JPH0618124B2 - Electrode processing device for chip parts - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrode processing apparatus for chip parts such as chip resistors, which is a kind of electronic parts that contributes to weight reduction, thickness reduction, and size reduction of electronic devices. is there.

2. Description of the Related Art Conventionally, this type of chip component has a structure as shown in FIG. FIG. 2 shows a cross-sectional view of a square plate chip resistor as an example. 1 is an insulating substrate such as alumina, 2 is a low antibody, 3 is a silver-based electrode film, 4 is a nickel (Ni) film, and 5 is A solder (Sn-Pb-based alloy) [or tin (Sn) or lead (Pb)] film deposited by electroplating, 6 is a glass coating film for protecting the low antibody 2.

As described above, the conventional chip component has the low melting point metal plating film or the low melting point alloy plating film (hereinafter, these are collectively referred to as the low melting point metal plating film) as the outermost layer of the electrode portion, and the underlayer (here As the nickel film 5), a high melting point alloy film or a high melting point alloy film made of a material having a higher melting point than the low melting point metal plating film and having a good affinity with the low melting point metal plating film (hereinafter referred to as a high melting point metal film). (Collectively referred to) is formed.

In such a conventional chip component, the outermost layer of the electrode portion is made of a low-melting-point metal plating film, and the surface thereof is rough, so that the surface area is very large. For this reason, these films are more likely to absorb foreign matter and adsorb gas, and when stored for a long period of time, the electrode surface undergoes chemical changes such as oxidation, causing soldering defects during mounting and soldering to the printed circuit board. There was a problem that there was a great possibility of causing it. In addition, when the low melting point metal plating film is formed by gloss plating in order to make the surface smooth, there is a fatal defect that the solderability is poor because it contains impurities (organic substances). There is.

An atmosphere furnace, an infrared furnace, a hot stove, a hot plate, or the like is used as an electrode processing device for making the low-melting-point metal plating film having a rough surface of the electrode portion as described above a smooth surface. A heating electrode processing device or a device using the vapor phase soldering method (VPS method) is known. Among them, as an example, an electrode processing apparatus for a chip component using an infrared heater will be described below.

FIG. 3 is a schematic block diagram of an electrode processing apparatus using this infrared heater.

In FIG. 3, 7 is a chip part having the structure as shown in FIG. 2, 8 is a chip part aligning machine, 9 is a flux applicator, 10 is an infrared heater, 11 is a cooler, and 12 is electrode-treated. Chip part take-out machine, 13 is a belt drive unit, 14
Is an electrode treatment device stand, 15 is a chip component conveying belt, 1
6 is a belt cleaner.

The process of melting the low melting point metal plating film of the electrode part of the chip component includes five processes of chip component alignment → flux application → heat melting → cooling solidification → chip component removal. That is, the belt drive unit 13
The chip components 7 are supplied from the chip component aligning machine 8 onto the chip component transport belt 15 transported by, and flux is applied to the chip components 7 in the next step, and then flux is applied by the tunnel type infrared heater 10. The electrode part is heated and melted, then the melted part is cooled and solidified by the cooler 11, and then the electrode-processed chip parts unloader 12 takes out the electrode-processed chip parts 7.
Further, the chip component conveying belt 15 is cleaned by the belt cleaning device 16 and then the chip component 7 is again supplied thereto.

Problems to be Solved by the Invention In such a conventional electrode processing apparatus, an independent facility is required for each process, and since the chip component conveyor belt is contaminated with flux, a cleaning device must be installed. Also,
Because of this, the equipment is inevitably larger and moreover, in order to maintain the timing between the equipment (the transfer speed of chip parts conveyed by the conveyor belt is synchronized with the timing of flux application and chip part removal). For),
It had a basic problem that it had to be equipment that required precision.

The problems of the above-mentioned electrode processing apparatus will be listed below.

When the electrode parts of the chip parts are melted, the electrode parts of the chip parts must be aligned so that the electrode parts of the chip parts do not stick to each other, which is a major factor that hinders mass productivity. .

Since it is heated and melted in the air, a flux is necessary to prevent oxidation of the surface of the molten metal.

Since the flux is used, the flux is heated and seized on the chip component, making it difficult to clean the chip component.

Since the heating part is a tunnel type, air can freely flow in and out, and it is difficult to stabilize the temperature.

Since the conveyor belt is also heated at the same time, it takes time to heat and cool, which requires a very long furnace and a cooler for rapid cooling.

Flux adheres to the conveyor belt, which may cause equipment failure, so the conveyor belt must be cleaned.

There are many mechanically moving parts from the viewpoint of the entire equipment, and since flux is used on top of them, the flux easily adheres to the moving parts of the equipment and causes a failure, which tends to reduce the operating rate of the equipment. As described above, the electrode processing apparatus using the infrared heater shown in FIG. 3 has many problems, and improvement thereof is strongly demanded.

Further, also in the other electrode processing apparatus described above,
It has problems similar to those of the electrode processing device using the infrared heater. The dimensions of chip parts are generally as small as 3.2 mm x 1.6 mm, and recently, very small chip parts such as 2.0 mm x 1.25 mm are being used, which is becoming smaller and smaller. The tendency is getting stronger. As described above, the size of the chip component may be very small, and as described above, the conventionally known electrode processing apparatus has many problems. The fact is that almost no treatment for making the surface of the electrode portion smooth is performed on the component.

The inventor of the present invention has previously proposed Japanese Patent Application No. 61-1 for removing the drawbacks of such an electrode processing apparatus for chip parts.
No. 93284 proposes an electrode processing apparatus for a chip part having a structure as shown in FIG. This device is a chip part 7 having a high boiling point liquid 18 such as oil filled inside and a low melting point metal plating film at the outermost layer of the electrode portion at one end.
A U-shaped cylindrical container 17 having a charging part for charging, and a heater 19 arranged at one end of the U-shaped cylindrical container 17 so that the high boiling point liquid 18 has a temperature gradient. And the other end of the U-shaped cylindrical container 17 without the heater 19 is an opening, and the opening is a take-out port for taking out the processed chip component 7.

A method of treating the surface of the electrode part of the chip part 7 in the apparatus shown in FIG. 4 will be described below. First, at the stage of performing the electrode treatment, the upper portion (one end) of the U-shaped cylindrical container 17 is heated to 250 to 280 ° C. by the heater 19.
At this time, since the U-shaped cylindrical container 17 contains coconut oil as the high boiling point liquid 18, the high boiling point liquid 18 is
Heat to 50-280 ° C. This heated high-boiling-point liquid 18 has a small specific gravity, and does not convect to the low temperature part (bottom side of the U-shaped cylindrical container 17) having a large specific gravity at the lower part, but only at the upper part on the charging part side. Cause convection. Therefore, the high boiling point liquid 18 in the U-shaped cylindrical container 17 has a temperature gradient from a high temperature state to a low temperature state from the upper part to the lower part,
The bottom side can keep room temperature. Then, the parts feeder 2 is inserted into the U-shaped cylindrical container 17 from the charging portion above the liquid surface of the high boiling point liquid 18 to the prepared place as described above.
From 0, the chip component 7 having the low melting point metal plating film on the outermost layer of the electrode portion is put. By this input, chip parts 7
Falls in the high boiling point liquid 18. At this time, due to the friction between the high-boiling liquid 18 and the tip part 7, the tip parts 7 are dropped in a state of being individually separated, and are provided in the outermost layer of the electrode part at a high temperature part heated to 250 to 280 ° C. The low-melting-point metal plating film is melted and dropped to the low temperature side having a temperature gradient, and the melted part is solidified on the low temperature side, and as a processed chip part 27 having an electrode with a smooth surface. It accumulates on the bottom side in the U-shaped cylindrical container 17. At this time, since the bottom side of the U-shaped cylindrical container 17 is at room temperature,
Treated chip parts 27 There is no concern that the two will stick together. Regarding removal of the chip component 27 that has been subjected to electrode surface treatment, the magnet 2 is used to continuously remove the treated chip component 27 from the opening on the side where the heater 19 is not provided.
The belt 21 with 2 is attached to the container 17 through the belt drive unit 23 from the opening at the other end of the U-shaped cylindrical container 17.
Of the processed chip parts 2 accumulated at the bottom by rotating the belt 21 in the direction of the arrow shown in FIG.
7 is pulled up while being attracted by the magnet 22, and the processed chip component 27 that has exited from the opening serving as the outlet is stored in the container 26. Then, the processed chip component 27 taken out is washed to be a finished product.

