JPH0565229B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Technical Field The present invention relates to an apparatus for applying adhesive to a printed circuit board, and in particular to control of the application position and amount.

Conventional technology Equipment for applying adhesive to printed circuit boards includes
There are various aspects. For example, JP-A-59-
In the coating device described in Japanese Utility Model Publication No. 152689, adhesive contained in a syringe is injected in predetermined amounts by supplying compressed air. ,
The adhesive contained in the sealed container is pushed out using pins and applied directly to the printed circuit board. Although there are coating devices in other forms than these, in any case, the printed circuit board positioning and supporting device that positions and supports the printed circuit board and the coating device are moved relative to each other in a direction parallel to the board surface of the printed circuit board by a moving device. Then, the adhesive is applied in spots on a preset application position on the printed circuit board.

In addition, the application conditions include the type of adhesive to be applied,
It is set appropriately depending on the purpose and the like, and is controlled so that it is applied in a predetermined amount.

Problems to be Solved by the Invention However, the printed circuit board is not always accurately positioned at a predetermined position on the printed circuit board positioning and supporting device, and therefore the printed circuit board positioning and supporting device and the coating device are not always positioned in advance. Even if the adhesive is moved to a certain relative position, the application position set on the printed circuit board and the relative position of the application device do not always match, and the adhesive may not be applied at the correct position.

In addition, the properties of adhesives, such as their viscosity, are not always constant, and even if you set the application conditions so that a predetermined amount is applied, the amount applied may be too much or too little, resulting in problems later. Process work may be disrupted. Furthermore, there are cases where the set coating conditions themselves are inappropriate and the coating is not performed well.

In the coating apparatus described in JP-A No. 59-152689, prior to coating or during coating, if coating is stopped for a certain period of time or more, the coating apparatus is coated multiple times in addition to coating the printed circuit board. Adhesive is injected to eliminate variations in the amount of application due to hardening of the adhesive, etc. However, even with this method, the amount of application may be incorrect due to changes in the properties of the adhesive or inappropriate application conditions. It is impossible to avoid the occurrence of inappropriate problems.

Means for Solving the Problems In order to solve these problems, the adhesive applicator according to the present invention is provided with (a) a reference mark, and uses the reference mark as a reference. (b) a printed circuit board positioning and supporting device for positioning and supporting a printed circuit board with an adhesive application position set in advance; a coating device that automatically applies adhesive in spots according to coating conditions; (c) an imaging device that captures an image of the reference mark and the adhesive applied to the printed circuit board; and (d) the coating device and the imaging device. (e) a moving device that relatively moves the device and the printed circuit board positioning support device at least in a direction parallel to the board surface of the printed circuit board; is moved to a predetermined relative position, the imaging device takes an image of the reference mark, detects the positional deviation of the reference mark, and corrects the predetermined relative position by the positional deviation. (f) a measuring means for measuring the amount of adhesive applied based on an image of the adhesive taken by the imaging device; (g) and an application condition changing means for changing the application conditions so that the amount of adhesive applied becomes a set amount based on the measurement result of the measuring means.

In the coating apparatus configured as described above, once the printed circuit board is positioned and supported by the printed circuit board positioning and supporting device, the positioning control means causes the moving device to control the printed circuit board positioning and supporting device before starting to apply the adhesive. and the imaging device to a predetermined relative position. In this state, the positioning control means causes the imaging device to take an image of the reference mark provided on the printed circuit board, and detects the amount of deviation of the reference mark from the expected position from the imaging result.

The positioning control means then causes the moving device to move the printed circuit board positioning support device and the adhesive application device to a predetermined relative position and apply the adhesive to the application position set on the printed circuit board. However, at this time, the relative position between the printed circuit board positioning and supporting device and the adhesive coating device is corrected by the amount of deviation of the reference mark.

The application position on the printed circuit board is set based on the fiducial mark, so if the fiducial mark is misaligned, the application position will also be misaligned by the amount of misalignment, and if this misalignment is corrected, the adhesive will be removed. The coating will be applied accurately to the desired coating position.

Further, after the adhesive is applied, the applied adhesive is imaged at the imaging position, and the amount of adhesive applied is measured by the measuring means based on the imaged image of the adhesive. If the coating amount requires changing the coating conditions, the coating condition changing means automatically changes the coating conditions so that the coating amount becomes the set amount.

Effects of the Invention As described above, in the coating device according to the present invention,
The reference mark on the printed circuit board is imaged by the imaging device, the amount of deviation of this reference mark is detected, and the amount of deviation is corrected when relative positioning the coating device and the printed circuit board. Even if there is an error in the positioning of the printed circuit board, the adhesive will be applied exactly to the planned position.

In addition, the amount of adhesive applied is measured based on the image of the applied adhesive, and the application conditions are changed so that the amount of applied adhesive is a predetermined amount based on the measurement results, so the properties of the adhesive are not as expected. It is possible to apply the correct amount of adhesive to the printed circuit board even if the preset application conditions are different from the one applied or the preset application conditions are inappropriate, and if the amount applied is too much or too little, it may cause problems in the subsequent process. This has the effect that no hindrances will occur.

