JPH0612341B2 - Optical surface inspection device - Google Patents
Optical surface inspection deviceInfo
- Publication number
- JPH0612341B2 JPH0612341B2 JP27966987A JP27966987A JPH0612341B2 JP H0612341 B2 JPH0612341 B2 JP H0612341B2 JP 27966987 A JP27966987 A JP 27966987A JP 27966987 A JP27966987 A JP 27966987A JP H0612341 B2 JPH0612341 B2 JP H0612341B2
- Authority
- JP
- Japan
- Prior art keywords
- sample
- scanning
- light beam
- signal
- scans
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/93—Detection standards; Calibrating baseline adjustment, drift correction
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- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 この発明は鏡面状の表面をもつ試料のその表面を光ビー
ムで走査し、試料表面の凹凸や付着した異物などで生じ
た散乱光を受光して、これらの凹凸や異物の付着の有無
や存在の程度を光学的に検査する装置に関し、特に高い
清浄度を必要とする半導体製造プロセスにおける半導体
基板の表面の光学的検査装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial application] The present invention scans the surface of a sample having a mirror-like surface with a light beam, and receives scattered light generated by unevenness of the sample surface or foreign matter adhering to the sample. The present invention also relates to an apparatus for optically inspecting the presence or absence of these irregularities or foreign matters and the degree of presence thereof, and particularly to an optical inspection apparatus for the surface of a semiconductor substrate in a semiconductor manufacturing process that requires high cleanliness.
上述の光学的検査装置においては精度の高い検査を行う
上で、検査領域を設定するための試料の位置決めや試料
の移動速度の再現性ができるだけ正確であることが要求
される。In the above-described optical inspection device, in order to perform inspection with high accuracy, it is required that the positioning of the sample for setting the inspection region and the reproducibility of the moving speed of the sample be as accurate as possible.
この種の光学的表面検査装置における光ビームの走査方
式には、試料を回転させながら直線方向にも移動させ、
固定した光ビームで渦巻状に走査する方式と、試料を直
線方向に移動させ、移動方向に垂直な直線上に一定周期
で光ビームを動かして走査する方式の二方式がある。The scanning method of the light beam in this kind of optical surface inspection device, while moving the sample in the linear direction while rotating,
There are two methods: a method of scanning in a spiral with a fixed light beam, and a method of moving a sample in a linear direction and moving the light beam on a straight line perpendicular to the moving direction at a constant cycle for scanning.
第6図は渦巻状に走査を行う従来の光学的検査装置の要
部構成の一例を示したものである。FIG. 6 shows an example of the configuration of the main parts of a conventional optical inspection device that performs spiral scanning.
第6図(a)において光投射手段1は光源2と集光レンズ
3とを備えており、光源2から投射された平行光束4は
集光レンズ3によって円板状の試料5の表面に垂直でか
つスポット状に集光する光ビーム6として投射される。
試料5の表面に凹凸や微粒子の付着のような異常箇所7
があり、これを光ビーム6が照射するとパルス状の散乱
光8を生ずる。この散乱光8は試料5の表面に対して斜
めに配置された光検出器9で受光され、受光量に応じた
パルス状の電気信号10を出力する。異常箇所7が存在し
ない場合は光ビーム6は正反射し、正反射光の方向は試
料5の表面に対して垂直なのでこの正反射光は光検出器
9には入射しない。In FIG. 6 (a), the light projecting means 1 is provided with a light source 2 and a condenser lens 3, and the parallel light flux 4 projected from the light source 2 is perpendicular to the surface of the disk-shaped sample 5 by the condenser lens 3. And is projected as a light beam 6 that is condensed in a spot shape.
Abnormal place 7 such as unevenness or adhesion of fine particles on the surface of sample 5
When the light beam 6 irradiates this, pulsed scattered light 8 is generated. The scattered light 8 is received by a photodetector 9 arranged obliquely with respect to the surface of the sample 5, and a pulsed electric signal 10 corresponding to the amount of received light is output. When the abnormal portion 7 does not exist, the light beam 6 is specularly reflected, and since the direction of specularly reflected light is perpendicular to the surface of the sample 5, this specularly reflected light does not enter the photodetector 9.
試料5は駆動速度制御系181と回転速度制御系182とを備
えた駆動装置18で駆動される回転ステージ11に搭載さ
れ、その回転ステージ11の軸12まわりに回転しながらさ
らに矢印で示すP方向に直線状に移動させられる。すな
わちこの例では回転ステージ11は走査手段と相対的移動
手段とを兼ねている。光投射手段1は固定されているの
で、この移動によって光ビーム6は試料5の表面を第6
図(b)に示すように渦巻き状に走査し、軸12の位置で定
められる検査領域について電気信号10のパルス状成分を
パルス計数回路からなる信号処理手段16で計数し、計数
結果17を出力して検査を行う。The sample 5 is mounted on a rotary stage 11 driven by a drive device 18 having a drive speed control system 181 and a rotation speed control system 182. While rotating around a shaft 12 of the rotary stage 11, the sample 5 is further in a P direction indicated by an arrow. Can be moved in a straight line. That is, in this example, the rotary stage 11 serves both as a scanning unit and a relative moving unit. Since the light projection means 1 is fixed, this movement causes the light beam 6 to move the surface of the sample 5 to the sixth position.
As shown in FIG. 6B, the scanning is performed in a spiral shape, and the pulse-shaped component of the electric signal 10 is counted by the signal processing means 16 including the pulse counting circuit in the inspection area defined by the position of the axis 12, and the counting result 17 is output. And inspect.
第7図は第2の従来例として、直線上を移動する光ビー
ムで走査を行う装置の要部斜視図を示したものである。
この例においては光投射手段1は走査手段をも兼ねてお
り、試料5に対して垂直あるいはある角度をもつ面を走
査面13とし、その走査面13内で光ビーム6の投射方向を
周期的に変じて試料5の表面を検査する。試料5の表面
と走査面13との交線が走査線14である。FIG. 7 is a perspective view of a main part of an apparatus for scanning with a light beam moving on a straight line as a second conventional example.
In this example, the light projecting means 1 also serves as the scanning means, and the surface perpendicular to the sample 5 or having an angle is defined as the scanning surface 13, and the projection direction of the light beam 6 is cyclical within the scanning surface 13. Then, the surface of the sample 5 is inspected. The line of intersection between the surface of the sample 5 and the scanning surface 13 is the scanning line 14.
試料5の近傍には走査線14と平行な円筒レンズからなる
光入射面を備え、入射した光を光ファイバー束で集光す
る集光装置15が試料5表面の異常箇所7からのパルス状
の散乱光8のみを受光する角度で配置されている。この
集光装置15に光検出器9が接続されており、散乱光8に
よるパルス状の電気信号10を出力し、これを信号処理手
段16で計数し、計数結果17を得る。A light incident surface consisting of a cylindrical lens parallel to the scanning line 14 is provided in the vicinity of the sample 5, and a light condensing device 15 for converging the incident light by an optical fiber bundle is used for pulse-like scattering from the abnormal portion 7 on the surface of the sample 5. It is arranged at an angle for receiving only the light 8. The photodetector 9 is connected to the light collecting device 15, which outputs a pulsed electric signal 10 due to the scattered light 8, which is counted by the signal processing means 16 to obtain a counting result 17.
試料5は駆動速度制御系191を備えた駆動装置19で駆動
される支持機構20によって走査線14と交わる矢印Q方向
に直線的に移動し、これによって試料5は全面にわたっ
て光ビーム6で走査される。The sample 5 is linearly moved in the direction of the arrow Q intersecting the scanning line 14 by the support mechanism 20 driven by the driving device 19 having the driving speed control system 191, whereby the sample 5 is scanned with the light beam 6 over the entire surface. It
上述の光学的表面検査装置においては、通常光ビーム6
がある一個の異常箇所7を走査する回数は確立的に1回
以下あるいは複数回であることが多く、電気信号10のパ
ルス状成分の計数結果はそのままでは実際の異常箇所数
を示さない。そこで計数結果を実際の異常箇所数に対し
て校正した上で検査が行われる。走査の周期は一定であ
るため、試料5の表面の検査領域全体が走査される回数
は試料5の移動速度が異なると、それに応じて異なって
くる。このため単位長当りの走査線数すなわち走査線密
度は試料5の移動速度によって異なり、同一の異常箇所
7が走査される回数すなわち異常箇所の検知数は試料5
の移動速度の影響を受ける。したがって電気信号10のパ
ルス状成分の計数結果を実際の異常箇所数に対して校正
を行った場合の移動速度と同一の移動速度をその後の検
査においても正確に保つことが必要とされ、このために
駆動装置18や19には移動速度を不変に保つ駆動速度制御
系181,191や回転速度制御系182を備えなければならな
い。あるいは検査のつど異常箇所数が既知である試料を
用いて校正を行なわねばならない。In the above-mentioned optical surface inspection apparatus, the normal light beam 6
In many cases, the number of times of scanning one abnormal point 7 is deterministically less than once or plural times, and the counting result of the pulse-shaped component of the electric signal 10 does not show the actual number of abnormal points. Therefore, the counting result is calibrated for the actual number of abnormal points and then the inspection is performed. Since the scanning cycle is constant, the number of times the entire inspection area on the surface of the sample 5 is scanned varies depending on the movement speed of the sample 5 and accordingly. Therefore, the number of scanning lines per unit length, that is, the scanning line density depends on the moving speed of the sample 5, and the number of times the same abnormal portion 7 is scanned, that is, the number of detected abnormal portions is the same as that of the sample 5.
