JPH06101581B2 - Method of forming photo interrupter - Google Patents
Method of forming photo interrupterInfo
- Publication number
- JPH06101581B2 JPH06101581B2 JP19176388A JP19176388A JPH06101581B2 JP H06101581 B2 JPH06101581 B2 JP H06101581B2 JP 19176388 A JP19176388 A JP 19176388A JP 19176388 A JP19176388 A JP 19176388A JP H06101581 B2 JPH06101581 B2 JP H06101581B2
- Authority
- JP
- Japan
- Prior art keywords
- light
- light emitting
- emitting element
- receiving element
- primary
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明はカメラ及びフロッピーディスクドライブ等の小
型機器に好適なホトインタラプタの形成方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of forming a photo interrupter suitable for a small device such as a camera and a floppy disk drive.
従来の技術 従来の二重モールドタイプのホトインタラプタの外観を
示す斜視図を第7図に、その断面図を第8図に示す。2
重モールドタイプはホトインタラプタの小型化のために
実現されたもので、遮光性樹脂による2次モールド構造
をとることによってホルダーケースを排除し、小型化を
達成している。2次モールドに用いられる遮光性樹脂6
は、発光素子7Lと受光素子7Pを一体化する役目と外乱光
をさえぎる役目を併せ持っている。光の出入口となる窓
部分10を形成するために、発光素子7Lと受光素子7Pを形
成するための1次モールドにおいて、透光性樹脂の外殻
の対向面側に所定幅の突出部8を設け、ホトインタラプ
タとしてのスリットを形成して分解能を向上させてい
る。なお、遮光性樹脂6に形成されている溝部9は窓部
分10の上に遮光性樹脂6がかぶらないように、1次モー
ルドされた発光素子7Lと受光素子7Pに2次モールドの金
型に形成された突出部を押しつけたため形成された溝部
である。したがって、この窓部分10と受発光各素子7P,7
Lとの位置関係は1次モールド完了の時点で決まる。な
お、1次モールドされた発光素子7Lおよび受光素子7Pは
第9図の斜視図で示す形状となっている。2. Description of the Related Art A perspective view showing the appearance of a conventional double mold type photo interrupter is shown in FIG. 7, and a sectional view thereof is shown in FIG. Two
The heavy mold type is realized for downsizing of the photo interrupter, and the holder case is eliminated by adopting the secondary molding structure of the light-shielding resin to achieve downsizing. Light-shielding resin 6 used for secondary molding
Has a role of integrating the light emitting element 7L and a light receiving element 7P and a role of blocking ambient light. In order to form the window portion 10 serving as a light entrance / exit, in the primary mold for forming the light emitting element 7L and the light receiving element 7P, the protruding portion 8 having a predetermined width is provided on the facing surface side of the outer shell of the transparent resin. A slit is provided as a photo interrupter to improve the resolution. The groove 9 formed in the light-shielding resin 6 is used as a secondary molding die for the light-emitting element 7L and the light-receiving element 7P that are primary-molded so that the light-shielding resin 6 does not cover the window portion 10. It is a groove formed by pressing the formed protrusion. Therefore, the window portion 10 and the light receiving and emitting elements 7P, 7
The positional relationship with L is determined when the primary molding is completed. The light-emitting element 7L and the light-receiving element 7P that are primary-molded have the shapes shown in the perspective view of FIG.
発明が解決しようとする課題 ホトインタラプタの分解能を向上させるためには、光の
出入口となる窓部分10をできるだけ小さくすることが望
ましく、実際には0.2mm〜0.3mm程度の寸法が要求され
る。しかしながら、ホトインタラプタの構成主体である
発光素子基板1Lの大きさも0.3mm角前後であるため、窓
部分10の幅と発光素子基板1Lの大きさがほぼ同じとな
り、窓部分10と受発光素子基板の位置関係にずれが生じ
ると、発光素子と受光素子との間の光通路の一部が遮光
性樹脂6によってさえぎられ、光信号の有効な伝達が妨
げられる問題が生じる。In order to improve the resolution of the photointerrupter, it is desirable to make the window portion 10 serving as a light entrance / exit as small as possible, and actually a dimension of about 0.2 mm to 0.3 mm is required. However, since the size of the light emitting element substrate 1L, which is the main constituent of the photointerrupter, is also around 0.3 mm square, the width of the window portion 10 and the size of the light emitting element substrate 1L are almost the same, and the window portion 10 and the light receiving and emitting element substrate are the same. If the positional relationship between the light emitting element and the light receiving element is deviated, a part of the optical path between the light emitting element and the light receiving element is blocked by the light shielding resin 6, which causes a problem that the effective transmission of the optical signal is hindered.
