JPH0579510B2 - - Google Patents
Info
- Publication number
- JPH0579510B2 JPH0579510B2 JP58226460A JP22646083A JPH0579510B2 JP H0579510 B2 JPH0579510 B2 JP H0579510B2 JP 58226460 A JP58226460 A JP 58226460A JP 22646083 A JP22646083 A JP 22646083A JP H0579510 B2 JPH0579510 B2 JP H0579510B2
- Authority
- JP
- Japan
- Prior art keywords
- drive signal
- signal lines
- signal line
- heating element
- resistance heating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/345—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads characterised by the arrangement of resistors or conductors
Landscapes
- Electronic Switches (AREA)
Description
【発明の詳細な説明】
本発明は、ワードプロセツサやタイプライタの
プリンタとして用いられ、あるいはまたフアクシ
ミリなどにおいて用いられる熱印刷装置に関す
る。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a thermal printing device used as a printer for word processors and typewriters, or also used in facsimiles and the like.
第１図は本発明の一実施例を示し、あわせて先
行技術を説明するための熱印刷装置の平面図であ
り、第２図はその等価回路図である。この熱印刷
装置では、電気絶縁性材料たとえばセラミツクス
やガラスなどから成る平板状の基板１の一表面上
に発熱ドツトを形成する多数の抵抗発熱体２が第
１図の左右方向に一列状に形成されている。この
抵抗発熱体２の一方端上端には共通導体３が接続
されている。また抵抗発熱体２の他方端下端に
は、相互に間隔をあけて総括的に参照符Ａ１〜
Anで示される複数の個別駆動信号線が形成され
ている。個別駆動信号線Ａ１〜Anには集積回路
素子Ｄ１〜Dnの総括的に参照符Da１〜Da２で示
される複数の端子Da１〜Danが接続される。集
積回路素子Ｄ１〜Dnには、総括的に参照符Ｂ１
〜Bnで示される複数の制御信号線と、Ｅ１〜En
で示される共通駆動信号線Ｅ１〜Enとが集積回
路素子Ｄ１の総括的に参照符Db１〜Dbnで示さ
れる複数の端子と、端子De１〜Denにそれぞれ
接続される。 FIG. 1 is a plan view of a thermal printing apparatus showing an embodiment of the present invention and also for explaining the prior art, and FIG. 2 is an equivalent circuit diagram thereof. In this thermal printing device, a large number of resistance heating elements 2 forming heating dots are formed in a row in the left-right direction in FIG. 1 on one surface of a flat substrate 1 made of an electrically insulating material such as ceramics or glass. has been done. A common conductor 3 is connected to the upper end of one end of the resistance heating element 2. Further, at the lower end of the other end of the resistance heating element 2, there are generally reference marks A1 to A1 at intervals from each other.
A plurality of individual drive signal lines indicated by An are formed. A plurality of terminals Da1-Dan of the integrated circuit elements D1-Dn, collectively indicated by reference symbols Da1-Da2, are connected to the individual drive signal lines A1-An. Integrated circuit elements D1-Dn are collectively designated by the reference B1.
Multiple control signal lines indicated by ~Bn and E1~En
Common drive signal lines E1 to En indicated by are connected to a plurality of terminals generally indicated by reference numerals Db1 to Dbn of integrated circuit element D1 and terminals De1 to Den, respectively.
集積回路素子Ｄ１は、制御信号線Ｂ１を介して
入力された制御信号に応答し、共通駆動信号線Ｅ
１と個別駆動信号線Ａ１のそれぞれとを選択的に
導通される作用を為す。前記個別駆動信号線Ａ１
の各々は、抵抗発熱体２にそれぞれ個別的に接続
されている。なお、残余の集積回路素子Ｄ２〜
Dnについても同様である。 The integrated circuit element D1 responds to a control signal input via the control signal line B1, and outputs the common drive signal line E.
1 and each of the individual drive signal lines A1 is selectively made conductive. The individual drive signal line A1
are individually connected to the resistance heating element 2. Note that the remaining integrated circuit elements D2~
The same applies to Dn.
第１図では、感熱記録紙は抵抗発熱体２の延在
方向（第１図の左右方向）に垂直な方向（第１図
の上下方向）に移動される。この移動に伴ない、
各発熱ドツトを構成する抵抗発熱体２に共通駆動
信号線Ｅ１〜En、個別駆動信号線Ａ１〜Anおよ
び共通導体３を介して電圧を印加し、各発熱ドツ
トを選択的に発熱されることにより感熱記録紙に
ドツト印字が行なわれる。 In FIG. 1, the thermal recording paper is moved in a direction (vertical direction in FIG. 1) perpendicular to the extending direction of the resistance heating element 2 (horizontal direction in FIG. 1). Along with this movement,
By applying a voltage to the resistance heating element 2 constituting each heating dot via the common drive signal lines E1 to En, the individual drive signal lines A1 to An, and the common conductor 3, each heating dot is selectively heated. Dot printing is performed on thermal recording paper.
しかしながら、この先行技術では、個別駆動信
号線Ａ１〜An、制御信号線Ｂ１〜Bn、共通駆動
信号線Ｅ１〜Enおよび共通導体３が、通常配線
密度を上げるために蒸着またはスパツタリングな
どの薄膜手法によつて電気絶縁基板１上に形成さ
れており、各信号線Ａ１〜An，Ｂ１〜Bn，Ｅ１
〜Enおよび共通導体３は導電路がせまいことか
ら電気抵抗が高いものになつている。各抵抗発熱
体２を発熱させ、ドツト印字を行なう場合、各抵
抗発熱体２に接続されている信号線Ａ１〜Anの
それぞれに流れる電流は、たとえば40〜50mAの
比較的小さな値であるものの、共通導体３および
共通駆動信号線Ｅ１〜Enに流れる電流は、たと
えば約20Aと極めて大きな値となり、各抵抗発熱
体２に印加される電圧が共通導体３および共通駆
動信号線Ｅ１〜Enの有する大きな電気抵抗によ
つて電圧降下を発生し、その結果抵抗発熱体２を
所定温度に発熱させることができず、印字にむら
を生じて印字品質が著しく低下するという欠点を
有していた。 However, in this prior art, the individual drive signal lines A1 to An, the control signal lines B1 to Bn, the common drive signal lines E1 to En, and the common conductor 3 are usually formed by thin film techniques such as vapor deposition or sputtering in order to increase wiring density. Therefore, each signal line A1-An, B1-Bn, E1 is formed on the electrically insulating substrate 1.
~En and the common conductor 3 have a high electrical resistance because the conductive path is narrow. When each resistance heating element 2 generates heat and performs dot printing, the current flowing through each of the signal lines A1 to An connected to each resistance heating element 2 is a relatively small value of, for example, 40 to 50 mA. The current flowing through the common conductor 3 and the common drive signal lines E1 to En has an extremely large value of, for example, about 20 A, and the voltage applied to each resistance heating element 2 has a large current flowing through the common conductor 3 and the common drive signal lines E1 to En. A voltage drop occurs due to the electrical resistance, and as a result, the resistance heating element 2 cannot be heated to a predetermined temperature, resulting in uneven printing and a significant deterioration in printing quality.
本発明は上記欠点に鑑み案出されたもので、そ
の目的は印加電力の共通導体および共通駆動信号
線での電圧降下を抑制し、抵抗発熱体の発熱を常
に所定温度とすることによつて印字品質が極めて
優れた小型の熱印刷装置を提供することにある。 The present invention was devised in view of the above-mentioned drawbacks, and its purpose is to suppress the voltage drop in the common conductor of applied power and the common drive signal line, and to always maintain the heat generated by the resistance heating element at a predetermined temperature. An object of the present invention is to provide a compact thermal printing device with extremely excellent printing quality.
本発明は、電気絶縁性基板の一表面に、(a)抵抗
発熱体と、(b)該抵抗発熱体の一端に共通に接続さ
れる共通導体と、(c)前記抵抗発熱体の他端に接続
される個別駆動信号線と、(d)該個別駆動信号線に
接続されるスイツチング用集積回路素子と、(e)該
集積回路素子に接続される制御信号線および共通
駆動信号線を取着形成して成る熱印刷装置におい
て、
前記共通導体および共通駆動信号線を厚膜で、
個別駆動信号線および制御信号線を薄膜で形成し
たことを特徴とする熱印刷装置である。 The present invention provides, on one surface of an electrically insulating substrate, (a) a resistance heating element, (b) a common conductor commonly connected to one end of the resistance heating element, and (c) the other end of the resistance heating element. (d) a switching integrated circuit element connected to the individual drive signal line; and (e) a control signal line and a common drive signal line connected to the integrated circuit element. In a thermal printing device formed by depositing, the common conductor and the common drive signal line are made of a thick film,
This thermal printing device is characterized in that individual drive signal lines and control signal lines are formed of thin films.
以下、本発明を第３図および第４図に示す実施
例に基づき詳細に説明する。 Hereinafter, the present invention will be explained in detail based on the embodiment shown in FIGS. 3 and 4.
第３図は本発明の熱印刷装置の集積回路素子Ｄ
１付近の部分拡大図であり、第４図は第３図の切
断面線〜から見た断面図である。なお、図中
従来品と同一個別には同一符号が付してある。総
括的に参照符Ａ１で示された個別駆動信号線は、
各発熱ドツト毎に個別的に参照符Ａ１０１〜Ａ１
３２でそれぞれ示されている。同様にして、制御
信号線Ｂ１は個別的には参照符Ｂ１０１〜Ｂ１０
５で示されている。また集積回路素子Ｄ１の端子
Da１は、個別的には参照符Da１１〜Da１３２で
示されており、また端子Db１は、個別的には参
照符Db１１〜Db１５で示されている。 FIG. 3 shows an integrated circuit element D of the thermal printing device of the present invention.
FIG. 4 is a partially enlarged view of the vicinity of 1, and FIG. 4 is a cross-sectional view taken from the cutting plane line ~ in FIG. 3. In the figure, the same components as those of the conventional product are given the same reference numerals. The individual drive signal lines, generally designated by the reference symbol A1, are:
Individual reference numbers A101 to A1 for each heating dot
32, respectively. Similarly, the control signal lines B1 are individually designated by reference numbers B101 to B10.
5. Also, the terminal of the integrated circuit element D1
Da1 is individually indicated by reference symbols Da11 to Da132, and terminal Db1 is individually indicated by reference symbols Db11 to Db15.
そしてこのような熱印刷装置を製造するにあた
つては、まず、セラミツク、ガラス等の電気絶縁
基板１の表面にまず、抵抗発熱体２が形成され
る。次に、共通導体３１と共通駆動信号線EX１
が最後に個別駆動信号線Ａ１（Ａ１０１〜Ａ１３
２）および制御信号線Ｂ１（Ｂ１０１〜Ｂ１０
５）が形成される。前記共通導体３１および共通
駆動信号線EX１は、金や銀・パラジウムから成
り、スクリーン印刷などの厚膜印刷技術によつて
絶縁基板１上に印刷形成される。この共通導体３
１等は、その膜厚が、５〜30μｍ程度と極めて厚
い。そのため共通導体３１および共通駆動信号線
EX１はその電気抵抗が極めて低い値と成り、印
字の際に共通導体３１および共通駆動信号線EX
１に比較的大きな電流が流れたとしても、共通導
体３１等において大きな電圧降下を生じることは
一切なく、抵抗発熱体２の発熱を常に所定温度と
為すことができる。なお、前記共通導体３１はそ
の一部が各抵抗発熱体２の一端と接続するよう抵
抗発熱体２に重畳して形成される。 In manufacturing such a thermal printing apparatus, a resistance heating element 2 is first formed on the surface of an electrically insulating substrate 1 made of ceramic, glass, or the like. Next, the common conductor 31 and the common drive signal line EX1
Finally, the individual drive signal lines A1 (A101 to A13
2) and control signal line B1 (B101 to B10
5) is formed. The common conductor 31 and the common drive signal line EX1 are made of gold, silver, or palladium, and are printed on the insulating substrate 1 using a thick film printing technique such as screen printing. This common conductor 3
The film thickness of the first grade is extremely thick, about 5 to 30 μm. Therefore, the common conductor 31 and the common drive signal line
EX1 has an extremely low electrical resistance, and when printing, the common conductor 31 and the common drive signal line
Even if a relatively large current flows through the resistive heating element 2, no large voltage drop occurs in the common conductor 31 or the like, and the resistance heating element 2 can always generate heat at a predetermined temperature. Note that the common conductor 31 is formed so as to overlap the resistance heating element 2 so that a part thereof is connected to one end of each resistance heating element 2.
また前記個別駆動信号線Ａ１０１〜Ａ１３２お
よび制御信号線Ｂ１０１〜Ｂ１０５は窒化チタン
等から成り、蒸着やスパツタリングなどの薄膜手
法を採用することによつて絶縁基板１上に形成さ
れる。前記個別駆動信号線Ａ１０１〜Ａ１３２お
よび制御信号線Ｂ１０１〜Ｂ１０５はその線幅を
たとえば100μｍ、膜厚を2μｍ程度に成すことが
でき、配線密度が高いとしても高精度、高密度に
形成することができる。この個別駆動信号線Ａ１
０１〜Ａ１３２および制御信号線Ｂ１０１〜Ｂ１
０５は導電路が狭いことから高い抵抗値を有する
もののこの各信号線を流れる電流は、比較的小さ
い値（40〜50mA）であり、各信号線において、
電圧降下を発生することはない。なお、前記個別
駆動信号線Ａ１０１〜Ａ１３２のそれぞれは、そ
の一部が各抵抗発熱体２の一端と接続するよう抵
抗発熱体２に重畳して形成される。 The individual drive signal lines A101 to A132 and control signal lines B101 to B105 are made of titanium nitride or the like, and are formed on the insulating substrate 1 by employing a thin film technique such as vapor deposition or sputtering. The individual drive signal lines A101 to A132 and control signal lines B101 to B105 can have a line width of, for example, 100 μm and a film thickness of about 2 μm, and can be formed with high precision and high density even if the wiring density is high. can. This individual drive signal line A1
01 to A132 and control signal lines B101 to B1
05 has a high resistance value because the conductive path is narrow, but the current flowing through each signal line is a relatively small value (40 to 50 mA), and in each signal line,
No voltage drop occurs. Note that each of the individual drive signal lines A101 to A132 is formed so as to overlap the resistive heating element 2 so that a portion thereof is connected to one end of each resistive heating element 2.
また前記個別駆動信号線Ａ１０１〜Ａ１３２制
御信号線Ｂ１０１〜Ｂ１０５共通駆動信号線EX
１には、それぞれ集積回路素子Ｄ１の端子Da１
１〜Da１３２，Db１１〜Db１５およびDeが導
電接着剤等を介して電気的に接続されており、該
集積回路素子Ｄ１は制御信号線Ｂ１０１〜Ｂ１０
５を介して入力される制御信号に対応して共通駆
動信号線EX１と個別駆動信号線Ａ１０１〜Ａ１
３２のそれぞれを選択的に導通させる。 In addition, the individual drive signal lines A101 to A132 control signal lines B101 to B105 common drive signal line EX
1 each have a terminal Da1 of the integrated circuit element D1.
1 to Da132, Db11 to Db15, and De are electrically connected via a conductive adhesive or the like, and the integrated circuit element D1 is connected to control signal lines B101 to B10.
Common drive signal line EX1 and individual drive signal lines A101 to A1 correspond to control signals input through
32 are selectively made conductive.
なお、上述の説明では集積回路素子Ｄ１に関連
して行なつたけれども、残余の集積回路素子Ｄ２
〜Dnに関しても同様である。 Note that although the above description has been made in relation to the integrated circuit element D1, the remaining integrated circuit element D2
The same applies to ~Dn.
かくして本発明の熱印刷装置によれば、共通導
体と共通駆動信号線を厚膜で形成して低抵抗と成
し、個別駆動信号線と制御信号線を薄膜で形成し
て高密度配線を成したことにより、印字の際、共
通導体と共通駆動信号線に大きな電流が流れたと
しても該共通導体および共通駆動信号線における
印加電力の降下を有効に防止することができ、抵
抗発熱体の発熱温度を常に一定とし、印字品質が
極めて優れた小型、高信頼性の熱印刷装置が得ら
れる。 Thus, according to the thermal printing apparatus of the present invention, the common conductor and the common drive signal line are formed with a thick film to achieve low resistance, and the individual drive signal lines and the control signal line are formed with a thin film to form high-density wiring. As a result, even if a large current flows through the common conductor and the common drive signal line during printing, it is possible to effectively prevent a drop in the applied power in the common conductor and the common drive signal line, thereby reducing the heat generation of the resistance heating element. A small, highly reliable thermal printing device with constant temperature and extremely excellent printing quality can be obtained.
なお、本発明は上記実施例に限定されるもので
はなく、本発明の要旨を逸脱しない範囲であれば
種々の変更は可能である。 Note that the present invention is not limited to the above embodiments, and various changes can be made without departing from the gist of the present invention.
第１図は本発明の一実施例を示し、かつ先行技
術を説明するための平面図、第２図は第１図に示
された熱印刷装置の等価回路図、第３図は集積回
路素子Ｄ１付近の拡大平面図、第４図は第３図に
おける切断面線−から見た本発明に伴う実施
例の断面図である。
１……基板、２……抵抗発熱体、３，３１……
共通導体、Ａ１〜An，Ａ１０１〜Ａ１３２……
個別駆動信号線、Ｂ１〜Bn，Ｂ１０１〜Ｂ１０
５……制御信号線、Ｄ１〜Dn……集積回路素子、
Da１〜Dan，Db１〜Dbn，De１〜Den……端子、
Ｅ１，EX１……共通駆動信号線。
FIG. 1 is a plan view showing one embodiment of the present invention and for explaining the prior art, FIG. 2 is an equivalent circuit diagram of the thermal printing apparatus shown in FIG. 1, and FIG. 3 is an integrated circuit element. FIG. 4 is an enlarged plan view of the vicinity of D1, and is a sectional view of the embodiment according to the present invention taken along the cutting plane line - in FIG. 3. 1... Board, 2... Resistance heating element, 3, 31...
Common conductor, A1~An, A101~A132...
Individual drive signal lines, B1 to Bn, B101 to B10
5...Control signal line, D1-Dn...Integrated circuit element,
Da1~Dan, Db1~Dbn, De1~Den... terminal,
E1, EX1...Common drive signal line.
Claims (1)
と、(b)該抵抗発熱体の一端に共通に接続される共
通導体と、(c)前記抵抗発熱体の他端に接続される
個別駆動信号線と、(d)該個別駆動信号線に接続さ
れるスイツチング用集積回路素子と、(e)該集積回
路素子に接続される制御信号線および共通駆動信
号線を取着形成して成る熱印刷装置において、 前記共通導体および共通駆動信号線を厚膜で、
個別駆動信号線および制御信号線を薄膜で形成し
たことを特徴とする熱印刷装置。[Claims] 1. On one surface of an electrically insulating substrate, (a) a resistance heating element, (b) a common conductor commonly connected to one end of the resistance heating element, and (c) the resistance heating element. an individual drive signal line connected to the other end; (d) a switching integrated circuit element connected to the individual drive signal line; and (e) a control signal line and a common drive signal connected to the integrated circuit element. In a thermal printing device formed by bonding and forming wires, the common conductor and the common drive signal wire are made of a thick film,
A thermal printing device characterized in that individual drive signal lines and control signal lines are formed of thin films.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58226460A JPS60116474A (en) | 1983-11-29 | 1983-11-29 | Heat printer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58226460A JPS60116474A (en) | 1983-11-29 | 1983-11-29 | Heat printer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60116474A JPS60116474A (en) | 1985-06-22 |
| JPH0579510B2 true JPH0579510B2 (en) | 1993-11-02 |
Family
ID=16845440
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58226460A Granted JPS60116474A (en) | 1983-11-29 | 1983-11-29 | Heat printer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60116474A (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5724273A (en) * | 1980-07-18 | 1982-02-08 | Toshiba Corp | Thermal head |
| JPS5862655U (en) * | 1981-10-22 | 1983-04-27 | 日本電気株式会社 | thermal printer head |
-
1983
- 1983-11-29 JP JP58226460A patent/JPS60116474A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60116474A (en) | 1985-06-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |