JPH0560655B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION <Technical Field> The present invention relates to a method of attaching a semiconductor chip to a substrate.

<Prior art> When attaching a semiconductor chip to a substrate, when the semiconductor chip is connected to the substrate by a bonding method, a molding (sealing) process for the semiconductor chip is performed after the bonding process is completed. As described above, requiring two steps in assembly is time consuming and disadvantageous in terms of cost.

<Object of the Invention> In view of the above-mentioned circumstances, an object of the present invention is to provide an improved method for attaching a semiconductor chip to a substrate so that a bonding process and a molding process can be performed simultaneously.

<Example> Hereinafter, the configuration of the present invention will be described with reference to the drawings.

The method of attaching a semiconductor chip to a substrate according to the present invention consists of the following four steps.

(A) As shown in FIG. 1, the LSI chip 1 is placed on the substrate (PWB ) 4. At this time, the LSI pads 2a and 2b are
Positioning is performed to connect to conductor (copper) foils 5a and 5b patterned on the substrate 4, respectively. Note that this positioning is performed using a prism method such as a COS direct bonder or a method using two cameras.

(B) As a result of the above steps, the LSI chip 1 and the substrate 4 are temporarily attached, as shown in FIG. Note that each symbol in FIG. 2 is equivalent to the one already mentioned. (Above, the first step) (C) Subsequently, a preliminarily measured amount of foamed resin 5 is dropped onto the LSI chip 1 placed on the substrate 4. As shown in Figure 3, each symbol is the same as previously mentioned.
This foamed resin 5 is used for molding.

At this point, the foamed resin 5 remains on the LSI chip due to its viscosity. (that's all,
Second Step) (D) Next, the bonder head 6 is moved onto the LSI chip 1 onto which the foamed resin 5 has been dropped, and the bonder head 6 is lowered from above the LSI chip 1 toward the substrate 4.

Then, in the second step, the foamed resin 5 remaining on the LSI chip 1 is pressed against the bonder head 6 and flows.

This bonder head 6 is connected to the LSI chip 1.
, the thickness of the conductive adhesive film 3 plus the thickness of the foamed resin 5 when molded, and the length of the LSI chip 1 plus the thickness of the foamed resin 5 when molded. It has added width.

Therefore, as shown in FIG. 4, when the bonder head 6 is completely covered, the foamed resin 5 covers the LSI chip 1 and the conductive adhesive film interposed between the LSI chip and the substrate 4. Surround the area around 3. Each symbol in Fig. 4 is the same as previously mentioned. (Above, third step) (E) After that, heat is applied to the bonder head 6.

As a result of this heating, the conductive adhesive film 3 has adhesive properties, and the foamed resin 5 increases in volume.

Since the bonder head 6 presses from above and the substrate 4 is fixed with a fixing stand or the like,
The LSI chip 1 is pushed from above, and the conductive adhesive film 3 is further deformed. As a result, the above
The LSI chip 1 and the substrate 4 are firmly connected. (Fourth step) (F) After the foamed resin 5 is cured, the bonder head 6 is removed to complete the bonding and molding steps. See Figure 5. In addition, each number is the same as the one already published.

In this embodiment, the foamed resin 5 is heated and expands, and strongly presses the LSI chip 1 toward the substrate 4, so that the connection strength between the two is high.

<Effects> As described above, in the present invention, a predetermined amount of a mold member made of foamed resin is dropped onto a semiconductor chip mounted on a substrate, a bonder head is placed over the semiconductor chip on which the mold member has been dropped, and the bonder head is placed on the semiconductor chip mounted on a substrate. The material is flowed around the semiconductor chip and the bonding member interposed between the semiconductor chip and the substrate, and heated by the bonder head, which causes the mold member to expand and strongly press the semiconductor chip against the substrate, increasing the strength of the connection between the two. , is a method for attaching a semiconductor chip to a substrate by adhering with a bonding member and curing a molding member, and the effect is that the bonding process and the molding process are performed simultaneously while the semiconductor chip is hardened in close contact with the substrate. Semiconductors can be quickly commercialized and manufactured, resulting in cost advantages.

[Brief explanation of the drawing]

1 to 5 are process diagrams of a method for attaching a semiconductor chip to a substrate according to the present invention. 1... LSI chip, 3... Anisotropic conductive adhesive film, 4... Substrate, 5... Foamed resin, 6... Bonder head.

Claims (1)

[Scope of Claims] 1. A method for attaching a semiconductor chip to a substrate, comprising the steps of: placing the semiconductor chip on the substrate via a bonding member; foaming a predetermined amount on the semiconductor chip placed on the substrate; a step of dropping a mold member made of resin, a step of covering the semiconductor chip onto which the mold member has been dropped with a bonder head, and flowing the mold member around the semiconductor chip and the bonding member interposed between the semiconductor chip and the substrate. The method is characterized by comprising the steps of performing bonding with the bonding member and curing the mold member while the mold member expands by heating with the bonder head and presses the semiconductor chip against the substrate. How to attach a semiconductor chip to a board.