Affected by the movement speed of. Therefore, it is necessary to maintain the same moving speed as the moving speed when calibrating the counting result of the pulsed component of the electric signal 10 for the actual number of abnormal points even in the subsequent inspection. In addition, the drive devices 18 and 19 must be provided with drive speed control systems 181, 191 and rotation speed control system 182 that keep the moving speed unchanged. Alternatively, calibration must be performed using a sample with a known number of abnormal points in each inspection.
第6図に示した従来例では試料の移動機構である回転ス
テージ11が回転運動と直線運動の二種類の運動によって
移動するため、それぞれの運動における速度を不変に保
つ必要があり、駆動装置18には駆動速度制御系181と回
転速度制御系182の2系統の制御系が必要となる。In the conventional example shown in FIG. 6, the rotary stage 11 which is a sample moving mechanism moves by two kinds of motions, that is, a rotary motion and a linear motion. Therefore, it is necessary to keep the speed in each motion unchanged. Requires a drive speed control system 181 and a rotation speed control system 182.
第7図の従来例に示す移動機構は一方向の直線運動であ
って、第6図のものにくらべて著しく簡単となってはい
るが、その直線運動速度を不変に保つ駆動速度制御系19
1を欠かすことができない。The moving mechanism shown in the conventional example of FIG. 7 is a linear movement in one direction, which is significantly simpler than that of FIG. 6, but the drive speed control system 19 keeps the linear movement speed unchanged.
Can not miss one.
したがってこれらの従来例に示した光学的表面検査装置
は正確に制御されたその装置固有の移動速度をもつ試料
移動機構を装置の一部として備える必要があり、光学系
と光検出器ならびにその信号処理系の部分だけを独立さ
せて既存の生産ラインの試料搬送系(たとえばベルト式
ウエハ搬送装置)に適宜設置して用いることはきわめて
困難であった。Therefore, in the optical surface inspection apparatus shown in these conventional examples, it is necessary to provide a sample moving mechanism having a precisely controlled moving speed unique to the apparatus as a part of the apparatus, and the optical system, the photodetector and its signal are required. It was extremely difficult to independently install only the processing system part and appropriately install it in a sample transfer system (for example, a belt type wafer transfer device) of an existing production line.
この発明は従来の光学的表面検査装置において必要であ
った装置専用の試料移動機構を不要とし、光学的表面検
査装置の構成を簡単化するとともに送り速度を異にする
既存の試料搬送装置への適用が可能で、しかもその送り
速度が一定でない場合においてもその影響を受けること
のない装置を提供することを目的とする。The present invention eliminates the need for a sample moving mechanism dedicated to the conventional optical surface inspection apparatus, simplifies the structure of the optical surface inspection apparatus, and improves the existing sample transfer apparatus with different feed rates. It is an object of the present invention to provide a device which is applicable and is not affected by the feed rate even when the feed rate is not constant.
この発明は試料表面の異常個所で生じた散乱光を受光し
た光検出器の出力する電気信号のパルス状成分の計数値
と光ビームの走査線密度との間には常に比例関係が成立
すること、ならびに試料の移動速度が一定でない場合で
あっても短い時間内においては一定とみなせることに着
目して異常箇所数を正確に求めようとするものである。According to the present invention, a proportional relationship is always established between the count value of the pulsed component of the electric signal output from the photodetector that receives the scattered light generated at the abnormal point on the sample surface and the scanning line density of the light beam. In addition, the number of abnormal points is accurately obtained by focusing on the fact that even if the moving speed of the sample is not constant, it can be regarded as constant within a short time.
すなわち信号処理手段に光ビームの走査回数計数手段と
試料の移動距離計測手段と電気信号のパルス状成分を計
数する計数回路とを接続した演算手段とを備えて、検査
領域全体にわたる光ビームの走査回数をいくつかに分割
した短時間内の複数回数の走査毎に走査回数と試料の移
動距離と電気信号のパルス状成分数とを測定し、測定さ
れた走査回数と試料の移動距離とからその複数回数の走
査における走査線密度を算出する。一方あらかじめ異常
箇所数既知の基準試料によってその既知の異常箇所数と
等しいパルス状成分数の測定値を与える走査線密度を基
準走査線密度として求めておき、走査線密度とパルス状
成分計数値との比例関係を用いて前記の測定したパルス
状成分計数値を基準走査線密度に対する値に換算する。
試料の異常箇所数は各複数回数の走査毎に求めたこれら
の換算した値を総和することによって算出する。That is, the signal processing means is provided with a scanning number counting means of the light beam, a moving distance measuring means of the sample, and an arithmetic means connected to a counting circuit for counting the pulse-like component of the electric signal, and the scanning of the light beam over the entire inspection region. The number of scans, the moving distance of the sample, and the number of pulsed components of the electric signal are measured for each of a plurality of times of scanning within a short time obtained by dividing the number of times, and the measured number of scans and the moving distance of the sample The scan line density in a plurality of scans is calculated. On the other hand, a scanning line density that gives a measured value of the number of pulse-like components equal to the known number of abnormal places is previously obtained as a reference scanning line density by a reference sample with a known number of abnormal places, and the scanning line density and the pulse-like component count value The measured pulse-like component count value is converted into a value for the reference scanning line density by using the proportional relationship of.
The number of abnormal points in the sample is calculated by summing these converted values obtained for each of the plurality of scans.
試料全体にわたる光ビームの走査回数をいくつかに分割
した複数回数の走査における所要時間が短いと、試料の
移動速度が一様でなくともその所要時間内における移動
速度は一定で、したがって走査線密度も一定とみなすこ
とができる。このような場合には走査線密度と電気信号
のパルス状成分の計数値との間には比例関係が成立す
る。このため前記の複数回数の走査における走査回数測
定値を試料の移動距離測定値で除して走査線密度を算出
し、その複数回数の走査において測定したパルス状成分
計数値に基準走査線密度と前記の走査線密度との比を乗
ずれば、測定されたパルス状成分の計数値は試料が基準
走査線密度で走査された場合のパルス状成分の計数値す
なわち実際の異常箇所数に換算されて算出される。各複
数回数の走査毎に算出されたこれらの換算値の総和を演
算すれば試料の異常箇所数が求められる。If the time required for a plurality of scans in which the number of times the light beam is scanned over the entire sample is divided is short, the moving speed within the required time is constant even if the moving speed of the sample is not uniform. Can also be considered constant. In such a case, a proportional relationship is established between the scanning line density and the count value of the pulsed component of the electric signal. For this reason, the scanning line density is calculated by dividing the scanning number measurement value in the above-mentioned plural times of scanning by the moving distance measurement value of the sample, and the reference scanning line density is added to the pulse component count value measured in the plural times of scanning. If the ratio of the scanning line density is multiplied, the measured pulse-like component count value is converted into the pulse-like component count value when the sample is scanned at the reference scan line density, that is, the actual number of abnormal points. Calculated. The number of abnormal points in the sample can be obtained by calculating the sum of these converted values calculated for each of the plurality of scans.
走査線密度もパルス状成分の計数値もともに試料の移動
速度と比例関係にあるので、移動速度が一定であれば速
度値の差異による影響は走査線密度とパルス状成分の計
数値に対して同じように作用するので換算の演算におい
てその作用は打ち消される。このため算出された異常箇
所数は試料の移動速度が異なっても、一定でなくてもそ
の影響を受けない。Since both the scanning line density and the count value of the pulse-like component are proportional to the moving speed of the sample, if the moving speed is constant, the effect of the difference in the speed value is the influence on the scanning line density and the count value of the pulse-like component. Since they act in the same way, their effects are canceled in the conversion operation. Therefore, the calculated number of abnormal points is not affected even if the moving speed of the sample is different or not constant.
第1図はこの発明の実施例の構成図である。光投射手段
21からは細く集束された光ビームが投射される。この光
ビームはビームエキスパンダ22,回転多面鏡23,f・θ
レンズ24で構成される点線で囲まれた走査手段25を介し
て試料5上に集束する光ビーム6となって、試料5の表
面を走査する。ビームエキスパンダ22は入射した細い光
ビームを数mm程度の幅をもつ平行光束26に整え、回転多
面鏡23はその平行光束26を反射してその軸まわりに回転
する光ビーム27とする。f・θレンズ24は入射した光ビ
ーム27の回転角速度と出射する光ビーム6の走査速度と
が比例関係にあるレンズで、光ビーム6を常に試料5の
表面に集束させながら一定の周期で直線状にその表面を
走査させる。試料5上に凹凸あるいは異物の付着などの
異常箇所7があるとそこでパルス状の散乱光8を生ず
る。この散乱光8は一点鎖線で囲んだ光検出手段28で検
出される。FIG. 1 is a block diagram of an embodiment of the present invention. Light projection means
A light beam that is narrowly focused is projected from 21. This light beam consists of a beam expander 22, a rotary polygon mirror 23, and f · θ.
