JPH0611486B2 - Method for manufacturing ceramic tubular member - Google Patents
Method for manufacturing ceramic tubular memberInfo
- Publication number
- JPH0611486B2 JPH0611486B2 JP26538185A JP26538185A JPH0611486B2 JP H0611486 B2 JPH0611486 B2 JP H0611486B2 JP 26538185 A JP26538185 A JP 26538185A JP 26538185 A JP26538185 A JP 26538185A JP H0611486 B2 JPH0611486 B2 JP H0611486B2
- Authority
- JP
- Japan
- Prior art keywords
- tubular member
- base material
- cvd
- cylindrical
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 19
- 238000000034 method Methods 0.000 title claims description 17
- 239000000919 ceramic Substances 0.000 title claims description 13
- 239000000463 material Substances 0.000 claims description 46
- 230000002093 peripheral effect Effects 0.000 claims description 18
- 239000003779 heat-resistant material Substances 0.000 claims description 5
- 238000005524 ceramic coating Methods 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 2
- 238000002844 melting Methods 0.000 claims description 2
- 239000002585 base Substances 0.000 description 35
- 208000037998 chronic venous disease Diseases 0.000 description 30
- 229910010271 silicon carbide Inorganic materials 0.000 description 16
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 16
- 238000006243 chemical reaction Methods 0.000 description 13
- 238000000576 coating method Methods 0.000 description 12
- 239000011248 coating agent Substances 0.000 description 8
- 239000000758 substrate Substances 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 229910052575 non-oxide ceramic Inorganic materials 0.000 description 4
- 239000011225 non-oxide ceramic Substances 0.000 description 4
- 238000005245 sintering Methods 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 238000002485 combustion reaction Methods 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000010453 quartz Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 229920003002 synthetic resin Polymers 0.000 description 3
- 239000000057 synthetic resin Substances 0.000 description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 238000000746 purification Methods 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 229910003902 SiCl 4 Inorganic materials 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- -1 aluminum and nickel Chemical class 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000004031 devitrification Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000012770 industrial material Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000012495 reaction gas Substances 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Landscapes
- Manufacturing Of Tubular Articles Or Embedded Moulded Articles (AREA)
- Chemical Vapour Deposition (AREA)
Description
【発明の詳細な説明】 [産業上の利用分野] 本発明はセラミックス製の管状部材の製造方法に係り、
特に半導体製造用反応管として用いるに好適なセラミッ
クス製管状部材の製造方法に関する。TECHNICAL FIELD The present invention relates to a method for manufacturing a ceramic tubular member,
In particular, the present invention relates to a method for manufacturing a ceramic tubular member suitable for use as a reaction tube for semiconductor production.
[従来の技術] 従来、半導体製造用反応管としては、石英管又はその外
側にムライト質もしくは炭化珪素質の均熱用ライナチュ
ーブを設けたものが使われている。ところが、石英管で
は割れ易い、コンタミが入り失透するなどの欠点を有
し、特に高温での強度が不足し、撓む結果、最近の大口
径のSiウェハに対応できなくくなりつつある。[Prior Art] Conventionally, as a reaction tube for semiconductor production, a quartz tube or a tube provided with a mullite or silicon carbide soaking liner tube on the outside thereof has been used. However, a quartz tube has drawbacks such as easy cracking and devitrification due to contamination. In particular, the strength at high temperature is insufficient, and as a result of bending, it is becoming difficult to cope with recent large-diameter Si wafers.
そこで、石英以外の材質からなる半導体製造用反応管の
提供が期待されている。Therefore, it is expected to provide a reaction tube for semiconductor production made of a material other than quartz.
ところで、近年、炭化珪素や窒化珪素等の非酸化物系セ
ラミックスは、優れた耐熱特性を有しているところか
ら、各種工業材料への適用が検討されており、非酸化物
系セラミックスを用いて半導体製造用反応管を製造する
ことが考えられる。この場合、非酸化物系セラミックス
は、焼結しにくいので、焼結体とするには適宜の焼結助
剤を用いたり、反応焼結法を採用する必要がある。By the way, in recent years, since non-oxide ceramics such as silicon carbide and silicon nitride have excellent heat resistance characteristics, application to various industrial materials has been studied, and non-oxide ceramics have been used. It is conceivable to manufacture a reaction tube for semiconductor manufacturing. In this case, since non-oxide ceramics are difficult to sinter, it is necessary to use an appropriate sintering aid or a reaction sintering method to form a sintered body.
また、管体もしくは棒を蒸着基材とし、これを加熱しつ
つその内面もしくは外面に反応ガスを供給してCVD被
膜を形成し、しかる後基材を適当な方法で除去すること
によりパイプを得る方法が知られている。(例えば特開
昭58−177461)。Further, a pipe or a rod is used as a vapor deposition base material, a reaction gas is supplied to the inner surface or the outer surface while heating the vapor deposition base material to form a CVD film, and then the base material is removed by an appropriate method to obtain a pipe. The method is known. (For example, JP-A-58-177461).
[発明が解決しようとする問題点] 上記の従来法のうち、焼結助剤を用いたり、反応焼結に
よる方法では、高純度化に多大の労力を要し、価格が高
いばかりでなく、粉末プロセスを採用する以上、高純度
化にも限度がある。[Problems to be Solved by the Invention] Of the above-mentioned conventional methods, a method using a sintering aid or a reaction sintering method requires a great deal of labor for high purification, and is not only expensive, As the powder process is adopted, there is a limit to high purification.
一方、CVD法によれば、極めて緻密で高純度なセラミ
ックスが得られるものの、肉厚が大きく高剛性の管状部
材を製造する場合、CVD処理に長時間を要し、生産効
率が悪いという問題がある。On the other hand, according to the CVD method, although extremely dense and high-purity ceramics can be obtained, when manufacturing a tubular member having a large wall thickness and high rigidity, the CVD process requires a long time, resulting in poor production efficiency. is there.
なお、焼結した炭化珪素管の内面に、高純度の炭化珪素
をCVD法によって蒸着することによりセラミックス製
反応管を得ることが考えられるが、母材炭化珪素からの
不純物の拡散散や被膜の剥離もしくは割れによる母材炭
化珪素の露出の恐れがあり、CVD膜だけから構成され
た反応管の提供が期待されている。Although it is possible to obtain a ceramic reaction tube by depositing high-purity silicon carbide by a CVD method on the inner surface of the sintered silicon carbide tube, diffusion of impurities from the base material silicon carbide and formation of a film Since the base material silicon carbide may be exposed due to peeling or cracking, it is expected to provide a reaction tube composed only of a CVD film.
[問題点を解決するための手段] 本発明は順次に行なう次の〜の工程によりるセラミ
ックスのCVD膜よりなる管状部材を製造するようにし
たものである。[Means for Solving the Problems] The present invention is intended to manufacture a tubular member made of a CVD CVD film of ceramics by the following steps to be sequentially performed.
燃焼除去又は溶解除去可能な材質からなり、かつ周壁
に多数の貫通孔を有する筒状基材の内外両周面及び前記
貫通孔内面にCVD処理によりセラミックスの被膜を形
成し、 次いで前記筒状基材を燃焼又は溶解により除去し、周
壁に多数の貫通孔を有するCVD膜よりなる二重筒状管
状部材となし、 さらに、該貫通孔に耐熱材料を充填し、 該二重筒状管状部材の内周面及び外周面にCVD処理
によりセラミックスの被膜を形成する。A ceramic coating is formed on both the inner and outer peripheral surfaces of the cylindrical base material having a large number of through holes in the peripheral wall and the inner surface of the through hole by a CVD process, and then the cylindrical base is formed. The material is removed by burning or melting to form a double cylindrical tubular member made of a CVD film having a large number of through holes in its peripheral wall. Further, the through holes are filled with a heat-resistant material, and the double cylindrical tubular member A ceramic coating is formed on the inner peripheral surface and the outer peripheral surface by a CVD process.
かかる本発明によれば、肉厚が小さくとも剛性の高いセ
ラミックス製の管状部材を極めて容易に製造できる。According to the present invention, it is possible to extremely easily manufacture a tubular member made of ceramics having a high rigidity even if the wall thickness is small.
以下に本発明の工程〜につき図面を参照しながら更
に詳細に説明する。The steps of the present invention will be described below in more detail with reference to the drawings.
工程 本発明においては、基材として燃焼除去又は溶解除去可
能な材質からなり、かつ第1図に示すように、周壁に多
数の貫通孔1を有する筒状の基材2を用いる。Process In the present invention, as the base material, a cylindrical base material 2 which is made of a material that can be removed by combustion or dissolved and has a large number of through holes 1 in its peripheral wall as shown in FIG. 1 is used.
この基材としては、CVD処理温度に耐え得る材質のも
のが用いられる。その厚さは、目的とする管状部材の肉
厚よりもCVD被膜の厚さ分だけ薄いものを用いる。As the base material, a material that can withstand the CVD processing temperature is used. Its thickness is thinner than the intended thickness of the tubular member by the thickness of the CVD coating.
燃焼除去できる基材としては、炭素(その結晶形態のい
かんを問わない)などの他、合成樹脂や紙なども用いる
ことができる。また溶解除去できる基材としては、アル
ミニウムやニッケル等の金属や有機溶剤にて溶解する合
成樹脂等が挙げられる。As the base material that can be removed by combustion, in addition to carbon (regardless of its crystal form), synthetic resin or paper can be used. Examples of the base material that can be dissolved and removed include metals such as aluminum and nickel, and synthetic resins that dissolve in an organic solvent.
なお、第1図では円筒形状の基材を用いているが、本発
明においては楕円筒形や角筒(例えば六角筒)等の形状
の基材を用いてもよい。Although a cylindrical base material is used in FIG. 1, a base material having an elliptic cylinder shape, a rectangular cylinder shape (for example, a hexagonal cylinder shape) or the like may be used in the present invention.
基材2に穿設される貫通孔1は、図示の如く均等に分布
させるのが好適である。また、貫通孔1の直径や設置個
数は任意であるが、直径が100〜300mm程度の半
導体製造用反応管を製造する場合には、直径2〜10m
m程度の貫通孔を1cm2当り0.2〜1個程度設ける
のが好適である。この貫通孔1は円孔、角孔のいずれで
も良い。The through holes 1 formed in the base material 2 are preferably evenly distributed as shown in the figure. Further, the diameter and the number of the through holes 1 to be installed are arbitrary, but in the case of manufacturing a reaction tube for semiconductor production having a diameter of about 100 to 300 mm, the diameter is 2 to 10 m.
It is preferable to provide about 0.2 to 1 through hole of about m per cm 2 . The through hole 1 may be a circular hole or a square hole.
このような筒状基材に、本発明においてはCVD処理を
施し、その内周面及び外周面並びに貫通孔の内面にCV
D被膜を形成する。CVD被膜を形するには、常法に従
って行なえばよく、例えばCVD処理装置内に装入し、
適当するCVD反応温度に加熱して、CVD原料ガスを
導入すればよい。In the present invention, such a cylindrical substrate is subjected to a CVD treatment, and CV is formed on the inner and outer peripheral surfaces and the inner surface of the through hole.
Form D coating. The CVD coating may be formed according to a conventional method, for example, by placing it in a CVD processing apparatus,
The CVD source gas may be introduced by heating to a suitable CVD reaction temperature.
このCVD被膜は、本発明においてはセラミックスであ
る。具体的な材質としては炭化珪素、窒化珪素などの非
酸化物系セラミックスの他マグネシア、アルミナ等の酸
化物系のものでもよいが、反応管として用いる管状部材
を製造するには、炭化珪素を析出させるのが好適であ
る。炭化珪素のCVD析出反応に用いられる原料ガス
は、各種のものが知られており、本発明ではいずれのも
のも採用できる。例えば、よく知られているように、C
H3SiCl3を熱分解させることによりSiCを析出
させることができる。またSiCl4をCH4等のハイ
ドロカーボンを用いて還元することによってもSiCを
析出させることができる。This CVD coating is a ceramic in the present invention. Specific materials may be non-oxide ceramics such as silicon carbide and silicon nitride, as well as oxide-based ones such as magnesia and alumina. However, in order to manufacture a tubular member used as a reaction tube, silicon carbide is deposited. Is preferred. Various source gases are known for use in the CVD deposition reaction of silicon carbide, and any of them can be adopted in the present invention. For example, as is well known, C
SiC can be deposited by thermally decomposing H 3 SiCl 3 . SiC can also be deposited by reducing SiCl 4 with a hydrocarbon such as CH 4 .
析出させるCVD被膜の厚さは、特に限定はされず、得
られる管状部材に要求される強度を満たす肉厚となるよ
うにCVD処理条件を選定する。The thickness of the CVD coating film to be deposited is not particularly limited, and the CVD processing conditions are selected so that the thickness will satisfy the strength required for the tubular member to be obtained.