ところで、上記の窓部分10と受発光素子基板1P,1Lの位
置関係がずれる原因としては、製造工程において素子基
板をリードフレーム上に搭載する時のずれと1次モール
ド時のずれが挙げられるが、特に支配的となるのは1次
モールド時のずれである。受発光素子の1次モールド
は、多連のリードフレームに受発光素子基板を取りつけ
た状態で行なうが、この時の樹脂の硬化温度として一般
的には100℃以上の温度設定がなされる。このため、リ
ードフレーム材料と1次モールド金型との熱膨張係数の
差によってリードフレームと1次モールドの突出部8と
の位置ずれが生じ、この位置ずれによって受発光素子基
板1P,1Lと窓部分10の位置ずれが生じる。なお、リード
フレームの代表的な素材であるFeの熱膨張係数は1.2×1
0-5/℃また、Cuの熱膨張係数は1.7×10-5/℃である。一
方、注型法で金型に使用するAlの熱膨張係数は2.3×10
-5/℃である。By the way, as a cause of the positional relationship between the window portion 10 and the light emitting / receiving element substrates 1P and 1L being shifted, there is a deviation when the element substrate is mounted on the lead frame in the manufacturing process and a deviation during the primary molding. Especially, it becomes the deviation at the time of primary molding that becomes dominant. The primary molding of the light emitting / receiving element is performed with the light receiving / emitting element substrate mounted on the multiple lead frames, and the curing temperature of the resin at this time is generally set to 100 ° C. or higher. Therefore, due to the difference in the thermal expansion coefficient between the lead frame material and the primary molding die, the lead frame and the protrusion 8 of the primary mold are displaced from each other, and this displacement causes the light emitting / receiving element substrates 1P and 1L and the windows. A displacement of the portion 10 occurs. The thermal expansion coefficient of Fe, which is a typical material for lead frames, is 1.2 x 1
0 -5 / ° C. The thermal expansion coefficient of Cu is 1.7 × 10 -5 / ℃. On the other hand, the coefficient of thermal expansion of Al used for the mold in the casting method is 2.3 × 10
-5 / ° C.
したがって、従来の2重モールドタイプのホトインタラ
プタには、遮光性樹脂6による2次モールドが完了した
時点で、受発光素子間の光通路の一部が遮光性樹脂6に
よってさえぎられ、有効窓面積が減少して光伝達特性の
効率低下を引き起こす問題点があった。第8図の断面図
は、有効窓面積減少を例示しており、発光素子基板1Lあ
るいは受光素子基板1Pが窓部分10と位置ずれを起こして
いる。Therefore, in the conventional double-mold type photointerrupter, when the secondary molding with the light-shielding resin 6 is completed, a part of the light path between the light receiving and emitting elements is blocked by the light-shielding resin 6, and the effective window area is reduced. However, there is a problem in that the efficiency of the light transfer characteristic is reduced due to the decrease of the light transmission efficiency. The cross-sectional view of FIG. 8 illustrates the reduction of the effective window area, and the light emitting element substrate 1L or the light receiving element substrate 1P is displaced from the window portion 10.
