JPH06101619B2 - Method for forming curved circuit board - Google Patents
Method for forming curved circuit boardInfo
- Publication number
- JPH06101619B2 JPH06101619B2 JP19285485A JP19285485A JPH06101619B2 JP H06101619 B2 JPH06101619 B2 JP H06101619B2 JP 19285485 A JP19285485 A JP 19285485A JP 19285485 A JP19285485 A JP 19285485A JP H06101619 B2 JPH06101619 B2 JP H06101619B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- circuit
- circuit board
- curved
- predetermined
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
【発明の詳細な説明】 ［発明の技術分野］ この発明は曲面回路基体の形成方法に関する。Description: TECHNICAL FIELD OF THE INVENTION The present invention relates to a method for forming a curved circuit board.
［従来技術とその問題点］ 曲や折曲等の曲面を有する曲面筐体、曲面プリント基板
等にスクリーン印刷による曲面回路を形成する際には各
種の困難が伴なう。このため、従来から、曲面回路を形
成するために、メタルコアのような変形可能な基板上に
導体を作成し、これをエッチングで回路パターンを形成
した後に所定形状に加工したり、あるいは曲面上にスパ
ックリングや真空蒸着で導体を作成した後に回路パター
ンを形成していたが、このような従来法では材質が限定
されたり、高価な装置を必要とし、製作費が高価になる
とともに、使用範囲が限定されるなどの欠点があった。[Prior Art and its Problems] Various difficulties are involved in forming a curved surface circuit by screen printing on a curved surface housing having a curved surface such as bending or bending, or a curved surface printed circuit board. For this reason, conventionally, in order to form a curved circuit, a conductor is formed on a deformable substrate such as a metal core, and a circuit pattern is formed by etching this, and then processed into a predetermined shape, or on a curved surface. The circuit pattern was formed after the conductor was created by sprinkling or vacuum evaporation.However, in such a conventional method, the material is limited, an expensive device is required, the manufacturing cost becomes expensive, and the range of use is increased. There were drawbacks such as being limited.
［発明の目的］ この発明は上述した事情を鑑みてなされたもので、その
目的とするところは、任意の曲面回路基体が容易かつ確
実に形成できるとともに、高価な装置も必要としないの
で、簡便かつ低価格で曲面回路基体が形成できるように
した曲面回路基体の形成方法を提供しようとするもので
ある。[Object of the Invention] The present invention has been made in view of the above-described circumstances, and an object of the present invention is that a curved circuit substrate can be easily and surely formed, and an expensive device is not required. Further, it is an object of the present invention to provide a method for forming a curved circuit board, which allows the curved circuit board to be formed at low cost.
［発明の要点］ この発明は上述した目的を達成するために、基板上に、
導電性ペースト、絶縁性保護用皮膜を順次被覆して回路
基体を形成した後に、これらを液中に浸して基板より回
路基体を剥離し、この剥離した回路基体を加熱プレスに
より塑性変形して所定の曲面を形成し、これを絶縁性の
曲面基体等に接着するようにした点を要旨としたもので
ある。[Summary of the Invention] In order to achieve the above-mentioned object, the present invention provides:
After forming a circuit board by sequentially coating a conductive paste and an insulating protective film, the circuit board is peeled from the substrate by immersing them in a liquid, and the peeled circuit board is plastically deformed by a heat press to a predetermined size. The gist of the present invention is that a curved surface is formed and is adhered to an insulating curved base material or the like.
［実施例］ 以下、この発明を図面に示す実施例により説明する。図
中１は平板状のガラス板よりなる基板で、この基板１の
上面に第１図に示すように例えばフェノール樹脂をベー
スとした導電性ペースト２（導電性物質としては例えば
Au、Ag等）によりスクリーン印刷を行って所定の回路パ
ターンを形成する。次に、第２図に示すように、上記導
電性ペースト２が半ば硬化した状態で、これの上面の基
板１の全面にわたって同系樹脂をベースとするペースト
状の絶縁性保護用皮膜３を被覆したのち、これらを完全
に硬化させて、基板１上に、導電性ペースト２、保護用
皮膜３よりなる回路基体４を形成する。そして、第３図
に示すように上記導電性ペースト２、皮膜３が完全に硬
化した後に、基板１とこれに付着している回路基体４を
容器５内の液６中（この液は水あるいは溶剤でもよい）
に浸すと、回路基体４が基板１より剥離して遊離し、こ
の遊離した回路基体４を液６中より取出して十分に乾燥
させると、厚さが数10μｍ〜数100μｍ程度のフレキシ
ブルな薄板状の回路基体４が形成される。このようにし
て形成された回路基体４を第４図に示すような所定曲面
状の加圧面を有する加熱プレス７により加熱プレスして
塑性変形させて、所定曲面を有する回路基体４を形成す
る。そして、第５図に示すように、所定の曲面が形成さ
れた回路基体４を接着剤８により絶縁性の曲面筐体また
は曲面基板等よりなる曲面基体９の所定個所に接着する
と、曲面基体９の上面にこれの曲面に対応して所定の回
路基体４よりなる導電パターンを確実に形成することが
できる。Embodiments The present invention will be described below with reference to embodiments shown in the drawings. In the figure, reference numeral 1 denotes a substrate made of a flat glass plate. As shown in FIG.
Screen printing is performed using Au, Ag, etc.) to form a predetermined circuit pattern. Next, as shown in FIG. 2, with the conductive paste 2 half cured, a paste-like insulating protective film 3 made of a similar resin was coated over the entire surface of the substrate 1 on the upper surface thereof. After that, these are completely cured to form a circuit substrate 4 composed of the conductive paste 2 and the protective film 3 on the substrate 1. Then, as shown in FIG. 3, after the conductive paste 2 and the film 3 are completely cured, the substrate 1 and the circuit substrate 4 attached thereto are placed in a liquid 6 in a container 5 (this liquid is water or It may be a solvent)
When soaked in, the circuit substrate 4 is peeled off from the substrate 1 and released, and when the released circuit substrate 4 is taken out from the liquid 6 and sufficiently dried, it is a flexible thin plate with a thickness of several tens of μm to several hundreds of μm The circuit substrate 4 is formed. The circuit board 4 thus formed is heated and pressed by a heating press 7 having a pressing surface having a predetermined curved surface as shown in FIG. 4 to be plastically deformed to form the circuit board 4 having a predetermined curved surface. Then, as shown in FIG. 5, when the circuit substrate 4 having a predetermined curved surface is adhered to a predetermined portion of the curved substrate 9 made of an insulating curved casing or curved substrate with an adhesive 8, the curved substrate 9 is formed. It is possible to reliably form a conductive pattern made of a predetermined circuit substrate 4 on the upper surface of the substrate corresponding to the curved surface thereof.
なお、回路基体４を加熱プレス７により塑性変形させる
際には曲面基体９の所定形状に応じて加工することは勿
論であり、また、曲面基体９の代りに曲面プリント基板
等にも適用できる。When the circuit substrate 4 is plastically deformed by the heating press 7, it is needless to say that the circuit substrate 4 is processed according to the predetermined shape of the curved substrate 9, and instead of the curved substrate 9, it can be applied to a curved printed circuit board or the like.
また、上記実施例では基板１としてガラス板を使用した
が、これに限らず、導電性ペースト２、皮膜３と剥離し
やすい材料、例えば鏡面仕上げのステンレス板等でも差
支えないし、また、上記導電性ペースト２、皮膜３は互
いに密着性の優れた材料が好ましい。Further, although the glass plate is used as the substrate 1 in the above embodiment, the present invention is not limited to this, and a material that easily separates from the conductive paste 2 and the film 3, such as a stainless steel plate having a mirror finish, may be used. The paste 2 and the film 3 are preferably materials having excellent adhesiveness to each other.
［発明の効果］ この発明は以上詳細に説明したように、基板上に、導電
性ペースト、絶縁性保護用皮膜を順次被膜して回路基体
を形成した後に、これらを液中に浸して基板より回路基
体を剥離し、この剥離した回路基体を加熱プレスにより
塑性変形して所定の曲面を形成し、これを曲面基体に接
着するようにしたので、任意の曲面回路基体が容易かつ
確実に形成できるとともに、高価な装置も必要としない
ので、簡便かつ低価格の曲面回路基体が形成できる。[Effects of the Invention] As described in detail above, according to the present invention, a conductive paste and an insulating protective film are sequentially formed on a substrate to form a circuit substrate, which is then immersed in a liquid to remove the substrate. The circuit substrate is peeled off, and the peeled circuit substrate is plastically deformed by a heat press to form a predetermined curved surface, which is adhered to the curved surface substrate, so that any curved circuit substrate can be easily and surely formed. At the same time, since an expensive device is not required, a simple and inexpensive curved circuit board can be formed.
第１図ないし第５図はこの発明の一実施例の各工程を順
次説明するための各説明図である。 １……基板、２……導電性ペースト、３……絶縁性保護
用皮膜、４……回路基体、５……容器、６……液、７…
…加熱プレス、８……接着剤、９……曲面基体。1 to 5 are explanatory views for sequentially explaining each step of one embodiment of the present invention. 1 ... Substrate, 2 ... Conductive paste, 3 ... Insulating protective film, 4 ... Circuit base, 5 ... Container, 6 ... Liquid, 7 ...
… Heating press, 8 …… Adhesive, 9 …… Curved substrate.
Claims (1)
パターン基体を形成した後に、上記導電性ペーストの上
面に絶縁性保護用皮膜を被覆し、上記回路基体導電性ペ
ースト、皮膜により所定の回路基体を構成し、この回路
基体が硬化した後に、上記基板、回路基体を液中に浸し
て基板と回路基体を剥離させ、剥離した回路基体を加熱
プレスにより塑性変形させて所定曲面を有する回路基体
を形成し、この所定曲面の回路基体を接着剤により絶縁
性曲面基体の所定個所に接着するようにしたことを特徴
とする曲面回路基体の形成方法。1. A predetermined circuit pattern base is formed on a substrate with a conductive paste, and then an insulating protection film is coated on the upper surface of the conductive paste, and the predetermined circuit is formed with the circuit base conductive paste and film. A circuit substrate having a predetermined curved surface which constitutes a substrate, and after the circuit substrate is cured, the substrate and the circuit substrate are immersed in a liquid to separate the substrate and the circuit substrate, and the peeled circuit substrate is plastically deformed by a hot press. And a circuit board having a predetermined curved surface is adhered to a predetermined portion of the insulating curved circuit board with an adhesive agent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19285485A JPH06101619B2 (en) | 1985-08-31 | 1985-08-31 | Method for forming curved circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19285485A JPH06101619B2 (en) | 1985-08-31 | 1985-08-31 | Method for forming curved circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6252995A JPS6252995A (en) | 1987-03-07 |
| JPH06101619B2 true JPH06101619B2 (en) | 1994-12-12 |
Family
ID=16298074
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19285485A Expired - Lifetime JPH06101619B2 (en) | 1985-08-31 | 1985-08-31 | Method for forming curved circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06101619B2 (en) |
-
1985
- 1985-08-31 JP JP19285485A patent/JPH06101619B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6252995A (en) | 1987-03-07 |
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