The surface of the sample 5 is scanned by the light beam 6 which is focused on the sample 5 through the scanning means 25 surrounded by the dotted line constituted by the lens 24. The beam expander 22 arranges the incident thin light beam into a parallel light beam 26 having a width of about several mm, and the rotating polygon mirror 23 reflects the parallel light beam 26 to form a light beam 27 which rotates around its axis. The f.theta. lens 24 is a lens in which the rotational angular velocity of the incident light beam 27 and the scanning velocity of the emitted light beam 6 are in a proportional relationship, and the light beam 6 is always focused on the surface of the sample 5 and linearly moved at a constant period. To scan its surface in a circular pattern. When there is an irregular portion 7 such as unevenness or adhesion of foreign matter on the sample 5, pulsed scattered light 8 is generated there. The scattered light 8 is detected by the light detecting means 28 surrounded by the alternate long and short dash line.
光検出手段28においては光の入射面に円筒レンズを備え
た入射集光系29で散乱光8を受光し、受光された散乱光
8は光ファイババンドル30に入射し、出射集光系31を介
して光検出器32に入射し、光検出器32の出力する電気信
号10にパルス状の成分を与える。In the light detecting means 28, the scattered light 8 is received by an incident light condensing system 29 having a cylindrical lens on the light incident surface, and the received scattered light 8 is incident on the optical fiber bundle 30 and is emitted by the outgoing light condensing system 31. It is incident on the photodetector 32 via the light detector 32 and gives a pulsed component to the electric signal 10 output from the photodetector 32.
試料5の表面は鏡面状に仕上げられているので、試料5
の表面を照射する光ビーム6は入射集光系29には入射し
ない角度で正反射するように投射される。このため入射
集光系29したがって光検出器32には試料5の表面からの
きわめて微弱な散乱光と異常箇所7による散乱光8のみ
が入射する。Since the surface of sample 5 is mirror-finished, sample 5
The light beam 6 irradiating the surface of is incident on the incident light condensing system 29 so as to be specularly reflected at an angle not incident. For this reason, only the extremely weak scattered light from the surface of the sample 5 and the scattered light 8 due to the abnormal portion 7 are incident on the incident light condensing system 29 and thus the photodetector 32.
試料5は2点鎖線で囲まれた相対的移動手段33を構成す
る試料台34に搭載され、試料台34は試料台駆動装置35に
よって光ビーム6の走査方向と垂直な方向に駆動される
ので、これによって光ビーム6は試料5の全面を走査し
て検査を行うことができる。The sample 5 is mounted on a sample table 34 which constitutes a relative moving means 33 surrounded by a two-dot chain line, and the sample table 34 is driven by a sample table driving device 35 in a direction perpendicular to the scanning direction of the light beam 6. As a result, the light beam 6 can scan the entire surface of the sample 5 for inspection.
光検出手段28の出力する電気信号10は実線で囲まれた信
号処理手段36に与えられる。信号処理手段36は図示のよ
うに領域設定手段37,パルス計数手段38,走査回数計数
手段39,移動距離計測手段71に接続された演算手段40を
備えている。The electric signal 10 output from the light detection means 28 is applied to the signal processing means 36 surrounded by a solid line. The signal processing means 36 includes an area setting means 37, a pulse counting means 38, a scanning number counting means 39, and a computing means 40 connected to the moving distance measuring means 71 as shown in the figure.
後に詳しく述べるように領域設定手段37は光ビーム6が
試料5を走査するつど、試料5とその検査領域とを走査
する時間の幅をもつ矩形波パルスをそれぞれ信号55aと
信号59aとして出力する。信号59aはパルス計数手段38
に与えられ、上記の矩形波パルスの幅に相当する時間だ
け計数ゲートを開き、電気信号10のパルス状成分を計数
する。一方矩形波パルスとしての信号55aは走査回数計
数手段に与えられ、光ビームが試料5を走査する走査回
数が計数される。この実施例においては、この信号55a
は移動距離計測手段71にも与えられる。この実施例にお
ける移動距離計測手段71は信号55aとしての矩形波パル
スの幅を測定する時間計測回路で構成され、時間測定用
のクロックパルスを計数して円形の試料5表面の走査時
間を測定する。この走査時間は試料5を形成する円の弦
長としての走査線長と比例関係にあるので、この後演算
手段によって試料5の移動方向に対する上記の円の中心
からの距離を算出して試料5の移動距離を得るようにな
っている。As will be described later in detail, the region setting means 37 outputs a rectangular wave pulse having a time width for scanning the sample 5 and the inspection region thereof as the signal 55a and the signal 59a each time the light beam 6 scans the sample 5. The signal 59a is the pulse counting means 38.
The pulsed component of the electric signal 10 is counted by opening the counting gate for the time corresponding to the width of the rectangular wave pulse. On the other hand, the signal 55a as a rectangular wave pulse is given to the scanning number counting means, and the number of scanning times that the light beam scans the sample 5 is counted. In this embodiment, this signal 55a
Is also given to the moving distance measuring means 71. The moving distance measuring means 71 in this embodiment is composed of a time measuring circuit for measuring the width of a rectangular wave pulse as the signal 55a, and counts clock pulses for measuring time to measure the scanning time of the surface of the circular sample 5. . Since this scanning time is proportional to the scanning line length as the chord length of the circle forming the sample 5, the distance from the center of the circle with respect to the moving direction of the sample 5 is calculated by the calculating means after this. To get the distance traveled.
一つの走査が終了すると領域設定手段37からパルス状の
走査終了信号70aが演算手段40に与えられる。演算手段
40はこの走査終了信号70aを受けて走査回数計数手段39
からはその走査までの走査回数j,移動距離計測手段71
からは走査時間計測用のクロックパルスの計数値Xj,パ
ルス計数手段38からはその走査において計数されたパル
ス状成分の計数値Njをそれぞれデータ39a,74a,68a
として読みとって記憶した後、リセット信号74bと68b
とをそれぞれ移動距離計測手段71とパルス計数手段38と
に送って、計数内容をクリアする。When one scan is completed, the pulse setting scan end signal 70a is given from the area setting means 37 to the calculating means 40. Computing means
The scanning number counting means 39 receives the scanning end signal 70a.
Is the number of scans j up to that scan, and the moving distance measuring means 71
From the pulse count means 38, the count value Nj of the pulse-like component counted in the scan from the pulse counting means 38, respectively, as data 39a, 74a, 68a.
Read and memorize as the reset signal 74b and 68b
Are sent to the moving distance measuring means 71 and the pulse counting means 38, respectively, and the counting contents are cleared.
試料5についての全走査を終了すると、領域設定手段37
からパルス状の検査終了信号62aが演算手段40に与えら
れる。演算手段40はこの信号を受けて演算を実行し、リ
セット信号39bを走査回数計数手段39に送って計数内容
をクリアする。When all the scans for the sample 5 are completed, the area setting means 37
From this, a pulsed inspection end signal 62a is given to the arithmetic means 40. The calculation means 40 receives this signal and executes a calculation, and sends a reset signal 39b to the scanning number counting means 39 to clear the count content.
演算手段40においてはあらかじめ校正によって得た基準
走査密度n0,試料5の縁から検査領域までの距離d,試
料の直径D,全走査回数Sをいくつかの複数回数の走査
回数に等分する数m,走査時間計測用のクロックパルス
の周期τC,走査速度vが定数として記憶されている。
これらの定数と全走査回数S,前述の各走査回数j,走
査時間計測用クロックパルスの計数値Xj,パルス成分の
計数値Njを用いて下記の演算を行い、検査領域の異常箇
所数N0を算出する。In the calculation means 40, the reference scanning density n 0 obtained by calibration in advance, the distance d from the edge of the sample 5 to the inspection region, the diameter D of the sample, and the total number of scans S are equally divided into a plurality of number of scans. The number m, the period τ C of the scanning time measuring clock pulse, and the scanning speed v are stored as constants.
The following calculation is performed using these constants, the total number of scans S, the number of scans j described above, the count value Xj of the clock pulse for measuring the scan time, and the count value Nj of the pulse component, and the number of abnormal points N 0 in the inspection area is calculated. To calculate.
1)試料5の縁から検査領域までの走査回数S1 S1=S(d/D) (1) 2)検査領域の全走査回数Sをm等分した複数回数の走
査回数SC Sc=(S−2S1)/m (2) 3)i番目の複数回数の走査のはじめの走査回数S(i
1)と終りの走査回数S(i2) 4)i番目の複数回数の走査におけるパルス状成分の計
数値Ni 5)走査回数S(i1)とS(i2)とにおける走査線の円板状
の試料5の端部からの距離Y(i1)とYS(i2) 6)i番目の複数回数の走査における試料5の移動距離
li li=|YS(i1)−Y(i2) (6) (i=1,2,…,m) 7)検査領域における異常箇所数N0 (7)式で算出された異常箇所数N0は検査結果46として出
力される。1) The number of scans from the edge of the sample 5 to the inspection area S 1 S 1 = S (d / D) (1) 2) The number of scans S C S c = (S−2S 1 ) / m (2) 3) The first number of scans S (i
1) and the number of scans at the end S (i2) 4) Count value Ni of the pulse-shaped component in the i-th multiple scans 5) Distances Y (i1) and Y S (i2) of the scanning line from the end of the disk-shaped sample 5 at the number of scans S (i1) and S (i2) 6) Moving distance of the sample 5 in the i-th multiple times of scanning
l i l i = | Y S (i1) −Y (i2) (6) (i = 1, 2, ..., m) 7) Number of abnormal points in the inspection area N 0 The abnormal point number N 0 calculated by the equation (7) is output as the inspection result 46.
上記各式の成立する根拠については後に述べる。The grounds for establishing the above equations will be described later.
この発明においては演算手段40において(7)式による演
算を行うことで試料の移動速度が異なったり検査中に変
動したりすることによる影響を除いている。In the present invention, the calculation means 40 performs the calculation according to the equation (7) to eliminate the influence of the moving speed of the sample being different or changing during the inspection.
この(7)式は試料5の移動速度に変動があっても短時間
内であればその移動速度は一定とみなせること、またそ
の移動速度が一定であれば一つの異常箇所7が走査され
る回数は走査線密度に比例し、したがってパルス状成分
の計数値が確率的に走査線密度に比例するという考え方
にもとづいて導かれたものである。According to this equation (7), even if the moving speed of the sample 5 varies, the moving speed can be regarded as constant within a short time, and if the moving speed is constant, one abnormal portion 7 is scanned. The number of times is derived based on the idea that the scanning line density is proportional to the scanning line density and thus the count value of the pulse-like component is stochastically proportional to the scanning line density.
すなわち検査領域の全走査回数をm等分してその各々の
Sc回の走査における所要時間を短いものとする。そのう
ちのi番目のSc回の走査においてパルス状成分の計数値
Ni,試料の移動距離liを得たとすれば、走査線密度niは
ni=Sc/liであるからNiとniとの比例関係によってNiは で与えられる。kは定数である。(8)式においてパルス
状成分の計数値Niが実際の異常箇所数N0iに等しい場合
の走査線密度は基準走査線密度n0であるから N0i=kn0 ………………………………(9) である。(8)(9)の両式からkを消去して N0i=(n0/n1)Ni =(n0/Sc)Nili ………………………(10) を得る。(10)式は走査線密度ni=Sc/liの場合に得られ
た計数値Niを基準走査線密度niの場合における値に換算
するものである。Niとniとは比例関係にあって試料5の
移動速度は両者に同じように作用するため、Niとniとが
それぞれ分子と分母の関係にある(10)式の演算でその影
響は打ち消されてN0iの値は試料の移動速度が異なって
もその影響を受けない。(10)式のN0iのiについての総
和をとることによって(7)式で与えられる関係が導かれ
る。That is, the total number of scans of the inspection area is divided into m equal parts, and
The time required for Sc scans is short. Count value of pulse-like component in the i-th Sc times of scanning
Assuming that Ni and the moving distance l i of the sample are obtained, the scanning line density ni is
Since ni = Sc / l i , Ni is proportional to Ni and ni Given in. k is a constant. In equation (8), the scanning line density when the count value Ni of the pulsed component is equal to the actual number of abnormal points N 0i is the reference scanning line density n 0 , so N 0i = kn 0 ………………………… ………… (9). Eliminating k from both equations (8) and (9), N 0i = (n 0 / n 1 ) N i = (n 0 / S c ) N i l i ………………………… (10 ) Get The equation (10) converts the count value Ni obtained in the case of the scanning line density n i = S c / l i into the value in the case of the reference scanning line density n i . Since Ni and n i are in a proportional relationship and the moving speed of sample 5 acts on both in the same way, Ni and n i have a numerator and denominator relationship, respectively. The value of N 0i that is canceled out is not affected by the moving speed of the sample. The relationship given by Eq. (7) is derived by taking the sum of i in N 0i in Eq. (10).
第2図は(8)式に示した比例関係が成立することを第1
図に示した装置を用いて実験的に確認した結果である。
ここではパルス状成分計数値Nに相当する値としてこの
Nと実際の異常箇所数N0との比である検出率η=N/N0
を用いている。試料5は直径10cmのシリコンウエハーで
あって、その表面に直結0.518μmのポリスチレン
ラテックス球を均一に分散させて異常箇所とし、実際の
数N0は顕微鏡で目視計数し、第1図に示した装置で試料
の移動速度を一定に保って得た計数値Nを上記のN0で割
って検出率ηを求めた。一方試料の移動速度を異ならせ
てそのつど上記のシリコンウエハーに対する全走査回数
Sを求め、これから走査線密度nを導き、横軸にnと
S,縦軸にηをとって両者の関係を得た。ηとnあるい
はηとSとの間には明らかに原点を通る直線関係すなわ
ち比例関係が成立することが示されている。第2図につ
いて得た回帰直線は1000回以上の走査回数については であり、η=100%に対する基準走査線密度n0として、n
0=223.8/cmあるいはS0=2238を得ている。この値
は光ビーム6が試料表面に作るスポットの径rを実測
し、このrで値をシリコンウエハーの直径Dを割った値
D/r,すなわち光ビームが試料面を重なることなく、
また隙間をあけることなく走査する場合の値と一致して
いる。FIG. 2 shows that the proportional relationship shown in Eq. (8) holds.
It is the result confirmed experimentally using the apparatus shown in the figure.
Here detection rate is the ratio between the pulse-like component count N real anomaly number N 0 this N as corresponding values to eta = N / N 0
Is used. Sample 5 was a silicon wafer with a diameter of 10 cm, and 0.518 μm polystyrene latex spheres directly connected to the surface were uniformly dispersed to make it an abnormal point. The actual number N 0 was visually counted with a microscope and shown in FIG. The detection rate η was obtained by dividing the count value N obtained by keeping the moving speed of the sample constant with the above apparatus by the above N 0 . On the other hand, by varying the moving speed of the sample, the total number of scans S for the silicon wafer is obtained each time, the scanning line density n is derived from this, and the abscissa indicates n and S, and the ordinate indicates η to obtain the relationship between them. It was It has been shown that a linear relationship, that is, a proportional relationship, passing through the origin is clearly established between η and n or η and S. The regression line obtained for Fig. 2 is for 1000 or more scans Where η = 100%, the standard scan line density n 0 is
0 = 223.8 / cm or to obtain the S 0 = 2238. This value is obtained by actually measuring the diameter r of the spot formed by the light beam 6 on the sample surface, and dividing the value by this r by the diameter D of the silicon wafer, that is, D / r, that is, the light beam does not overlap the sample surface,
In addition, the values are the same as those in the case of scanning without a gap.
第3図はこの実施例における計測手段36の具体構成を説
明する前提として、試料5の表面とそれを走査する光ビ
ーム6による走査線の一つおよびその走査によって得ら
れる光検出器32からの電気信号10の波形とを示したもの
である。第3図(a)は試料台34上の試料5の平面図で、
矢印で示した試料5の移動方向Qと直交して光ビーム6
によって走査線41が形成されている。FIG. 3 shows the surface of the sample 5 and one of the scanning lines by the light beam 6 for scanning the surface of the sample 5 and the photodetector 32 obtained by the scanning, as a premise for explaining the specific constitution of the measuring means 36 in this embodiment. 3 shows the waveform of the electric signal 10. FIG. 3 (a) is a plan view of the sample 5 on the sample table 34,
The light beam 6 is orthogonal to the moving direction Q of the sample 5 indicated by the arrow.
The scanning line 41 is formed by.
試料5の縁から距離dまでの斜線を施した周辺領域42は
試料5の取扱いの際に保持具が触れる領域で、多数の異
物の付着が予想されるため検査の対象とならない領域で
ある。したがって斜線を施してない領域が検査領域43と
なる。光ビーム6は試料台34上の点Oに投射されて走査
線41に沿って走査を開始し、試料5の表面を走査した後
ふたたび試料台34を照射し点0′で走査を終了する。試
料5の表面に付着した微粒子701,702,703はいずれも
第1図における異常箇所7に相当する。点Oと点0′間
の距離▲▼′はどの走査においても不変である。The peripheral region 42, which is shaded from the edge of the sample 5 to the distance d, is a region that the holder contacts when handling the sample 5, and is a region that is not an object of inspection because a large number of foreign substances are expected to adhere. Therefore, the area not shaded becomes the inspection area 43. The light beam 6 is projected onto a point O on the sample stage 34 to start scanning along the scanning line 41, scans the surface of the sample 5 and then irradiates the sample stage 34 again, and finishes scanning at point 0 ′. The fine particles 701, 702, and 703 attached to the surface of the sample 5 all correspond to the abnormal portion 7 in FIG. The distance ▲ ▼ 'between the point O and the point 0'is invariable in any scan.
