JPH0586331B2 - - Google Patents

Description

[Detailed description of the invention]

[Industrial Field of Application] The present invention relates to a method for producing a chemically plated laminate having an extremely excellent effect of preventing the transmission of ultraviolet rays. [Prior art] When processing a chemically plated laminate into a printed wiring board using a well-known additive process, as one method for producing high-precision fine patterns,
59-151495, the steps are as follows. A. Drilling holes in a laminate for chemical plating using an NC drill B. Chemical etching of the adhesive surface C. Applying a catalyst for chemical plating to the adhesive surface and all inside the holes D. Applying liquid plating resist to the adhesive surface E. Plating resist Exposure, development, patterning F Chemical plating G Printed wiring board In the above process, when applying the liquid plating resist in Step D, the plating resist enters the hole formed in Step A, and the inside of the hole is exposed by the exposure of fixing E. The plating resist in the hole is exposed to light and hardened, and plating may not be deposited on the plating resist in the hole during chemical plating in step F. The cause and mechanism for this is that the light that has passed through the plating resist layer is refracted by the glass filament of the glass cloth, which is the base material of the chemical plating laminate, and the plating resist on the hole wall is exposed to light and hardened. is possible. [Purpose of the Invention] As a result of intensive research by the present inventors to prevent the sticking resist attached to the hole wall from being exposed to light and hardening, the present inventors found that by imparting the function of preventing UV transmission to the adhesive layer, The present invention has been completed by discovering that the above object can be achieved. [Structure of the Invention] The present invention provides a method for manufacturing a laminate for chemical plating in which an adhesive layer made of a curable resin containing synthetic rubber is formed on both surfaces of an insulating substrate. A laminate for chemical plating, characterized in that it contains 0.1 to 5.0% by weight of an organic ultraviolet absorbing substance exhibiting an absorption peak in 0.1 to 20% by weight of an inorganic oxide having a maximum particle size of 20 μm or less. This is the manufacturing method. The organic ultraviolet absorbing substance used in the present invention is
Hydroxybenzophenones, hydroxyphenylbenzotriazoles, such as 2-hydroxy-4-octoxybenzophenone, 2-
(2'-hydroxy-5'-methylphenyl)-benzotriazole, 2-(2'-hydroxy-3'-t-
Butyl-5'-methylphenyl)-5-chlorobenzotriazole, 2-(2'-hydroxy-5'-t
-octylphenyl)-benzotriazole, 2
Examples include -(3-t-butyl-5-methyl-2-hydroxyphenyl)-5-chlorobenzotriazole. These are all
It shows a light absorption peak in the wavelength range of 10 nm to 450 nm. Particularly suitable for use in the present invention is 2-(2'-hydroxy-3'-t-butyl-
5'-methylphenyl)-5-chlorobenzotriazole and 2-(3-t-butyl-5-methyl-
2-hydroxyphenyl)-5-chlorobenzotriazole. Inorganic oxides used in the present invention include magnesium oxide, aluminum oxide, iron oxide, titanium oxide, zinc oxide, lead oxide, silicon oxide, and the like. Among these, titanium oxide is suitable for use in the present invention. If the organic ultraviolet absorber exceeds 5.0% by weight, the solvent resistance and heat resistance of the adhesive layer will be poor, and if it is less than 0.1% by weight, the ultraviolet shielding effect will be reduced. In addition, if oxides are added in excess of 20% by weight,
Increased adhesive viscosity and poor plating adhesion in subsequent processes. Furthermore, if the oxide content is less than 0.1% by weight, the UV shielding effect is small. The oxide content is preferably 1.0 to 10% by weight. Regarding the particle size of the oxide, when forming high-precision fine patterns, if particles larger than 20 μm are present, the oxide particles will be exposed on the surface of the adhesive during the chemical etching process, causing unevenness in the circuit formed by plating, and causing the circuit to deteriorate. impairs the smoothness of the surface. The particle size of the oxide is preferably 5μm
It is as follows. [Effects of the Invention] According to the present invention, ultraviolet rays that have passed through the plating resist layer are blocked by the adhesive layer and do not penetrate deeply into the layers of the chemically plated laminate. It is possible to prevent the resist from being exposed to light and hardening. Furthermore, by using UV absorbers and inorganic oxides together, the UV shielding effect is large, and the amount of organic UV absorbing substances added is small.
The electrical properties, chemical properties, and heat resistance of the printed wiring board will not deteriorate. [Example] The method for producing a chemically plated laminate according to the present invention will be described below using Examples and Comparative Examples. Example 1 A laminate for chemical plating was obtained by preparing an adhesive according to the following formulation, coating it on a glass-epoxy laminate, and heating it at 160° C. for 120 minutes to form adhesive layers on both sides. The thickness of the adhesive layer was 30 μm. NBR rubber (JSR-N-230SH) 100 parts Resol type phenolic resin 100 parts SiO ₂ powder (maximum particle size 5 μm) 10 parts TiO ₂ powder (maximum particle size 1 μm) 10 parts 2-(2'-Hydroxy-3'- t-Butyl-5'-methylphenyl)-5-chlorobenzotriazole 2 parts Methyl ethyl ketone 500 parts Example 2 An adhesive was prepared with the following composition, and a laminate for chemical plating was obtained in the same manner as in Example 1. NBR rubber (JSR-N-530) 100 parts Resol type phenolic resin 100 parts TiO ₂ powder (maximum particle size 10 μm) 5 parts 2-(3-t-butyl-5-methyl-2-hydroxyphenyl)-5- Chlorobenzotriazole 5 parts Methyl ethyl ketone 500 parts Comparative Example 1 An adhesive was prepared according to the following composition, and a laminate for chemical plating was obtained in the same manner as in Example 1. NBR rubber (JSR-N-230SH) 100 parts Resol type phenolic resin 100 parts TiO ₂ powder (maximum particle size 10 μm) 60 parts Methyl ethyl ketone 500 parts Comparative example 2 An adhesive was prepared with the following composition and the same procedure as in Example 1 was carried out. A laminate for chemical plating was obtained. NBR rubber (JSR-N-230SH) 100 parts Resol type phenolic resin 100 parts 2-(3-t-butyl-5-methyl-2-hydroxyphenyl)-5-chlorobenzotriazole 10 parts Methyl ethyl ketone 500 parts Comparative example 3 An adhesive was prepared according to the following composition, and a laminate for chemical plating was obtained in the same manner as in Example 1. NBR rubber (JSR-N-230SH) 100 parts Resol type phenolic resin 100 parts Methyl ethyl ketone 500 parts The chemical plating laminates obtained in Examples 1 and 2 and Comparative Examples 1, 2, and 3 were A printed wiring board was obtained by processing in this order. On the other hand, Examples 1 and 2
And the adhesives prepared in Comparative Examples 1, 2, and 3 were

[Table] After coating on aluminum foil and curing by heating at 160°C for 120 minutes, the aluminum foil was removed to obtain an adhesive film with a thickness of 30 μm. Table 1 shows the evaluation results of the printed wiring board and adhesive film. As a result, it was found that when the transmittance was 0.1% or less, poor plating precipitation inside the through holes could be eliminated. In Examples 1 and 2, there were no defects due to plating precipitation in the through holes, no blistering occurred in the plated copper film, and the soldering heat resistance of the printed wiring board was good. On the other hand, in Comparative Examples 1 and 2, no defects due to plating precipitation in the through holes occurred, but blistering of the plated copper film or poor soldering heat resistance of the printed wiring board occurred. In Comparative Example 3, defects occurred due to plating precipitation within the through holes.

Claims (1)

[Claims] 1. In a method for manufacturing a laminate for chemical plating in which an adhesive layer made of a curable resin containing synthetic rubber is formed on both surfaces of an insulating substrate, in the adhesive
For chemical plating, characterized by containing 0.1 to 5.0% by weight of an organic ultraviolet absorbing substance exhibiting an absorption peak in the range of 10nm to 450nm and 0.1 to 20% by weight of an inorganic oxide having a maximum particle size of 20μm or less. Method of manufacturing laminates.