また、1次モールドを注型法により行なった場合、抜き
型の制約からその突出部形状が制限される。すなわち、
第10図のような突出部11の成形はできるが、第11図に示
すような突出部11の成形はできない。したがって、第7
図で示したX軸方向の分解能を窓形状によって改善する
ことはできるが、Y軸方向の分解能を窓形状によって改
善することができなかった。Further, when the primary molding is performed by the casting method, the shape of the protruding portion is limited due to the restriction of the die. That is,
The protrusion 11 as shown in FIG. 10 can be molded, but the protrusion 11 as shown in FIG. 11 cannot be molded. Therefore, the seventh
Although the resolution in the X-axis direction shown in the figure can be improved by the window shape, the resolution in the Y-axis direction could not be improved by the window shape.
課題を解決するための手段 以上に述べた従来技術の問題点を解決するために、本発
明のホトインタラプタの製造方法は、上面にテーパ部が
設けられ、かつ、前面が平坦面となるように透光性樹脂
で1次モールドされた発光素子および受光素子を形成す
る工程と、同発光素子および同受光素子の前面に対応す
る位置に上面まで達する突出部を有する2次モールド用
金型内へ、前記発光素子および前記受光素子を対向配置
して遮光性樹脂で2次モールドし、両素子間に前記テー
パ部と前記突出部で光通路形成用の窓部を形成する工程
とを備えたことを特徴とするものである。Means for Solving the Problems In order to solve the problems of the conventional techniques described above, the method for manufacturing a photointerrupter of the present invention is such that a taper portion is provided on the upper surface and the front surface is a flat surface. A step of forming a light emitting element and a light receiving element which are primary-molded with a light-transmissive resin, and into a secondary molding die having a protrusion reaching the upper surface at a position corresponding to the front surface of the light emitting element and the light receiving element. A step of secondly molding the light emitting element and the light receiving element so as to face each other and forming a window portion for forming an optical path by the tapered portion and the projecting portion between both elements. It is characterized by.
作用 本発明の形成方法によれば、1次モールドで形成された
テーパ部12と2次モールド用の金型に形成された突出部
によって窓部分が形成されるため、窓部分の位置の2次
モールドされたホトインタラプタの外形に対する窓部分
の位置ずれは、2次モールド用金型の加工精度によって
一義的に決まるので非常に小さくなる。According to the forming method of the present invention, the window portion is formed by the taper portion 12 formed by the primary mold and the protrusion portion formed on the mold for the secondary molding, and therefore the secondary portion of the position of the window portion is formed. The positional displacement of the window portion with respect to the outer shape of the molded photo interrupter is uniquely determined by the processing accuracy of the secondary molding die, and therefore is extremely small.
また、1次モールドを注型法としても、従来は困難であ
ったY軸方向の窓形状寸法を2次モールド金型の突出部
の長さと1次モールドのテーパ部の形状を変えることに
よって、自由に変えることができる。Even if the primary mold is used as a casting method, by changing the window shape dimension in the Y-axis direction, which has been difficult in the past, by changing the length of the protrusion of the secondary mold and the shape of the taper of the primary mold, You can change it freely.
実施例 以下に本発明のホトインタラプタの形成方法の実施例を
説明する。Example An example of a method for forming a photo interrupter of the present invention will be described below.
まず、第4図に示すように発光素子基板1Lをリードフレ
ーム2に固着し、さらに、発光素子基板1Lの電極と外部
リードとの間を金属細線3で接続する。次いで、第5図
で示すように透光性樹脂4によって上面にテーパ部が設
けられ、前面が平坦な1次モールドを行なうことによっ
て発光素子5Lが完成する。受光素子も、同様の方法によ
って形成する。First, as shown in FIG. 4, the light emitting element substrate 1L is fixed to the lead frame 2, and furthermore, the electrodes of the light emitting element substrate 1L and the external leads are connected by the thin metal wires 3. Next, as shown in FIG. 5, a light-transmissive resin 4 is provided with a tapered portion on the upper surface, and the light emitting element 5L is completed by performing a primary molding in which the front surface is flat. The light receiving element is also formed by the same method.
ところで、1次モールドされた素子形状を示す第5図か
ら明らかなように、本発明の製造方法で形成されるホト
インタラプタでは、光の通路となる窓部の形状が1次モ
ールドでは決まらないため、2次モールド用金型の突出
部が押し付けられる部分は平坦になっている。また、テ
ーパ部12はY軸方向の窓部寸法を調整するのに利用され
る。By the way, as is apparent from FIG. 5 showing the shape of the primary-molded element, in the photointerrupter formed by the manufacturing method of the present invention, the shape of the window portion which becomes the passage of light is not determined by the primary molding. The portion of the secondary molding die against which the protrusion is pressed is flat. Further, the tapered portion 12 is used to adjust the size of the window portion in the Y-axis direction.
すなわち、第2図において、窓部分15のY軸方向寸法は
Y軸方向の検出精度を決定する重要な要素であって、Y
軸方向寸法が小さければ検出精度が上がる(検出対象物
の微小範囲の移動または有無を検出できる)ことにな
り、Y軸方向寸法が大きければこの逆となる。このため
にテーパ部12の傾きを大きくすることにより窓部分15の
Y軸方向寸法を小さく形成し、テーパ部12の傾きを小さ
くすることで窓部分15のY方向寸法を大きく形成すると
いう調節が可能となる。That is, in FIG. 2, the dimension of the window portion 15 in the Y-axis direction is an important factor that determines the detection accuracy in the Y-axis direction.
If the dimension in the axial direction is small, the detection accuracy is improved (movement or presence / absence of a minute range of the detection target can be detected). For this reason, the taper portion 12 is made to have a large inclination so that the window portion 15 has a small dimension in the Y-axis direction, and the taper portion 12 has a small inclination so that the window portion 15 has a large Y-direction dimension. It will be possible.
さらに、テーパ面の別な効果として、さらに、後述する
遮光性樹脂13による2次モールドを実施するに際し、テ
ーパ部12は、対向配置した発光素子5Lと受光素子5Pの間
に窓部分15を形成するための2次モールド用金型の突出
部を挿入するときに突出部先端をテーパ部1に沿って滑
らかに挿入させる効果を奏するものである。Further, as another effect of the tapered surface, when the secondary molding with the light-shielding resin 13 which will be described later is further performed, the tapered portion 12 forms the window portion 15 between the light emitting element 5L and the light receiving element 5P which are arranged to face each other. This has the effect of smoothly inserting the tip of the protruding portion along the tapered portion 1 when the protruding portion of the secondary molding die is inserted.
なお、1次モールドはトランスファー成形法あるいは注
型法のいずれであってもかまわない。The primary mold may be either a transfer molding method or a casting method.
次に、1次モールドの完了した発光素子5Lと受光素子5P
を両素子の前面に対応する位置に突出部を有する2次モ
ールド用金型内に対向させて配置し、2次モールド用の
樹脂として遮光性樹脂13を用いて両者を一体化する2次
モールドを行なう。2次モールド樹脂としては熱可塑性
樹脂あるいは熱硬化性樹脂のいずれであってもよく、ま
た、成形法も射出成形法、トランスファー成形法あるい
は注型法のいずれであってもよい。熱可塑性樹脂を使用
し、射出成形法によって形成したホトインタラプタの斜
視図を第1図に、断面図を第2図および第3図に示す。
2次モールドに用いられる遮光性樹脂13は発光素子5Lと
受光素子5Pを一体化する構造上の役割と外乱光をさえぎ
る役割を兼ねている。なお、発光素子5Lと受光素子5Pの
背面それぞれに設けられた凹部14は2次モールド時に、
凸出部を有する金型で発光素子5Lと受光素子5Pをそれぞ
れ前方に押し出し、発光・受光素子の窓となる部分を押
しつけて、窓部分15への遮光性樹脂13のまわりこみを防
止する役目を持つために形成されたものである。Next, the light-emitting element 5L and the light-receiving element 5P whose primary molding has been completed
Are placed opposite to each other in a mold for secondary molding having protrusions at positions corresponding to the front surfaces of both elements, and a light-shielding resin 13 is used as a resin for the secondary molding to integrate the two. Do. The secondary mold resin may be either a thermoplastic resin or a thermosetting resin, and the molding method may be either an injection molding method, a transfer molding method or a casting method. A perspective view of a photo interrupter formed by injection molding using a thermoplastic resin is shown in FIG. 1, and sectional views thereof are shown in FIGS. 2 and 3.
The light-shielding resin 13 used for the secondary mold has a structural role of integrating the light emitting element 5L and the light receiving element 5P and a role of blocking ambient light. The recesses 14 provided on the back surfaces of the light emitting element 5L and the light receiving element 5P are
The light emitting element 5L and the light receiving element 5P are respectively pushed forward by a die having a protruding portion, and the window forming portion of the light emitting and light receiving element is pressed to prevent the light shielding resin 13 from wrapping around the window portion 15. It was created to have.
第3図において、窓部分15のX軸方向の寸法は2次モー
ルド用金型の突出部の幅寸法によって決定され、また、
第2図において、窓部分15のY軸方向の寸法は2次モー
ルド用金型の突出部の長さ寸法と1次モールドされた素
子のテーパ部の形状とによって決定される。In FIG. 3, the dimension of the window portion 15 in the X-axis direction is determined by the width dimension of the protrusion of the secondary molding die, and
In FIG. 2, the dimension of the window portion 15 in the Y-axis direction is determined by the length dimension of the protruding portion of the secondary molding die and the shape of the taper portion of the primary-molded element.
ところで、本発明の製造方法によれば、第3図で示すよ
うに、発光素子基板1Lの発光素子5L内におけるX軸方向
のずれ、および受光素子基板1Pの受光素子5P内における
X軸方向のずれが大きくても、2次モールド後の窓部分
15の位置と受発光素子基板1L,1Pとの位置を1次モール
ドと2次モールドに分離して決められるため精度よく一
致させることができる。By the way, according to the manufacturing method of the present invention, as shown in FIG. 3, the deviation in the X-axis direction in the light-emitting element 5L of the light-emitting element substrate 1L and the X-axis direction in the light-receiving element 5P of the light-receiving element substrate 1P are observed. Even if the deviation is large, the window part after the secondary molding
Since the position of 15 and the positions of the light emitting / receiving element substrates 1L and 1P are determined separately for the primary mold and the secondary mold, they can be accurately matched.
なお、以上の実施例で説明した透光性樹脂4は発光素子
として赤外発光ダイオードを用いる場合、可視光を遮断
するタイプの樹脂であってもよいことは勿論である。It is needless to say that the transparent resin 4 described in the above embodiments may be a type of resin that blocks visible light when an infrared light emitting diode is used as a light emitting element.
また、形成されるホトインタラプタも、第6図に示すよ
うに、発光側および受光側に複数個の窓部を持つもので
あってもよい。The photo interrupter formed may also have a plurality of windows on the light emitting side and the light receiving side, as shown in FIG.
発明の効果 このように本発明によれば、1次モールド形成時のテー
パ部と2次モールド形成時の凸出部とによって窓部分の
寸法を自在に決定でき、1次モールドされた素子の外囲
器に設けた突出部を発光・受光の窓とする従来の2重モ
ールド構造のホトインタラプタでは実現できなかった、
高精度でかつ高伝達特性の2重モールドホトインタラプ
タを安価かつ量産性に優れた方法で生産できる。As described above, according to the present invention, the size of the window portion can be freely determined by the taper portion at the time of forming the primary mold and the protruding portion at the time of forming the secondary mold. It could not be realized with a conventional photointerrupter with a double mold structure in which the protruding portion provided on the enclosure serves as a light emitting / receiving window.
It is possible to produce a double-molded photointerrupter with high precision and high transmission characteristics at a low cost and with excellent mass productivity.
第1図は本発明の方法で形成したホトインタラプタの実
施例を示す斜視図、第2図および第3図は第1図で示す
ホトインタラプタの断面図、第4図は1次モールド前の
組立構体の状態を示す斜視図、第5図は1次モールド後
の発光素子を示す斜視図、第6図は本発明の方法で形成
されたホトインタラプタの他の実施例を示す斜視図、第
7図は従来のホトインタラプタを示す斜視図、第8図は
第7図で示すホトインタラプタの断面図、第9図は従来
のホトインタラプタを形成する1次モールド後の素子の
構造を示す斜視図、第10図は注型法またはトランスファ
ー成形法による1次モールドの例を示す断面図、第11図
はトランスファー成形法による1次モールドの例を示す
断面図である。 1L……発光素子基板、1P……受光素子基板、2……リー
ドフレーム、3……金属細線、4……1次モールド用の
透光性樹脂、5L,7L……発光素子、5P,7P……受光素子、
6,13……遮光性樹脂、8……1次モールドの突出部、9
……溝部、10,15……窓部分、11……トランスファー成
形により形成された突出部、12……1次モールドのテー
パ部、14……凹部。FIG. 1 is a perspective view showing an embodiment of a photo interrupter formed by the method of the present invention, FIGS. 2 and 3 are sectional views of the photo interrupter shown in FIG. 1, and FIG. 4 is an assembly before primary molding. FIG. 5 is a perspective view showing a state of the structure, FIG. 5 is a perspective view showing a light emitting element after the primary molding, and FIG. 6 is a perspective view showing another embodiment of the photo interrupter formed by the method of the present invention. FIG. 8 is a perspective view showing a conventional photointerrupter, FIG. 8 is a cross-sectional view of the photointerrupter shown in FIG. 7, and FIG. 9 is a perspective view showing the structure of the element after the primary molding forming the conventional photointerrupter. FIG. 10 is a sectional view showing an example of a primary mold by a casting method or transfer molding method, and FIG. 11 is a sectional view showing an example of a primary mold by a transfer molding method. 1L: Light emitting element substrate, 1P: Light receiving element substrate, 2 ... Lead frame, 3 ... Metal wire, 4 ... Translucent resin for primary mold, 5L, 7L ... Light emitting element, 5P, 7P ……Light receiving element,
6,13 …… Light-shielding resin, 8 …… Projection of primary mold, 9
...... Grooves, 10,15 ・ ・ ・ Window parts, 11 …… Projections formed by transfer molding, 12 …… Primary mold taper parts, 14 …… Concave parts.
Claims (1)
平坦面となるように透光性樹脂で1次モールドされた発
光素子および受光素子を形成する工程と、同発光素子お
よび同受光素子の前面に対応する位置に上面まで達する
突出部を有する2次モールド用金型内へ、前記発光素子
および前記受光素子を対向配置して遮光性樹脂で2次モ
ールドし、両素子間に前記テーパ部と前記突出部で光通
路形成用の窓部を形成する工程とを備えたことを特徴と
するホトインタラプタの形成方法。1. A step of forming a light emitting element and a light receiving element which are primary-molded with a transparent resin so that a taper portion is provided on the upper surface and the front surface becomes a flat surface, and the light emitting element and the light receiving element. The light emitting element and the light receiving element are arranged to face each other in a mold for secondary molding having a protrusion reaching the upper surface at a position corresponding to the front surface of the element, and the light emitting resin is secondarily molded, and the element between the both elements is described above. A method of forming a photo interrupter, comprising: forming a window portion for forming an optical path with a tapered portion and the protruding portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19176388A JPH06101581B2 (en) | 1988-07-29 | 1988-07-29 | Method of forming photo interrupter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19176388A JPH06101581B2 (en) | 1988-07-29 | 1988-07-29 | Method of forming photo interrupter |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0240970A JPH0240970A (en) | 1990-02-09 |
| JPH06101581B2 true JPH06101581B2 (en) | 1994-12-12 |
Family
ID=16280108
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19176388A Expired - Lifetime JPH06101581B2 (en) | 1988-07-29 | 1988-07-29 | Method of forming photo interrupter |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06101581B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH081960B2 (en) * | 1993-11-30 | 1996-01-10 | シャープ株式会社 | Optical coupling device manufacturing method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60113480A (en) * | 1983-11-24 | 1985-06-19 | Sharp Corp | Photo-interrupter |
-
1988
- 1988-07-29 JP JP19176388A patent/JPH06101581B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0240970A (en) | 1990-02-09 |
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