.4% by weight of paraffin wax was melt-kneaded in a kneader to obtain a compound.
Two 5 mm x 5 mm x 50 mm columnar bodies were molded by injection molding, and ceramic polysilazane molded bodies were obtained in the same manner as in Example 1 using toluene.
This was heated to 700℃ at a rate of 3℃/mm, and then further heated to 15℃/mm.
9.5 mm in nitrogen gas at 1850°C after heating to 1100°C
A bonded ceramic molded body was obtained by sintering under pressure of Kg/cm 2 . The bending strength of this molded body was 47.3 Kg/mm 2 .
実施例 3
SiC粉体(昭和電工製A−2)81.4重量%、セ
ラミツクス前駆体であるポリシラザン(前記(ロ)の
タイプ;分子量1300)18.2重量%及びパラフイン
ワツクス0.4重量%の混合物をニーダーにて溶融
混練しコンパウンドを得、射出成形法で5mm×5
mm×50mmの柱状体を成形し、これからヘプタンを
用いて実施例1と同様にしてセラミツクス・ポリ
シラザン成形体を得、これを3℃/mmで700℃ま
で昇温し、更に15℃/mmで1100℃まで昇温後、
1700℃のアルゴンガス中9.5Kg/cm2の加圧下で焼
結して接合セラミツクス成形体を得た。この成形
体の曲げ強度は18.3Kg/mm2であつた。Example 3 A mixture of 81.4% by weight of SiC powder (A-2 manufactured by Showa Denko), 18.2% by weight of polysilazane (type (b) above; molecular weight 1300), which is a ceramic precursor, and 0.4% by weight of paraffin wax was put into a kneader. Melt and knead to obtain a compound, and use the injection molding method to form 5mm x 5
A columnar body of mm x 50 mm was molded, and a ceramic polysilazane molded body was obtained using heptane in the same manner as in Example 1. This was heated to 700 °C at a rate of 3 °C/mm, and further heated to 15 °C/mm. After raising the temperature to 1100℃,
A bonded ceramic molded body was obtained by sintering under a pressure of 9.5 kg/cm 2 in argon gas at 1700°C. The bending strength of this molded body was 18.3 Kg/mm 2 .
〔実施例4〕
アルミナ粉体76.4重量%、マグネシヤ5.0重量
%、セラミツクス前駆体であるポリシラザン(前
記(ハ)のタイプ;分子量950)18.2重量%及びパラ
フインワツクス0.4重量%の混合物をニーダーに
て溶融混練しコンパウンドを得、射出成形法で5
mm×5mm×50mmの柱状体を成形し、これからヘプ
タン溶媒を用いて実施例1と同様にしてセラミツ
クス・ポリシラザン成形体を得、これを3℃/mm
で700℃まで昇温し、更に15℃/mmで1100℃まで
昇温後、1700℃の窒素ガス中9.5Kg/cm2の加圧下
で焼結して接合セラミツクス成形体を得た。この
成形体の曲げ強度は15.3Kg/mm2であつた。[Example 4] A mixture of 76.4% by weight of alumina powder, 5.0% by weight of magnesia, 18.2% by weight of polysilazane (type (c) above; molecular weight 950), which is a ceramic precursor, and 0.4% by weight of paraffin wax was mixed in a kneader. A compound is obtained by melt-kneading, and then molded using injection molding method.
A columnar body of mm x 5 mm x 50 mm was molded, and a ceramic polysilazane molded body was obtained in the same manner as in Example 1 using a heptane solvent.
The temperature was raised to 700°C at a rate of 15°C/mm, and the temperature was further raised to 1100°C at a rate of 15°C/mm, followed by sintering under a pressure of 9.5 kg/cm 2 in nitrogen gas at 1700°C to obtain a bonded ceramic molded body. The bending strength of this molded body was 15.3 Kg/mm 2 .
以上説明したように、この発明による接合セラ
ミツクス成形体は、セラミツクスのかかえている
複雑形状化の容易なる実現及び曲がりくねつた中
空ラインを内部に有するセラミツクス成形体の容
易なる実現が可能であり、セラミツクスの産業を
大きく発展させるものと期待される。
As explained above, the bonded ceramic molded body according to the present invention can easily realize the complicated shape of ceramics and can easily realize a ceramic molded body having a winding hollow line inside. It is expected that this will greatly develop the industry.