Moreover, since the reference mark and the adhesive are imaged by a common imaging device, the cost of the device can be reduced.

Embodiments Hereinafter, embodiments of the present invention will be described in detail based on the drawings.

FIG. 4 is a diagram showing the entire mechanism of the adhesive applicator, and in the figure, reference numeral 10 denotes an X-axis table that moves in the X-axis direction within a horizontal plane. The X-axis table 10 is moved by a ball screw screwed into a nut (not shown) rotated by a servo motor 11 (see FIG. 7). Further, on the X-axis table 10, a Y-axis table 12 is provided which moves in a Y-axis direction perpendicular to the X-axis direction in a horizontal plane. Y-axis table 12
A nut 14 fixed thereto is screwed onto a ball screw 16, and the ball screw 16 is rotated by a servo motor 18 to move it.

A pair of coating units 24 are attached to the side surfaces of the Y-axis table 12 parallel to the X-axis direction by brackets 26, each of which is a holding member.
The Y-axis table 12 constitutes a frame that supports the coating unit 24, and the bracket 2
6 is attached to the Y-axis table 12 so as to be movable up and down, and is raised and lowered by a lifting device 28 while holding the coating unit 24.

The bracket 26 is L-shaped as shown in FIG. 3, and a guide block 32 provided on one arm portion 30 is slidably fitted into a guide rail 34 provided on the Y-axis frame 12. ing. A block 36 is attached to the side surface of the Y-axis table 12 so as to extend downward, and a guide rail 34 is attached to the front surface of the block 36 so as to extend vertically.
is raised and lowered vertically at a position below the Y-axis table 12.

A gear housing 4 is mounted on the Y-axis table 12.
0 is fixed so that a part of it protrudes from the side surface, and a rack 42 is attached to the protrusion in the vertical direction via a pair of slide bearings 44, as shown in FIGS. 5 and 6. movably mounted. The gear housing 4 is mounted on the rack 42.
A gear 46 rotatably supported by the gear 46 is meshed with the gear 46. A sector gear 48 is integrally provided on the gear 46 and is meshed with another gear 50, which is rotated by a servo motor 52 to move the rack 42.

The lower end of the rack 42 has a yoke shape and is connected to a rod 54, as shown in FIG. 3, to which the bracket 26 is connected by a plate 56. One end of the plate 56 is fixed to the lower surface of the arm 30 of the bracket 26, and the other end is slidably fitted to the rod 54 and disposed between it and a spring receiver 58 provided on the rod 54. It is urged downward by a spring 60. The plate 56 is prevented from coming off the rod 54 by a nut 62 screwed into the lower end of the rod 54. The bracket 26 is raised and lowered when the plate 56 is raised and lowered integrally with the rod 54 while in contact with the nut 62. The rack 42, gear 46, sector gear 48, gear 50, servo motor 52, rod 54, plate 56, etc. constitute the lifting device 26. The rack 42 is designed to be lowered a short distance even after the bracket 26 reaches a predetermined lowering end position, but the extra lowering distance is absorbed by the compression of the spring 60. Further, the rising end of the rack 42 is detected by a photoelectric switch 66 provided on the gear housing 40, and the descending end of the rack 42 is detected by a photoelectric switch 68 provided on the plate 56.
(see FIG. 4), and switching of the servo motor 52 is performed based on the detection signal.

The other arm 70 of the bracket 26 extends horizontally from the lower end of the arm 30, and the application unit 24 is attached to this arm 70. As shown in FIG. 2, a cylindrical member 72 is fitted into the arm portion 70 via a sleeve 74 so as to be rotatable and immovable in the axial direction. The cylindrical member 72 has a stepped shape, and has a small diameter portion 76.
The large diameter portion 77 is fitted into the sleeve 74 , and is seated on the sleeve 74 at the large diameter portion 77 , and is prevented from rotating relative to the sleeve 74 by a pin 78 . Further, a discharge head 82 having one discharge pipe 80 is fitted into the lower end portion of the cylindrical member 72 protruding from the arm portion 70, and is engaged with a pin 84 to prevent rotation. It is fixed by a nut 86. A stopper 88 extending downward from the tip of the discharge pipe 80 is fixed to the discharge pipe 80.
When applying the adhesive, the stopper 88 is brought into contact with the printed circuit board to create a certain gap between the stopper 88 and the discharge pipe 80.

On the other hand, the sleeve 74 is rotatably supported by the arm portion 70, and a nut 90 is screwed onto the lower end portion protruding from the arm portion 70 to prevent movement in the axial direction. Further, a large diameter gear 92 is provided at the upper end of the sleeve 74. The large-diameter gear 92 is meshed with a small-diameter gear 94 (see FIG. 4) that is rotatably disposed about an axis extending vertically between the pair of units 24.
By rotating the small diameter gear 94 by the servo motor 96, the sleeve 74 and the cylindrical member 72 are rotated. A large-diameter gear 92, a small-diameter gear 94, a servo motor 96, etc. constitute a rotation drive device, and the discharge pipe 80 is connected to two points in order to apply adhesive to two points at a time.
When using this discharge head, the cylindrical member 72 is rotated by the rotary drive device when it is necessary to change the alignment direction of the two discharge pipes 80.

Furthermore, a syringe 9 is attached to the upper end of the cylindrical member 72.
8 is installed. The syringe 98 is made up of a bottomed cylindrical member 100 whose opening is closed by a cap 102, and a piston 104 fitted therein in an airtight and slidable manner. Syringe 9
8 is a holding member fixed on the sleeve 74 and is airtightly fitted into a fitting hole 110 formed in the large diameter portion 77 of the cylindrical member 72 at a small diameter fitting protrusion 108 formed at the lower end. 112, it is held immovable in the axial direction and immovable relative to each other. The holding member 112 has a cylindrical shape with a bottom, and its bottom wall is fitted into the cylindrical member 72 and the sleeve 74, and is fixed to the sleeve 74 with bolts 114. A pair of inward flange portions 116 are formed in the opening of the holding member 112, and have an inner diameter into which the syringe 98 can be fitted. Opening 11 with a notch reaching
8 is formed. Engagement protrusions 120 that extend outward are formed at two diametrically apart locations on the lower part of the syringe 98, and when the engagement protrusions 120 and the notches of the opening 118 are in phase with each other, the syringe 98 is held in the holding member. 112, the fitting protrusion 108 is fitted into the fitting hole 110, and the syringe 98 is rotated, so that the engagement protrusion 120 engages with the flange portion 116 and is prevented from moving in the axial direction. At the same time, the friction generated on the contact surface with the flange portion 116 prevents relative rotation. Note that the inner surface (lower surface) of the flange portion 116 is an inclined surface that slopes toward the bottom wall of the holding member 112 as it goes from one side in the circumferential direction to the other side, so that the syringe 98 As it rotates, it is pressed against the cylindrical member 72.

Furthermore, in the cap 102 of the syringe 98,
Hose 1 connected to a compressed air supply source (not shown)
22 are connected by a connecting fitting 124.
An electromagnetic directional valve 125 is installed in the middle of the hose 122.
(See Figure 7) is provided, and its switching valve 1
25 allows the syringe 98 to be alternatively communicated with the compressed air supply and the atmosphere. By supplying compressed air to the syringe 98, the piston 104 is lowered, and the adhesive is applied to the cylindrical member 72,
A predetermined amount is injected through a passage formed in the discharge head 82 and the discharge pipe 80.

As shown in FIG. 4, in this adhesive application apparatus, a camera 126 for reading reference marks provided on a printed circuit board is attached to a position adjacent to the application unit 24 on the Y-axis table 12.
The camera 126 includes a lens held by a holding tube 127, and a light projector 128 provided at the bottom of the camera 126 illuminates the reference mark during photographing. The reflected light from the reference mark irradiated by the projector 128 enters the range, and an image corresponding to the outer shape of the reference mark is formed on the solid-state image sensor of the camera 126, and the image is converted into a signal and output. . The adhesive application position is set based on the reference mark, and the reference mark is read prior to applying the adhesive. The amount of movement of the tables 10 and 12 is corrected based on the read results, so that the application unit 24 can be moved with high precision to the adhesive application position on the printed circuit board.

Although not shown, a printed circuit board positioning and supporting device is provided below the adhesive application device, and the printed circuit board is transported by the loading device and is positioned and supported by the positioning and supporting device before applying the adhesive. After coating, it is transported to the next process by a transport device.

The adhesive application device configured as described above is controlled by a computer 130 shown in FIG. The computer 130 includes a CPU (central processing unit) 132, a ROM (read only memory) 1
34, RAM (Random Access Memory) 136
It is equipped with 132 CPUs and 13 ROMs.
4. The RAM 136 is connected via the I/O port 138 to an input device 140, an operation start switch 142,
A stop switch 144 and an abnormality alarm 146 are connected to notify the abnormality when an abnormality occurs in the mechanical part of the adhesive application device. Input device 140
is the number of times N ₁ (three times in this example) and position of adhesive preliminary application, the number N ₂ (three times in this example) and position of adhesive preliminary application, the position of regular application, and the number N of applied areas. _3. Standard application amount of adhesive (in this example, it is indicated by the external area of the adhesive mass adhered to the printed circuit board by injection in plan view), compressed air supply time to the syringe 98, preliminary injection, and trial injection. The reference stop time T ₀ required to determine whether the adhesive applied by this coating device has hardened and pre-casting is required due to the interval when performing multiple times, interruption of coating, etc. This is for inputting information such as

Preliminary injection is an injection to remove the cured adhesive in the syringe 98 to ensure that injection is performed normally.Trial injection is an injection to ensure that injection is performed normally. This injection is performed to measure the amount of adhesive applied and set the injection conditions under the conditions in which the adhesive is applied. Further, in this embodiment, preliminary punching and trial punching are performed on a straight line parallel to the X-axis direction at a position that is away from the electronic component fixing position on the printed circuit board and has no relation to the wiring. Additionally, the positions for preliminary application, trial application, and regular application of adhesive are set based on reference marks provided on the printed circuit board.
Expressed in XY coordinates.

Above CPU132, ROM134, RAM136
Furthermore, servo motor drive circuits 150, 15
2,154,155, electromagnetic directional valve control circuit 1
56 and camera drive circuit 158, respectively.
Servo motor 11 for driving the X-axis table, servo motor 18 for driving the Y-axis table, and lifting device 28
servo motor 52, servo motor 96 for rotating the cylindrical member, electromagnetic directional control valve 125, camera 126,
A printed circuit board loading device, positioning support device, unloading device, etc. are connected.

Further, the CPU 132 is provided with a timer 164, and the RAM 136 is provided with a pre-stroke number counter 1.
66, trial application number counter 168, regular application number counter 170, _F1 to _F3 flags 172, 17
4,176, preliminary application information memory 180, trial application information memory 182, regular application information memory 18
4. Standard application amount memory 186, compressed air supply time memory 188, preliminary application/trial application number memory 190, preliminary application/trial application interval memory 1
92, stop time memory 194, test area memory 1 for storing the external area of the trial applied adhesive;
96 are provided. Further, the ROM 134 stores a program shown in the flowchart of FIG. 8, and the CPU 132 controls the adhesive application according to this program. Below, the 8th
Preliminary application, trial application, and regular application of adhesive will be explained based on the flowchart shown in the figure.

Step S1 (hereinafter referred to as
Abbreviated as S1. The same goes for other steps. )
In this step, each of the counter numbers C ₁ to _{C 3} of the counters 166 to 170 is set to 0, the flags 172 to 176 are reset, and the count number n indicating the number of preliminary stampings and trial stampings performed on one printed circuit board is set to 0. The initial setting to 0 is performed, and S2
Information is input using the input device 140 at . The input data is stored in a predetermined memory 180~
188, 192, and 194. The number of preliminary shots and the injection position are both stored in the preliminary shooting information memory 1.
80. The same is true for trial application and regular application, and the injection positions are input in the order of injection, and the count number of the counter specifies the injection position data to be read.
The counter number 0 specifies data regarding the first injection position. Once this input is completed and input completion data is input, the judgment result of S3 will be displayed.
YES, the reference mark is read in S4, and preliminary application of adhesive is performed in S5 and thereafter.

In S5, it is determined whether or not the F ₁ flag 172 is OFF, but the F 1 flag 172 is not set unless the preliminary application of adhesive is completed, and the F ₁ flag 172 is not set in S5.
The determination result is YES, and table movement information for preliminary printing is read out in S6. First, the position data for preliminary printing is read out, and after this position data is corrected based on the position of the reference mark read out in S4, the X-axis table 10 and Y-axis table 12 are adjusted in S7. A pair of application units 24 are moved.
Of these, the discharge pipe 80 of the coating unit 24 that is used for regular coating is moved so that it is located directly above the preliminary coating position. Subsequently, adhesive is applied in S8. The servo motor 52 is activated and the rack 42 is moved, thereby lowering the coating unit 24 held by the bracket 26. The racks 4 and 2 can be moved a short distance even after the stopper 88 contacts the printed circuit board, but this movement is controlled by the spring 60.
The distance between the discharge pipe 80 and the printed circuit board is maintained constant while avoiding damage to the stopper 88 and the printed circuit board. Coating unit 2
4 moves to the lowered position, the servo motor 52
is stopped, the electromagnetic directional switching valve 125 is switched, and compressed air is supplied to the syringe 98. As a result, the piston 104 is lowered, and adhesive is injected and applied to the printed circuit board.
When the compressed air has been supplied for a predetermined period of time, the electromagnetic directional control valve 125 is switched, the syringe 98 is communicated with the atmosphere, the injection of adhesive is stopped, and the servo motor 52 is activated to start the application unit 24. be raised.

Next, in S9, it is determined whether or not the _F2 flag 174 is OFF, but the result of this determination is
YES, and after the count number C ₁ of the counter 166 is increased by 1 in S10, C ₁ is increased in S11.
A determination is made as to whether or not is greater than or equal to N ₁ (in this case, 3), but initially the determination result is NO, and the program execution returns to S5. Next, the second preliminary striking position is read out in S6, and hereafter, in S11
S5 to S11 are repeatedly executed until the determination result becomes YES, and a preliminary strike is performed. As a result, even if some time has passed since the last application performed using this adhesive application device and the adhesive has hardened to some extent at the outlet of the discharge pipe 80, the application process will be repeated N ₁ times. The preliminary injection removes this lump and allows normal injection.

