JPH0624210B2 - Adhesive supply device - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an adhesive agent supply device for supplying an adhesive agent for adhering a semiconductor element onto a predetermined substrate of a lead frame by a stamp.

[Conventional technology]

FIG. 7 is a perspective view showing an example of a conventional adhesive supply device of this type.

The adhesive 3 is discharged from the discharge port 2 of the container 1 containing the adhesive onto the plate surface 5 of the supply plate 4. The adhesive discharged onto the plate surface 5 is thinly and evenly spread on the plate surface 5 by the rotating spatula 7 which rotates in association with the rotation of the rotary rod 6 attached to the supply plate 4.
The adhesive 3 thinly spread on the plate surface 5 is captured by the stamp 8 which moves back and forth and up and down in conjunction with a driving mechanism (not shown), and moves in the lead frame guide frame 9 on the semiconductor element mounting substrate 11 of the lead frame 10. Supply to.

[Problems to be solved by the invention]

The conventional adhesive supply device of this type is configured as described above, and the adhesive is discharged onto the dish surface 5 in the open air, spread thinly on the dish surface 5, captured by the stamp 8, and the lead frame 10 Since it is supplied on a predetermined substrate 11, the adhesive easily dries and becomes difficult to spread thinly, or the stamp 8 makes it difficult to catch it. To prevent this, a special adhesive that is hard to dry must be used. There was a problem that it did not happen. In addition, since the surface of the stamp 8 is pressed against the adhesive thinly spread on the dish surface 5 to catch the adhesive, it is difficult to control the adhesive supplied on the substrate 11 to a uniform thickness, and the adhesive floats in the outside air. There is a problem that impurities that are mixed in are mixed into the adhesive.

The present invention has been made to solve the above-mentioned problems, and it is not necessary to use a special adhesive, it is easy to control the adhesive supplied onto the substrate 11 to a uniform thickness, and It is an object of the present invention to provide an adhesive agent supply device in which the above impurities are not mixed.

[Means for solving problems]

In order to solve the above problems, an adhesive is supplied from a container accommodating the adhesive onto the plate surface of a supply plate, the adhesive is thinly spread on the surface of the supply plate, and the thinly spread adhesive is stamped. In an adhesive agent supply device which captures by means of a substrate and supplies it onto a predetermined substrate of a lead frame, a support base covered with the supply plate, a stamp penetrating the supply plate and attached so as to be reciprocally movable, and a stamp immediately below the stamp. A carrying device for the lead frame that carries in and carries out the substrate on the support base;
The adhesive supplied from the adhesive container discharge port,
The stamp surface and a rotary spatula thinly extending on the stamp end surface that is in the same plane as the dish surface and forming an adhesive thin film on the stamp end surface are provided. Adhering to the substrate, supplying the adhesive thin film on the end face of the stamp onto the predetermined substrate, and causing the adhesive discharge port of the container accommodating the adhesive to penetrate the support table and reciprocate. It is possible or fixedly attached, the plate surface of the supply plate at the tip of the adhesive discharge port is widened, and the penetrating part of the stamp of the supply plate is formed by a replacement part. The adhesive replacement device is characterized in that the replacement part is detachable from the supply tray.

Example of Invention

FIG. 1 is a perspective view showing an embodiment of the present invention, FIG. 2 is a partial sectional perspective view showing the internal structure of the embodiment shown in FIG. 1 by cutting along the II-II plane, and FIG. 2 is a sectional view of the embodiment shown in FIG. 1. FIG. In FIGS. 1 and 2, the supply tray 4 is
Rotating rod 6 attached to supply tray 4 with dish surface 5 inside
The stamp 8 is attached to the box-shaped support 12 for accommodating the rotating spatula 7 which rotates in the direction of the arrow in association with the rotation of the. 4 is mounted so that it can reciprocate vertically.

The ejection port 2 of the container 1 containing the adhesive is arranged so as to penetrate the support 12 and reciprocate in the vertical direction with respect to the support. In FIG. 1, a container 1 containing an adhesive and a discharge port 2 are separated and connected by a rubber tube 13. When the adhesive is discharged, the discharge port 2 is moved so that the tip end portion thereof is directly below the plate surface 5 as shown by the wavy line in FIG. To be done. The adhesive discharged onto the dish surface 5 is thinly and uniformly spread on the dish surface 5 by the rotating spatula 7 which is interlocked with the rotation of the rotary rod 6. At this time, the adhesive 3 is thinly and uniformly spread on the end surface of the stamp 8 located on the same plane as the dish surface 5 of the supply tray 4, and an adhesive thin film is formed.

As shown in FIGS. 1 and 2, the lead frame 10 is carried in along a lead frame guide frame 9 mounted on the bottom surface of the support 12, and a predetermined substrate 11 of the lead frame 10 is directly below the stamp 8. It is moved to come to.

In the space surrounded by the supply tray 4 and the support base 12, there is only a small gap for loading and unloading the lead frame 10 near the lead frame 10 at the joint between the lead frame guide frame 9 and the support base 12. However, air hardly circulates with the outside.

The stamp 8 reciprocates in the vertical direction, so that the end surface of the stamp 8 is moved to the substrate 11
The adhesive thin film on the end face of the stamp 8 is supplied onto the substrate 11 directly below the stamp 8 by adhering to the substrate 11.

The lead frame 10 to which the adhesive is supplied is sequentially supplied to the supply plate 4
Then, the semiconductor element is carried out from the space surrounded by the support 12 and the semiconductor element is immediately bonded.

When the spread of the adhesive to be supplied onto the substrate 11 is changed, a supply tray through which the stamp 8 having a different size penetrates may be attached to the support base.

FIG. 4 is a sectional view showing another embodiment of the present invention.

The discharge port 2 of the container 1 containing the adhesive penetrates the supply plate 4, and the container 1 is fixed to the supply plate 4 with the surface of the tip opening of the discharge port 2 on the same surface as the plate surface 5. Has been done.

This embodiment has an advantage that a drive mechanism for moving the discharge port 2 is unnecessary.

Further, as in another embodiment shown in FIG. 5, when the tray surface of the adhesive supply tray at the tip of the discharge port 2 is widened, the rotating spatula 7 makes it easy for the adhesive to spread thinly and uniformly.

In the case of the structure described above, when the stamp 8 is replaced, the entire supply tray 4 must be replaced. However, with the configuration as shown in FIG. 6, it becomes possible to easily exchange stamps having different end planes. That is, the supply plate 4 is provided with an exchange member 14 having step portions 14A of equal size as shown in FIGS. 6 (B) and 6 (C).
And is configured to be attachable to and detachable from the supply tray 4. The exchange member 14 has openings 14B and 14C for inserting stamps.
Is provided. These openings 14B and 14C are shown in FIG.
As is clear from (B) and (C), the stamps used differ in size.

〔The invention's effect〕

As described above, according to the present invention, since the adhesive is supplied in the space where the air does not circulate to the outside, it is not necessary to use the adhesive that is particularly difficult to dry, and impurities in the outside air are mixed. Moreover, since the adhesive is transferred as a thin layer directly onto the stamp and the surface of the stamp by a rotating spatula, the adhesive supplied onto the substrate can be easily controlled to have a uniform thickness.

[Brief description of drawings]

FIG. 1 is a perspective view showing an embodiment of the present invention, FIG. 2 is a partial sectional perspective view showing the internal structure of the embodiment shown in FIG. 1 by cutting along the II-II plane, and FIG. 1 is a sectional view of the embodiment shown in FIG. 1, and FIGS. 4, 5, 6 (A), (B), and (C) are sectional views showing another embodiment of the present invention, respectively. FIG. 1 is a perspective view of a conventional device of this type. 1 ... Container containing adhesive, 2 ... Discharge port, 3 ... Adhesive, 4 ... Supply plate, 5 ... Plate surface, 6 ... Rotating rod, 7 ...
… Rotating spatula, 8 …… Stamp, 9 …… Leadframe guide frame, 10 …… Leadframe, 11 …… Board, 12 …… Supporting base, 13 …… Rubber tube, 14 …… Replacement member, 14A …… Step Department,
14B, 14C ... Open.

Claims (5)

[Claims] 1. A lead frame in which an adhesive is supplied from a container containing an adhesive onto the plate surface of a supply plate, the adhesive is thinly spread on the surface of the supply plate, and the thinly spread adhesive is caught by a stamp. In the adhesive supply device for supplying onto a predetermined substrate, a support table covered with the supply plate, a stamp penetrating the supply plate and reciprocally mounted, and on the support table immediately below the stamp. A carrier of the lead frame for loading and unloading the substrate, and an adhesive supplied from a discharge port of the storage container for the adhesive,
The stamp surface and a rotary spatula thinly extending on the stamp end surface in the same plane as the dish surface, and forming a thin adhesive film on the stamp end surface; An adhesive agent supply device which adheres to the substrate and supplies the adhesive thin film on the end face of the stamp onto the predetermined substrate. 2. The adhesive supply device according to claim 1, wherein an adhesive discharge port of a container containing the adhesive penetrates the support and is reciprocally mounted. Characteristic adhesive supply device. 3. The adhesive supply device according to claim 1, wherein the adhesive discharge port penetrates the supply plate,
An adhesive agent supply device characterized in that a tip end surface of the adhesive agent discharge port is fixed in the same plane as the supply dish. 4. The adhesive supply device according to claim 3, wherein the plate surface of the supply plate at the tip of the adhesive discharge port is widened. 5. The adhesive supply device according to claim 3 or 4, wherein a penetrating portion of the stamp of the supply plate is formed of a replacement part, and the replacement part is detachable from the supply plate. The adhesive supply device according to claim 1.