第3図(b)に示す電気信号10の波形において、走査の繰
り返し周期は時刻t00から時刻t01までの間の一定時間T0
であり、光ビームの走査は時刻t0からt6の間の一定時間
Tにおいて行われる。走査速度は一定であるため、横軸
方向の経過時間tは走査距離に対応するので、各時刻に
対して第3図(a)に示す走査線上の位置を括弧内に対応
させて示した。In the waveform of the electric signal 10 shown in FIG. 3 (b), the scanning repetition cycle is a constant time T 0 between time t 00 and time t 01.
Therefore, the scanning of the light beam is performed at the constant time T between the times t 0 and t 6 . Since the scanning speed is constant, the elapsed time t in the horizontal axis direction corresponds to the scanning distance. Therefore, the position on the scanning line shown in FIG. 3 (a) is shown in parentheses for each time.
時刻t00とt0との間では、まず光ビーム6が投射されな
いため、電気信号10のレベルは光検出器32あるいはその
増幅器の雑音信号で定まる雑音レベル44にある。時刻t0
で光ビーム6が試料台34の表面に投射されはじめる。試
料台34の表面は比較的強い散乱光を生じ、したがって電
気信号10のレベルはレベルV1まで上昇する。時刻t1にお
いて光ビーム6が試料5の表面に投射されるようになる
と、散乱光が急激に減少して電気信号10のレベルはこれ
にともないレベルV2まで低下する。さらに時刻t2,t3,
t4において光ビーム6が微粒子701,702,703を照射す
ると、そのつどパルス状の散乱光を生じ電気信号10にパ
ルスb1,b2,b3を生ずるが、これらの散乱光のレベルは
試料台34表面からの散乱光のレベルにくらべて微弱であ
り、したがってパルスb1,b2,b3の波高値のレベルVp
はV1よりも小さい。Between times t 00 and t 0 , the light beam 6 is not projected first, so that the level of the electrical signal 10 is at the noise level 44 determined by the noise signal of the photodetector 32 or its amplifier. Time t 0
Then, the light beam 6 starts to be projected on the surface of the sample table 34. The surface of the sample stage 34 produces relatively strong scattered light, so that the level of the electrical signal 10 rises to the level V 1 . When the light beam 6 comes to be projected on the surface of the sample 5 at time t 1 , the scattered light sharply decreases and the level of the electric signal 10 lowers to the level V 2 accordingly. Furthermore, at times t 2 , t 3 ,
When the light beam 6 irradiates the particles 701, 702, and 703 at t 4 , pulse-like scattered light is generated each time, and pulses b 1 , b 2 , and b 3 are generated in the electric signal 10, but the level of these scattered light is The level is weaker than the level of scattered light from the surface of the sample table 34, and therefore the level Vp of the peak value of the pulses b 1 , b 2 , and b 3.
Is less than V 1 .
電気信号10は上記のように光ビーム6が試料5の表面を
走査する時間帯T1においてレベルの低下を示すので、こ
れを利用してレベルV1よりやや低いレベルに所定レベル
45としてのVs1をあらかじめて定めておき、走査時間T
の間で電気信号10がレベルVs1を下まわる時刻t1におい
て試料の一方の縁が、またその状態からふたたびレベル
VS1を上まわる時刻t5において他方の縁が検知され、時
刻t1とt5の間の時間T1において試料5の表面が走査され
る。また第3図(a)のP1X1あるいはP2X2間の距離dが走
査される時間をτとすれば、時刻t1+τと時刻t5−τ=
t1+T1−τとの間のT1−2τが検査領域の走査時間とな
る。As described above, the electric signal 10 shows a decrease in level in the time zone T 1 in which the light beam 6 scans the surface of the sample 5, and using this, the electric signal 10 is used at a predetermined level slightly lower than the level V 1.
V s1 as 45 is determined in advance, and the scanning time T
At time t 1 when the electrical signal 10 falls below the level V s1 between the two edges of the sample and again from that state
The other edge is detected at time t 5 above V S1, and the surface of sample 5 is scanned at time T 1 between times t 1 and t 5 . Further, when the time for scanning the distance d between P 1 X 1 or P 2 X 2 in FIG. 3 (a) is τ, time t 1 + τ and time t 5 −τ =
T 1 -2τ between t 1 + T 1 -τ is the scanning time of the inspection area.
一方試料5の移動方向については、走査回数と試料の移
動距離とが比例関係にあるため、光ビーム6が最初に検
知した試料5の縁P3,P4からそれぞれ距離dまでの斜線
を施した領域 を光ビーム6が走査する回数S1は、全走査回数をS,試
料5の直径をDとすれば、下記の再掲する(1)式 S1=S(d/D) …………………………(1) によって与えられる。したがって検査領域はS1+1回目
からS−S1回目まで走査されることになり、その間の走
査回数はS−2S1回となる。これをm等分して(2)式に示
すScが定められる。On the other hand, with respect to the moving direction of the sample 5, since the number of scans and the moving distance of the sample are in a proportional relationship, diagonal lines are drawn from the edges P 3 , P 4 of the sample 5 detected by the light beam 6 to the distance d respectively. Area Assuming the total number of scans S 1 by the light beam 6 as S and the diameter of the sample 5 as D, the following re-expression (1) S 1 = S (d / D) ……………… …………… given by (1). Therefore, the inspection area is scanned from the S 1 + 1st time to the S−S 1st time, and the number of scans during that time is S−2S 1st time. By dividing this by m, Sc shown in equation (2) is determined.
この実施例では通常円形であるシリコンウエハーを試料
5としている。直径が普通は5ないし10cmのシリコンウ
エハーでは、全走査回数が500ないし2000の範囲となる
移動速度が望ましく、Scはmが10程度であるように選定
される。In this embodiment, a silicon wafer which is usually circular is used as the sample 5. For silicon wafers, which are usually 5 to 10 cm in diameter, it is desirable to have a moving speed that results in a total number of scans in the range of 500 to 2000, and Sc is selected so that m is about 10.
i番目の複数回数の走査のはじめの走査回数S(i1)と終
りの走査回数S(i2)とを示す(3)式と、その走査におけ
るパルス状成分の計数値を示す(4)式は自明であり説明
するまでもない。The equation (3) showing the initial number of scans S (i1) and the last number of scans S (i2) of the i-th plural number of scans and the equation (4) showing the count value of the pulse-like component in the scan are It is self-explanatory and needless to say.
前に記した試料5としてのシリコンウエハーはほとんど
正確な円であるため、第3図において走査線41の試料表
面の長さ は試料5を形成する直径Dの円の弦長であり、試料5の
移動方向におけるこの円の中心Cとの距離Yは で与えられる。Since the silicon wafer as the sample 5 described above is an almost accurate circle, the length of the sample surface of the scanning line 41 in FIG. Is the chord length of a circle of diameter D forming sample 5, and the distance Y from the center C of this circle in the moving direction of sample 5 is Given in.
したがってi番目の複数回数の走査のはじめの走査と終
りの走査の走査回数S(i1),S(i2)におけるそれぞれの 長さを測定してYs(i1),Ys(i2)を求め、(6)式に示すよ
うにこれらの差からi番目の複数回数の走査における試
料5の移動距離liを得ることができる。Therefore, the number of scans S (i1) and S (i2) of the first and last scans of the i-th multiple scans The length is measured to obtain Y s (i1) and Y s (i2), and the moving distance l i of the sample 5 in the i-th plural number of scans is obtained from these differences as shown in the equation (6). You can
この実施例では の長さは第3図に示す電気信号10が所定のレベルVs1を
下まわっている時間T1を測定することによって求めてい
る。時間測定用の周期τcのクロックパルスによる計数
をX,光ビームの走査速度をvとすれば であり、(12)式から(13)式とから(5)式に示すYs(i1)と
Ys(i2)とが導かれる。In this example Is determined by measuring the time T 1 during which the electrical signal 10 shown in FIG. 3 is below a predetermined level V s1 . If the count by the clock pulse of the period τ c for time measurement is X and the scanning speed of the light beam is v And Y s (i1) shown in Eqs . (12) to (13) and (5)
Y s (i2) is derived.
なお(5),(6)式の演算においてはXs(i2)の値はXs(i2)お
よびD/(vτc)の値と逐次比較され、Xs(i2)≒X
s(i1)あるいはXs(i2)≒D/(vτc)と判断された場合はY
s(i2)を負の値として扱うようにしている。Note (5), the value of (6) in the calculation of X s (i2) is successively compared with the value of X s (i2) and D / (vτ c), X s (i2) ≒ X
Y when s (i1) or X s (i2) ≒ D / (vτ c )
s (i2) is treated as a negative value.
第4図は信号処理手段36の回路構成の一例を示したブロ
ック図である。また第5図は第4図の回路構成の各部分
における信号の波形図である。以下第4図の各部分の動
作を第5図の波形図とともに説明する。FIG. 4 is a block diagram showing an example of the circuit configuration of the signal processing means 36. FIG. 5 is a waveform diagram of signals in each part of the circuit configuration of FIG. The operation of each part of FIG. 4 will be described below with reference to the waveform chart of FIG.