After the preliminary hitting is performed as described above, a trial hitting is performed. If the preliminary strike is performed _N times and the judgment result in S11 is YES, then in S12
After F ₁ and F ₂ flags 172 and 174 are turned ON,
The program execution returns to S5, but the judgment result is NO, and the judgment result of the subsequent S13 is YES,
In S14, the position of the first trial shot is read out, and corrections are made based on the positional error of the reference mark. Next, in S7, the coating unit 24 used for preliminary application is moved, and its discharge pipe 80 is positioned directly above the trial application position. Then, the adhesive is injected in S8, but the judgment result in the subsequent S9 is NO, and in S15
The determination result is YES, and S16 is executed.
In S16, the X-axis table 10 and the Y-axis table 12 are moved, and the camera 126 is moved directly above the adhesive applied by trial printing. The movement in this case is performed based on the movement information for the trial shot read out in S14, and the camera 126 photographs the lump of adhesive adhered to the printed circuit board after the trial shot. An image of the outline of the adhesive in plan view is formed on the surface of the solid-state image sensor, converted into a binary signal, and output to the computer 130. As a result, the external area of the photographed adhesive is calculated in the calculating section of the computer 130 and stored in the test area memory 196.

Next, in S17, the count number _C2 of the counter 168 is incremented by 1, and in S18, it is determined whether the count number is greater than or equal to _N2 (here, 3), but the determination result is initially NO. Then, program execution returns to S5.

Hereafter, S5, until the judgment result of S18 becomes YES,
S13, 14, S7-S9, and S15-S18 are repeatedly executed. Then, if the trial shot is performed N ₂ times and the judgment result in S18 is YES, in S19 the average value of the external area of the adhesive photographed for each of the three trial shots is calculated, The average value is compared with a preset reference value, and the supply time of compressed air to the syringe 98 is corrected so that the application amount becomes the reference value. If the average value is larger than the reference value, the injection amount is too large, and the compressed air supply time is shortened to reduce the amount. If the average value is smaller than the reference value, the compressed air supply time is lengthened. . Although the standard values are set within a certain range, they are set within a relatively narrow range between the maximum and minimum allowable application amounts, and the compressed air supply time set by one correction is Even if the time at which the reference coating amount is obtained does not match, the adhesive is prevented from being connected to the adhesive applied adjacently or from being insufficiently coated. After the compressed air supply time is corrected in this way,
In S20, the _F3 flag 176 is turned ON, and the program execution returns to S5.

The judgment result of S5 is NO, and the judgment result of S13 is also
When it is turned ON, S21 is executed, and table movement information for regular coating is read out. First, information on the position where adhesive is applied is read out, and corrections are made based on the reference mark position error.
Subsequently, the coating unit 24 on which the trial application was performed is moved in S7, and coating is performed in S8. The judgment result of S9 is NO, and the judgment result of S15 is also
If the answer is NO, the count number _C3 of the counter 170 is incremented by 1 in S22, and then it is determined in S23 whether or not an abnormal signal or a stop signal has been issued. There is no abnormality in the mechanical part of the coating device.
If the stop switch 144 is also not operated, the result of this determination is NO, and in S24 it is determined whether C ₃ is greater than or equal to N ₃ , that is, the total number of adhesive application positions, but this determination result is NO. Yes, program execution returns to S5.

Hereafter, S5, until the judgment result of S24 becomes YES,
S13, S21, S7 to S9, S15, and S22 to S24 are repeatedly executed. During this time, if some abnormality occurs in the mechanism of the adhesive applicator and an abnormal signal is issued, or if the stop switch 144 is operated,
The determination result in S23 becomes YES, and the operation of the device is stopped in S30. Next, in S31, after the count number T of the timer 164 is increased by 1,
In S32, it is determined whether the stoppage has been canceled, that is, whether the operation start switch 142 has been operated. Until the judgment result of S32 becomes YES
S31 and S32 are repeatedly executed, and the stop time is measured by the timer 164. If the stoppage is canceled and coating is restarted, the determination result in S32 becomes YES, and in S33 it is determined whether the stoppage time T is longer than the stoppage reference time _T0 . If the stop time is short, the determination result in S33 becomes NO, and the program execution returns to S23, where coating is performed from the position next to the position where coating was being performed at the time of stop.

Also, the stop time is long and the judgment result of S33 is YES.
If so, S34 is executed, the F ₁ to _{F 3} flags 172 to 176 are turned off, C ₁ and C ₂ are set to 0, and the A is added to all values, and the number n of preliminary shots/trial shots is set to 1. Therefore, the next time S5 and below are executed, S5, S9,
The determination results in S13 and S15 are YES, and preliminary shots and trial shots are performed again. You can also specify the table movement position during preliminary hitting and trial hitting.
Since A is added to the coordinate value, the pre-strike can be performed without overlapping the previously applied adhesive at a position that is a distance A apart in the X-axis direction from the position where the previous pre-strike or trial run was performed. A trial shot will be held.

Then, after preliminary shots and trial shots are performed a predetermined number of times, and the compressed air supply time is corrected,
Regular dispensing is resumed. Since the counter 170 has not been reset, coating will continue from the next position that was being coated before the interruption.

