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JPH0618123B2 - Network resistor - Google Patents
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JPH0618123B2 - Network resistor - Google Patents

Network resistor

Info

Publication number
JPH0618123B2
JPH0618123B2 JP1200053A JP20005389A JPH0618123B2 JP H0618123 B2 JPH0618123 B2 JP H0618123B2 JP 1200053 A JP1200053 A JP 1200053A JP 20005389 A JP20005389 A JP 20005389A JP H0618123 B2 JPH0618123 B2 JP H0618123B2
Authority
JP
Japan
Prior art keywords
trimming
resistance
insulating substrate
resistance element
line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1200053A
Other languages
Japanese (ja)
Other versions
JPH0364002A (en
Inventor
滋 蒲原
進 奥野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP1200053A priority Critical patent/JPH0618123B2/en
Publication of JPH0364002A publication Critical patent/JPH0364002A/en
Publication of JPH0618123B2 publication Critical patent/JPH0618123B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Non-Adjustable Resistors (AREA)

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、絶縁基板上に複数の抵抗素子を列状に形成
し、その各抵抗素子の上面と抵抗素子に連通する電極端
子とにわたって絶縁基板上面にガラスコーテイングして
成るチップネットワーク抵抗器(以下単にネットワーク
抵抗器という)の構造に関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Industrial application] The present invention forms a plurality of resistance elements in a row on an insulating substrate and insulates the upper surface of each resistance element and an electrode terminal communicating with the resistance element. The present invention relates to the structure of a chip network resistor (hereinafter simply referred to as a network resistor) formed by glass coating on the upper surface of a substrate.

〔従来の技術〕[Conventional technology]

この種ネットワーク抵抗器は、例えば第9図〜第12図
に示すように、通常セラミック等の絶縁基板1の上面左
右両端部に銀・パラジウム等の導体用ペーストをマスク
を掛けて塗着したのち焼成して一対の電極端子2a,2
bを適宜間隔にて形成した後、同様に抵抗用ペーストを
前記各一対の電極端子2a,2bに重複するようにマス
クを掛けて塗着・焼成して抵抗素子3を各々形成する。
For example, as shown in FIGS. 9 to 12, this type of network resistor is formed by applying a conductive paste such as silver or palladium on a mask on the left and right ends of the upper surface of an insulating substrate 1 usually made of ceramic or the like. After firing, a pair of electrode terminals 2a, 2
After forming b at appropriate intervals, similarly, a resistor paste is similarly applied to the pair of electrode terminals 2a and 2b by masking and coating and firing to form the resistance elements 3, respectively.

従って絶縁基板1上面には、抵抗素子3が所定の間隔に
て一列状に並んで形成させることになる。
Therefore, the resistance elements 3 are formed on the upper surface of the insulating substrate 1 in a line at a predetermined interval.

しかるのち、当該抵抗素子3の汚染防止や抵抗膜安定化
のためのパッシベーション膜を施しまたは施さないで、
前記各一対の電極端子2a,2bにプローブ(探針)を
接触させて抵抗素子3の抵抗値を測定しつつ、当該抵抗
素子3にレーザ等によるトリミングを実行し、所定の抵
抗値になるように調節している。
After that, with or without applying a passivation film for preventing contamination of the resistance element 3 or stabilizing the resistance film,
While measuring the resistance value of the resistance element 3 by bringing a probe (probe) into contact with each of the pair of electrode terminals 2a and 2b, trimming with a laser or the like is performed on the resistance element 3 so that the resistance value becomes a predetermined resistance value. Is adjusted to.

そしてこのトリミング工程を終了したのち、第9図の一
点鎖線で示すように、絶縁基板1の上面に前記抵抗素子
3を覆うようにガラスペーストを塗布した後焼成すると
いうガラスコーテイング等による保護膜5を形成する。
After the trimming process is completed, as shown by the alternate long and short dash line in FIG. 9, a protective film 5 such as a glass coating is formed by applying a glass paste on the upper surface of the insulating substrate 1 so as to cover the resistive element 3 and then firing it. To form.

このように少なくともトリミング工程後であってメッキ
工程前に保護膜を施すのは、次の理由に因るものであ
る。
The reason why the protective film is applied at least after the trimming step and before the plating step is as follows.

即ち、従来では、第9図に示すように各抵抗素子3の長
手方向中途部に、電極端子2a,2bと直交する抵抗素
子3の一側縁3aに連通する平面視L字状またはP字状
のトリミング部4を、平面視同じ向きに形成するのが通
常であった。
That is, conventionally, as shown in FIG. 9, an L-shaped or P-shaped plan view that communicates with one side edge 3a of the resistance element 3 orthogonal to the electrode terminals 2a and 2b is provided at a midway portion in the longitudinal direction of each resistance element 3. It was usual to form the striped trimming portions 4 in the same direction in plan view.

