JPH0618147B2 - Electronic parts - Google Patents
Electronic partsInfo
- Publication number
- JPH0618147B2 JPH0618147B2 JP15239091A JP15239091A JPH0618147B2 JP H0618147 B2 JPH0618147 B2 JP H0618147B2 JP 15239091 A JP15239091 A JP 15239091A JP 15239091 A JP15239091 A JP 15239091A JP H0618147 B2 JPH0618147 B2 JP H0618147B2
- Authority
- JP
- Japan
- Prior art keywords
- main body
- electrode
- lid
- electronic component
- base substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 claims description 17
- 239000011810 insulating material Substances 0.000 claims description 5
- 239000002184 metal Substances 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000007688 edging Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
Description
【0001】[0001]
【産業上の利用分野】本発明は、電子回路に用いられる
電子部品に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to electronic components used in electronic circuits.
【0002】[0002]
【従来の技術】従来の電子部品、例えば抵抗部品のよう
なものは、抵抗素子の両端部にリード線を設けておき、
予め用意されたプリント基板の所定位置に設けられた小
孔内に、前記リード線を挿通させ、かつ半田付けによっ
て溶着し、残ったリード線を切り落すなどして構成して
いた。2. Description of the Related Art Conventional electronic parts, such as resistance parts, are provided with lead wires at both ends of a resistance element.
The lead wire is inserted into a small hole provided in a predetermined position of a printed circuit board prepared in advance, and is welded by soldering, and the remaining lead wire is cut off.
【0003】[0003]
【発明が解決しようとする課題】しかしながら、上述し
た従来の技術では部品の取付けに、半田付けを行うた
め、多くの時間と労力を費し、且つ部品の接点となるプ
リント基板上の面積が例えば1〜4mm2 に過ぎず、加
えて中央に挿通孔を設けるため、ほぼ0.5〜3mm2
となり、折角溶着した部品でも急激な力が加わると基板
から剥離したり、基板そのものを破損させることがあっ
た。However, in the above-mentioned conventional technique, since soldering is performed for mounting the parts, much time and labor are consumed, and the area on the printed circuit board which is the contact point of the parts is, for example, large. It is only 1 to 4 mm 2 , and in addition, since it has an insertion hole in the center, it is approximately 0.5 to 3 mm 2.
Therefore, even if the parts are welded at a certain angle, they may be peeled from the substrate or the substrate itself may be damaged if a sudden force is applied.
【0004】本発明は、上記事情に鑑みてなされたもの
で、その目的とするところは、部品を基板の小孔に挿通
させて半田付けをせず、また、基板から剥離されること
もなく基板を補強するとともに、取付取扱が容易で、且
つ小型化可能な電子部品を提供しようとするものであ
る。The present invention has been made in view of the above circumstances. An object of the present invention is not to insert a component into a small hole of a substrate for soldering and to prevent the component from being separated from the substrate. The present invention intends to provide an electronic component that reinforces a board, is easy to mount and handle, and can be downsized.
【0005】[0005]
【課題を解決するための手段】上記目的を達成するた
め、本発明の電子部品は、開放口を有する有底ほぼ箱状
の本体の前記開放口に蓋部が嵌合される、絶縁性材料で
形成された筐体構造からなり、本体の周囲にリブ状の凸
部を設け、本体内部に素子を配設したベース基板を収納
し、このベース基板の両端部に前記蓋部の上面に突出す
る内部電極を設け、この内部電極の蓋部に表出する面に
前記凸部と略同じ高さの電極部を設け、前記本体と蓋部
とを超音波溶着させた構成としたものである。In order to achieve the above object, the electronic component of the present invention is an insulating material in which a lid portion is fitted into the open mouth of a box-like body having an open mouth. It is composed of a housing structure, and is provided with rib-shaped protrusions around the main body, and accommodates a base substrate in which elements are arranged inside the main body, and both ends of the base substrate project to the upper surface of the lid portion. The internal electrode is provided, and an electrode portion having substantially the same height as the convex portion is provided on the surface of the internal electrode exposed on the lid portion, and the main body and the lid portion are ultrasonically welded to each other. .