本発明においては、当然ながら、例えばCVD処理時間
を長短調整することにより、CVD被膜の肉厚の調整を
行なうことが可能である。In the present invention, as a matter of course, the thickness of the CVD film can be adjusted by adjusting the length of the CVD treatment, for example.
工程 このようなCVD被膜の析出を行なった後、基材の除去
を行なう。この基材の除去を行なうには、前述のように
燃焼除去又は溶解除去を行なう。燃焼除去を行なうに
は、酸化雰囲気中において基材が燃焼する温度領域に保
持すればよい。この際、CVD処理装置内に保持したま
ま、雰囲気を酸素又は空気に切り換えることにより、処
理装置内で基材の燃焼除去を引き続き行なうことができ
る。このようにすれば、基材とCVD被膜との熱膨張差
に起因する熱応力の発生を防止することができる。勿
論、本発明においては、一旦室温まで戻した後基材を燃
焼除去してもよい。また、CVD処理温度とは異なる温
度で基材を燃焼させてもよいことは明らかである。Step After depositing such a CVD film, the substrate is removed. In order to remove this base material, combustion removal or dissolution removal is performed as described above. In order to remove by burning, it is sufficient to keep the temperature in the temperature range where the base material burns in the oxidizing atmosphere. At this time, the atmosphere can be switched to oxygen or air while being held in the CVD processing apparatus, so that the substrate can be continuously burned and removed in the processing apparatus. This makes it possible to prevent the occurrence of thermal stress due to the difference in thermal expansion between the base material and the CVD coating. Of course, in the present invention, the substrate may be burned and removed after returning to room temperature. It is also clear that the substrate may be burned at a temperature different from the CVD processing temperature.
基材を溶解除去させる場合、例えば基材がアルミニウム
やニッケル等の金属であるならば、適当な濃度の酸を用
いる。また、アルミニウムはアルカリでも溶解除去する
ことが可能である。更に、基材が合成樹脂である場合、
それを適度な早さで溶解し得る有機溶剤を用いてもよ
い。When the base material is dissolved and removed, for example, when the base material is a metal such as aluminum or nickel, an acid having an appropriate concentration is used. Further, aluminum can be dissolved and removed even with an alkali. Further, when the base material is a synthetic resin,
You may use the organic solvent which can melt | dissolve it at a suitable speed.
このような基材の除去により、第2図に示すように、内
筒3、外筒4、これらを連結する柱部5、該柱部5を貫
通する貫通孔6よりなる二重筒状部材7が得られる。こ
の工程の基材の除去を行なうに先立って、第3図の如
く、CVD被膜付の基材2の少なくとも一端、好ましく
は両端を切り落とし、除去すべき基材を外部に露出さ
せ、基材の燃焼除去もしくは溶解除去の開始部を形成す
るのが好ましい。なお、基材端面や端部を研磨して除去
すべき基材を露出させてもよい。或いは、基材の端部又
は端面にCVD被膜を形成させないように対策を講じて
おけば、かかる端部もしくは端面の切断や研磨工程は不
要である。By removing such a base material, as shown in FIG. 2, a double-cylindrical member including an inner cylinder 3, an outer cylinder 4, a column portion 5 connecting these, and a through hole 6 penetrating the column portion 5. 7 is obtained. Prior to removing the base material in this step, at least one end, preferably both ends, of the CVD-coated base material 2 is cut off to expose the base material to be removed to the outside as shown in FIG. It is preferable to form the start of burn-off or dissolution removal. The end face or end of the base material may be polished to expose the base material to be removed. Alternatively, if measures are taken so as not to form the CVD coating on the end portion or the end surface of the base material, the step of cutting or polishing the end portion or the end surface is unnecessary.
工程 この二重筒状部材7の貫通孔6に、第4図に示すよう
に、耐熱材料8を充填する。この耐熱材料8としては、
黒鉛などの炭素質のものが好適であるが、セラミックス
の粉末でもよい。セラミックス粉末の場合、CVDによ
り析出したセラミックスと同材質のものが好適である。Step The through hole 6 of the double cylindrical member 7 is filled with a heat resistant material 8 as shown in FIG. As this heat-resistant material 8,
A carbonaceous material such as graphite is preferable, but a ceramic powder may be used. In the case of ceramic powder, the same material as the ceramic deposited by CVD is suitable.
工程 次いで、第5図の如く、二重筒状部材7の内周面及び外
周面にCVD被膜9、10を形成する。これにより、耐
熱材料8が被覆されると共に二重筒状の管状部材11を
形成することができる。CVD被膜3、4と同材質のも
のが好適であるが、熱膨張率の差が小さければ異なる材
質のものでもよい。CVD被膜9、10の厚さは、特に
限定はない。このようにして得られた二重筒状管状部材
11は、その剛性が主として二重筒構造とすることによ
り発現されるものであるので、CVD被膜3、4、9、
10について特に厚肉としなくとも十分に高剛性の管状
部材を得ることができる。Step Next, as shown in FIG. 5, CVD coatings 9 and 10 are formed on the inner peripheral surface and the outer peripheral surface of the double cylindrical member 7. As a result, the heat-resistant material 8 is coated and the tubular member 11 having a double cylindrical shape can be formed. The same material as the CVD coatings 3 and 4 is preferable, but different materials may be used as long as the difference in coefficient of thermal expansion is small. The thickness of the CVD coatings 9 and 10 is not particularly limited. Since the double tubular tubular member 11 thus obtained has its rigidity mainly due to the double tubular structure, the CVD coatings 3, 4, 9,
With respect to 10, it is possible to obtain a tubular member having a sufficiently high rigidity without increasing the thickness.
[実施例] 実施例1 内径9cm、外径10cmの黒鉛製の基材の周壁に、直
径5mmの貫通孔を1cm2当り1個の割合で穿設し
た。この円筒状基材をCVD処理装置内に装入し、15
00℃に加熱した状態でCVD原料ガスとしてSiCl
4を0.6/min、C3H8を0.1/minの
割合で筒状基材の内面及び外面に沿って流通させ、基材
内外両周面に厚さ0.3mmのSiCのCVD被膜を形
成した。Example 1 Example 1 A through hole having a diameter of 5 mm was bored at a rate of 1 per cm 2 on a peripheral wall of a graphite base material having an inner diameter of 9 cm and an outer diameter of 10 cm. This cylindrical base material is loaded into a CVD processing apparatus,
SiCl as a CVD source gas in a state of being heated to 00 ° C.
4 at a rate of 0.6 / min and C 3 H 8 at a rate of 0.1 / min along the inner surface and the outer surface of the tubular substrate, and 0.3 mm thick SiC on both the inner and outer peripheral surfaces of the substrate. A CVD film was formed.
次いで、処理装置から取り出し、端部を5mmの幅で切
り落とし、1000℃の大気雰囲気で基材の燃焼除去を
行なった。基材の燃焼除去終了後、得られた二重筒状管
状部材の周壁貫通孔に黒鉛粉を充填し、再度CVD処理
装置内に装入し、上記と同様の処理条件で厚さ0.1m
mのSiCのCVD被膜を内外両周面に形成した。得ら
れたものをCVD処理装置外に取り出し、外径100.
4mm、内径89.6mm、全長390mmの筒状部材
を得た。この管状部材は全体的に肉厚が均一であり、ま
た析出したSiCの密度は3.20であった。なおX線
回折により結晶構造を調べたところ、生成物はSiCだ
けからなるものであることが確認された。Then, it was taken out of the processing apparatus, the end portion was cut off into a width of 5 mm, and the base material was removed by burning in an atmosphere of 1000 ° C. After the removal of the base material by burning, the peripheral wall through-holes of the obtained double tubular tubular member were filled with graphite powder and charged again into the CVD processing apparatus, and the thickness was 0.1 m under the same processing conditions as above.
m CVD film of SiC was formed on both the inner and outer peripheral surfaces. The obtained product was taken out of the CVD processing apparatus and had an outer diameter of 100.
A tubular member having a diameter of 4 mm, an inner diameter of 89.6 mm and a total length of 390 mm was obtained. The tubular member had a uniform thickness as a whole, and the density of the precipitated SiC was 3.20. When the crystal structure was examined by X-ray diffraction, it was confirmed that the product consisted only of SiC.
[発明の効果] 以上の説明から明らかな通り、本発明によれば二重筒状
であり、肉厚が小さくとも高剛性を有し、しかも構成セ
ラミックス材が緻密であると共に高純度であり、高温強
度特性の優れた管状部材が得られる。本発明により得ら
れる管状部材は、実質的にCVD法により形成された被
膜のみからなり、基材を除去したものであるから、CV
D被膜と基材との熱膨張差に起因した応力の発生がな
い。また、本発明によれば、大口径の管状部材も容易に
製造でき、肉厚の小さい軽量のものも製造できる。[Effects of the Invention] As is clear from the above description, according to the present invention, it is a double cylinder, has high rigidity even when the wall thickness is small, and the constituent ceramic material is dense and highly pure, A tubular member having excellent high temperature strength properties can be obtained. The tubular member obtained according to the present invention consists essentially of the coating film formed by the CVD method, and the base material is removed.
No stress is generated due to the difference in thermal expansion between the D coating and the substrate. Further, according to the present invention, a large-diameter tubular member can be easily manufactured, and a lightweight member having a small wall thickness can also be manufactured.
本発明によって炭化珪素製管状部材を製造する場合に
は、得られる管状部材は、高純度で高温強度に優れ、か
つ均熱できるものであるから、半導体製造用反応管とし
て好適であり、大口径Siウェハにも十分に対応でき
る。勿論、本発明方法により製造される管状部材は、そ
の他の各種の用途に供し得る。When the silicon carbide tubular member is produced by the present invention, the obtained tubular member is suitable as a reaction tube for semiconductor production because of its high purity, excellent high-temperature strength, and uniform heat distribution, and a large diameter. Sufficiently applicable to Si wafers. Of course, the tubular member produced by the method of the present invention can be used for various other purposes.
第1図ないし第5図の各図は、筒状基材の製造法の一例
を示す説明図である。 1、2……基材。Each of FIGS. 1 to 5 is an explanatory view showing an example of a method for manufacturing a tubular base material. 1, 2 ... Base material.
Claims (2)
とを特徴とする中空二重筒状のセラミックス製管状部材
の製造方法。 燃焼除去又は溶解除去可能な材質からなり、かつ周壁
に多数の貫通孔を有する筒状基材の内外両周面及び前記
貫通孔内面にCVD処理によりセラミックスの被膜を形
成し、 次いで前記筒状基材を燃焼又は溶解により除去し、周
壁に多数の貫通孔を有するCVD膜よりなる二重筒状管
状部材となし、 さらに、該貫通孔に耐熱材料を充填し、 該二重筒状管状部材の内周面及び外周面にCVD処理
によりセラミックスの被膜を形成する。1. A method for producing a hollow double-cylindrical ceramic tubular member, which comprises the following steps to be carried out in sequence. A ceramic coating is formed on both the inner and outer peripheral surfaces of the cylindrical base material having a large number of through holes in the peripheral wall and the inner surface of the through hole by a CVD process, and then the cylindrical base is formed. The material is removed by burning or melting to form a double cylindrical tubular member made of a CVD film having a large number of through holes in its peripheral wall. Further, the through holes are filled with a heat-resistant material, and the double cylindrical tubular member A ceramic coating is formed on the inner peripheral surface and the outer peripheral surface by a CVD process.
に先立って、基材の少なくとも一端を切断することを特
徴とする特許請求の範囲第1項に記載のセラミックス製
管状部材の製造方法。2. The method for producing a ceramic tubular member according to claim 1, wherein at least one end of the base material is cut prior to removing the tubular base material in the above step. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26538185A JPH0611486B2 (en) | 1985-11-26 | 1985-11-26 | Method for manufacturing ceramic tubular member |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26538185A JPH0611486B2 (en) | 1985-11-26 | 1985-11-26 | Method for manufacturing ceramic tubular member |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62124910A JPS62124910A (en) | 1987-06-06 |
| JPH0611486B2 true JPH0611486B2 (en) | 1994-02-16 |
Family
ID=17416389
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26538185A Expired - Lifetime JPH0611486B2 (en) | 1985-11-26 | 1985-11-26 | Method for manufacturing ceramic tubular member |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0611486B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010064918A (en) * | 2008-09-10 | 2010-03-25 | Showa Denko Kk | Method for producing silicon carbide single crystal, silicon carbide single crystal wafer, and silicon carbide single crystal semiconductor power device |
-
1985
- 1985-11-26 JP JP26538185A patent/JPH0611486B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62124910A (en) | 1987-06-06 |
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