第4図において光検出器32の出力する電気信号10は、ロ
ーパスフィルタ51によって白色雑音を除去された信号51
aとなり、それぞれ破線の枠で囲んだ領域設定手段37と
パルス計数手段38とに与えられる。領域設定手段37にお
いては、まずコンパレータ52,単安定マルチバイブレー
タ53,インバータ54,ANDゲート55で構成される系統
によって、光ビーム6が試料5の表面を走査している時
間帯T1に等しい時間幅をもつ矩形波の信号55aを得る。In FIG. 4, the electric signal 10 output from the photodetector 32 is the signal 51 from which white noise has been removed by the low-pass filter 51.
a, which is given to the area setting means 37 and the pulse counting means 38, which are surrounded by broken line frames. In the area setting means 37, first, by the system including the comparator 52, the monostable multivibrator 53, the inverter 54, and the AND gate 55, the time equal to the time zone T 1 during which the light beam 6 scans the surface of the sample 5 A rectangular wave signal 55a having a width is obtained.
この系統では信号51aのレベルをコンパレータ52で所定
のレベルVs1と比較し、V>Vs1の場合には高レベル
「H」,V<Vs1の場合は低レベル「L」となる出力信
号52aを得る。単安定マルチバイブレータ53は信号52a
が高レベル「H」にあればトリガされて時間幅が走査時
間Tに等しい矩形波を信号53aとして出力する。一方イ
ンバータ54は信号52aの極性を反転させて信号54aと
し、これらの信号53aと信号54aとをANDゲート55に
与えて時間幅T1の矩形波を信号55aとして出力する。光
ビーム6が試料5を走査しない場合はT1=0で、信号55
aは低レベル「L」のままである。In this system, the level of the signal 51a is compared with a predetermined level V s1 by the comparator 52, and when V> V s1, a high level “H”, and when V <V s1 , a low level “L” output signal. Get 52a. The monostable multivibrator 53 receives the signal 52a.
Is at a high level "H", it is triggered to output a rectangular wave having a time width equal to the scanning time T as a signal 53a. On the other hand, the inverter 54 inverts the polarity of the signal 52a into a signal 54a, supplies these signals 53a and 54a to the AND gate 55, and outputs a rectangular wave having a time width T 1 as a signal 55a. If the light beam 6 does not scan the sample 5, T 1 = 0 and the signal 55
a remains at low level "L".
この信号55aは走査のつど矩形波として出力されるの
で、これを論理パルスとしてパルス計数回路である走査
回路計数手段39で計数して走査回数を求める。Since the signal 55a is output as a rectangular wave each time of scanning, the scanning circuit counting means 39 which is a pulse counting circuit counts this as a logical pulse to obtain the number of scanning.
信号55aはまた破線で囲んだ移動距離計測手段71のAN
Dゲート73の一方の入力として与えられる。The signal 55a is also the AN of the moving distance measuring means 71 surrounded by a broken line.
It is provided as one input of D gate 73.
この移動距離計測手段71は時間計測回路として構成され
ており、発振器72の発生するクロックパルス信号72aが
上記のANDゲート73の他方の入力として与えられてい
る。したがって信号55aを形成する矩形波の幅に相当す
る時間すなわち光ビーム6が試料5の表面を走査する時
間に相当するクロックパルス数Xがパルス計数回路74で
計数される。その計数値はデータ74aとして演算手段40
に与えられて既に説明した手順によって試料の移動距離
が導かれる。The moving distance measuring means 71 is configured as a time measuring circuit, and the clock pulse signal 72a generated by the oscillator 72 is given to the other input of the AND gate 73. Therefore, the pulse counting circuit 74 counts the clock pulse number X corresponding to the time corresponding to the width of the rectangular wave forming the signal 55a, that is, the time required for the light beam 6 to scan the surface of the sample 5. The count value is calculated as data 74a by the calculating means 40.
The moving distance of the sample is derived by the procedure described above and described above.
信号55aはさらに領域設定手段37において一点鎖線で囲
んだ検査領域設定系統56と試料検知系統57にも与えられ
る。The signal 55a is also given to the inspection area setting system 56 and the sample detection system 57 surrounded by the alternate long and short dash line in the area setting means 37.
検査領域設定系統56においては、時刻t1から2τ時間後
に立上り光ビーム6の走査方向における検査領域43の走
査時間T1−2τを時間幅とする矩形波の信号59aが走査
のつど出力される。遅延回路58は時間幅T1の矩形波であ
る信号55aに所定の時間おくれτ1=2τを与えて信号58
aとし、その信号58aと前記の信号55aとを与えられた
ANDゲート59は時間幅T1−τ1=T1−2τの矩形波を
信号59aとして出力する。光ビームが試料5を走査せ
ず、信号55aが低レベル「L」にある場合は信号59aも
低レベル「L」のままである。In the inspection area setting system 56, a rectangular wave signal 59a having a time width of the scanning time T 1 -2τ of the inspection area 43 in the scanning direction of the rising light beam 6 is output each time 2τ after the time t 1. . The delay circuit 58 gives a signal 55a which is a rectangular wave having a time width T 1 by a predetermined time delay τ 1 = 2τ, and outputs the signal 58a.
and a, the AND gate 59 given a signal 55a of the and the signal 58a outputs a rectangular wave of duration T 1 -τ 1 = T 1 -2τ as signal 59a. When the light beam does not scan the sample 5 and the signal 55a is at the low level "L", the signal 59a also remains at the low level "L".
この信号59aはパルス計数手段38に与えられて、検査領
域43が走査されるT1−2τ時間計数ゲートを開くゲート
信号の役目を果す。The signal 59a is supplied to the pulse counting means 38, and serves a gate signal for opening the T 1 -2τ time counting gate inspection area 43 is scanned.
信号59aはさらにインバータ69にも与えられて極性を反
転し、光ビーム6が試料5の検査領域43の走査を終了し
た時刻t5で立上る信号69aとなって単安定マルチバイブ
レータ70をトリガしてパルス状の走査終了信号70aを演
算手段40に与える。The signal 59a is also given to the inverter 69 to invert the polarity, and becomes a signal 69a which rises at time t 5 when the light beam 6 finishes scanning the inspection area 43 of the sample 5 and triggers the monostable multivibrator 70. The pulse-shaped scanning end signal 70a to the arithmetic means 40.
試料検知系統57は光ビーム6が試料5の走査を完了する
と演算手段40の演算を開始させるパルス信号62aを出力
する。The sample detection system 57 outputs a pulse signal 62a for starting the calculation of the calculation means 40 when the scanning of the sample 5 by the light beam 6 is completed.
単安定マルチバイブレータ60は信号55aによってトリガ
され、時間幅T2が走査周期T0より長いすなわちT2>T0で
あるような矩形波を信号60aとして出力する。この単安
定マルチバイブレータ60は再トリガが可能な機能を与え
られているので、光ビーム6が試料5の走査を繰り返す
と、走査開始のつど信号60aの矩形波の立下り時点以前
に再トリガされ続け、走査が行われている間は信号60a
は高レベル「H」の状態を継続する。この信号60aはイ
ンバータ61を介して極性の反転した信号61aに変換され
る。このため信号61aは光ビーム6が試料5を走査して
いる間は低レベル「L」を維持し、走査を終了すると高
レベル「H」に転ずる信号となる。したがって走査が終
了するとこの信号61aは単安定マルチバイブレータ62を
トリガし、パルス状の検査終了信号62aを演算手段40に
与える。The monostable multivibrator 60 is triggered by the signal 55a and outputs a rectangular wave having a time width T 2 longer than the scanning period T 0 , that is, T 2 > T 0 , as the signal 60a. Since this monostable multivibrator 60 is provided with a function capable of retriggering, when the light beam 6 repeatedly scans the sample 5, it is retriggered before the falling edge of the rectangular wave of the signal 60a each time scanning starts. Continuing, signal 60a while scanning is being performed
Keeps the high level "H". This signal 60a is converted into a signal 61a whose polarity is inverted via an inverter 61. Therefore, the signal 61a becomes a signal that maintains a low level "L" while the light beam 6 scans the sample 5 and shifts to a high level "H" when the scanning is completed. Therefore, when the scanning is completed, this signal 61a triggers the monostable multivibrator 62 and gives a pulse-shaped inspection completion signal 62a to the arithmetic means 40.
一方パルス計数手段38においては、まず信号51aとその
信号51aをローパスフィルタ63に与えてパルス成分を除
いた信号63aとがコンパレータ64で比較され、信号51a
と信号63aとの差のパルス成分のみが信号64aとして出
力される。On the other hand, in the pulse counting means 38, first, the signal 51a and the signal 63a obtained by applying the signal 51a to the low-pass filter 63 and removing the pulse component are compared by the comparator 64 to obtain the signal 51a.
And a signal 63a is output as a signal 64a.