According to the electrode processing apparatus previously proposed by the present inventor, a film or layer made of a low melting point metal (low melting point alloy) is melted on the high temperature side of the high boiling point liquid in the container and cooled on the low temperature side. Therefore, the surface tension becomes small during melting and the surface area becomes small. By cooling in this state, the low melting point metal film (low melting point alloy film) formed by the plating film or the like
The surface area of the chip component is much smaller than that of the chip component, and the surface is smooth, so that it is possible to obtain a chip component in which foreign matter and gas are not adsorbed extremely during storage.
In addition, since foreign substances and gases that have been adsorbed and occluded on the surface or inside the dents are released during melting, the outermost layer itself becomes a clean film that does not contain impurities, and the solder wettability and soldering reliability are improved. It is possible to obtain a chip component that leads to the improvement of Then, the electrode treatment can be carried out simply without moving complicated components in the high boiling point liquid, from the high temperature side to the low temperature side. In addition, since the melting and cooling are performed in the high boiling point liquid and the electrodes of the chip parts do not stick to each other on the low temperature side, the chip parts are not aligned during the electrode treatment, and a large amount of them are scattered. It can be processed simply by throwing it in and the heating and cooling can be completed in a short time because the chip parts are in contact with the liquid, so that the mass productivity becomes very high. further,
Since it is melted and cooled in the high boiling point liquid and there is no opportunity to come into contact with air, there is no risk of the electrode surface being oxidized even when melted. In addition, performing melting treatment in a liquid means that the specific gravity of the high-boiling-point liquid that is in contact with the melt (low-melting point metal, low-melting point alloy, etc.) is higher than that of air,
Moreover, since the viscosity is large, pressure is applied to the molten metal from the surroundings, the surface state of the molten metal becomes a smooth surface without waviness, and the thickness can be made uniform. It should be noted that by using a liquid having a flux function such as oil such as natural plant oil or glycerin as the high boiling point liquid, the flux becomes unnecessary, which simplifies the equipment and also cleans the treated chip parts. It will be very easy.

As described above, in the electrode treatment apparatus previously proposed by the present inventor, the drawbacks of the conventional apparatus are largely solved, but in order to take out the treated chip parts, the belt is put into the high boiling point liquid. Therefore, it is necessary to specially devise the selection of belt material, the structure of the belt, the structure of the driving unit for driving the belt, the method of transferring the processed chip parts to the container, and the like.

The present invention solves the problems of the electrode part of the chip component as described above, reduces the surface area of the electrode part of the chip component, and further smoothes it to improve solder wettability and long-term storage reliability of soldering. It is a first object to provide an electrode processing device capable of improving the property. The second object of the present invention is to solve the problems of the conventionally known electrode processing apparatus, to eliminate mechanically moving parts, and to insert chip parts without aligning them, but at the time of melting. Without the electrode parts of the chip parts sticking together,
The purpose of the present invention is to enable melt processing, control the melting temperature accurately, and perform electrode processing of chip parts with good mass productivity without using flux. Further, a third object of the present invention is to eliminate the drawbacks of the electrode treatment apparatus previously proposed by the present inventor, namely, the problems associated with the belt used to take out the treated chip component, and An object of the present invention is to provide a device that can be easily taken out.