この場合、前記平面視L字状のトリミング部4は、抵抗
素子3の一側縁3aに連通する幅方向の横トリミング線
4aと該横トリミング線4aの先端から長手方向(一方
の電極端子2aに向かう方向)の縦トリミング線4bと
から成り、このトリミング部4の始端となる横トリミン
グ線4aの始端は、前記抵抗素子3の一側縁3aを完全
に横切るようにするため、レーザトリミングのレーザビ
ームの照射を、抵抗素子3の一側端3aより外側の絶縁
基板1上から始まるようにして形成していた。
In this case, the L-shaped trimming portion 4 in plan view has a widthwise lateral trimming line 4a communicating with the one side edge 3a of the resistance element 3 and a longitudinal direction from one end of the lateral trimming line 4a (one electrode terminal 2a). The vertical trimming line 4b in the direction toward the direction), and the starting end of the horizontal trimming line 4a, which is the starting end of the trimming portion 4, completely crosses the one side edge 3a of the resistance element 3, so that laser trimming is performed. The irradiation of the laser beam is formed so as to start on the insulating substrate 1 outside the one end 3a of the resistance element 3.

したがって、列の最前位置の抵抗素子3におけるトリミ
ング部4の横トリミング線4aの始端は絶縁基板1の上
面外周縁に対面するようになり、且つその外周縁に近接
したものとなる。
Therefore, the starting end of the lateral trimming line 4a of the trimming portion 4 in the resistor element 3 at the frontmost position of the row faces the outer peripheral edge of the upper surface of the insulating substrate 1 and is close to the outer peripheral edge.

そして、レーザトリミングを実行すると、その熱エネル
ギーによって抵抗素子3の抵抗体を所定の細い幅にて蒸
発気化させて除去するのであるが、このときレーザビー
ムが照射された箇所の絶縁基板1の上面も同時に熱エネ
ルギーを受けて、第11図及び第12図に図解するよう
に、横トリミング線4aに沿って絶縁基板1が削り取ら
れて凹溝部7ができる。
Then, when laser trimming is performed, the resistor of the resistance element 3 is evaporated and vaporized with a predetermined narrow width by the thermal energy, and the upper surface of the insulating substrate 1 at the portion irradiated with the laser beam at this time is removed. Simultaneously with the heat energy, the insulating substrate 1 is scraped off along the lateral trimming line 4a to form the concave groove portion 7 as illustrated in FIGS. 11 and 12.

他方、前記のトリミング工程の後、電極端子2a,2b
の電気導通性能を向上させるため、第10図に示すよう
にその表面にニッケルメッキ層8をメッキにて形成し、
さらにニッケルメッキ層8の表面に半田層9をメッキ等
の手段を施すことで形成するようにしている。
On the other hand, after the trimming step, the electrode terminals 2a, 2b
In order to improve the electric continuity performance of, the nickel plating layer 8 is formed on the surface by plating as shown in FIG.
Further, the solder layer 9 is formed on the surface of the nickel plating layer 8 by plating or other means.

このニッケルメッキ層8を形成するメッキ工程は、いわ
ゆるバレルメッキ法であり、多数のネットワーク抵抗器
を篭に入れた状態で、メッキ液に浸漬させるものであっ
て、このメッキ工程において、前記トリミングされた箇
所がメッキされないように、前述の保護膜5を予め施し
て置くのである。
The plating step for forming the nickel plating layer 8 is a so-called barrel plating method, in which a large number of network resistors are placed in a basket and immersed in a plating solution. The above-mentioned protective film 5 is applied in advance so as not to plate the exposed portions.

〔発明が解決しようとする課題〕[Problems to be Solved by the Invention]

ところで、この保護膜5の縁が第11図に示すように、
凹溝部7の始端部と交差するように不足すると、次の問
題がある。
By the way, as shown in FIG. 11, the edge of the protective film 5 is
If the groove portion 7 is insufficient so as to intersect with the starting end portion, the following problem occurs.

即ち、保護膜5の材料であるガラスペーストの塗布工程
において、当該ガラスペーストの粘性のため、このペー
ストが凹溝部7の始端部分の底面に届かず、凹溝部7の
底面と保護膜5下面との間に隙間が残ることがある(第
11図及び第12図参照)。
That is, in the step of applying the glass paste that is the material of the protective film 5, the paste does not reach the bottom surface of the starting end portion of the concave groove portion 7 due to the viscosity of the glass paste, and the bottom surface of the concave groove portion 7 and the lower surface of the protective film 5 A gap may remain between them (see FIGS. 11 and 12).

そうすると、前記のバレルメッキ工程中にメッキ工程中
にメッキ液が前記隙間に浸透し、抵抗素子3の露出箇所
(トリミング部4である)に達すると、抵抗素子3は一
種の電気導体であるため、メッキ液中の金属イオン(ニ
ッケルイオン)が抵抗素子3に引き寄せられ、抵抗素子
3中の金属との相互間での化学置換及び還元作用によ
り、このメッキ金属が抵抗素子3の表面から成長し、ト
リミング部4をメッキ金属にて電気的に導通状態にして
しまう。
Then, during the barrel plating process, when the plating liquid penetrates into the gap during the plating process and reaches the exposed portion (trimming portion 4) of the resistance element 3, the resistance element 3 is a kind of electric conductor. , Metal ions (nickel ions) in the plating solution are attracted to the resistance element 3, and the plating metal grows from the surface of the resistance element 3 due to chemical substitution and reduction action with the metal in the resistance element 3. , The trimming portion 4 is electrically connected with the plated metal.

従って前段階で折角抵抗膜素子3の一部を切除して所定
の抵抗値に調節したにも拘わらず、抵抗値が大幅に変化
し、いわゆる不良品となる。
Therefore, although the bending resistance film element 3 is partially cut off in the previous step and adjusted to a predetermined resistance value, the resistance value changes significantly, resulting in a so-called defective product.