If the adhesive has been applied to all the electronic component fixing points on one printed circuit board, the determination result in S24 becomes YES, and in S25 it is determined whether the application work has been completed for the planned number of printed circuit boards. However, initially, the result of this determination is NO. Therefore, in S26, the F ₃ flag 176 is reset, C ₂ and C ₃ are set to 0, and the value of the X coordinate that specifies the table movement position for preliminary hitting and trial hitting is returned to the value at the time of inputting the movement information. After
In S27, n is set to 0 and the program execution is
Returning to S5, the next printed circuit board to be transported is tested and the proper coating is performed. A test drive is performed for each printed circuit board. When the adhesive has been applied to a predetermined number of printed circuit boards, the determination result in S25 becomes YES, and the F ₁ to _{F 3} flags 172 to 176 are set in S28.
is reset, C ₁ to C ₃ are set to 0, and
After the value of the X coordinate of the injection position data is returned to its original value in the same manner as in S26, n is set to 0 in S29, and the execution of the program ends.

In this way, according to the adhesive applicator of this embodiment, trial application is performed prior to regular application of adhesive to the printed circuit board, and the compressed air supply time to the syringe 98 is adjusted based on the result. For,
The advantage is that there is no need to apply an excessive amount of adhesive and cause wiring defects due to adjacent adhesives being connected, or prevent problems in fixing electronic components due to insufficient amount of adhesive applied.

In addition, a preliminary shot was held prior to the trial shot,
Since the trial application is performed with the adhesive being injected normally, it will not be affected even if the adhesive in the syringe 98 has hardened to some extent, and the application will be performed in the same condition as when regular application is performed. By measuring the applied amount of the injected adhesive, the compressed air supply time can be set more accurately.

Further, even if the regular adhesive application is interrupted for a certain period of time or more, preliminary application and trial application are performed, so that it is possible to eliminate variations in the amount of application due to the interruption of application.

As is clear from the above explanation, ROM134
Area for storing S5 to S15, S17, S18, F ₁ , F ₂
Flags 172, 174, counters 166, 16
8, memory 180, 182, 190, 192,
The part of the CPU 132 that executes the above steps constitutes a trial run execution means, and this trial run execution means is connected to the area _F3 of the ROM 134 that stores S22 to S34.
Flag 176, counter 170, timer, CPU
The application means is constituted together with a regular application execution means constituted by the part 132 that executes the above-mentioned steps, and an application mechanism section equipped with a syringe 98. In addition, the camera 126 constitutes an imaging device, and an area for storing S16 of the ROM 134,
The part that executes S16 of the CPU 132 and the arithmetic unit constitute the measurement means, and the area that stores S19 of the ROM 134, the memories 186, 188, 196, and the CPU
The part that executes S19 of 132 constitutes a coating condition changing means.

In addition, in the above embodiment, the printed circuit board 1
Trial strikes started to be conducted for each sheet, but
This may be performed for each of a plurality of boards, or if there are many adhesive application areas on one printed circuit board, a test shot may be performed in between.

Further, the test shot is not limited to the printed circuit board, but may be performed on another member such as a member exclusively for the test shot. Even if it is a printed circuit board, if it is used only for trial driving, it is a member only for trial driving.When a printed circuit board is used only for trial driving, it is placed at the regular coating position as in the above example, that is, on the printed circuit board. Adhesive may be applied at locations other than those required to complete the structure, or may be applied to some of the normal application locations.

Another embodiment of the invention is shown in FIGS. 9 and 10. In this embodiment, the amount of adhesive applied is measured every predetermined number of times during regular application, and if the amount of adhesive applied is inappropriate, the application conditions are changed.

In this embodiment, the ROM of the computer 130
136, as shown in FIG. 9, a total number of applications counter 200, a measurement number counter 202, a number of applications counter 204, and a flag 20 for measuring the amount of application.
6. Application information memory 208, standard application amount memory 2
10, an allowable coating amount memory 212, a compressed air supply time memory 214, a coating area memory 216, a measurement number memory 218, and a coating number memory 220 are provided. The total number of applications counter 200 counts the total number of applications applied to one printed circuit board, the measurement number counter 202 counts the number of times the amount of adhesive applied is measured, and the number of applications counter 204 counts the number of times the amount of adhesive applied is measured. This is to count the number of applications that do not occur. The coating information memory 208 is the same as the regular coating information memory 184, and stores the total number of coatings α and the coating position. The standard coating amount memory 210 is the same as the standard coating amount memory 186, and stores the maximum and minimum values of the standard coating amount determined within a certain range. Further, the allowable application amount memory 212 stores the upper limit and lower limit amount of adhesive necessary for fixing electronic components to a printed circuit board, and the allowable maximum amount and allowable minimum amount are wider than the standard application amount. Set in range. The compressed air supply time memory 214 is the same as the compressed air supply time memory 188, and the coating area memory 216 is the same as the trial application area memory 19.
It is the same as 6. Furthermore, the measurement number memory 2
18 stores the number of times β of measuring the amount of application.
The number of times of application memory 220 stores the number of times of application γ without measuring the amount of application. Further, the ROM 134 stores a flowchart shown in FIG. 10, and the adhesive application will be described below based on this flowchart.

S101 to S107 are the same as S1 to S4, S21, S7, and S8, and the X-axis table 10 and Y-axis table 12 are moved based on the table information stored in the coating information memory 208 to a predetermined position. Adhesive is applied sequentially. After applying to one place, S108
The count number of the total number of applications counter 200 at
C _T is increased by 1, and then in S109 it is determined whether C _T is equal to or greater than the total number of applications α, but this determination result is initially NO, and in S110 the application amount measurement flag 206 is set. A determination is made as to whether or not it has been set. Flag 206 is
This is set in the initial settings in S101, and the determination result is YES, and in S111, the camera 126 is moved to photograph the applied adhesive and the external area is calculated, as in S16. Application area memory 216
is memorized.

Next, in S112, the measurement number counter 202
After the count number C _o is increased by 1, it is determined in S113 whether or not C _o is equal to or greater than the number of measurements β. This judgment result was initially NO,
Program execution returns to S105. Thereafter, S105 to S113 are repeatedly executed until the determination result in S113 becomes YES. The coating amount is measured a predetermined number of times,
If the determination result in S113 is YES, the average value of the measured adhesive application area is calculated in S114, and then in S115 it is determined whether the average value is larger than the maximum allowable application amount. be exposed. A printed circuit board with more adhesive than the maximum allowable amount is unsuitable for use as a product, and there is no need to continue applying adhesive, and an alarm will be issued in S117 to prevent the amount of adhesive applied The worker is notified that an abnormality has occurred. Based on this notification, the operator takes appropriate actions, such as discarding the printed circuit board and adjusting the compressed air supply time.

When the operator completes these processes, he inputs completion, and the determination result in S118 becomes YES, and the program execution returns to S105, where the application of adhesive to the next printed circuit board is started.

On the other hand, if the average value of the coating amount is smaller than the maximum allowable coating amount, the determination result in S115 is NO, and it is determined in S116 whether or not it is smaller than the minimum allowable coating amount. If it is small
If the judgment result in S116 is YES, S117 and S118 are executed in the same way as in the above case, and if the amount is large, the amount of adhesive applied is within the allowable range.
S119 is executed.

In S119, it is determined whether the average value of the applied amount is larger than the maximum value of the reference range, and if it is larger, the compressed air supply time is shortened in S121, and the contents of the memory 214 are rewritten in S122. After that, S123 is executed, the measurement number counter 218 and the measurement number flag 206 are reset, and the program execution returns to S105. Further, if the determination result in S119 is NO, S120 is executed, and it is determined whether the average value is smaller than the minimum value of the reference range. If it is small, the compressed air supply time is lengthened in S214 and the contents of the memory 214 are rewritten in S122, whereas if it is large, the application amount is within the standard range, and the compressed air supply time is corrected. is not done, and after S123 is executed, the program execution is
Return to S105.

Next time S110 is executed, the determination result is
When the result is NO, S125 is executed, and the count number C _N of the coating number counter 204 is incremented by 1, and then S126
It is determined whether C _N is equal to or greater than the number of applications γ. The determination result is initially NO, and the program execution returns to S105, where adhesive application continues. Thereafter, S105 to S110, S125, and S126 are repeatedly performed until the determination result of S126 becomes YES. The adhesive is applied γ times,
If the determination result in S126 is YES, S127 is executed, and after the counter 204 is cleared and the measurement flag 206 is set, the program execution returns to S105. Next time S110 is executed, the judgment result will be YES and S111 to S124 will be executed.
is carried out, the amount of adhesive applied is measured, and the compressed air supply time is corrected if necessary.

Then, if the adhesive has been applied α times to one printed circuit board, the judgment result in S109 will be YES,
Counters 200, 202, 204 in S128
After the flag 206 is cleared and the flag 206 is set, S129 is executed to determine whether or not the coating work has been completed for the scheduled number of printed circuit boards. Initially, the result of this determination is NO. Therefore, the program execution returns to S105, and adhesive is applied to the next printed circuit board to be transported. Once the adhesive has been applied to the scheduled number of printed circuit boards, the determination result in S129 becomes YES, and the program execution ends.

In this way, in this embodiment, the application amount is measured when the adhesive is normally applied to the printed circuit board, and the compressed air supply time is corrected if necessary based on the measurement results. The amount of application is always maintained at an appropriate level. In particular, in this embodiment, the amount of adhesive applied is measured at the beginning of application, so if the amount of applied adhesive is not appropriate, it can be dealt with quickly, and the adhesive is not wasted or the standard amount is measured. This avoids producing a printed circuit board with external adhesive applied in many places.

In addition, if the amount of adhesive applied exceeds the allowable range, the operator is notified and appropriate measures are taken, which prevents defective products from being mixed with standard products. .

As is clear from the above description, in this embodiment, the application mechanism section equipped with the syringe 98,
The area for storing S101 to S109 and S125 to S129 of the ROM 134, the part of the CPU 132 that executes these steps, the counters 200 and 204, and the memory 20
8, 220, etc. constitute the application means, and the camera 126
constitutes the imaging device, and S101 and S110 of ROM134
~ Area for storing S113, S123, S127, S128,
the portion of the CPU 132 that executes those steps;
measurement number counter 202, measurement flag 206,
The coating area memory 216, the measurement number memory 218, etc. constitute the measuring means, and S114 to 122 of the ROM 134,
S124, the portion of the CPU 132 that executes these steps, the reference coating amount memory 210, the allowable coating amount memory 212, etc. constitute coating condition changing means.

In this embodiment, the amount of coating is measured for each printed circuit board after a certain number of coatings, but the amount of coating may be measured every time the coating is applied.

In addition, measurements were taken multiple times to determine the average coating amount.
Although it was designed to compare the allowable application amount and the reference application amount, the application amount obtained by one measurement may be compared with the allowable application amount and the reference application amount.

Furthermore, in this embodiment as well, preliminary striking and trial striking may be performed in the same way as in the previous embodiment.

Furthermore, in each of the above embodiments, the syringe 98
Previously, the amount of adhesive applied was changed by adjusting the supply time of compressed air to the
The amount of coating may be changed depending on the combination thereof.

Furthermore, the mechanism for applying adhesive to a printed circuit board is not limited to one equipped with a syringe, and as shown in FIG.
0, and after plunging the cylindrical nozzle 232 into the adhesive, it may be taken out and the adhesive attached to the tip may be applied to the printed circuit board. In this case, the temperature and viscosity of the adhesive or the nozzle 232
By changing the depth of insertion into the container 230, the amount of adhesive that adheres, that is, the amount of adhesive applied can be changed. The depth of penetration of the nozzle 232 can be changed by changing the vertical distance of the nozzle 232, but can also be changed by adjusting the height of the container 230. The container 230 is placed on a table 236 via a height adjustment mechanism 234, and the height of the container 230 is adjusted so that a desired amount of adhesive adheres to the nozzle 232.

Further, as shown in FIG. 12, the plate material 240
The nozzle 244 is attached to the adhesive layer 242 formed on the adhesive layer 242.
It is also possible to stick the adhesive into the tip and apply it to the printed circuit board. In this case, the coating amount can be changed by changing the thickness of the adhesive layer 242.

Furthermore, it is also possible to use the coating apparatus described in the above-mentioned Japanese Utility Model Publication No. 57-58794.

Furthermore, in each of the above embodiments, the outer area of the adhesive applied and attached to the printed circuit board was measured to set the application conditions, but the height was also measured and the adhesive adhered to the printed circuit board was measured. Alternatively, the volume may be determined and the coating conditions may be set based on the volume.

Further, the applied adhesive may be measured not only by the camera 126 but also by other means.

In addition, various modifications and variations may be made to the elevating device, etc., based on the knowledge of those skilled in the art, although we will not give examples of each.
The invention can be practiced in modified forms.

[Brief explanation of the drawing]

FIG. 1 is a block diagram showing the configuration of the present invention. FIG. 2 is a side sectional view showing the main parts of an adhesive coating device according to an embodiment of the present invention. FIG. 3 is a side view of the coating device, and FIG. 4 is a front view. FIG. 5 is a side sectional view showing the lifting device constituting the above device, and FIG. 6 is a plan sectional view.
FIG. 7 is a block diagram of a control device that controls the adhesive coating device. FIG. 8 is a flowchart showing a portion of the program stored in the ROM of the computer that constitutes the main body of the control device, which is closely related to the present invention. FIG. 9 is a block diagram showing the configuration of the RAM of a computer that forms the main body of a control device for controlling an adhesive applicator according to another embodiment of the present invention, and FIG. 10 shows a program stored in the ROM. It is a flowchart. FIG. 11 and FIG. 12 are front sectional views each schematically showing another aspect of the coating mechanism section. 10: X-axis table, 12: Y-axis table, 2
8: Lifting device, 80: Discharge pipe, 98: Syringe,
125: Electromagnetic directional control valve, 126: Camera, 13
0: Computer, 232, 244: Nozzle.

Claims (1)

[Scope of Claims] 1. A printed circuit board positioning and supporting device for positioning and supporting a printed circuit board provided with a reference mark and with an adhesive application position set in advance based on the reference mark; an application device that automatically applies adhesive in spots according to set application conditions to the application position of a printed circuit board supported by the device; and an image of the reference mark and the adhesive applied to the printed circuit board. a moving device that relatively moves the coating device, the imaging device, and the printed circuit board positioning and supporting device at least in a direction parallel to the board surface of the printed circuit board; and the printed circuit board positioning support device to a predetermined relative position, the imaging device takes an image of the reference mark, detects the positional deviation of the reference mark, and adjusts the predetermined relative position by the amount of the positional deviation. a positioning control means that causes the moving device to position the coating device and the printed circuit board positioning and supporting device while making corrections; and a measuring device that measures the amount of adhesive applied based on an image of the adhesive taken by the imaging device. and a coating condition changing means for changing the coating condition so that the applied amount of adhesive becomes a set amount based on the measurement result of the measuring means.