Means for Solving the Problems In order to solve the above problems, the present invention is to fill the inside with a high boiling point liquid such as oil, and the outermost layer of one of the electrode parts is a low melting point metal or a low melting point alloy. S-shaped cylindrical container having a charging part for charging a chip component having a film or layer made of, and one end of the S-shaped cylindrical container so that the high boiling point liquid has a temperature gradient. And a magnet provided so as to be movable along the outer wall of the S-shaped cylindrical container, and
The other end of the V-shaped cylindrical container is an opening, and this opening is used to take out the processed chip parts accumulated at the bottom of the S-shaped cylindrical container to the outside by using the magnet. It is designed to be a mouth. In a preferred embodiment, the high boiling point liquid is a natural vegetable oil,
It is made of any one of natural animal oil, natural mineral oil, synthetic silicone oil and glycerin.

Operation According to this configuration, the film or layer made of a low melting point metal (low melting point alloy) is melted on the high temperature side of the high boiling point liquid in the container and is cooled on the low temperature side. It works, the surface area is small, and it becomes high by cooling in this state. Further, since it is melted and cooled in the high boiling point liquid and there is no opportunity to come into contact with air, there is no concern that the surface of the electrode portion will be oxidized even when melted. In addition, performing melting treatment in a liquid means that the high-boiling-point liquid that is in contact with the melt (low-melting point metal, low-melting point alloy, etc.) has a higher specific gravity and higher viscosity than air. Therefore, pressure is applied to the molten metal from the surroundings, the surface state of the molten metal becomes a smooth surface without waviness, and the thickness can be made uniform. It should be noted that by using a liquid having a flux function such as oil such as natural plant oil or glycerin as the high boiling point liquid, the flux becomes unnecessary, which simplifies the equipment and also cleans the treated chip parts. It will be very easy. Further, since the tubular container is S-shaped and the low temperature part outlet can be always directed downward in the open state, when the electrode-treated chip component is taken out, the liquid surface of the high boiling point liquid is not changed, Moreover, the high boiling point liquid can be continuously taken out without being mixed with air, regardless of the timing of inputting the chip parts. Further, it is not necessary to insert a belt to take out the treated chip parts into the high boiling point liquid, and the structure is simple.

Embodiment An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a schematic configuration diagram showing an example of an electrode processing apparatus for chip parts according to the present invention.

In FIG. 1, reference numeral 7 is a chip component having the structure shown in FIG. 2, and the same reference numerals as those in FIGS. 28 is, for example, a glass S-shaped cylindrical container having a height of 200 cm and an outer diameter of about 10 cm from the inlet side to the outlet side of the chip component 7, and is installed vertically in this case. There is. 29 is coconut oil which is a natural vegetable oil contained in the container 28, 30 is a heater such as a mantle heater provided on the outer periphery of the upper portion of the S-shaped cylindrical container 28, 31 is the S-shaped -Shaped opening 32 of cylindrical container 28
This is a parts feeder for putting the chip parts 7 into the container 28.

Reference numeral 33 denotes a divisible ring-shaped permanent magnet that can be moved along the outer wall of the S-shaped cylindrical container 28 from the bottom blow to the outlet side (when an electromagnet is used,
(It may not be divided), and the magnet 33 is connected to the bottom portion A.
To the point, the chip component 34 which has been subjected to the electrode treatment is adsorbed to the inner wall of the S-shaped cylindrical container 28, and left for a while at the upper point B apart from the low temperature side coconut oil liquid surface 35 for treatment. The coconut oil 29 adhering to the finished chip component 34 is collected toward the coconut oil liquid surface 35 on the coldest side as much as possible, then moved to the upper point C of the outlet opening 36, and at the point C The permanent magnet 33 is divided and can be separated from the outer wall of the S-shaped cylindrical container 28. Then, the processed chip component 34 falls into the container 37 and is taken out. Further, 38 is a high temperature side coconut oil liquid level.