また、前記トリミング部4を導通状態にしないまでも、
トリミング工程中に切除した低抗体の切り屑が前記凹溝
部7の底部に残っていると、その切り屑からメッキ金属
が成長し、このメッキ金属が凹溝部7を通って、保護膜
5の縁より外側に突出することがあり、こうなると、後
のネットワーク抵抗器を回路基板(プリント配線板)へ
の装着ときの半田メッキ工程において、当該半田メッキ
が前記突出したメッキ金属と繋がることになり、電気特
性不良となったり、雑音発生の原因となる種々の不都合
が発生する。
Further, even if the trimming section 4 is not made conductive,
If the low-antibody chips removed during the trimming process remain at the bottom of the groove 7, the plated metal grows from the chip, and the plated metal passes through the groove 7 to form the edge of the protective film 5. It may project further outward, and in this case, in the solder plating step when mounting the later network resistor on the circuit board (printed wiring board), the solder plating is connected to the projecting plated metal, Various inconveniences may occur, which may lead to poor electrical characteristics and noise.

この不都合を回避するため、保護膜5の縁が前記横トリ
ミング線4aの始端である凹溝部7の始端箇所をも覆う
ように、換言すれば、絶縁基板1の外縁まできっちりと
コーテイングしなければならない。
In order to avoid this inconvenience, the edge of the protective film 5 must also cover the starting end portion of the concave groove portion 7 which is the starting end of the lateral trimming line 4a, in other words, the outer edge of the insulating substrate 1 must be exactly coated. I won't.

しかし、保護膜5として塗布するときのガラスペースト
は流動体であるため、前述のように絶縁基板1の外縁に
きっちりとガラスペーストの縁が来るように過不足無く
塗布することは困難で、塗布が多過ぎると絶縁基板1の
裏面まで垂れるし、不足すると前述の不都合が解消でき
ない。
However, since the glass paste applied as the protective film 5 is a fluid, it is difficult to apply the glass paste exactly so that the edge of the glass paste is exactly on the outer edge of the insulating substrate 1 as described above. If it is too large, the back surface of the insulating substrate 1 will hang down, and if it is insufficient, the above-mentioned inconvenience cannot be solved.

このような不都合は、抵抗素子3のトリミング工程前
に、いわゆるパッシベーション膜10を施し(第14図
参照)、トリミング時に抵抗素子3とパッシベーション
膜10とを同時に切除するような製作工程を採用してい
ても、同じように生じていた。
To avoid such inconvenience, a so-called passivation film 10 is applied before the trimming process of the resistance element 3 (see FIG. 14), and a manufacturing process is adopted in which the resistance element 3 and the passivation film 10 are simultaneously cut off during trimming. But the same happened.

また、パッシベーション膜10の縁が抵抗素子3の一側
縁3aより外側まで位置するときには、トリミング部4
の横トリミング線4aの始端は前記パッシベーション膜
10の縁を切り取るように絶縁基板1の外縁に限りなく
近付けなければならず、(そうしないと、抵抗素子の切
り屑がトリミング部の溝に溜り易いから)その上にメッ
キ工程前に再度前述の保護膜5を形成するのは至難のこ
とであった。
When the edge of the passivation film 10 is located outside the one side edge 3a of the resistance element 3, the trimming portion 4 is formed.
The starting end of the lateral trimming line 4a must be as close as possible to the outer edge of the insulating substrate 1 so as to cut off the edge of the passivation film 10 (otherwise, chips of the resistance element are likely to collect in the groove of the trimming portion. It was extremely difficult to form the protective film 5 again thereon before the plating process.

さらに、前述の不都合を回避するため、例えば第15図
及び第16図に示すように、一列状の適宜間隔にて配設
した複数の抵抗素子3のうち相隣接する二つの抵抗素子
3,3において、各々のトリミング部4,4の横トリミ
ング線4a,4aの始端が連通するように、平面視コ字
状にトリミングするときは、当該両トリミング部4,4
の横トリミング線4a,4aの始端が絶縁基板1の外周
縁ではなく、内周寄り(中央部寄り位置)に位置するか
ら、前述のメッキ工程前に抵抗素子3,3を覆うように
施す保護膜5にて、前記両横トリミング線4a,4aの
始端の上方を全面的に覆うことができる。
Further, in order to avoid the above-mentioned inconvenience, for example, as shown in FIG. 15 and FIG. 16, two resistance elements 3 and 3 adjacent to each other among the plurality of resistance elements 3 arranged in a row at appropriate intervals. When trimming in a U-shape in a plan view so that the starting ends of the lateral trimming lines 4a, 4a of the trimming portions 4, 4 communicate with each other,
Since the starting ends of the lateral trimming lines 4a, 4a are located not on the outer peripheral edge of the insulating substrate 1 but on the inner peripheral side (position closer to the central portion), protection is performed so as to cover the resistance elements 3, 3 before the plating process described above. The film 5 can entirely cover above the starting ends of the both lateral trimming lines 4a, 4a.

従って、前述のメッキ工程中にメッキ金属が成長する等
の不都合は生じないが、その代わりに次の不都合が生じ
る。
Therefore, there is no inconvenience such as the growth of plated metal during the above-mentioned plating process, but the following inconvenience occurs instead.