【0006】[0006]
【作用】上記のように構成された本発明の電子部品1は
蓋部3と本体2とを超音波によって容易に一体化でき、
このとき内部素子も固定してしまい、また、このように
して作成された電子部品1は、超音波溶着可能な材質に
よって作成されたプリント基板16の所定位置に、電極
部14を端子面間に合わせて被せて超音波振動を加える
と、電極部14は端子面に溶接され、また本体2のリブ
状の凸部8はプリント基板16に溶着され一体化するた
め、この電子部品1はプリント基板16から剥離される
ことなく電気的に導通され、筐体4はプリント基板16
上に確実に溶着されることからプリント基板を補強する
こともできる。In the electronic component 1 of the present invention configured as described above, the lid portion 3 and the main body 2 can be easily integrated by ultrasonic waves,
At this time, the internal element is also fixed, and the electronic component 1 thus produced has the electrode portion 14 aligned between the terminal surfaces at a predetermined position of the printed board 16 made of a material capable of ultrasonic welding. When covered with ultrasonic vibration, the electrode portion 14 is welded to the terminal surface, and the rib-shaped convex portion 8 of the main body 2 is welded to and integrated with the printed circuit board 16. The casing 4 is electrically connected to the printed circuit board 16 without being peeled off.
The printed circuit board can also be reinforced because it is reliably welded on.
【0007】また、収納されるベース基板11に各種電
子部品用の素子の複数個を積層させることによって種々
の電子部品を構成することが可能となり、また、取付面
積も狭少とすることができ、小型化可能である。Further, by stacking a plurality of elements for various electronic components on the base substrate 11 to be housed, various electronic components can be constructed, and the mounting area can be reduced. , Can be miniaturized.
【0008】[0008]
【実施例】以下、本発明の一実施例を図1ないし図6に
よって説明する。図1において1は電子部品で、この電
子部品1を例えば抵抗電子部品として説明する。この電
子部品1は、例えば有底ほぼ箱状の本体2とそれに冠着
される蓋部3とで形成された筐体4内に各種の素子を適
宜選択して収納構成される。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. In FIG. 1, reference numeral 1 is an electronic component, and the electronic component 1 will be described as a resistance electronic component, for example. The electronic component 1 is constructed by appropriately selecting various elements in a housing 4 formed of, for example, a main body 2 having a substantially box-like bottom and a lid portion 3 attached to the main body 2.
【0009】すなわち、本体2は超音波溶着可能な絶縁
性材料で形成された薄型用容器で、図の上面は開放口5
をなし、この開放近辺の壁部内側には後述する蓋部3を
嵌合係止する段差部6が設けてあり、この内側に突出し
た段差部6により蓋部3は本体2内に落ち込まないよう
になっている。この段差部6の下方は後述する電子素子
7を収納するに十分な空間を形成してある。That is, the main body 2 is a thin container made of an insulating material which can be ultrasonically welded, and the upper surface of the figure has an opening 5
A step portion 6 for fitting and locking a lid portion 3 described later is provided inside the wall portion near the opening, and the lid portion 3 does not fall into the main body 2 due to the step portion 6 protruding inward. It is like this. Below the stepped portion 6, a sufficient space is formed to accommodate an electronic element 7 described later.
【0010】この本体2の前記開放口5を区画形成する
壁部の上面には、開放口5を囲むリブ状の凸部8が設け
てある。この凸部8は本体2の成型時に一体成形された
もので、その断面は略台形状をなしている。これはまた
台形に限るものではなく、その他先端方向が稍細く形成
された半円状のものであってもよい。A rib-shaped convex portion 8 surrounding the opening 5 is provided on the upper surface of the wall of the main body 2 that defines the opening 5. This convex portion 8 is integrally molded when the main body 2 is molded, and its cross section has a substantially trapezoidal shape. The shape is not limited to the trapezoid, and may be a semicircular shape in which the tip direction is finely formed.
【0011】蓋部3は本体2の前記開放口5内に隙間な
く嵌合される薄板状部材で、本体2と同じ超音波溶着可
能な絶縁性材料で形成されており、内部に収納される電
子素子7の内部電極9を挿通する電極取出孔10が設け
てある。The lid portion 3 is a thin plate-like member which is fitted into the opening 5 of the main body 2 without a gap, is made of the same ultrasonically weldable insulating material as the main body 2, and is housed inside. An electrode lead-out hole 10 for inserting the internal electrode 9 of the electronic element 7 is provided.
【0012】電子素子7は、例えばガラスチップもしく
はセラミック等で形成されたベース基板11と、このベ
ース基板11の両端部に設けられた内部電極9と、これ
らの内部電極9に導通されベース基板11上に設けられ
た電子部品用の素子12(この実施例においては抵抗素
子)より構成されており、内部電極9の一方に印加され
た電流を反対側の電極から取出せるように構成してあ
る。The electronic element 7 includes a base substrate 11 formed of, for example, a glass chip or ceramics, internal electrodes 9 provided at both ends of the base substrate 11, and a base substrate 11 electrically connected to the internal electrodes 9. It is composed of an element 12 (resistive element in this embodiment) for an electronic component provided above, and is configured so that the current applied to one of the internal electrodes 9 can be taken out from the opposite electrode. .
【0013】この電子素子7に用いられている内部電極
9は例えば柱状の導体金属で、低部には端子片13が突
出され素子12と接触されるようになっており、内部電
極9の頭部には本体2の上部端面に設けたリブ状の凸部
8とほぼ同じ高さに形成されたリブ状の電極部14が設
けてある。この電極部14は図1には図示していないプ
リント基板上の端子部に接触される。The internal electrode 9 used in the electronic element 7 is, for example, a columnar conductive metal, and the terminal piece 13 is projected at the lower portion so as to come into contact with the element 12. The portion is provided with a rib-shaped electrode portion 14 formed at substantially the same height as the rib-shaped convex portion 8 provided on the upper end surface of the main body 2. The electrode portion 14 is brought into contact with a terminal portion on the printed board which is not shown in FIG.
【0014】この内部電極9は図2に示すように、薄板
金属を略L字状に折曲し、上面側に電極部14を形成さ
せたものでもよく、また図3に示すように、上面外側部
分を下方に折曲してその折曲した先端を本体2の段差部
6上に当接するように突出部15を形成したものでもよ
い。この突出部15は図1に示した柱状の導体金属のも
のにあっては、図4に示すように、一部にスリワリを設
けて薄板金属を挟んだものでもよい。As shown in FIG. 2, the internal electrode 9 may be formed by bending a thin metal into a substantially L-shape and forming the electrode portion 14 on the upper surface side. As shown in FIG. It is also possible to bend the outer portion downward and form the protruding portion 15 so that the bent front end abuts on the stepped portion 6 of the main body 2. In the case of the columnar conductive metal shown in FIG. 1, the protruding portion 15 may be one in which a slivers are provided and a thin sheet metal is sandwiched, as shown in FIG.
【0015】このような突出部15を内部電極9に設け
ることにより、図1の本体2に蓋部3を嵌合させたとき
内部電極9は確実に固定される。By providing such a protrusion 15 on the internal electrode 9, the internal electrode 9 is securely fixed when the lid 3 is fitted to the main body 2 of FIG.
【0016】上記のように構成された電子部品1は、筐
体4の本体2内に内部電極9と素子13とを取付けた電
子素子7のベース基板11側を底側にして収納し、蓋部
3を本体2の開放口5内に嵌合すると、蓋部3の上面に
は内部電極9の電極部14が突出する。この状態で本体
2の底部と蓋部3上に周知構造の超音波溶接のホーン
(図示せず)を圧接させて超音波振動を加えると、本体
2と蓋部3とは溶着されて一体化され、電子部品1が成
形される。The electronic component 1 constructed as described above is housed in the main body 2 of the housing 4 with the base plate 11 side of the electronic element 7 having the internal electrode 9 and the element 13 attached to the bottom side, and the lid. When the portion 3 is fitted into the opening 5 of the main body 2, the electrode portion 14 of the internal electrode 9 projects from the upper surface of the lid portion 3. In this state, when the ultrasonic welding horn (not shown) having a well-known structure is pressed against the bottom portion of the main body 2 and the lid portion 3 to apply ultrasonic vibration, the main body 2 and the lid portion 3 are welded and integrated. Then, the electronic component 1 is molded.
【0017】この電子部品1を図5に示すようにプリン
ト基板16の所定位置に配設する。この場合、プリント
基板16には本体2の凸部8と内部電極上の電極部14
とを収納するための空間部17が設けてあって、本体2
の端面の外周はプリント基板16上に密接する。The electronic component 1 is arranged at a predetermined position on the printed board 16 as shown in FIG. In this case, the printed circuit board 16 includes the convex portion 8 of the main body 2 and the electrode portion 14 on the internal electrode.
A space 17 for accommodating the
The outer circumference of the end face of the is closely contacted with the printed circuit board 16.
【0018】この状態で本体2とプリント基板16に対
し、接合したい部分に、同様にして超音波振動を加える
と、本体2の凸部8とプリント基板16とは溶着され、
電極部14はプリント基板16上の予めエッシング等に
よって形成されている端子部に溶接される。このとき、
前記空間部17は殆んど真空状態で溶着されるので、温
度や化学薬品等によって電極が侵されることはなく、ま
た、取付部品等の位置決めも行われる特徴がある。In this state, when ultrasonic vibration is similarly applied to the portion to be joined to the main body 2 and the printed circuit board 16, the convex portion 8 of the main body 2 and the printed circuit board 16 are welded,
The electrode portion 14 is welded to a terminal portion formed on the printed board 16 in advance by edging or the like. At this time,
Since the space 17 is welded in a vacuum state, the electrodes are not attacked by temperature or chemicals, and the mounting parts are positioned.
【0019】図6は電子部品1の素子としてコンデンサ
ーを適用した例である。この場合、例えばセラミックの
誘電体をベース基板11として用い、その上面に絶縁性
の膜18を数段に亘って設け、この積層体の両端部に電
極板19を設けるなどして構成し、この電極板19の一
部に電極凸部(図示せず)を設けて前記したような筐体
4内に収納し超音波溶着を施せばよい。FIG. 6 shows an example in which a capacitor is applied as an element of the electronic component 1. In this case, for example, a ceramic dielectric is used as the base substrate 11, an insulating film 18 is provided on the upper surface of the base substrate 11 in several stages, and electrode plates 19 are provided at both ends of the laminated body. Electrode protrusions (not shown) may be provided on a part of the electrode plate 19, and the electrode plate 19 may be housed in the housing 4 as described above and subjected to ultrasonic welding.
【0020】なお、本発明の電子部品は上記の実施例に
限るものではなく、IC回路による電子部品にも適用可
能であり、その他適宜の設計変更によりその他の態様で
も実施することが可能である。The electronic component of the present invention is not limited to the above-described embodiment, but can be applied to an electronic component having an IC circuit, and can be implemented in other modes by appropriate design changes. .
【0021】[0021]
【発明の効果】以上説明したように本発明の電子部品
は、開放口5を有する本体2の前記開放口5に蓋部3が
嵌合される、絶縁性材料で形成された筐体4からなり、
本体2の周囲にリブ状の凸部8を設け、また、本体2内
部に素子12を配設したベース基板11を収納し、この
ベース基板11の両端部に前記蓋部3の上面に突出する
内部電極9を設け、この内部電極9の蓋部3に表出する
面に前記凸部8と略同じ高さの電極部14を突設し、前
記本体2と蓋部3とを超音波溶着させて一体化するよう
にしたので、部品をプリント基板の小孔に挿通させて半
田付けによる工程を削除することが可能となり、また、
プリント基板16に実装する場合、その所定位置に電極
部14を端子面に合わせて被せ、接合箇所に超音波振動
を加えるだけでリブ状の凸部8はプリント基板16に溶
着され、電極部14もプリント基板16上に予め形成さ
れた端子面に溶接されて剥離されることなく、プリント
基板16は補強されるとともに、電子部品の作成や取付
取扱が容易となり、且つその小型化を図ることが可能と
なる利点がある。As described above, according to the electronic component of the present invention, the body 4 having the opening 5 has the housing 5 formed of the insulating material, into which the lid 3 is fitted. Becomes
A rib-shaped convex portion 8 is provided around the main body 2, and a base substrate 11 in which an element 12 is arranged is housed inside the main body 2, and both ends of the base substrate 11 project to the upper surface of the lid portion 3. An internal electrode 9 is provided, and an electrode portion 14 having substantially the same height as the convex portion 8 is provided on the surface of the internal electrode 9 exposed on the lid portion 3 by ultrasonic welding of the main body 2 and the lid portion 3. Since it is made to be integrated, it becomes possible to insert the component into the small hole of the printed circuit board and eliminate the step of soldering.
When mounting on the printed circuit board 16, the rib-shaped convex portion 8 is welded to the printed circuit board 16 only by covering the predetermined position with the electrode portion 14 in conformity with the terminal surface and applying ultrasonic vibration to the joint portion. Also, the printed circuit board 16 is reinforced without being welded to the terminal surface formed in advance on the printed circuit board 16 and peeled off, and the electronic parts can be easily manufactured and mounted and handled, and the size thereof can be reduced. There is an advantage that becomes possible.
【図1】本発明の一実施例の電子部品の断面図である。FIG. 1 is a cross-sectional view of an electronic component according to an embodiment of the present invention.
【図2】電子部品に用いられる内部電極の側面図であ
る。FIG. 2 is a side view of internal electrodes used for an electronic component.
【図3】内部電極の別の実施例の側面図である。FIG. 3 is a side view of another embodiment of the internal electrode.
【図4】内部電極の他の実施例の側面図である。FIG. 4 is a side view of another embodiment of the internal electrode.
