JPH062264Y2 - Semiconductor device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to an improvement of a low power semiconductor device such as a CMOS type semiconductor device.

[Prior art]

Conventionally, in a semiconductor device for which low heat generation of a semiconductor pellet, such as a semiconductor device for low power consumption, it is not necessary to dissipate heat of the pellet through the pellet mount portion, and the pellet and the pellet mount portion are made of epoxy resin or silver paste. It is die-bonded with a conductive paste such as. That is, as shown in FIG. 6, the semiconductor pellet 102 is attached to the pellet mount portion 101 with a resin adhesive 1 such as an epoxy resin.
After die-bonding with 03 and wire-bonding each lead 104 and the electrode 102a of the pellet 102, packaging with resin 105 etc. is performed.

[Problems to be solved by the device]

However, in the above low-power semiconductor device, since the pellets 102 need not be displaced during wire bonding, the adhesive 103 may be the minimum required. On the other hand, the adhesive 103 is supplied by a stamp method or a syringe, but the viscosity varies depending on the ambient temperature, the ratio of the solvent, etc., and it has been complicated to keep the supply amount constant.

Therefore, an object of the present invention is to provide a semiconductor device having a structure that does not require die bonding with the resin adhesive 103.

[Means for Solving the Problems]

In order to achieve the above object, the present invention provides a semiconductor device in which a semiconductor pellet is supported on a pellet mount portion, and the electrode of the pellet and a lead near the pellet mount portion are wire-bonded and packaged. It is characterized in that it is placed on the pellet mount portion without an adhesive, and that the pellet mount portion has a hole covered with a semiconductor pellet.

[Function of device]

In assembling a semiconductor device having such a configuration, a semiconductor pellet is placed on a pellet mount portion, and the pellet is adsorbed by a suction nozzle or the like from below the perforated hole and fixed to the pellet mount portion. Therefore, it is not necessary to die-bond the pellet to the pellet mount.

〔Example〕

 An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a partially cutaway perspective view of a semiconductor device 1 according to an embodiment of the present invention. In the figure, reference numeral 2 denotes a semiconductor pellet, which is arranged on a pellet mount portion 3a in which a copper plate or the like is punched and bent in advance, without a resin adhesive or the like interposed. A through hole 4 is bored in the pellet mount portion 3a and is completely covered by the pellet 2 to be arranged. Each electrode 2a on the upper surface of the pellet 2 is wire-bonded to a predetermined lead 3b in the vicinity of the pellet mount 3a by a wire 5 such as an aluminum wire by ultrasonic bonding or the like, and an epoxy resin 6 having a good filling property is used. The semiconductor device 1 is resin-molded and packaged.

In the semiconductor device 1 as described above, each electrode 2 of the pellet 2 is
When the wire bonding between the a and the leads 3b is performed by ultrasonic bonding, the pellet 2 must be securely fixed to the pellet mount portion 3a.
During wire bonding, for example, as shown in FIG. 2, below the through hole 4 formed in the pellet mount portion 3a,
A nozzle 7 for suction is brought into contact, the pellet 2 is vacuum-sucked and fixed to the pellet mount portion 3a to perform ultrasonic bonding, and after the ultrasonic bonding is completed, the vacuum suction is released to perform packaging such as resin molding. I'll do it. In this case, the pellet 2 is wire-bonded to the leads 3b ... By the wire 5, but it may be floated from the pellet mount portion 3a and packaged. However, the load applied to one wire 5 at the time of resin molding is minute, and there is no problem in deformation of the wire 5 or the like. Therefore, the die bonding work can be omitted.

FIG. 3 is a perspective view of a semiconductor device 10 according to another embodiment of the present invention, and FIG. 4 is a longitudinal sectional view of a main part of the same embodiment.
In this semiconductor device 10, a dummy electrode 2b that does not affect the electrical characteristics at all is formed on the upper surface of the pellet 2, and the dummy electrode 2b and the mount support portions 3c and 3c extending on both sides of the pellet mount portion 3a are provided. The wire bonding is performed with the fixing wire 8 in a tension state close to a straight line. The wire bonding direction is preferably parallel to the injection direction of the packaging resin 6 indicated by arrow A. Since other configurations are similar to those of the semiconductor device 1 described above, the same members are designated by the same reference numerals and the description thereof will be omitted. In the semiconductor device 1 of the first embodiment, after the wire bonding is completed, the pellet 2 and the pellet mount portion 3a are not fixed, and the wire 5 is only wire-bonded to the leads 3b. Even if a resin having poor fluidity is injected in the casting step, the pellet 2 is held by the fixing wires 8 and 8 due to the resin flow at the time of injection, and the deformation of the wire 5 and the contact between the wires 5 are eliminated.

FIG. 5 shows a semiconductor device 20 according to another embodiment. In the semiconductor device 20, the pellet locking portion 3d is formed by bending the corner portion of the pellet mount portion 3a upward with respect to the injection direction of the packaging resin 6 indicated by the arrow A. Since the other structure is the same as that of the semiconductor device 1 of the first embodiment described above, the same members are designated by the same reference numerals and the description thereof will be omitted. However, such a semiconductor device 20 is also injected in the packaging process. The movement of the pellet 2 by the resin can be stopped by the pellet locking portion 3d, and there is no fear of the wires 5 coming into contact with each other. In this case, the dummy electrode 2b similar to that of the semiconductor device 10 of the second embodiment is further formed, and the wire 8 is used to wire-bond the mount support portions 3c and 3c extending to both sides of the pellet mount portion 3a under tension. The movement of the pellets 2 due to the injected resin can be prevented more reliably, which is even more preferable.

Here, the pellet 2 is mounted on the pellet mount portion 3a.
A plurality of holes 4 covered by may be drilled.

[Effect of device]

As is clear from the above description, in the semiconductor device of the present invention, the pellets are supported on the pellet mount portion without being fixed with a resin adhesive or the like, so die bonding work is unnecessary and the number of assembly steps can be reduced. Produces the effect.

[Brief description of drawings]

1 is a partially broken perspective view of a semiconductor device according to an embodiment of the present invention, FIG. 2 is a cross-sectional view showing wire bonding of pellets of the same embodiment, and FIG. 3 is another embodiment of the present invention. FIG. 4 is a partially cutaway perspective view of a semiconductor device according to an example, FIG. 4 is a longitudinal sectional view of an essential part of the same embodiment, and FIG. 5 is a partially cutaway perspective view of a semiconductor device according to still another embodiment of the present invention. FIG. 6 is a sectional view of a main part of a conventional semiconductor device. 1, 10 and 20 ... Semiconductor device, 2 ... Pellet, 2a ... Electrode, 3a ... Pellet mount part, 3b ... Lead, 4 ... Through hole,

Claims (1)

[Scope of utility model registration request] 1. A pellet mounting portion having a through hole, a semiconductor pellet is placed with the back surface thereof in direct contact with the through hole closed, and an electrode on the semiconductor pellet and one end thereof are arranged in the vicinity of the semiconductor pellet. A semiconductor device characterized in that it is electrically connected to the provided lead and is resin-molded.