JPH0611063B2 - Bonding device - Google Patents

Description

Description: TECHNICAL FIELD OF THE INVENTION The present invention relates to an improvement in a bonding apparatus in manufacturing a semiconductor device.

[Technical background of the invention and its problems]

In a manufacturing process of a semiconductor device, a bonding device for fixing electronic parts such as ICs to a lead frame or a substrate is used. This is equipped with a supply unit that houses electronic parts such as ICs (hereinafter referred to as "parts"), a positioning part that is provided next to this part, and a bonding part. It is configured such that the component is sent to the claw portion, the position thereof is detected, and the bonding portion bonds the component to a predetermined position based on the position information. However, in general, a plurality of components are often fixed to one substrate, and there are often a plurality of types. Therefore, the supply unit arranges a large number of trays containing the components in a plane and picks up the desired components one by one by vacuum suction. Since the conventional bonding apparatus is configured as described above, it is the current situation that the operator replaces these trays when replenishing parts or changing the product type. There was an inconvenience that accidents often happened.

[Object of the Invention]

The present invention has been made in order to eliminate the above-mentioned inconvenience, and an object of the present invention is to provide a bonding apparatus having a supply unit that can be replaced in a short time without causing an accident when replacing a tray.

[Outline of Invention]

The present invention relates to a bonding apparatus having a supply unit containing an electronic component and a bonding unit for bonding the electronic component taken out from the supply unit to a circuit board or a lead frame, wherein the supply unit has a plurality of electronic components. Trays in which the trays can be arranged and accommodated in a plane, a stocker in which a plurality of trays can be arranged and accommodated in a matrix, a holder for positioning and holding the stocker, and a stocker held by the holders. The present invention provides a bonding apparatus having a pickup head that moves with respect to an electronic component accommodated in a tray accommodated in (1) and picks up and transfers a predetermined electronic component.

Example of Invention

The details of the present invention will be described below with reference to an embodiment shown in FIGS. FIG. 1 shows the overall structure of an embodiment as a die bonding apparatus. This device includes a supply section (2) for accommodating and supplying a large number of components (1) such as IC chips.
Positioning part (3) for positioning the supplied parts (1), magazine part (6) for storing a large number of carriers (5) on which the circuit board (4) is mounted, and bonding part for performing die bonding work (7) and a pedestal part (8). Supply department
To elaborate on (2), (11) is a tray made of a rectangular plate-like member, and on the front side, there are accommodating recesses (12), ... Each accommodating a component (IC chip) (1) ,. They are arranged in a matrix with rows and columns at right angles. Further, a rectangular positioning recess (13) is formed on the back side. (15) is a stocker, which is a recess for positioning the tray (11) on the surface of the rectangular plate member.
The positioning protrusions (16) that engage with (13) are arranged in a matrix form at a right angle to the matrix, so that the trays (11), ... Can be arranged and accommodated in the matrix form. Further, a pressing body (17), ... Is provided near each corner of each of the positioning convex portions (16) ,, and the leaf spring (18) presses the tray (11) obliquely. The positioning concave portion (13) and the convex portion (16) are configured to be pressed in a fixed direction to reduce the positioning error. One side surface (19) is a reference surface in the XX 'direction in FIG. 1, one end surface (20) is a reference surface in the YY' direction, and a handle (22) is attached to the other end surface (21). ing. (twenty four)
Is a holding body, the upper surface of which is formed as a flat surface that slidably supports the stocker (15), and the guides that are in sliding contact with one side surface (19) and the other side surface (23) of the stocker (15) on both sides thereof. Walls (25) and (26) are provided in a protruding manner, and the guide wall (25) is XX ′ of the stocker (15).
A spring body (not shown) is attached to the guide wall (26) to press the stocker (15) toward the guide wall (25). A reference end face (27) in the Y-Y 'direction is provided on the one end face (20) side of the stocker (15), and the stocker (15) is positioned in the Y-Y' direction by abutting. (3
0) is a feeding mechanism, which is not shown in detail, but an X-direction feeding mechanism
(31) and a Y-direction feed mechanism (32). These mechanisms are a combination of a pulse motor and a feed screw mechanism and are the same as those generally known, so detailed description thereof will be omitted. A pickup head (33) is attached to the X-direction feed mechanism (31), which is driven in the XX 'direction, and the X-direction feed mechanism (31) is driven by the Y-direction feed mechanism (32) in the Y-Y direction. Driven in the'direction. The pickup head (33) is provided with a pickup (34) for vacuum suction and a Z-direction feed mechanism (not shown) for moving the pickup up and down.
The pickup (34) is moved to a desired position on the stocker (15) by (31) and (32), and is moved up and down by the Z-direction feed mechanism to suck the component (1) by vacuum, and It is designed to be transported to the positioning part (3).

Next, the positioning part (3) will be described.
1) and the positioning mechanism (42). The positioning mechanism (42) includes a turntable (43) that intermittently rotates 180 degrees back and forth, and two angle correction bases (44) symmetrically provided on the turntable (43) 180 degrees apart. Although not shown, the turntable (43) is provided with an indexing driver for rotating 180 degrees and an angle driver for rotating the angle correcting table (44) by a designated angle. Is a vacuum chuck which is rotatably supported by the turntable (43) and sucks and holds the supplied component (1).
And the angle correction stand (44) on the receiving side closer to the supply section (2)
When the component (1) is supplied to the
The image is picked up by, for example, a black and white television camera attached to (41), the errors in the X direction, the Y direction and the angle θ are calculated, and the angle driver is instructed to rotate the angle correction base (44) to rotate the angle θ.
To fix. The errors in the X and Y directions are used as position information in the next process. The corrected angle correction table (44) is rotated 180 degrees by the indexing driver to reach the supply side.

Next, the magazine section (6) will be described. (51) is a supply magazine that houses a plurality of stages of carriers (5) at a constant pitch,
Rotating substrates (4) are mounted on these carriers (5). The supply magazine (51) is lowered by one pitch by an elevating mechanism (52), and the carrier (5) at the bottom end on a supply conveyor (not shown) running under the supply magazine (51). ) Is attached from the magazine (51). That is, each time an external command is input, the pitch is lowered by one pitch, and the carriers (5) are taken out in order from the bottom. (53) is a storage magazine, which has the same structure as the supply side, but on the contrary to the supply side, it is raised by one pitch each time the carrier (5) is received by the elevating mechanism (54) from the top. The circuit board (4) which has been bonded together with the carrier (5) is sequentially housed in the lower stage.

Next, the bonding section (7) will be described. It is provided between the magazine section (6) and the positioning section (3) and is located between the magazine section (6) and the positioning section (3). A backward conveyer (62) that runs in the opposite direction to the forward conveyer (61) that runs in a jerk, a dispensing head (63), and a bonding head (64),
Circuit board (4) at each work position, not shown
There are provided a lifting member that lifts the carrier from the carrier (5) on the conveyor (61) to a predetermined height, and a holding plate that holds the circuit board (4) lifted above and elastically fixes it. The dispense head (63) has a nozzle for ejecting adhesive and a TV camera mounted above it, images the circuit board (4) that has arrived and is fixed, and compares it with a pre-stored pattern to check the position error. Is calculated and the position where the adhesive should be applied is detected. Then, the adhesive is applied at a predetermined position. The bonding head (64) also detects the position to be bonded in the same manner, and sucks the component (1) on the angle correction base (44) on the supply side of the above-mentioned positioning portion (3) to adsorb the circuit board.
(4) Carry it to the prescribed position and press it to perform bonding. The return conveyor (62) conveys the bonded circuit board (4) together with the carrier (5) to the storage magazine (53).
To be stored in. The transport conveyor between the forward conveyor (61) and the backward conveyor (62) is not shown. In addition to the above, a control device having a built-in CPU is provided, and the operation of each part is sequentially performed by the detection sensor and the CPU.

Next, the operation of the present apparatus will be briefly described. First, the trays (11), ... containing the parts (1), ... are placed on the stocker (15) while being positioned by the pressing body (17). This is mounted on the holder (24) and brought into contact with the reference end face (27) and the guide wall (25) to be positioned.
At this time, it is desirable to perform spot irradiation from the pickup head (33), align the spot irradiation with marks provided on both ends of the diagonal line of the stocker (15), and teach the control device of the supply mechanism (30) a reference point. The supply magazine (51) stores the carrier (5) on which the circuit board (4) is placed. Then, when the apparatus is started, first, the elevating mechanism (52) is driven by a command from the control apparatus, and the supply magazine (51) is lowered by one pitch and stopped. Then, by driving the forward conveyor (61), the lowest carrier (5) is conveyed, and is stopped by a stopper (not shown) at a position facing the dispense head (63), and the forward conveyor (61) is also stopped. Where the circuit board
(4) is lifted and fixed by the restraining plate. Then, the position error is calculated by the pattern recognition technique by the television camera of the dispense head (63), the position where the adhesive is applied is detected, and the adhesive is applied by the nozzle.

Next, the supply magazine (51) is lowered by one pitch, and the forward conveyor (61) is driven, so that one carrier (5) is conveyed under the dispensing head (63) and the adhesive is applied. The circuit board (4) is carried under the next bonding head (64) together with the carrier (5), stopped by the stopper, and the forward conveyor (61) also stops. On the other hand, in the supply unit (2), the supply mechanism (30) is driven by a command from the CPU, the pickup head (33) moves to the position of the component (1) of the predetermined tray (11), and the pickup (34 ) By parts (1)
Is adsorbed, conveyed, and placed on the angle correction table (4) on the receiving side. The mounted part (1) is immediately sucked and held, and then the error is calculated by the detection device (41), the error in the X and Y directions is sent to the bonding head (64), and the angular error θ is corrected by rotation. To be done. When the correction is over, turntable (4
3) rotated 180 degrees, the component (1) was carried to the position of the angle correction base (44) on the supply side, immediately adsorbed by the bonding head (64), and the adhesive of the circuit board (4) was applied. It is pressed to a predetermined position and bonded. When a plurality of parts (1), ... Are bonded in this way, the carrier (5)
Is carried to a return conveyor (62) by a carrying conveyor (not shown), carried and carried into a storage magazine (53). And the storage magazine (53) is raised by one pitch. The bonding work is performed by repeating the above.

〔The invention's effect〕

As described above in detail, since the bonding apparatus of the present invention is configured by arranging a plurality of trays containing the components in the stocker in a matrix form, the components can be supplied and replaced only by replacing the stocker. Accidents such as misplacement of trays and removal of trays can be completely prevented, which is extremely beneficial in improving productivity.

[Brief description of drawings]

FIG. 1 is a perspective view of an embodiment of the present invention, FIG. 2 is a perspective view of the same tray, FIG. 3 is a sectional view taken along line (III)-(III) of FIG. 2, and FIG. FIG. 5 is a perspective view of a stocker according to an embodiment of the present invention, and FIG. 5 is an enlarged perspective view of a main part of the stocker. (1) …… electronic parts, (2) …… supply section, (3) …… positioning section, (4) …… circuit board, (7) …… bonding section, (11) …… tray, (15 ) …… Stocker, (24) …… Holder, (33) …… Pickup head.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Koichi Chiba No. 1 Toshiba-cho, Fuchu-shi, Tokyo Inside the Fuchu factory, Toshiba Corp. (56) Reference JP-A-57-63836 (JP, A)

Claims (2)

[Claims] 1. A bonding apparatus having a supply section containing an electronic component and a bonding section for bonding the electronic component taken out from the supply section to a circuit board or a lead frame, wherein the supply section has a plurality of electrons. A tray capable of accommodating parts in a matrix in a planar arrangement, a stocker capable of accommodating a plurality of trays in a matrix in an array, a holder for positioning and holding the stocker, and a holder held by the holder A bonding apparatus comprising: a pickup head that moves with respect to an electronic component accommodated in a tray accommodated in a stocker, and that picks up and transfers a predetermined electronic component. 2. The bonding apparatus according to claim 1, wherein the XY directions of the electronic component array, the XY directions of the tray array, and the XY directions of the pickup head drive are coincident with each other.