第5図に示す例においては信号64aはパルス成分b1,
b2,b3のみを含んでおり、この信号64aはさらにコンパ
レータ65で比較的低レベルのしきいレベルVs2と比較さ
れ、パルス成分の波高値VpがVp>Vs2であれば矩形波パ
ルスの信号65aが出力される。In the example shown in FIG. 5, the signal 64a has a pulse component b 1 ,
This signal 64a including only b 2 and b 3 is further compared with a relatively low level threshold level V s2 by the comparator 65, and if the peak value V p of the pulse component is V p > V s2 , it is rectangular. The wave pulse signal 65a is output.
信号65aは遅延回路66で第2の所定の時間おくれτを与
えられ、信号66aとしてANDゲート67に入る。AND
ゲート67は同時に与えられた信号59aによって時刻t1+
2τからt1+T1までの時間のT1−2τ時間開かれる計数
ゲートとして作動し、次に記すように信号65aのうちの
検査領域43内の走査で得た部分に相当する信号67aをパ
ルス計数回路68に与える。これにより検査領域43中の微
粒子702によって得られたパルス信号(b2)のみが計数
される。The signal 65a is given a delay .tau. For a second predetermined time by the delay circuit 66, and enters the AND gate 67 as the signal 66a. AND
The gate 67 receives the signal 59a provided at the same time, so that the time t 1 +
It operates as a counting gate opened for T 1 -2τ time from 2τ to t 1 + T 1 and pulses a signal 67a corresponding to the portion of the signal 65a obtained by scanning in the inspection region 43 as described below. It is given to the counting circuit 68. As a result, only the pulse signals (b 2 ) obtained by the fine particles 702 in the inspection area 43 are counted.
ここで信号65aと信号67aとの関係について説明する。
時間t1からの経過時間をtとし、信号65aと66aをそれ
ぞれf(t),g(t)として示すと、 g(t)=f(t−τ) ………………………(7) である。信号67aはANDゲート67によって信号66aす
なわちg(t)のt=τ1=2τとt=T1との間のものとな
る。(7)式によって g(τ1)=f(τ1−τ)=f(2τ−τ)=f(τ) g(T1)=f(T1−τ)………………………(8) であるので、信号67aは信号65aのt=τとt=T1−τ
との部分すなわち検査領域43から得られる部分となる。Here, the relationship between the signal 65a and the signal 67a will be described.
Letting t be the elapsed time from time t 1 , and representing signals 65a and 66a as f (t) and g (t), respectively, g (t) = f (t−τ) ……………………………… (7). The signal 67a is brought by the AND gate 67 to the signal 66a, that is, between t = τ 1 = 2τ and t = T 1 of g (t). According to equation (7), g (τ 1 ) = f (τ 1 −τ) = f (2τ−τ) = f (τ) g (T 1 ) = f (T 1 −τ) ………………… (8), the signal 67a is t = τ and t = T 1 −τ of the signal 65a.
And a portion obtained from the inspection area 43.
走査回数計数手段39,計数回路68,および計数回路74と
演算手段40との間のデータ39a,68a,74aとリセット
信号39b,68b,74bとについては既に第1図において
説明した通りである。The scanning number counting means 39, the counting circuit 68, and the data 39a, 68a, 74a and the reset signals 39b, 68b, 74b between the counting circuit 74 and the computing means 40 have already been described in FIG.
この実施例においては検査領域全体にわたる走査回数を
m等分して複数回数の走査回数Scを得ているが、必ずし
も等分する必要はなく、それぞれ異なる複数回数の走査
回数Sci(i=1.2,…,m)を与えるようにm分割
するだけでもよい。In this embodiment, the number of scans over the entire inspection region is equally divided into m to obtain a plurality of number of scans S c , but it is not always necessary to equally divide the number of scans, and different number of scans Sci (i = 1). , 2, ..., M) may be simply divided into m parts.
また試料5の移動距離liもこの実施例のように電気信号
10を処理する方式でなく、直接試料5の移動距離あるい
は移動速度を測定する方式の移動速度計測手段によって
測定してよいことはもちろんである。この場合はこの検
査装置に試料5の移動距離あるいは移動速度を直接測定
するセンサを移動距離測定手段として設ける場合と、相
対的移動手段側にこれらセンサを設け演算手段にその出
力を接続するように構成してもよい。たとえば第1図に
示す試料台34の表面に試料5の移動方向に沿って一定間
隔のバーコードを取りつけ、このバーコードとこれを読
みとる光センサとその出力パルスを計数する計数回路と
で簡単に移動距離計測手段を構成することができる。Further, the moving distance l i of the sample 5 is also an electric signal as in this embodiment.
Needless to say, it may be measured by a moving speed measuring means of a method of directly measuring the moving distance or moving speed of the sample 5 instead of the method of processing 10. In this case, a sensor for directly measuring the moving distance or moving speed of the sample 5 is provided as the moving distance measuring means in this inspection device, and those sensors are provided on the relative moving means side so that the output is connected to the calculating means. You may comprise. For example, bar codes at fixed intervals are attached to the surface of the sample table 34 shown in FIG. 1 along the moving direction of the sample 5, and the bar code, the optical sensor for reading the bar code, and the counting circuit for counting the output pulses can be simply used. A moving distance measuring means can be configured.
このような移動距離計測手段は、試料5がその表面を走
査する走査線の長さからその移動距離を算出することが
困難な形状をもっ場合に必要となる。Such moving distance measuring means is required when the sample 5 has a shape in which it is difficult to calculate the moving distance from the length of the scanning line scanning the surface thereof.
この発明によれば光ビームで鏡面状の試料表面を走査
し、異常箇所で生じたパルス状の散乱光を光検出手段で
受光して、その光検出手段の出力信号のパルス状成分を
信号処理手段におけるパルス計数回路で計数して異常箇
所数を検査する表面検査装置において、信号処理手段が
走査回数計数手段と試料の移動距離計測手段とパルス計
数回路とを接続した演算手段を備えて、検査領域全体に
わたる走査回数をいくつかに分割した複数回数の走査毎
に走査回数と試料の移動距離と電気信号のパルス状成分
数とを測定し、測定された走査回数と試料の移動距離と
からその複数回の走査における走査線密度を算出し、そ
の走査線密度の値と基準走査線密度の値を用いて、測定
されたパルス状成分の計数値を基準走査線密度に対する
値に換算し各複数回数の走査毎に求めたこれらの換算値
の総和を算出して異常箇所数を得るようにしている。基
準走査線密度は上記のパルス状成分の計数値が実際の異
常箇所数と等しくなる場合の走査線密度であり、また各
複数回数の走査毎の所要時間は短かく、その間における
試料の移動速度したがって走査線密度は試料の移動速度
が一様でない場合においても一定とみなすことができ
る。このため上記の換算と総和とによって得た異常箇所
数は試料の移動速度が異なり、しかも変動するような場
合においても、これらとは関係なく実際の異常箇所数を
得ることが可能となる。According to the present invention, the surface of the mirror-like sample is scanned with the light beam, the pulsed scattered light generated at the abnormal portion is received by the photodetector, and the pulse-shaped component of the output signal of the photodetector is processed. In a surface inspection apparatus for inspecting the number of abnormal points by counting with a pulse counting circuit in the means, the signal processing means includes a scanning number counting means, a sample moving distance measuring means, and a computing means for connecting the pulse counting circuit, The number of scans, the moving distance of the sample, and the number of pulsed components of the electric signal are measured for each of a plurality of scans obtained by dividing the number of scans over the entire region into several, and the measured number of scans and the moving distance of the sample The scanning line density in multiple scans is calculated, and by using the scanning line density value and the reference scanning line density value, the measured pulse component count value is converted into a value for the reference scanning line density. Times And to obtain calculated by the number of anomaly the sum of these converted values obtained for each scan. The reference scan line density is the scan line density when the count value of the above pulse-shaped component becomes equal to the actual number of abnormal points, and the time required for each multiple scans is short, and the moving speed of the sample during that period. Therefore, the scanning line density can be regarded as constant even when the moving speed of the sample is not uniform. Therefore, even if the moving speed of the sample is different and the number of abnormal points obtained by the above conversion and summation varies, it is possible to obtain the actual number of abnormal points regardless of these.
このため従来のように光投射手段,走査手段,光検出手
段,信号処理手段を試料の移動速度が一定に制御された
相対的移動手段と一体化する必要がなくなり、装置の小
形化と低コスト化が図れる。したがって試料の移動速度
がそれぞれに異なり、しかもそれが一様でないような既
存の製造ラインに対しても必要箇所に適宜設置できるよ
うになる。たとえば半導体製造ラインに対してはシリコ
ンウエハーの微粒子汚染状況のインライン検査や半導体
製造装置のローダー,アンローダー部への設置による半
導体製造装置内部発塵監視などの幅広い適用が可能とな
る。Therefore, it is not necessary to integrate the light projecting means, the scanning means, the light detecting means, and the signal processing means with the relative moving means in which the moving speed of the sample is controlled to be constant as in the conventional case, and the apparatus is downsized and the cost is reduced. Can be realized. Therefore, the moving speed of the sample is different from each other, and it can be properly installed in a necessary place even in an existing manufacturing line in which the moving speed is not uniform. For example, it is possible to apply a wide range of applications such as in-line inspection of the state of particle contamination of silicon wafers and monitoring of dust generation inside the semiconductor manufacturing equipment by installing it in the loader and unloader of the semiconductor manufacturing equipment to the semiconductor manufacturing line.
第1図は本発明の実施例の構成図、第2図は異常箇所の
計数値と走査線密度との比例関係を異常箇所の計数値と
実際の異常箇所数との比である検出率と走査線密度との
比例関係で実証した結果を示すグラフ、第3図(a),(b)
は試料と一つの走査線とを示す平面図とその走査におけ
る電気信号の波形図、第4図は計測手段の回路構成を示
すブロック図、第5図は第4図の回路構成の各部におけ
る信号の波形図、第6図,第7図は夫々従来技術におけ
る光学的検査装置の例を示す要部構成図である。 1,21……光投射手段、5……試料、6……光ビーム、
7……異常箇所、701,702,703……微粒子、8……散
乱光、10……電気信号、25……走査手段、33……相対的
移動手段、34……試料台、35……試料台駆動装置、16,
36……信号処理手段、38……パルス計数手段、39……走
査回数計数手段、40……演算手段、43……検査領域、6
8,74……パルス計数回路、71……移動距離計測手段。FIG. 1 is a block diagram of an embodiment of the present invention, and FIG. 2 shows the proportional relationship between the count value of abnormal points and the scanning line density as a detection rate which is the ratio between the count value of abnormal points and the actual number of abnormal points. Graph showing the results demonstrated by the proportional relationship with scanning line density, Fig. 3 (a), (b)
Is a plan view showing the sample and one scanning line and a waveform diagram of electric signals in the scanning, FIG. 4 is a block diagram showing a circuit configuration of the measuring means, and FIG. 5 is a signal in each part of the circuit configuration of FIG. FIG. 6, FIG. 6 and FIG. 7 are main-part configuration diagrams showing an example of an optical inspection device in the prior art. 1, 21 ... Light projection means, 5 ... Sample, 6 ... Light beam,
7 ... Abnormal part, 701, 702, 703 ... Fine particles, 8 ... Scattered light, 10 ... Electrical signal, 25 ... Scanning means, 33 ... Relative moving means, 34 ... Sample stage, 35 ... Sample stage drive, 16,
36 ... Signal processing means, 38 ... pulse counting means, 39 ... scanning number counting means, 40 ... computing means, 43 ... inspection area, 6
8,74 …… Pulse counting circuit, 71 …… Movement distance measuring means.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 杉本 啓介 神奈川県川崎市川崎区田辺新田1番1号 富士電機株式会社内 (72)発明者 難波 泰明 神奈川県川崎市川崎区田辺新田1番1号 富士電機株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Keisuke Sugimoto 1-1, Tanabe Nitta, Kawasaki-ku, Kawasaki-shi, Kanagawa Fuji Electric Co., Ltd. (72) Inventor Yasuaki Namba, Tanabe Nitta, Kawasaki-ku, Kawasaki-shi, Kanagawa No. 1 inside Fuji Electric Co., Ltd.
Claims (4)
ビームで鏡面状の試料表面を直線的に所定の周期で繰り
返して走査する走査手段と、その走査手段と前記の試料
とを走査方向と交わる方向にそれぞれ相対的に移動させ
る相対的移動手段と、前記の光ビームの試料表面ならび
にその試料表面以外の領域で生じた散乱光を検出する光
検出手段と、その光検出手段の出力する電気信号を処理
してその電気信号のうち試料表面に設定された所定の検
査領域における異常箇所で生じた散乱光にもとづくパル
ス状成分をパルス計数回路で計数してその計数結果を出
力する信号処理手段とを備えて前記の試料表面を検査す
る装置において、信号処理手段が光ビームの走査回数計
数手段と試料の移動距離計測手段と前記のパルス計数回
路とを接続した演算手段を備え、検査領域全体にわたる
光ビームの走査回数を分割した複数回数の走査毎に走査
回数と試料の移動距離と電気信号のパルス状成分計数値
とを測定し、測定された走査回数と試料の移動距離とか
らその複数回数の走査における走査線密度を算出し、あ
らかじめ異常箇所数既知の基準試料によって求めておい
たその既知の異常箇所数と等しいパルス状成分数の測定
値を与える基準走査線密度と前記の算出した走査線密度
とから前記の測定したパルス状成分計数値をその基準走
査線密度に対する値に換算し、異常箇所数を各複数回数
の走査毎に求めた前記の換算した値の総和として算出す
ることを特徴とする光学的表面検査装置。1. A light projecting means for projecting a light beam, a scanning means for linearly and repeatedly scanning a specular surface of a sample surface with the light beam, and a scanning means for scanning the sample and the sample. Relative moving means for relatively moving in a direction intersecting with the direction, light detecting means for detecting scattered light generated on the sample surface of the light beam and a region other than the sample surface, and output of the light detecting means A signal that processes the electrical signal and counts the pulsed component based on the scattered light generated in the abnormal area in the predetermined inspection area set on the sample surface in the pulse counting circuit and outputs the counting result In the above-mentioned apparatus for inspecting the surface of a sample provided with a processing means, the signal processing means connects the light beam scanning frequency counting means, the sample moving distance measuring means, and the pulse counting circuit. Means for measuring the number of scans, the moving distance of the sample and the pulse-like component count value of the electric signal for each of a plurality of scans obtained by dividing the number of scans of the light beam over the entire inspection region, and the measured number of scans and the sample The scanning line density is calculated based on the moving distance of the scanning line for multiple scans, and the reference scan that gives the measured value of the number of pulse-like components equal to the known number of abnormal points, which was previously obtained by the reference sample with the known number of abnormal points. The measured pulse-like component count value was converted to a value for the reference scanning line density from the linear density and the calculated scanning line density, and the number of abnormal points was calculated for each of a plurality of times of scanning. An optical surface inspection device characterized by being calculated as a sum of values.
て、走査回数計数手段が信号処理手段の一部をなす矩形
波の計数回路よりなり、光ビームが試料表面を走査する
場合に光検出手段の出力する電気信号が所定のレベルを
下まわることにもとづいて形成される矩形波を計数する
ことを特徴とする光学的表面検査装置。2. The apparatus according to claim 1, wherein the scanning number counting means comprises a rectangular wave counting circuit forming a part of the signal processing means, and light detection is performed when the light beam scans the sample surface. An optical surface inspection apparatus characterized by counting a rectangular wave formed when an electric signal output from the means falls below a predetermined level.
の装置において、試料が円板状であることを特徴とする
光学的表面検査装置。3. An optical surface inspection apparatus according to claim 1 or 2, wherein the sample is disk-shaped.
て、試料移動距離計測手段が信号処理手段の一部をなす
時間計測回路とそれに接続された演算手段とよりなり、
時間計測回路は光ビームの複数回の走査毎にその複数回
の走査のはじめの走査と終りの走査において光検出手段
の出力する電気信号が光ビームの試料表面の走査によっ
て所定のレベルを下まわっている間の時間をそれぞれ計
測し、演算手段はこれらの計測された時間に既知量とし
ての光ビームの走査速度に乗じて、はじめの走査と終り
の走査における試料表面の走査線の長さを算出しさらに
これら二つの走査線の長さと既知量としての円板状の試
料の円の径とから前記の二つの走査線のそれぞれと前記
の円の中心との距離を算出し、これら算出された距離の
差として試料の移動距離を求めることを特徴とする光学
的表面検査装置。4. The apparatus according to claim 3, wherein the sample moving distance measuring means comprises a time measuring circuit forming a part of the signal processing means and an arithmetic means connected to the time measuring circuit.
The time measuring circuit causes the electric signal output from the photodetector to fall below a predetermined level by scanning the surface of the sample with the light beam in each of the first scanning and the last scanning of the plural scannings of the light beam. The measuring means multiplies the measured time by the scanning speed of the light beam as a known amount to calculate the length of the scanning line on the sample surface in the first scanning and the final scanning. The distance between each of the two scanning lines and the center of the circle is calculated from the lengths of these two scanning lines and the diameter of the circle of the disk-shaped sample as a known amount, and these are calculated. An optical surface inspection apparatus characterized in that a moving distance of a sample is obtained as a difference between different distances.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27966987A JPH0612341B2 (en) | 1987-11-05 | 1987-11-05 | Optical surface inspection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27966987A JPH0612341B2 (en) | 1987-11-05 | 1987-11-05 | Optical surface inspection device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01121740A JPH01121740A (en) | 1989-05-15 |
| JPH0612341B2 true JPH0612341B2 (en) | 1994-02-16 |
Family
ID=17614212
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27966987A Expired - Lifetime JPH0612341B2 (en) | 1987-11-05 | 1987-11-05 | Optical surface inspection device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0612341B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5216485A (en) * | 1991-09-04 | 1993-06-01 | International Business Machines Corporation | Advanced via inspection tool (avit) |
| JP4857174B2 (en) * | 2007-04-25 | 2012-01-18 | 株式会社日立ハイテクノロジーズ | Defect inspection method and defect inspection apparatus |
-
1987
- 1987-11-05 JP JP27966987A patent/JPH0612341B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01121740A (en) | 1989-05-15 |
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