即ち、前記二つのトリミング部4,4の両横トリミング
線4a,4aに沿って出来る凹溝部7,7が互いに連通
している。そして、前記保護膜5用のガラスペーストを
絶縁基板1上面及び抵抗素子3,3の上面にわたって塗
布するとき、当該ガラスペーストの粘性のため、前記凹
溝部7の底面まで届かず、やはり隙間が生じることがあ
る。
That is, the concave groove portions 7, 7 formed along both lateral trimming lines 4a, 4a of the two trimming portions 4, 4 communicate with each other. When the glass paste for the protective film 5 is applied over the upper surface of the insulating substrate 1 and the upper surfaces of the resistance elements 3 and 3, the viscosity of the glass paste does not reach the bottom surface of the concave groove portion 7 and a gap is formed. Sometimes.

また、この隙間が生じないまでも、前述の通りトリミン
グ工程中に切除した抵抗体の切り屑等の不純物が上記隙
間又は凹溝部7の底面と保護膜5の境界面に残存し、且
つ凹溝部7が連通していることと抵抗素子3,3間の距
離が短いことから、隣接抵抗素子3,3間でリークを生
じることがある。
Further, even if this gap does not occur, impurities such as chips of the resistor cut off during the trimming process remain as described above at the gap or at the boundary surface between the bottom surface of the concave groove portion 7 and the protective film 5, and the concave groove portion is formed. Due to the communication of 7 and the short distance between the resistance elements 3 and 3, a leak may occur between the adjacent resistance elements 3 and 3.

従って、このように相隣接する2つの抵抗素子の一側部
外側でトリミング部の始端が連通するようなトリミング
を実行することができないのであった。
Therefore, it is impossible to perform the trimming in which the starting ends of the trimming portions communicate with each other outside one side portion of the two resistance elements adjacent to each other.

本発明は、これらの問題を解消することを目的とするも
のである。
The present invention aims to solve these problems.

〔課題を解決するための手段〕[Means for Solving the Problems]

この目的を達成するため本発明は、絶縁基板上面に複数
の抵抗素子を互いに適宜間隔をあけて列状に配設し、該
各抵抗素子の両端を、当該絶縁基板に形成した一対の電
極端子に接続して成るネットワーク抵抗器において、前
記各抵抗素子の中途部に形成するトリミング部における
トリミング線の始端を、一対の電極端子方向に延びる抵
抗素子における一側縁から開始するように設け、且つ、
前記列状に配設した抵抗素子のうち当該列の最前端位置
および最後端位置における抵抗素子に形成するトリミン
グ部のトリミング線の始端を、絶縁基板の外周縁に対面
する箇所とは反対の内周寄りに位置させる一方、前記列
における最前端位置および最後端位置の抵抗素子並びに
他の抵抗素子におけるトリミング部のトリミング線の始
端を、それと相隣接する相手側の抵抗素子におけるトリ
ミング部のトリミング線の始端に対して食い違い状の位
置に設けたものである。
In order to achieve this object, the present invention provides a pair of electrode terminals formed on the insulating substrate such that a plurality of resistance elements are arranged in a row on the upper surface of the insulating substrate at appropriate intervals, and both ends of each resistance element are formed on the insulating substrate. In the network resistor formed by connecting to, the starting end of the trimming line in the trimming portion formed in the middle of each resistance element is provided so as to start from one side edge of the resistance element extending in the direction of the pair of electrode terminals, and ,
Of the resistance elements arranged in a row, the starting ends of the trimming lines of the trimming portions formed on the resistance elements at the frontmost end position and the rearmost end position of the row are opposite to those facing the outer peripheral edge of the insulating substrate. The trimming line of the trimming portion of the resistance element on the opposite side adjacent to the resistance element at the foremost end position and the rearmost end position of the row and the trimming line of the trimming portion of the other resistance element while being positioned near the circumference It is provided at a position that is staggered with respect to the start end of.

〔実施例〕〔Example〕

次に本発明の実施例について説明すると、第1図におい
て符号11は、従来のネットワーク抵抗器におけると同
様のセラミックまたはガラス等の絶縁基板であり、符号
12a,12bは前記絶縁基板11の長手方向に沿う左
右両側部に導体用ペーストを印刷・焼成してなる一対の
電極端子であり、一定間隔でこの一対の電極端子12
a,12bが設けられている。
Next, an embodiment of the present invention will be described. In FIG. 1, reference numeral 11 is an insulating substrate such as ceramic or glass similar to that in a conventional network resistor, and reference numerals 12a and 12b are longitudinal directions of the insulating substrate 11. A pair of electrode terminals formed by printing and firing a conductor paste on both left and right sides along the
a and 12b are provided.

また、符号13は前記各一対の電極端子12a,12b
に端部が重複するように、絶縁基板11の上面に抵抗用
のペーストを印刷・焼成して形成した抵抗素子を示す。
Reference numeral 13 is a pair of the electrode terminals 12a and 12b.
A resistance element formed by printing and firing a paste for resistance on the upper surface of the insulating substrate 11 so that the ends overlap with each other is shown.