Next, a method of treating the surface of the electrode part of the chip part 7 using the apparatus shown in FIG. 1 will be described. First, at the stage of performing the electrode treatment, the upper portion of the glass S-shaped cylindrical container 28 is heated to 250 to 280 ° C. by the heater 30. At this time, since the coconut oil 29 is contained inside the S-shaped cylindrical container 28, the coconut oil 29 is heated to 250 to 280 ° C. The heated coconut oil 29 has a small specific gravity, and does not convection to the low temperature portion having a large specific gravity at the lower portion, but causes convection only by the above. Therefore, the coconut oil 29 in the S-shaped cylindrical container 28 has a temperature gradient from a high temperature state to a low temperature state from the upper part to the lower part, and the bottom part side can keep the room temperature. When you are ready for the above, coconut oil 2
The chip component 7 is loaded from the parts feeder 31 into the S-shaped cylindrical container 28 through the upper surface opening 32 above the high temperature palm oil liquid surface 38 of 9. Here, the chip component 7 used in this embodiment is a rectangular plate type chip resistor, and the structure of the electrode part is
The bottom layer is Ag-Pd, and the intermediate layer is a Ni outermost layer (low melting point metal plating film) having an electroplating film of Sn: Pb = 60: 40 and a thickness of 7 to 10 μm. The melting point of the outermost layer material is 180 to 190 ° C.

Then, insert the chip component 7 having the above specifications into the parts feeder 31.
Is used to drop into the high temperature palm oil level 38 heated at a rate of 250 pieces / minute. As a result, the chip component 7 hits the liquid surface 38 of the high temperature palm oil and drops in the palm oil 29. At this time, due to the friction between the coconut oil 29 and the chip component 7, the chip components 7 fall in the state of being individually separated, and
The Sn-Pb alloy plating film, which is the outermost layer of the electrode, is melted in the high temperature portion heated to 50 to 280 ° C and drops into the low temperature portion having a temperature gradient, and the temperature of the coconut oil 29 is almost constant. 1
The molten portion is solidified from the time when it passes through the portion where the temperature becomes 80 ° C. or less, and it accumulates at the point A on the bottom side in the S-shaped cylindrical container 28 as a treated chip component 34 having an electrode with a smooth surface. . At this time, since the bottom of the S-shaped cylindrical container 28 is at room temperature, there is no concern that the electrodes will stick to each other even if the processed chip parts 34 come into contact with each other. Then, in order to take out the chip component 34 after the electrode surface treatment, the ring-shaped permanent magnet 33 is moved to the point A, and the magnetic force causes the electrode-treated chip component 34 to be attracted to the inner wall of the S-shaped cylindrical container 28. In that state, the coconut oil 29 adhering to the processed chip component 34 is separated and dropped as much as possible by moving it to an upper point B of the low temperature coconut oil liquid surface 35 and stopping at the point B for a while. After that, the permanent magnet 33 is moved to the upper point C of the outlet opening 36, the permanent magnet 33 is divided at the point C, and the permanent magnet 33 is separated from the outer wall of the S-shaped cylindrical container 28, the magnet weakens, and the treated chip The component 34 drops into the container 37 through the outlet opening 36, and the removal is completed. By repeating this process, continuous take-out work can be performed without being affected by charging.

In this way, the low melting metal plating film of the chip component 7 is melted. Further, the processed chip component 34 taken out becomes a finished product only by washing it thereafter.

According to this electrode treatment device, the coconut oil 29 rarely flows out, and the liquid surfaces 35 and 38 in the S-shaped cylindrical container 28 are hardly changed.

Here, in the above-mentioned one embodiment, the case where coconut oil which is a natural vegetable oil is used as the high boiling point liquid has been explained. However, other than this, natural animal oil, natural favorite oil, synthetic silicone oil are used. Materials that have the effect of flux such as oil or glycerin can be used as those that have the same effect. Furthermore, not only these materials but also the melt (low melting point metal film) of the electrode part of the chip component Any high boiling point liquid having a boiling point higher than the melting point can be used. Also, an embodiment in which a mantle heater or the like is installed as a heater on the upper outer periphery of an S-shaped cylindrical container has been described. This is a sealed sheathed heater provided inside the upper part of the S-shaped cylindrical container. The higher boiling point liquid may be heated.

The outermost layer of the electrode part of the chip component to be melted in the device of the present invention is not limited to the low melting point metal plating film (low melting point alloy plating film) formed by electroplating or chemical plating, and it may be sprayed or vapor deposited. It does not matter even if it is a low melting point metal film (low melting point alloy film) formed by the above. In addition to the solder of the above-described embodiment, tin, which is commonly used, and lead can be used as the material for forming the low melting point metal film (low melting point alloy film).

The melting point of the low melting point metal film (low melting point alloy film) is 100.
˜550 ° C., and the film thickness is preferably 1 μm or more.
First, if the melting point is less than 100 ° C, after soldering,
The refractory metal film may melt due to self-heating during use of the component, and if it exceeds 550 ° C, the low antibody or the coating film may be destroyed, and the performance as a chip component may not be maintained. . When the film thickness is less than 1 μm,
A uniform film cannot be formed after the heat treatment, the reliability of soldering at the time of mounting is deteriorated, and it may be oxidized during storage. It has been confirmed by experiments that the thickness is 8 to 15 μm, which makes soldering very easy.

Further, the electrode treatment apparatus according to the present invention has a solderable metal film or alloy film of iron, magnetic alloy, or the like, and has a layer obtained by applying a low melting point metal paste or a low melting point alloy paste to the outermost layer and drying it. It can also be applied to chip parts. In this case, the melting point of the solderable metal film (alloy film) as the underlayer is, of course, higher than the melting point of the high boiling point liquid. Then, when the chip component having the outermost layer having a layer obtained by applying and drying this low melting point metal (low melting point alloy) paste is subjected to electrode treatment by the device of the present invention, the layer formed by the low melting point metal (low melting point alloy) paste is electrically conductive. From what is composed of plating film and chemical plating film,
This is advantageous in making the thickness related to soldering reliability thick and uniform. Also, cracks are usually contained in the low melting point metal (low melting point alloy) paste,
This flux dissolves in the high boiling point liquid when it melts,
It does not seize and does not hinder the effect. In the chip component having this structure, the thickness of the layer made of the low melting point metal (low melting point alloy) paste is preferably 3 μm or more in the dry state, and particularly 25 to 10
A thickness of 0 μm is suitable.

EFFECTS OF THE INVENTION As described above, the electrode processing apparatus for a chip component according to the present invention is configured and has many characteristics. First, a film or layer made of a low melting point metal (low melting point alloy) is melted on the high temperature side of the high boiling point liquid in the container,
Since it is cooled on the low temperature side, surface tension works during melting,
The surface area is small, and by cooling in this state, the surface area is much smaller than that of a low melting point metal film (low melting point alloy film) formed of a plating film, etc., and the surface is smooth. As a result, it is possible to obtain a chip component that has extremely little foreign matter or gas adsorption during storage. In addition, since foreign substances and gases that have been adsorbed and occluded on the surface or inside the hollows during melting are also released,
The outermost film itself is also a clean film containing no impurities, and a chip component having improved solder wettability and soldering reliability can be obtained. And as electrode treatment,
Since the chip component only moves from the high temperature side to the low temperature side in the high boiling point liquid, the operation can be easily performed without using complicated equipment. In addition, since the melting and cooling are performed in the high boiling point liquid and the electrodes of the chip parts do not stick to each other on the low temperature side, the chip parts are not aligned during the electrode treatment, and a large amount of them are scattered. It can be processed simply by throwing it in and the heating and cooling can be completed in a short time because the chip parts are in contact with the liquid, so that the mass productivity becomes very high. Further, since it is melted and cooled in the high boiling point liquid and there is no opportunity to come into contact with air, there is no concern that the surface of the electrode portion will be oxidized even when melted. In addition, performing melting treatment in a liquid means that the high-boiling-point liquid that is in contact with the melt (low-melting point metal, low-melting point alloy, etc.) has a higher specific gravity and higher viscosity than air. Therefore, pressure is applied to the molten metal from the surroundings, the surface state of the molten metal becomes a smooth surface without waviness, and the thickness can be made uniform. By using a liquid having a flux function such as oil such as natural plant oil or glycerin as the high-melting point liquid, the flux becomes unnecessary, which simplifies the equipment and cleans the treated chip parts. It will be very easy.

Furthermore, the effects of the present invention are listed below.

Since the chip parts can be put in without being aligned, they can be processed by the same equipment regardless of the size of the chip parts. It is also possible to mix and process chip parts having different sizes.

Since it can be processed without using flux, the chip parts can be easily cleaned, and there is no burning of the flux, resulting in a clean product.

Since the heat medium is a high-boiling liquid, temperature control is also highly accurate, and because the high-boiling liquid and the chip parts are in contact with each other, heat conduction is fast, melting and solidification can be done in a short time, and the melting process is reliable. It is highly likely. That is, there is no melting failure.

Since the high-boiling-point liquid has a temperature gradient, the processed chip parts can be accumulated in a pile at a low temperature part at a time and can be taken out all at once, and the taking-out work can be greatly simplified.

By selecting the type or specific gravity of the high boiling point liquid, the passage time of the chip component in the liquid can be changed. Further, since the specific gravity is changed by changing the temperature gradient of the high boiling point liquid, the passage time of the chip component in the liquid can be changed as well. This makes it possible to easily cope with the change in the type or size of the film or layer made of the low melting point metal or the low melting point alloy of the chip component.

Since there are few mechanically moving parts and there are no moving parts, especially in high boiling point liquids, it can be said that there is no equipment failure and the operating rate is dramatically improved.

Since it is an S-shaped cylindrical container, there is little drop in the liquid level due to the carry-out of high boiling point liquid when taking out the processed chip parts,
Moreover, the high boiling point liquid can be continuously taken out without being mixed with air, regardless of the timing of loading the chip parts.

In addition, even when the liquid level drops, high boiling point liquid can be replenished from the opening side of the low temperature part at room temperature, continuous processing is possible without temporarily stopping the electrode processing, quality stabilization and mass production. Suitable for sex.

When an electromagnet is used as the magnet, the electrode-treated chip parts can be taken out from the outer wall of the S-shaped cylindrical container without separating the magnet and only by cutting off the current, which simplifies the equipment.

Since the processed chip parts are taken out by using the magnet, it is not necessary to insert a belt for taking out the processed chip parts into the high boiling point liquid, and the structure is simplified.

[Brief description of drawings]

FIG. 1 is a schematic configuration diagram showing an embodiment of an electrode treatment device for chip parts according to the present invention, FIG. 2 is a sectional view showing a square plate type chip resistor which is a kind of chip parts, and FIG. FIG. 4 is a schematic configuration diagram showing an example of an apparatus for performing the electrode treatment of the chip component, which has been proposed, and FIG. 4 is a schematic configuration diagram of the electrode treatment apparatus for the chip component previously proposed by the present inventor. 1 ... Insulating substrate, 2 ... Resistor, 3 ... Silver-based electrode film, 4
...... Nickel film, 5 ...... Solder film, 6 ...... Glass coating film, 7 ...... Chip parts, 28 ...... S-shaped cylindrical container, 2
9 ... Palm oil (high boiling point liquid), 30 ... Heater, 31 ...
... Burts feeder, 32 ... Top opening, 33 ... Magnet (ring-shaped permanent magnet), 34 ... Processed chip parts, 3
5: low temperature part palm oil level, 36: outlet opening, 37
…… Container, 38 …… High temperature palm oil level.

Claims (3)

[Claims] 1. A high boiling point liquid such as oil is filled inside,
And an S-shaped cylindrical container having a charging part for charging a chip part having a film or layer made of a low melting point metal or a low melting point alloy at the outermost layer of the electrode part at one end, and the above high boiling point liquid A heater arranged at one end of the S-shaped cylindrical container so as to have a temperature gradient, and a magnet provided so as to be movable along the outer wall of the S-shaped cylindrical container. And the other end of the S-shaped cylindrical container is an opening, and the opening is a processed chip component accumulated at the bottom of the S-shaped cylindrical container. An electrode treatment device for chip parts, which is configured to take out to the outside by using. 2. The chip according to claim 1, wherein the high-boiling liquid is any one of natural vegetable oil, natural animal oil, natural mineral oil, synthetic silicone oil or glycerin. Electrode treatment equipment for parts. 3. An electrode processing apparatus for a chip component according to claim 1, wherein a mantle heater which is externally heated or a hermetically sealed sheathed heater which is internally heated is used as the heater.