Claims (1)
ンを含む組成物から成る2以上の成形体を前記ポ
リシラザンの溶媒の存在下に接合させることを特
徴とするセラミツクス・ポリシラザン接合成形体
の製造方法。 2 請求項1において、前記組成物中のセラミツ
クスが窒化珪素、炭化珪素及びアルミナの内の少
なくとも1種であることを特徴とする前記方法。 3 請求項1又は2において、前記ポリシラザン
が下記ポリシラザン(イ),(ロ)及び(ハ)の内の少なくと
も1つであることを特徴とする前記方法。 前記ポリシラザン(イ)は、下記式() で示されるくり返し単位からなる骨格構造を有
し、下記式() で示されるくり返し単位からなる複数の先駆体
が、部分的に、下記式() で示されるシラザンと共に、下記式() で示される構造単位を形成し、また、部分的に先
駆体相互間で、下記式() で示される構造単位を形成して互に連結すること
により構成されるものである。 (ここに、R1,R2及びR3は、水素、炭素原子
数1〜6のアルキル基、炭素原子数1〜6のアル
コキシ基、置換若しくは非置換のビニル基、置換
若しくは非置換のアリル基、炭素原子数6〜10の
置換若しくは非置換のアリール基、アルキル基の
炭素原子数が1〜6のトリー若しくはジ−アルキ
ルシリル基又はアルキル基の炭素原子数が1〜6
のジアルキルアミノ基を表わし、R4は炭素原子
数1〜6のアルキル基、炭素原子数1〜6のアル
コキシ基、置換若しくは非置換のビニル基、置換
もしくは非置換のアリル基、炭素原子数6〜10の
置換若しくは非置換のアリール基又はアルキル基
の炭素原子数が1〜6のトリー若しくはジ−アル
キルシリル基を表わし、R1,R2,R3及びR4は互
に同じであつても異なつていてもよい。) 前記ポリシラザン(ロ)は、下記式() で示されるくり返し単位からなる骨格構造を有
し、下記式()及び() で示されるくり返し単位からなる複数の先駆体
が、相互間で下記式() で示される構造単位を形成して互に連結すること
により構成されるものである。 (ここに、R1は前記と同じ意味を表わし、R5
及びR6は炭素原子数1〜6のアルキル基、置換
若しくは非置換のビニル基、置換若しくは非置換
のアリル基、炭素原子数6〜10の置換若しくは非
置換のアリール基、アルキル基の炭素原子数が1
〜6のトリー若しくはジ−アルキルシリル基、ア
ルキル基の炭素原子数が1〜6のジアルキルアミ
ノ基を表わし、R1,R5及びR6は同じであつても
異なつていてもよい。) 前記ポリシラザン(ハ)は、下記式() で示されるくり返し単位からなる骨格構造を有
し、下記式()及び() で示されるくり返し単位からなる複数の先駆体
が、部分的に、下記式() で示されるシラザンと共に、下記式() で示される構造を形成し、また、部分的に先駆体
相互間で、下記式() で示される構造単位を形成して互に連結すること
により構造されるものである。 (ここに、R1,R2,R3,R4,R5及びR6は前記
と同じ意味を表わし、互に同じであつても異なつ
ていてもよい。) 4 請求項1,2又は3に記載の方法で製造した
成形体を800〜2200℃で焼成することを特徴とす
る接合セラミツクス成形体の製造方法。 5 請求項1に記載の方法において前記組成物が
更に焼結助剤を含むことを特徴とする前記方法。 6 請求項5において、前記組成物中のセラミツ
クスが窒化珪素、炭化珪素及びアルミナの内の少
なくとも1種であることを特徴とする前記方法。 7 請求項5又は6に記載の方法において、前記
ポリシラザンが請求項3に記載したポリシラザン
(イ),(ロ)及び(ハ)の内の少なくとも1つであることを
特徴とする前記方法。 8 請求項5,6又は7に記載の方法で製造した
成形体を950〜1900℃で焼成することを特徴とす
る接合セラミツクス成形体の製造方法。[Claims] 1. A ceramic-polysilazane bonded molded product characterized in that two or more molded products made of a composition containing powdered or fibrous ceramics and polysilazane are joined in the presence of a solvent for the polysilazane. Production method. 2. The method according to claim 1, wherein the ceramic in the composition is at least one of silicon nitride, silicon carbide, and alumina. 3. The method according to claim 1 or 2, wherein the polysilazane is at least one of the following polysilazane (a), (b), and (c). The polysilazane (a) is represented by the following formula () It has a skeletal structure consisting of repeating units represented by the following formula () A plurality of precursors consisting of repeating units represented by are partially expressed by the following formula () Along with the silazane represented by the following formula () Forms a structural unit represented by the following formula (), and also partially between the precursors: It is constructed by forming structural units shown in and connecting them to each other. (Here, R 1 , R 2 and R 3 are hydrogen, an alkyl group having 1 to 6 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, a substituted or unsubstituted vinyl group, a substituted or unsubstituted allyl group) group, a substituted or unsubstituted aryl group having 6 to 10 carbon atoms, a tri- or di-alkylsilyl group having an alkyl group having 1 to 6 carbon atoms, or an alkyl group having 1 to 6 carbon atoms.
represents a dialkylamino group, R 4 is an alkyl group having 1 to 6 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, a substituted or unsubstituted vinyl group, a substituted or unsubstituted allyl group, or a C 6 alkyl group. ~10 substituted or unsubstituted aryl groups or alkyl groups each representing a tri- or di-alkylsilyl group having 1 to 6 carbon atoms, and R 1 , R 2 , R 3 and R 4 are the same, and may also be different. ) The polysilazane (b) is represented by the following formula () It has a skeletal structure consisting of repeating units represented by the following formulas () and (). Multiple precursors consisting of repeating units represented by are mutually expressed by the following formula () It is constructed by forming structural units shown in and connecting them to each other. (Here, R 1 represents the same meaning as above, R 5
and R 6 is an alkyl group having 1 to 6 carbon atoms, a substituted or unsubstituted vinyl group, a substituted or unsubstituted allyl group, a substituted or unsubstituted aryl group having 6 to 10 carbon atoms, or a carbon atom of an alkyl group. number is 1
-6 tri- or di-alkylsilyl group, a dialkylamino group in which the alkyl group has 1 to 6 carbon atoms, and R 1 , R 5 and R 6 may be the same or different. ) The polysilazane (c) is represented by the following formula () It has a skeletal structure consisting of repeating units represented by the following formulas () and (). A plurality of precursors consisting of repeating units represented by are partially expressed by the following formula () Along with the silazane represented by the following formula () and also partially between the precursors, the following formula () It is constructed by forming structural units shown in and connecting them to each other. (Here, R 1 , R 2 , R 3 , R 4 , R 5 and R 6 have the same meaning as above and may be the same or different.) 4 Claims 1 and 2 or 3. A method for producing a bonded ceramic molded body, which comprises firing the molded body produced by the method described in 3 at a temperature of 800 to 2200°C. 5. The method of claim 1, wherein the composition further comprises a sintering aid. 6. The method according to claim 5, wherein the ceramic in the composition is at least one of silicon nitride, silicon carbide, and alumina. 7. In the method according to claim 5 or 6, the polysilazane is the polysilazane according to claim 3.
The method described above, characterized in that it is at least one of (a), (b), and (c). 8. A method for producing a bonded ceramic molded body, which comprises firing the molded body produced by the method according to claim 5, 6 or 7 at a temperature of 950 to 1900°C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34339689A JPH03205380A (en) | 1989-12-29 | 1989-12-29 | Production of ceramic-polysilazane joined molded body and joined ceramic molded body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34339689A JPH03205380A (en) | 1989-12-29 | 1989-12-29 | Production of ceramic-polysilazane joined molded body and joined ceramic molded body |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03205380A JPH03205380A (en) | 1991-09-06 |
| JPH0559078B2 true JPH0559078B2 (en) | 1993-08-30 |
Family
ID=18361193
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP34339689A Granted JPH03205380A (en) | 1989-12-29 | 1989-12-29 | Production of ceramic-polysilazane joined molded body and joined ceramic molded body |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03205380A (en) |
-
1989
- 1989-12-29 JP JP34339689A patent/JPH03205380A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03205380A (en) | 1991-09-06 |
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