【図5】電子部品装着時の側面一部断面図である。FIG. 5 is a partial side sectional view of the electronic component when mounted.
【図6】本発明の他の実施例の電子素子の断面図であ
る。FIG. 6 is a sectional view of an electronic device according to another embodiment of the present invention.
1 電子部品 2 本体 3 蓋部 4 筐体 5 開放口 7 電子素子 8 溝状凸部 9 内部電極 11 ベース基板 12 素子 14 電極部 15 突出部 16 プリント基板 DESCRIPTION OF SYMBOLS 1 Electronic component 2 Main body 3 Lid part 4 Housing 5 Opening port 7 Electronic element 8 Groove-shaped convex part 9 Internal electrode 11 Base substrate 12 Element 14 Electrode part 15 Projection part 16 Printed circuit board
Claims (1)
の前記開放口5に蓋部3が嵌合される、絶縁性材料で形
成された筐体で4構造からなり、本体2の周囲上面にリ
ブ状の凸部8を設け、かつ本体2内部に素子12を配設
したベース基板11を収納し、このベース基板11の両
端部に前記蓋部3の上面に突出する内部電極9を設け、
この内部電極9の蓋部3に表出する面に前記凸部8と略
同じ高さの電極部14を設け、前記本体2と蓋部3とを
超音波溶着させ一体化してなることを特徴とした電子部
品。1. A body 2 having a bottom and a substantially box shape having an opening 5.
The lid 3 is fitted into the opening 5, and is made of an insulating material and has a four-structured structure. A rib-shaped convex portion 8 is provided on the upper surface of the main body 2 and the inside of the main body 2 is provided. The base substrate 11 on which the element 12 is arranged is housed, and the internal electrodes 9 projecting from the upper surface of the lid 3 are provided at both ends of the base substrate 11.
An electrode portion 14 having substantially the same height as that of the convex portion 8 is provided on the surface of the internal electrode 9 exposed on the lid portion 3, and the main body 2 and the lid portion 3 are ultrasonically welded and integrated. And electronic components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15239091A JPH0618147B2 (en) | 1991-05-28 | 1991-05-28 | Electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15239091A JPH0618147B2 (en) | 1991-05-28 | 1991-05-28 | Electronic parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04350916A JPH04350916A (en) | 1992-12-04 |
| JPH0618147B2 true JPH0618147B2 (en) | 1994-03-09 |
Family
ID=15539472
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15239091A Expired - Fee Related JPH0618147B2 (en) | 1991-05-28 | 1991-05-28 | Electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0618147B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2652524B2 (en) * | 1994-10-19 | 1997-09-10 | 株式会社エーユーイー研究所 | Method of assembling electronic circuit and electronic circuit thereof |
| JP6475830B2 (en) * | 2015-05-29 | 2019-02-27 | アルプスアルパイン株式会社 | Electronic equipment |
-
1991
- 1991-05-28 JP JP15239091A patent/JPH0618147B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04350916A (en) | 1992-12-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH10321407A (en) | Surface mount electronic components | |
| US5394479A (en) | Sounding apparatus with surface mounting terminals | |
| JP2001217148A (en) | Chip type aluminum electrolytic capacitor | |
| JPH0618147B2 (en) | Electronic parts | |
| JPH0149047B2 (en) | ||
| JP3500294B2 (en) | Shield structure | |
| JP2004031787A (en) | Surface mount type electronic device | |
| JP3662785B2 (en) | Electronic equipment | |
| JP4213820B2 (en) | Electronic components | |
| JP3365299B2 (en) | Terminal fixing structure for electronic components | |
| JPH05340962A (en) | Capacitance type acceleration sensor | |
| JP4218912B2 (en) | Electronic components | |
| CN114125670B (en) | Piezoelectric sounder | |
| JP2000036713A (en) | Piezoelectric oscillator | |
| JPH0132478Y2 (en) | ||
| JPH09162077A (en) | Electronic components | |
| JPH10242757A (en) | Oscillator and its manufacture | |
| JP6956022B2 (en) | Wiring boards, electronic devices and electronic modules | |
| JP2564164Y2 (en) | Electronic device case | |
| JP2955570B1 (en) | Electronic component housing | |
| JP3487355B2 (en) | Piezoelectric oscillator | |
| JPH1155060A (en) | Piezoelectric oscillator | |
| JPH06217392A (en) | Terminal structure for surface mount type electronic component | |
| JPH0733025U (en) | Electronic components with insulating plate | |
| JP3178106B2 (en) | Surface mounted piezoelectric component and method of manufacturing the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |