JPH0567064B2 - - Google Patents
Info
- Publication number
- JPH0567064B2 JPH0567064B2 JP60287843A JP28784385A JPH0567064B2 JP H0567064 B2 JPH0567064 B2 JP H0567064B2 JP 60287843 A JP60287843 A JP 60287843A JP 28784385 A JP28784385 A JP 28784385A JP H0567064 B2 JPH0567064 B2 JP H0567064B2
- Authority
- JP
- Japan
- Prior art keywords
- axle
- jig
- wheel
- semiconductor wafer
- wheels
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Description
【発明の詳細な説明】
産業上の利用分野
この発明は、車輪付きの半導体ウエハー用治具
に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application This invention relates to a wheeled semiconductor wafer jig.
従来の技術
半導体ウエハーを載せて炉芯管の内部に搬入す
るための半導体ウエハー用治具には、特開昭56−
42333号公報、特開昭60−142513号公報および米
国特許3705714号に記載された従来技術がある。Conventional technology A semiconductor wafer jig for loading a semiconductor wafer and carrying it into a furnace core tube was developed in Japanese Patent Application Laid-open No. 1983-
There are conventional techniques described in Japanese Patent Application Laid-open No. 42333, Japanese Patent Application Laid-open No. 142513/1983, and US Pat. No. 3,705,714.
特開昭56−42333号公報、特開昭60−142513号
公報に開示されている半導体ウエハー用治具の車
輪部は、車軸と車輪が分割体で形成されており、
ピン等で車輪がはずれないようになつているが、
車軸が回転しない構造になつている。 In the wheel portion of the semiconductor wafer jig disclosed in Japanese Patent Application Laid-open No. 56-42333 and Japanese Patent Application Laid-Open No. 60-142513, the axle and the wheel are formed as separate bodies,
The wheels are secured with pins, etc., but
The structure is such that the axle does not rotate.
これは治具の回転部の摩擦をできるだけ小さく
し、半導体ウエハーに有害となるダストの発生を
できるだけ防ぐためである。 This is to minimize the friction of the rotating parts of the jig and to prevent the generation of dust that would be harmful to semiconductor wafers as much as possible.
発明が解決しようとする問題点
しかしこのように車輪と車軸が分割体になつて
いると車輪がガタつくため、炉芯管内に搬出入す
る際に直進性が悪く、炉芯管と車輪の摩擦が大き
くなつてダストが発生する。またマザーボードの
挿入・引出においてオートローダに負荷がかか
り、スピードの誤差を生じる欠点があつた。Problems to be Solved by the Invention However, when the wheels and axles are separated into separate bodies, the wheels wobble, making it difficult to move straight when loading and unloading them into the furnace core tube, and causing friction between the furnace core tube and the wheels. becomes larger and generates dust. Another drawback was that loading and unloading the motherboard placed a load on the autoloader, resulting in speed errors.
また米国特許3705714号のFig.2のように、車輪
と車軸を一体とし、車軸を滑らかに研摩したもの
があるが、車軸と本体との接触面積が大きくダス
トを防ぐ効果は小さい。 Also, as shown in Fig. 2 of US Pat. No. 3,705,714, there is a device in which the wheels and axle are integrated and the axle is polished smoothly, but the contact area between the axle and the main body is large and the effect of preventing dust is small.
尚、従来の治具は何れも構造が複雑であり、治
具の洗浄が繁雑で清浄することが困難であつた。 Note that all conventional jigs have complicated structures, making cleaning the jigs complicated and difficult.
本発明は、炉芯管内に搬出入する際に直進性が
よく、半導体ウエハーに有害なダストが発生にく
く、かつ洗浄が容易な車輪付きの半導体ウエハー
用治具を提供することを目的とするものである。 An object of the present invention is to provide a semiconductor wafer jig with wheels that has good straightness when carried into and out of a furnace core tube, hardly generates harmful dust on semiconductor wafers, and is easy to clean. It is.
問題点を解決するための手段
この目的を達成するために、本発明は、半導体
ウエハー支持台の先端部、後端部の両方に着脱自
在に取り付けられた車輪を有する半導体ウエハー
を支持するための治具において、支持台の中間部
に穴群が形成され、それが円弧断面形状であり、
治具本体の両端部が中空状であり、各端部の下面
側の一部を切り欠くことによつて車輪取り付け部
を形成し、これに車輪と車軸が一体となつている
車輪部材を装着し、かつ車軸の下から車軸取り付
け部の下面に凸部を有する板を当接した構造を有
し、上記各構成部材が石英ガラス材質やSiC材質
またはSi−SiC材質からなることを特徴とする半
導体ウエハー用治具を要旨としている。Means for Solving the Problems In order to achieve this object, the present invention provides a device for supporting a semiconductor wafer that has wheels removably attached to both the front end and the rear end of a semiconductor wafer support. In the jig, a group of holes is formed in the middle part of the support base, and the hole group has an arcuate cross-sectional shape.
Both ends of the jig body are hollow, and by cutting out a part of the lower surface of each end, a wheel mounting part is formed, and a wheel member in which the wheel and axle are integrated is attached to this part. and has a structure in which a plate having a convex portion is in contact with the lower surface of the axle mounting portion from below the axle, and each of the above-mentioned constituent members is made of quartz glass material, SiC material, or Si-SiC material. The main subject is jigs for semiconductor wafers.
実施例 １ 第１図〜第４図を参照する。Example 1 Please refer to FIGS. 1-4.
第１図の半導体ウエハー用治具本体１は、ウエ
ハーボード（図示せず）を載せて支持するための
支持台２と２つの端部材３を有する。すなわちこ
のウエハーの支持台２の先端と後端には、端部材
３がそれぞれ固定してある。ウエハーボードは多
数のウエハーを並べて置れるのである。 The semiconductor wafer jig main body 1 shown in FIG. 1 has a support base 2 on which a wafer board (not shown) is placed and supported, and two end members 3. That is, end members 3 are fixed to the front and rear ends of the wafer support stand 2, respectively. A wafer board can hold many wafers side by side.
支持台２は、第３図に示すように円弧断面形状
となつている。そしてその中間部に穴部２ａが形
成してある。 The support stand 2 has an arcuate cross-section as shown in FIG. A hole 2a is formed in the middle.
また、端部材３，３は中空体である。その断面
はほぼ長方形であるが四隅は丸くなつている。 Further, the end members 3, 3 are hollow bodies. Its cross section is almost rectangular, but the four corners are rounded.
第２図と第４図に示すように、端部材３の各下
面側の一部には切り欠き部４がそれぞれ形成して
ある。この切り欠き部４の巾は、車輪５の大径部
５ａに合わせた大きさである。これによつて、車
軸５を取り付けるための車軸取り付け部６を形成
している。この車軸取り付け部６には、車輪部材
７の車軸５を着脱可能にはめこみ装着する。車輪
部材７は、車軸５と車輪８を一体化したものであ
る。 As shown in FIGS. 2 and 4, cutouts 4 are formed in a portion of the lower surface of each end member 3. As shown in FIGS. The width of this notch portion 4 is sized to match the large diameter portion 5a of the wheel 5. This forms an axle attachment portion 6 to which the axle 5 is attached. The axle 5 of the wheel member 7 is removably fitted into the axle mounting portion 6. The wheel member 7 is made by integrating the axle 5 and the wheel 8.
さらに、車軸５の下から車軸取り付け部６の下
面６ａ側に板９を当接してある。板９は開口部３
ａに挿入したり取り出したりする。この板９は、
凸部１０を有する。この凸部１０は切り欠き部４
に合う大きさで下に向いている。ところで、支持
部２、端部材３および車輪部材７と板９は、石英
材質たとえば石英ガラス材質やSiC材質またはSi
−SiC材質で作られている。 Furthermore, a plate 9 is placed in contact with the lower surface 6a of the axle mounting portion 6 from below the axle 5. Plate 9 is opening 3
Insert or take out a. This board 9 is
It has a convex portion 10. This convex portion 10 is the cutout portion 4
It is sized to fit and faces downwards. By the way, the support part 2, the end member 3, the wheel member 7, and the plate 9 are made of quartz material, for example, quartz glass material, SiC material, or Si
-Made of SiC material.
実施例 ２
第５図〜第８図を参照する。第５図の半導体ウ
エハー用治具本体２１は、ウエハーボードを載せ
て支持するための支持台２２と２つの端部材２３
を有する。このウエハー支持台２２の先端と後端
には、端部材２３がそれぞれ固定してある。Example 2 Please refer to FIGS. 5 to 8. The semiconductor wafer jig main body 21 shown in FIG. 5 includes a support base 22 for mounting and supporting a wafer board, and two end members 23.
has. End members 23 are fixed to the front and rear ends of this wafer support stand 22, respectively.
支持台２２は、第７図に示す形状となつてい
る。そしてその中間部に穴部２２ａが形成してあ
る。 The support stand 22 has a shape shown in FIG. A hole 22a is formed in the middle.
また、長尺の端部材２３，２３は、中空体であ
る。その断面はほぼ長方形である。 Further, the elongated end members 23, 23 are hollow bodies. Its cross section is approximately rectangular.
第６図と第８図に示すように、各端部材２３の
各下面側の一部には切り欠き部２４がそれぞれ形
成してある。これによつて、車軸２５を取り付け
るための車軸取り付け部２６を形成している。こ
の車軸取り付け部２６には、車輪部材２７の車軸
２５を着脱可能にはめこみ装着する。車輪部材２
７は、車軸２５と車輪２８を一体化したものであ
る。 As shown in FIGS. 6 and 8, a notch 24 is formed in a portion of the lower surface of each end member 23. As shown in FIGS. This forms an axle attachment portion 26 to which the axle 25 is attached. The axle 25 of the wheel member 27 is removably fitted into the axle attachment portion 26 . Wheel member 2
7 is one in which the axle 25 and the wheels 28 are integrated.
さらに、車輪２５の下から車軸取り付け部２６
の下面２６ａ側に板２９を当接してある。板２９
は開口部２３ａに挿入したり取り出したりする。
この板２９は凸部３０を有する。この凸部３０は
切り欠き部２４に合う大きさで下に向いている。
ところで、支持部２２、端部材２３および車輪部
材２７と板２９は、石英材質たとえば石英ガラス
材質やSiC材質またはSi−SiC材質で作られてい
る。 Further, from below the wheel 25, the axle mounting portion 26
A plate 29 is in contact with the lower surface 26a side of the holder. Board 29
is inserted into or taken out from the opening 23a.
This plate 29 has a convex portion 30. The convex portion 30 is sized to fit the notch 24 and faces downward.
By the way, the support portion 22, the end member 23, the wheel member 27, and the plate 29 are made of a quartz material, such as a quartz glass material, a SiC material, or a Si-SiC material.
この発明は上記実施例に限定されるものではな
い。たとえばウエハーを支持台に直接配列するよ
うにしてもよい。また端部材を筒形あるいはその
他の形状にしてもよい。 This invention is not limited to the above embodiments. For example, the wafers may be arranged directly on a support. Further, the end member may have a cylindrical shape or other shape.
発明の効果
以上のような構成であるので、本発明の半導体
ウエハー用治具はウエハーを炉芯管内に搬出入す
る際に治具本体から発生するダストが少なくな
る。また車軸と車輪が一体であり、ガタつかない
ので直進性がよく、車輪と炉芯管の炉壁との摩擦
も小さく、車輪と炉壁との間にダストが発生しに
くい。またウエハーにもキズが発生しにくい。Effects of the Invention With the above configuration, the semiconductor wafer jig of the present invention generates less dust from the jig body when the wafer is carried in and out of the furnace core tube. In addition, since the axle and wheels are integrated, there is no wobbling, so straightness is good, and the friction between the wheels and the furnace wall of the furnace core tube is small, making it difficult for dust to be generated between the wheels and the furnace wall. Also, wafers are less prone to scratches.
さらに本発明によれば、車軸取り付け部分の構
造が簡単で車輪部材や板の取りはずしが容易であ
り、また単純な形状であるので治具の洗浄が簡単
でかつ汚れも容易に除去できる。 Further, according to the present invention, the structure of the axle mounting portion is simple, and the wheel members and plates can be easily removed, and since the jig is simple in shape, the jig can be easily cleaned and dirt can be easily removed.
さらに、本発明においては、支持台の中間部に
穴部が形成され、それが円弧断面形状であるの
で、軽量化が実現でき、治具下方からの熱導電性
が良好となる。また、例えば1000℃程度の高温下
における基材の熱変形（たわみ）を効果的に抑制
できる。 Furthermore, in the present invention, since the hole is formed in the middle of the support and has an arcuate cross-section, it is possible to reduce the weight and improve thermal conductivity from below the jig. Further, thermal deformation (deflection) of the base material at high temperatures of, for example, about 1000° C. can be effectively suppressed.
第１図はこの発明の半導体ウエハー用治具の実
施例１を示す平面図、第２図は第１図のＡ−Ａ線
における断面図、第３図は第１図のＢ−Ｂ線にお
ける断面図、第４図は第１図のＣ−Ｃ線における
断面図、第５図は実施例２を示す平面図、第６図
は第５図のＤ−Ｄ線における断面図、第７図は第
５図のＥ−Ｅ線における断面図、第８図は第５図
のＦ−Ｆ線における断面図である。
１……治具本体、２……支持部、３……端部
材、５……車軸、６……車軸取り付け部、７……
車輪部材、８……車輪、９……板、１０……凸
部。
FIG. 1 is a plan view showing Embodiment 1 of the semiconductor wafer jig of the present invention, FIG. 2 is a sectional view taken along line A-A in FIG. 1, and FIG. 3 is a cross-sectional view taken along line B-B in FIG. 4 is a sectional view taken along the line C-C in FIG. 1, FIG. 5 is a plan view showing the second embodiment, FIG. 6 is a sectional view taken along the line D-D in FIG. 5, and FIG. is a cross-sectional view taken along the line E--E in FIG. 5, and FIG. 8 is a cross-sectional view taken along the line F--F in FIG. DESCRIPTION OF SYMBOLS 1... Jig main body, 2... Support part, 3... End member, 5... Axle, 6... Axle attachment part, 7...
Wheel member, 8...Wheel, 9...Plate, 10...Convex portion.
Claims (1)
方に着脱自在に取り付けられた車輪を有する半導
体ウエハーを支持するための治具において、支持
台の中間部に穴群が形成され、それが円弧断面形
状であり、治具本体の両端部が中空状であり、各
端部の下面側の一部を切り欠くことによつて車輪
取り付け部を形成し、これに車輪と車軸が一体と
なつている車輪部材を装着し、かつ車軸の下から
車軸取り付け部の下面に凸部を有する板を当接し
た構造を有し、上記各構成部材が石英ガラス材質
やSiC材質またはSi−SiC材質からなることを特
徴とする半導体ウエハー用治具。1. In a jig for supporting a semiconductor wafer that has wheels removably attached to both the front end and the rear end of a semiconductor wafer support stand, a group of holes is formed in the middle part of the support stand, and the holes are arranged in a circular arc. It has a cross-sectional shape, and both ends of the jig body are hollow, and a part of the lower surface of each end is cut out to form a wheel attachment part, and the wheel and axle are integrated into this. It has a structure in which a wheel member is mounted, and a plate having a convex portion is brought into contact with the lower surface of the axle mounting part from below the axle, and each of the above constituent members is made of quartz glass material, SiC material, or Si-SiC material. A semiconductor wafer jig characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28784385A JPS62147742A (en) | 1985-12-23 | 1985-12-23 | Jig for semiconductor wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28784385A JPS62147742A (en) | 1985-12-23 | 1985-12-23 | Jig for semiconductor wafer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62147742A JPS62147742A (en) | 1987-07-01 |
| JPH0567064B2 true JPH0567064B2 (en) | 1993-09-24 |
Family
ID=17722492
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28784385A Granted JPS62147742A (en) | 1985-12-23 | 1985-12-23 | Jig for semiconductor wafer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62147742A (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5129109Y2 (en) * | 1973-08-07 | 1976-07-22 |
-
1985
- 1985-12-23 JP JP28784385A patent/JPS62147742A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62147742A (en) | 1987-07-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |