JPH0767025B2 - Outer lead bonding machine - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial application] The present invention is suitable for outer lead bonding (hereinafter abbreviated as bonding) of a plurality of different types of semiconductor chips such as IC chips on one printed circuit board. The present invention relates to an outer lead bonding device (hereinafter abbreviated as a bonding device).

[Conventional technology]

In recent years, there has been one in which a plurality of different types of semiconductor chips are bonded to one printed circuit board. In this case, 1
1 outer lead bonder (hereinafter abbreviated as bonder)
In a bonding apparatus equipped with a semiconductor chip supply device (hereinafter abbreviated as a supply device), for example, when the IC chips A and B are bonded, the case where the supply device is a carrier tape feeding type is taken as an example. After the carrier tape holding the is attached to the supply device and the bonding tool of the bonder has a shape suitable for the IC chip A, the printed boards are sequentially sent to the bonding device, and the IC chip A is first attached to the entire printed board. Bonding is performed, then the carrier tape of the supply device is replaced with the carrier tape holding the IC chip B, and the bonding tool of the bonder is also replaced with a shape suitable for the IC chip B, and then the printed circuit boards are sequentially bonded again. It was sent to the device and the IC chip B was bonded.

[Problems to be Solved by the Invention]

Among the above-described bonding tool replacement work and carrier tape replacement work, the bonding tool replacement work performs bonding for one IC chip as disclosed in Japanese Patent Application No. 62-68872 proposed by the present inventor. In this case, a universal bonder is used, in which the bonding tool is displaced in the horizontal plane relative to the IC chip for each bonding operation and a part is bonded by one bonding operation and the whole is bonded by a plurality of bonding operations. However, the carrier tape replacement work had to be performed.

It is also possible to provide two supply devices, a supply device for supplying the IC chip A and a supply device for supplying the IC chip B, but as in the conventional case, the IC chip is supplied to the printed circuit board of the bonding stage for bonding. However, if the bonding stage and the bonder are not provided for both the IC chip A and the IC chip B, efficient bonding cannot be performed. That is, if IC chips A and B are to be sequentially bonded by one bonding stage using a universal bonder, supply of IC chip A, bonding, supply of IC chip B, and bonding must be performed sequentially. It takes a long time in one bonding stage, which hinders improvement of the cycle time of the entire apparatus.

SUMMARY OF THE INVENTION The present invention is intended to solve the above-mentioned problems, and a bonding apparatus capable of extremely efficiently bonding a plurality of semiconductor chips of different types to one printed circuit board to improve the cycle time. It is intended to be provided in the form of a small number.

[Means for Solving the Problems]

According to the present invention, when the outer lead bonding is performed on one semiconductor chip 2 to 6 on the bonding stage 37 of the transfer path for transferring the printed circuit board 1, the bonding tool 52 is attached to the semiconductor chip 2 for each bonding operation.
6 to 6, the outer lead bonder is displaced relative to the horizontal plane to bond a part by one bonding operation and bond all by a plurality of bonding operations.
In the outer lead bonding apparatus provided with 19, a semiconductor chip sticking stage 36 is provided on the transport path upstream of the bonding stage 37, and an intermediate portion is provided between the sticking stage 36 and the semiconductor chip supply devices 7-11. A pedestal 20 is provided, and a first transfer device 38 having X-direction moving, vertical moving and rotating devices is provided between the intermediate pedestal 20 and the semiconductor chip supply devices 7 to 11, and the intermediate receiving device 38. Stand 20
The bonding apparatus is characterized by including a second transfer device 18 having an X-direction moving device, a Y-direction moving device, and a vertical moving device between the bonding stage 36 and the bonding stage 36.

[Work]

In the bonding apparatus of the present invention, a semiconductor chip sticking stage is provided in the transport path upstream of the bonding stage, an intermediate pedestal is provided between the sticking stage and the feeding device, and the feeding device is the first transfer device. The semiconductor chips of the intermediate cradle are transferred by the second transfer device to the printed circuit board by the second transfer device, and the positional deviation of the semiconductor chips can be corrected during the transfer by these transfer devices. The chip transfer cycle time can be shortened.

Further, in order to transfer the semiconductor chip to the printed circuit board in the bonding stage upstream of the bonding stage, if a paste is applied to the printed circuit board or the semiconductor chip in advance, a plurality of semiconductor chips can be transferred to the printed circuit board in the semiconductor chip bonding stage. It can be attached in place.

Since the printed circuit board to which a plurality of different types of semiconductor chips are already attached at predetermined positions is supplied to the bonding stage, bonding can be performed immediately. And since it has a versatile bonder,
A single bonder can continuously bond a plurality of different types of semiconductor chips.

That is, by providing the semiconductor chip attaching stage separately from the bonding stage, continuous bonding can be performed on a plurality of different types of semiconductor chips using one universal bonder at the bonding stage.

〔Example〕

 Embodiments of the present invention will be described with reference to the drawings.

FIG. 6 shows different types of IC chips 2 to 6 on the printed circuit board 1.
Shows that they are bonded to their respective predetermined mounting positions.

1 and 2 show the entire bonding apparatus for mounting the IC chips 2 to 6 on the printed board 1.

36 is an IC chip attachment stage (hereinafter abbreviated as attachment stage),
Reference numeral 37 denotes a bonding stage, which is a moving device (not shown) for moving the guide rails 17, 17 and the printed circuit board 1 so that the sticking stage 36 is on the upstream side and the bonding stage 37 is on the downstream side in the conveyance path of the printed circuit board 1. No) is provided. The second transfer device 18 is attached to the bonding stage 36 in the vicinity of one side of the transport path.
Bonders 19 are provided at 37.

Reference numerals 7 to 11 denote IC chip supply devices (hereinafter referred to as supply devices) for supplying the IC chips 2 to 6 to predetermined supply positions, and the line connecting the supply positions of the IC chips 2 to 6 is the conveyance direction of the printed circuit board 1 ( They are arranged side by side in the same direction as the (X direction). For example, the feeding device 9 is a feeder 13 for a carrier tape 12 holding the IC chip 4 at its outer lead portion.
Winding machine for carrier tape 12 with IC chip 4 removed
14 and a carrier tape conveying device composed of 14 and a cutting device composed of a punch 15 and a die 16 for separating the IC chip 4 from the carrier tape 12 by cutting the outer lead portion at a predetermined supply position. The separated IC chip 4 is a punch
The upper part of the punch 15 is left as a predetermined supply position on the punch 15. The other supply devices 7, 8, 10 and 11 are similarly formed by including a carrier tape carrier device holding each IC chip and a cutting device suitable for each IC chip.

Reference numeral 20 denotes an intermediate cradle, which is provided between the supply device group and the conveyance path of the printed circuit board 1, and an IC is provided between the intermediate cradle 20 and the supply device group.
A first transfer device 38 is provided for transferring the chips 2 to 6 from their respective supply positions to the intermediate pedestal 20. And the first
The IC transfer device 38, the intermediate receiving table 20, and the second transfer device 18 form an IC chip transfer device.

The first transfer device 38 is formed by attaching a vacuum suction tool 25 to the tip of an arm 21 provided with an X-direction moving device 22 for moving in the X direction, a vertical moving device 23, and a rotating device 24 that rotates around a vertical axis. Has been done.

One or more IC chip mounting positions are provided on the intermediate pedestal 20. In this embodiment, three mounting positions 26, 27, 28 are provided, but it is also possible to provide five mounting positions and determine the mounting positions for each IC chip. Further, in this embodiment, it is fixedly provided, but when a plurality of them are provided, an X-direction moving device is provided on the intermediate receiving table 20 so that the receiving position from the first transfer device 38 and the second transfer device 18 can be obtained. The delivery position can be set to one fixed position.

The second transfer device 18 picks up the IC chip placed on the intermediate pedestal 20 and prints the printed circuit board 1 on the attachment stage 36.
X-direction moving device 29, Y-direction moving device 30 for moving in the horizontal direction perpendicular to the X direction, and vertical movement device 31.
A vacuum suction tool 34 provided with a rotating device 33 that rotates about a vertical axis is provided at the tip of an arm 32 provided with. Then, a bonding stage in which a position detection device 35 for detecting the position and orientation of the IC chip on the intermediate receiving table 20 is provided, and the lead position is previously detected from the detected position.
The outer leads of the IC chip and the leads of the printed circuit board 1 are aligned with the IC chip mounting position of the printed circuit board 1 on the 36, that is, the position and the orientation of the IC chip are corrected, and the IC chip is transferred, placed and attached. Each device 30, 31, 33 is adapted to be worn.

FIG. 3 shows a sectional view of the bonding tool 52 of the bonder 19. The bonding tool 52 is provided with an X-direction moving device, a Y-direction moving device, a vertical moving device, and a rotating device (not shown). For example, half of the bonding-required portion is bonded in the posture shown by the solid line in the figure, and then the two-dot chain line is shown. The other half is bonded by displacing it in the posture shown by.

Then, the printed circuit board 1 is coated with the paste at the IC chip mounting position and conveyed to the bonding stage 36. Assuming that the IC chips are mounted in the order of IC chips 2, 3, 4, 5, and 6, the intermediate pedestal 20 has the IC chip 2 at the mounting position 26 and the IC chip 2 at the mounting position 27.
The IC chip 3 is supplied to the mounting position 28.

The IC chip 2 is attached to the printed circuit board 1 on the attachment stage 36 by the second transfer device 18. At this time, first, the position detection device 35 is moved above the mounting position 26 of the intermediate pedestal 20 to detect the displacement of the position and orientation of the IC chip 2. Next, the arm 32 is moved according to the detected value and the IC chip 2 is picked up by the vacuum suction tool 34. Then, the rotating device 33 is rotated by the value of the deviation of the direction of the IC chip 2 and the deviation of the direction of the lead corresponding to the IC chip 2 of the printed circuit board 1 which is detected in advance so as to match the directions of both, and it is detected in advance. The vacuum suction tool 34 is moved to a position where the IC chip 2 of the printed circuit board 1 is to be attached, and the IC chip 2 is placed on the printed circuit board 1. Then, the IC chip 2 is attached to the printed board 1 on the back surface of the main body by the paste applied in advance.

At the mounting position 26 where the IC chip 2 is picked up, the IC chip 5 is mounted from the supply device 10 by the first transfer device 38.

Then, in the same manner, the IC chips 3, 4, 5, 6 are sequentially arranged on the printed circuit board 1.
Transfer to and paste.

The printed board 1 to which all the IC chips 2 to 6 are attached is transferred to the bonding stage 37, and the outer lead of the IC chip and the lead of the printed board 1 are bonded by the bonder 19 based on the bonding position data used during the attachment. Bonded. In this case, half the bonding is performed on the IC chips 2 to 6 with the posture shown by the solid line in FIG.
It is possible to change the posture of the chain double-dashed line and perform the remaining bonding on the IC chips 2 to 6 again continuously, or to complete the bonding of the IC chips 2 to 6 one by one.

When bonding is continuously performed to the IC chips 2 to 6 by the bonder 19 in the bonding stage 37, the work of fixing the IC chips 2 to 6 to the next printed circuit board 1 is performed in parallel in the bonding stage 36. Has been done.

In this embodiment, the IC chip transfer device is the first transfer device 38,
Since it is formed of the intermediate cradle 20 and the second transfer device 18, the IC chips 2 to 6 can be transferred and supplied onto the printed circuit board 1 from the supply devices 7 to 11 in a short transfer cycle time. Also, since the intermediate receiving table 20 is provided with three mounting positions 26, 27, 28, it is convenient to cover a plurality of supply devices 7 to 11 with one first transfer device 38. is there. For example, the time required to transfer the IC chips 2 and 6 from the supply devices 7 and 11 onto the intermediate pedestal 20 is longer than the time required to transfer the IC chips 3 and 4, but the second transfer device 18 IC chip 2,6
You can have a margin before you transfer.

In the above-mentioned embodiment, if the printed circuit board support member of the attachment stage 36 is required, it is a fixed member having a vertical movement device,
Although the deviation (Δx, Δy, Δθ) between the lead of the printed circuit board 1 and the outer lead of the IC chip is corrected by the second moving device 18, the X direction moving device is used for the printed circuit board supporting member of the attachment stage 36. It is also possible to provide a Y-direction moving device, a rotating device, etc. to perform a correction operation on the printed circuit board supporting member.

Further, although each moving device is provided in the bonding tool 52,
The printed circuit board supporting member of the bonding stage 37 may be provided with all or a part of the moving device. For example, the posture of the bonding tool 52 can be relatively displaced by moving the printed circuit board supporting member of the bonding stage 37.

Further, instead of applying the sticking paste to the printed board 1, it may be applied to the back surface of the IC chip during the transfer process, for example.

Further, without using the first transfer device 38 and the intermediate pedestal 20, the second transfer device 18 directly supplies the IC chips 2 to 11 from the supply devices 7 to 11.
6 can also be transferred.

FIGS. 4 and 5 show another embodiment, which is different from the examples of FIGS. 1 and 2 in that the supply device and the first transfer device 38 are provided with a Y-direction moving device 39.

The IC chips 2 to 6 are housed in the trays 40 to 44, and the IC chips 2 to 6 are conveyed to the supply position at once with the trays.
The IC chip 2 is accommodated in the tray 40 and the IC chip 3 is accommodated in the tray 41 in this order.

The supply device 45 for supplying the IC chip 2 includes a raising device 46 for raising the tray 41 accommodating the IC chip 2 to the feeding height, a lowering device 47 for collecting the empty tray 41, and a raising device 46.
And a device (not shown) for moving the tray 41 onto the lowering device 47. Other IC chip feeder 48
~ 51 are similarly formed.

Since the first transfer device 38 includes the Y-direction moving device 39, if the positions of the IC chips 2 in the tray 41 and the order of taking out the IC chips 2 are predetermined, the IC chips 2 are transferred from the tray 41 at the supply position.
Can be taken out one by one.

When the tray 41 at the supply position becomes empty, the lowering position 47 is lowered by one tray in advance, the empty tray 41 is moved onto the tray of the lowering device 47, and the raising device 46 is raised by one stage to move to the next stage. The tray 41 containing the IC chip 2 is placed at the supply position.

In addition, in the embodiment shown in FIGS. 1 and 2, the IC chip in which the main body is adhered to the carrier tape so that it can be peeled by a vacuum suction tool is used, and in that case, a cutting device is not necessary.

Further, in the embodiment shown in FIGS. 4 and 5, an adhesive sheet is used instead of the tray in which a large number of IC chips are detachably held by a vacuum suction tool, and the adhesive sheet is supplied to a supply position. You can also

〔The invention's effect〕

According to the bonding apparatus of the present invention, when performing outer lead bonding on one semiconductor chip on the bonding stage of the transport path for transporting the printed circuit board, the bonding tool is placed on a horizontal plane relative to the semiconductor chip for each bonding operation. In an outer lead bonding apparatus provided with an outer lead bonder that is displaced in one step to perform a part of bonding and a plurality of times of bonding operations to bond all, a semiconductor chip is attached to a transport path upstream of the bonding stage. An attachment stage is provided, and an intermediate pedestal is provided between the attachment stage and the semiconductor chip supply device, and an X direction movement, a vertical movement and a rotation device are provided between the intermediate pedestal and the semiconductor chip supply device. A first transfer device comprising: Since the second moving device including the X-direction moving device, the Y-direction moving device, and the up-down moving device is provided between the interstage stand and the sticking stage, the chip transfer cycle time can be shortened. In the bonding stage, continuous bonding can be performed for a plurality of different types of semiconductor chips by using one universal bonder.

Therefore, it is possible to provide a bonding apparatus capable of extremely efficiently bonding a plurality of semiconductor chips of different types to one printed circuit board to improve the cycle time in a form having a small number of constituent devices.

[Brief description of drawings]

FIG. 1 is a plan view of an embodiment of the present invention, and FIG. 2 is its II.
3 is a sectional view of the bonding tool,
FIG. 4 is a plan view of another embodiment of the present invention, FIG. 5 is a left side view thereof, and FIG. 6 is a plan view of a printed circuit board. 1 ... Printed circuit board, 2 ... IC chip, 3 ... IC chip, 4 ... IC chip, 5 ... IC chip, 6 ... IC chip, 7 ... Supply device, 8 ... Supply device, 9 ... … Supplier, 10 …… Supplier, 11 …… Supplier, 12 …… Carrier tape, 13 …… Supplier, 14 …… Winder, 15 …… Punch,
16 ... Die, 17 ... Guide rail, 18 ... Second transfer device, 19 ... Bonder, 20 ... Intermediate cradle, 21 ... Arm,
22 …… X direction moving device, 23 …… Vertical movement device, 24 …… Rotating device, 25 …… Vacuum suction tool, 26 …… Mounting position, 27 ……
Placement position, 28 ... Placement position, 29 ... X-direction moving device, 30
...... Y direction moving device, 31 ...... Up / down moving device, 32 …… Arm, 33 …… Rotating device, 34 …… Vacuum suction tool, 35 …… Position detection device, 36 …… Adhesion stage, 37 …… Bonding Stage, 38 ... First transfer device, 39 ... Y-direction moving device, 40 ... Tray, 41 ... Tray, 42 ... Tray, 43 ...
... Tray, 44 ... Tray, 45 ... Supply device, 46 ... Ascending device, 47 ... Descent device, 48 ... Supply device, 49 ... Supplier device, 50 ... Supplier device, 51 ... Supplier device, 52 ... Bonding tool.

Claims (1)

[Claims] 1. A bonding tool 52 is mounted on a bonding stage 37 of a transfer path for transferring a printed circuit board 1 at each bonding operation when outer lead bonding is performed on one semiconductor chip 2-6. 6 to 6, the outer lead bonding apparatus is provided with an outer lead bonder 19 which is displaced in a horizontal plane relative to 6 and partially bonded in one bonding operation and bonded all in a plurality of bonding operations. A semiconductor chip sticking stage 36 is provided on the upstream side transport path, and an intermediate pedestal 20 is provided between the sticking stage 36 and the semiconductor chip feeders 7 to 11, and the intermediate cradle 20 and the semiconductor chip feed unit are provided. First transfer with X-direction movement, vertical movement and rotation device between devices 7-11 The location 38, also the intermediate receiving base 20
An outer lead bonding apparatus comprising a second transfer device 18 having an X-direction movement device, a Y-direction movement device, and a vertical movement device between the attachment stage 36 and the attachment stage 36.