符号14は前記各抵抗素子13の長手方向中途部にレー
ザトリミングにより形成した平面視L字状のトリミング
部で、該トリミング部14は、前記一対の電極端子12
a,12b方向に延びる抵抗素子13の一側縁13a近
傍の絶縁基板1上面から、その一側縁13aと略直角等
の交差する方向に延びる横トリミング線14aと、該横
トリミング線14aの終端に連通し、且つ前記一方の電
極端子12a方向に延びる縦トリミング線14bとから
成る。
Reference numeral 14 is an L-shaped trimming portion in plan view formed by laser trimming in the middle of each of the resistance elements 13 in the longitudinal direction. The trimming portion 14 includes the pair of electrode terminals 12.
A lateral trimming line 14a extending from the upper surface of the insulating substrate 1 in the vicinity of one side edge 13a of the resistance element 13 extending in the a and 12b directions in a direction intersecting the one side edge 13a at a substantially right angle, and the end of the horizontal trimming line 14a. And a vertical trimming line 14b which communicates with the first electrode terminal 12a and extends in the direction of the one electrode terminal 12a.

第2図で示すように、前記トリミング部14をレーザト
リミング等にて形成するとき、その熱エネルギー等にて
絶縁基板11の上面が削られて、横トリミング線14a
に沿って凹溝部16が形成されるのである。
As shown in FIG. 2, when the trimming portion 14 is formed by laser trimming or the like, the upper surface of the insulating substrate 11 is shaved by the heat energy or the like, and the lateral trimming line 14a is formed.
The concave groove portion 16 is formed along this.

そして、抵抗素子13,13が二つで一列状に配設され
ているとき(2連ネットワーク抵抗器)には、一方の抵
抗素子13が列の最前端位置のものとなり、他方の抵抗
素子13が最後端位置となる。この両抵抗素子13,1
3におけるトリミング部14,14の横トリミング線1
4a,14aの始端を絶縁基板11の外周縁に対面する
箇所とは反対の内周寄り(絶縁基板11の上面中央部寄
り位置)に位置させると共に、前記列の最前端位置にあ
る抵抗素子13におけるトリミング部14の横トリミン
グ線14aの始端を、それと相隣接する相手側(最後端
位置)の抵抗素子13におけるトリミング部14の横ト
リミング線14aの始端に対して距離(H1)だけ食い
状の位置に設けるのである。
When two resistance elements 13 and 13 are arranged in a line (two-line network resistor), one resistance element 13 is at the frontmost position of the row and the other resistance element 13 Is the last position. Both resistance elements 13 and 1
Horizontal trimming line 1 of trimming portions 14 and 14 in FIG.
The starting ends of 4a and 14a are located closer to the inner circumference (the position closer to the central portion of the upper surface of the insulating substrate 11) opposite to the position facing the outer peripheral edge of the insulating substrate 11, and the resistance element 13 located at the frontmost position of the row. The starting end of the lateral trimming line 14a of the trimming portion 14 in the line is eclipsed by a distance (H1) from the starting end of the lateral trimming line 14a of the trimming portion 14 in the resistance element 13 on the opposite side (the end position) adjacent thereto. It is provided at the position.

なお、抵抗素子13の抵抗値を正確に調節するためのト
リミング作業は、まず前記最前端位置における抵抗素子
13に接続する一対の電極端子12a,12bにプロー
ブ(探針)を接触させその間の抵抗素子の抵抗値を検出
しつつ、トリミング部14を形成し、所定の抵抗値にな
ったところでトリミング作業を停止する。
In the trimming work for accurately adjusting the resistance value of the resistance element 13, first, a probe (probe) is brought into contact with the pair of electrode terminals 12a and 12b connected to the resistance element 13 at the foremost end position and the resistance between them is set. While detecting the resistance value of the element, the trimming portion 14 is formed, and when the resistance value reaches a predetermined value, the trimming work is stopped.

次いで、前記と同じく抵抗値を測定しながら、隣接の抵
抗素子13の箇所に対しても同様にトリミング部14を
形成するのである。
Then, while the resistance value is being measured in the same manner as described above, the trimming portion 14 is similarly formed at the location of the adjacent resistance element 13.

このように構成すると、各抵抗素子13におけるトリミ
ング部14の横トリミング線14aの始端が絶縁基板1
1上面における略中央部分に位置するので、トリミング
工程後、メッキ工程の前に両抵抗素子13を覆うように
施すガラスコーテイングによる保護膜15(第2図の一
点鎖線で示す)にて前記両横トリミング線14a,14
aの始端ひいては絶縁基板上面に凹み形成された凹溝部
16上面を完全に覆うことができる。
With this configuration, the starting end of the horizontal trimming line 14a of the trimming portion 14 in each resistance element 13 is the insulating substrate 1.
Since it is located at the substantially central portion of the upper surface of the upper surface of FIG. 1, after the trimming process and before the plating process, a protective film 15 (shown by a dashed line in FIG. Trimming lines 14a, 14
It is possible to completely cover the starting end of a and, in turn, the upper surface of the groove 16 formed in the upper surface of the insulating substrate.

この結果、メッキ工程において、前記両横トリミング線
14a,14aの始端や凹溝部16からメッキ金属が成
長する等の不都合を完全になくすることができる。
As a result, in the plating process, it is possible to completely eliminate the inconvenience such as the plating metal growing from the starting ends of the both lateral trimming lines 14a, 14a and the recessed groove portion 16.

そして、前記両横トリミング線14a,14aの始端同
士が平面視で距離(H1)だけずれて食い違っているこ
とから、トリミング工程時に横トリミング線14aに沿
って絶縁基板11上面にできる凹溝部16(第1図で代
表して示す)が互いに連通することがなく、また、仮令
各凹溝部16に抵抗素子の切り屑が残っていても、平面
状の絶縁基板11上面に密着した前記保護膜15にて前
記両始端を絶縁的に遮断することができる。
Since the starting ends of the both lateral trimming lines 14a, 14a are offset by a distance (H1) in a plan view, the concave portions 16 (formed on the upper surface of the insulating substrate 11 along the lateral trimming line 14a during the trimming process). (Representatively shown in FIG. 1) does not communicate with each other, and even if chips of the resistance element remain in each of the concave groove portions 16, the protective film 15 adhered to the upper surface of the planar insulating substrate 11 It is possible to insulatively cut off both of the starting ends.

第3図は3つの抵抗素子13が一列状に配設された場合
(3連ネットワーク抵抗器)の実施例で、最前端位置
(第3図の左端位置)の抵抗素子13におけるトリミン
グ部14の横トリミング線14aの始端は列の後向き
に、最後端位置(第3図の右端位置)の抵抗素子13に
おけるトリミング部14の横トリミング線14aの始端
は列の前向きになるように各々形成することにより、両
抵抗素子13におけるトリミング部14の横トリミング
線14aの始端を絶縁基板11上面における内周寄り部
分に位置させることができ、この2つの抵抗素子13,
13の間に位置する中間位置の抵抗素子13におけるト
リミング部14の横トリミング線14aの始端が、最後
端位置の抵抗素子13におけるトリミング部14の横ト
リミング線14aと向かい合い、且つ平面視で距離(H
1)だけずれて食い違っているように形成するものであ
る。
FIG. 3 shows an embodiment in which three resistance elements 13 are arranged in a row (triple network resistor), and the trimming portion 14 of the resistance element 13 at the foremost end position (left end position in FIG. 3) is shown. The starting end of the lateral trimming line 14a should be formed in the rearward direction of the column, and the starting end of the lateral trimming line 14a of the trimming section 14 in the resistance element 13 at the rearmost position (the rightmost position in FIG. 3) should be formed in the frontward direction of the column. Thus, the starting ends of the horizontal trimming lines 14a of the trimming portions 14 of both the resistance elements 13 can be located at the inner peripheral portion of the upper surface of the insulating substrate 11, and the two resistance elements 13,
The starting end of the lateral trimming line 14a of the trimming portion 14 in the resistance element 13 at the intermediate position located between the two faces the lateral trimming line 14a of the trimming portion 14 in the resistance element 13 at the end position, and the distance (in plan view) H
It is formed so that they are displaced by 1) and disagree with each other.

第4図及び第5図は4つの抵抗素子13を一列状に配設
した場合(4連ネットワーク抵抗器)の実施例を各々示
し、この各実施例においても、最前端位置(各図の左端
位置)の抵抗素子13におけるトリミング部14の横ト
リミング線14aの始端は列の後向きに、最後端位置
(各図の右端位置)の抵抗素子13におけるトリミング
部14の横トリミング線14aの始端は列の前向きにな
るように各々形成することにより、両抵抗素子13にお
けるトリミング部14の横トリミング線14aの始端を
絶縁基板11上面における内周寄り部分に位置させるこ
とができる。
FIGS. 4 and 5 each show an embodiment in which four resistance elements 13 are arranged in a line (a four-series network resistor), and in each of these embodiments as well, the frontmost position (left end of each drawing) is shown. Position) of the trimming portion 14 of the resistance element 13 at the starting position of the trimming portion 14 in the rear end position (right end position of each figure) of the trimming portion 14 of the trimming portion 14 of the starting end of the row. By forming each of them so as to face forward, the starting end of the lateral trimming line 14a of the trimming portion 14 in both resistance elements 13 can be positioned on the inner peripheral portion of the upper surface of the insulating substrate 11.

そして第4図の実施例では、左端から2つ目及び3つ目
の抵抗素子13,13におけるトリミング14,14の
横トリミング線14a,14aの始端は同じ左側の一側
縁13a側に位置する。第5図の実施例における左端か
ら2つ目の抵抗素子13におけるトリミング14の横ト
リミング線14aの始端は前端位置の抵抗素子13側に
向かい、3つ目の抵抗素子13におけるトリミング14
の横トリミング線14aの始端は後端位置の抵抗素子1
3側に向かうように形成するのである。
In the embodiment of FIG. 4, the starting ends of the lateral trimming lines 14a and 14a of the trimmings 14 and 14 in the second and third resistance elements 13 and 13 from the left end are located on the same left side one edge 13a side. . The starting end of the lateral trimming line 14a of the trimming 14 in the second resistance element 13 from the left end in the embodiment of FIG. 5 is directed toward the resistance element 13 side at the front end position, and the trimming 14 in the third resistance element 13 is performed.
The starting end of the horizontal trimming line 14a is the resistance element 1 at the rear end position.
It is formed so as to face the 3 side.

第6図、第7図、第8図の実施例は5つの抵抗素子13
を一列状に配設した場合(5連ネットワーク抵抗器)で
あって、各図示のごとくに各トリミング部14の横トリ
ミング線14aの始端を、一列状に配列した抵抗素子の
うち当該列の最前端位置および最後端位置における抵抗
素子に形成するトリミング部のトリミング線の始端は、
絶縁基板の外周縁に対面する箇所とは反対の内周寄りに
位置させる一方、前記列における最前端位置および最後
端位置の抵抗素子並びに他の抵抗素子におけるトリミン
グ部のトリミング線の始端を、それと相隣接する相手側
の抵抗素子におけるトリミング部のトリミング線の始端
に対して食い違い状の位置に設けたものであり、図示の
ごとく、種々の配列パターンが考えられるのである。
The embodiment shown in FIGS. 6, 7, and 8 includes five resistance elements 13.
In a row (5-series network resistor), the starting end of the horizontal trimming line 14a of each trimming section 14 as shown in the figure is the most resistive element in the row among the resistance elements arranged in a row. The starting end of the trimming line of the trimming part formed on the resistance element at the front end position and the rear end position is
While being positioned on the inner peripheral side opposite to the location facing the outer peripheral edge of the insulating substrate, the leading end of the trimming line of the trimming portion in the resistor element at the foremost end position and the trailing end position in the row and other resistor elements, and It is provided at a position staggered with respect to the starting end of the trimming line of the trimming portion in the resistance element on the opposite side adjacent to each other, and various arrangement patterns are conceivable as shown in the figure.

なお、第4図〜第8図において保護膜15の箇所は省略
している。また、抵抗素子13は絶縁基板11上面に2
〜3列状に配設することもでき、その場合の電極端子の
一部は絶縁基板11の上面内周寄り位置に形成すること
は言うまでもない。
The location of the protective film 15 is omitted in FIGS. 4 to 8. In addition, the resistance element 13 is formed on the upper surface of the insulating substrate 11 by 2
It is needless to say that the electrodes may be arranged in three rows, and in that case, a part of the electrode terminals are formed near the inner circumference of the upper surface of the insulating substrate 11.

〔発明の作用・効果〕[Operation and effect of invention]

このように、列状に適宜間隔にて配設した抵抗素子のう
ち少なくとも、最前端位置と最後端位置とにおける抵抗
素子に形成するトリミング部のトリミング線の始端が絶
縁基板上面における内周寄り位置に位置するので、トリ
ミング工程後、メッキ工程の前にすべての抵抗素子を覆
うように施すガラスコーテイングによる保護膜にて前記
横トリミング線の始端上面を充分に、且つ完全に覆うこ
とができる。
As described above, at least of the resistance elements arranged in a row at appropriate intervals, the starting ends of the trimming lines of the trimming portions formed on the resistance elements at the frontmost end position and the rearmost end position are located near the inner circumference on the upper surface of the insulating substrate. Therefore, after the trimming step and before the plating step, the upper surface of the starting end of the lateral trimming line can be sufficiently and completely covered with the protective film formed by the glass coating so as to cover all the resistance elements.

この結果、メッキ工程において、前記横トリミング線の
始端ひいては絶縁基板上面に凹み形成された凹溝からメ
ッキ金属が成長する等の不都合を完全になくすことがで
きる。
As a result, in the plating process, it is possible to completely eliminate the inconvenience such as the plating metal growing from the starting end of the lateral trimming line and further from the groove formed in the upper surface of the insulating substrate.

そして、前記列における最前端位置および最後端位置の
抵抗素子並びに他の抵抗素子におけるトリミング部のト
リミング線の始端を、それと相隣接する相手側の抵抗素
子におけるトリミング部のトリミング線の始端に対して
平面視に食い違い状の位置に設けたものであるから、ト
リミング工程時に横トリミング線に沿って絶縁基板上面
にできる凹溝部が互いに連通することがなく、また、た
とえ、各凹溝部に抵抗素子の切り屑が残っていても、平
面状の絶縁基板上面に密着した前記保護膜にて前記両始
端を絶縁的に遮断することができる。
Then, the starting ends of the trimming lines of the trimming portions of the resistance elements at the frontmost position and the rearmost position of the row and the other resistance elements are compared with the starting ends of the trimming lines of the trimming portions of the resistance elements on the opposite side adjacent to the resistance element. Since it is provided in a staggered position in a plan view, the recessed grooves formed on the upper surface of the insulating substrate along the horizontal trimming line do not communicate with each other during the trimming process, and even if each of the recessed grooves has a resistance element Even if chips remain, the both ends can be insulated insulatively by the protective film that is in close contact with the upper surface of the planar insulating substrate.

このようにして本発明によれば、抵抗値の調節精度を格
段に向上させ、且つネットワーク抵抗器の電気的特性の
安定度も格段に向上するのである。
As described above, according to the present invention, the adjustment accuracy of the resistance value is remarkably improved, and the stability of the electrical characteristics of the network resistor is remarkably improved.

本発明は、保護膜の外周縁が絶縁基板の外周縁にきっち
りと位置させることができないもの、例えば、抵抗ネッ
トワークにおける抵抗素子の長さ及び幅寸法が短い微小
形状の場合に有効となり、且つ最終の保護膜の形成も省
略可能となる。
INDUSTRIAL APPLICABILITY The present invention is effective when the outer peripheral edge of the protective film cannot be precisely positioned on the outer peripheral edge of the insulating substrate, for example, in the case of a minute shape in which the length and width dimensions of the resistance element in the resistance network are short, and The formation of the protective film can also be omitted.

【図面の簡単な説明】[Brief description of drawings]

第1図から第8図までは本発明の実施例を示し、第1図
は斜視図、第2図は2連のネットワーク抵抗器の平面
図、第3図は3連ネットワーク抵抗器の平面図、第4図
及び第5図は各々4連ネットワーク抵抗器の平面図、第
6図及び第7図及び第8図は各々5連ネットワーク抵抗
器の平面図、第9図から第16図までは従来例を示し、
第9図は従来の2連ネットワーク抵抗器の平面図、第1
0図は第9図のX−X視拡大断面図、第11図は第9図
のXI−XI視拡大断面図、第12図は第11図のX−
II−XII視断面図、第13図は斜視図、第14図は従来
の例の斜視図、第15図は従来のさらに他の例を示す平
面図、第16図は第15図のXVI−XVI視拡大断面図で
ある。 1,11……絶縁基板、2a,2b,12a,12b…
…電極端子、3,13……抵抗素子、4,14……トリ
ミング部、4a,14a……横トリミング線、5,15
……保護膜、7,16……凹溝部、8……ニッケルメッ
キ層、9……半田層、10……パッシベーション膜。
1 to 8 show an embodiment of the present invention, FIG. 1 is a perspective view, FIG. 2 is a plan view of a double network resistor, and FIG. 3 is a plan view of a triple network resistor. , FIG. 4 and FIG. 5 are plan views of a 4-series network resistor, FIG. 6 and FIG. 7 and FIG. 8 are plan views of a 5-series network resistor, and FIG. 9 to FIG. Show a conventional example,
FIG. 9 is a plan view of a conventional dual network resistor, the first
0 is an enlarged sectional view taken along line XX of FIG. 9, FIG. 11 is an enlarged sectional view taken along line XI-XI of FIG. 9, and FIG. 12 is taken along line X- of FIG.
II-XII sectional view, FIG. 13 is a perspective view, FIG. 14 is a perspective view of a conventional example, FIG. 15 is a plan view showing still another example of the conventional example, and FIG. 16 is XVI- of FIG. FIG. 6 is an enlarged cross-sectional view taken along XVI. 1, 11 ... Insulating substrate, 2a, 2b, 12a, 12b ...
... Electrode terminals, 3, 13 ... Resistance elements, 4, 14 ... Trimming part, 4a, 14a ... Horizontal trimming line, 5, 15
...... Protective film, 7, 16 ...... concave groove part, 8 ...... nickel plating layer, 9 ...... solder layer, 10 ...... passivation film.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】絶縁基板の上面に、複数の抵抗素子を互い
に適宜間隔をあけて列状に配設し、該各抵抗素子の両端
を、当該絶縁基板に形成した一対の電極端子に接続して
成るネットワーク抵抗器において、前記各抵抗素子の中
途部に形成するトリミング部におけるトリミング線の始
端を、一対の電極端子方向に延びる抵抗素子における一
側縁から開始するように設け、且つ、前記列状に配列し
た抵抗素子のうち当該列の最前端位置および最後端位置
における抵抗素子に形成するトリミング部のトリミング
線の始端を、絶縁基板の外周縁に対面する箇所とは反対
の内面寄りに位置させる一方、前記列における最前端位
置および最後端位置の抵抗素子並びに他の抵抗素子にお
けるトリミング部のトリミング線の始端を、それと相隣
接する相手側の抵抗素子におけるトリミング部のトリミ
ング線の始端に対して食い違い状の位置に設けたことを
特徴とするネットワーク抵抗器。
1. A plurality of resistance elements are arranged in rows on an upper surface of an insulating substrate at appropriate intervals, and both ends of each resistance element are connected to a pair of electrode terminals formed on the insulating substrate. In the network resistor configured as described above, the starting end of the trimming line in the trimming portion formed in the middle of each resistance element is provided so as to start from one side edge of the resistance element extending in the direction of the pair of electrode terminals, and the row Position the starting ends of the trimming lines of the trimming portions formed on the resistance elements at the frontmost position and the rearmost position of the row of the resistance elements arranged in a line, on the inner surface side opposite to the location facing the outer peripheral edge of the insulating substrate. On the other hand, the starting ends of the trimming lines of the trimming portions of the resistance elements at the foremost end position and the rearmost end position in the row and the trimming portions of the other resistance elements are connected to the resistance of the other side adjacent thereto. Resistor networks, characterized in that provided on the discrepancy shaped position relative to the starting end of the trimming line of the trimming portion in the element.
JP1200053A 1989-08-01 1989-08-01 Network resistor Expired - Lifetime JPH0618123B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1200053A JPH0618123B2 (en) 1989-08-01 1989-08-01 Network resistor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1200053A JPH0618123B2 (en) 1989-08-01 1989-08-01 Network resistor

Publications (2)

Publication Number Publication Date
JPH0364002A JPH0364002A (en) 1991-03-19
JPH0618123B2 true JPH0618123B2 (en) 1994-03-09

Family

ID=16418048

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1200053A Expired - Lifetime JPH0618123B2 (en) 1989-08-01 1989-08-01 Network resistor

Country Status (1)

Country Link
JP (1) JPH0618123B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2003275693A1 (en) 2002-10-31 2004-05-25 Rohm Co., Ltd. Fixed network resistor
JP2009194148A (en) * 2008-02-14 2009-08-27 Rohm Co Ltd Chip resistor

Also Published As

Publication number Publication date
JPH0364002A (en) 1991-03-19

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