JPH071768B2 - Bonding resin surface adjustment device in resin bonding equipment - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for adjusting a bonding resin surface in a resin bonding apparatus, and more specifically, a plurality of types of semiconductor chips having different sizes are mounted on a substrate such as a ceramic resin. The present invention relates to an improvement of a die bonding resin bonding apparatus for adjusting the height of a bonding resin surface according to the type of a semiconductor chip.

[Prior Art] FIGS. 2 and 3 show a schematic configuration of a resin bonding apparatus of this type according to a conventional example.

That is, in each of these drawings, reference numeral 1 denotes a substrate on which a semiconductor chip is mounted, here, a substrate made of ceramic or the like for die-bonding a plurality of types of semiconductor chips having different sizes to each other. This is a bonding stage that can be controlled to move in the front, back, left, and right directions.

In addition, 3 is a resin for bonding such as silver epoxy, 4
Is a stamp plate which receives the bonding resin 3, 5 is a stamp table which pivotally supports the stamp plate 4, and is rotated at a predetermined speed by a rotating mechanism 5a, and 6 is extended in the horizontal direction. An adjusting lever 7 in which an intermediate portion is pivotally supported on the stamp table 5 so that its tip end faces the stamp tray 4, and 7 is attached to the tip end of the adjusting lever 6, the stamp tray 4 It is a squeegee that is in contact with the upper surface of the bonding resin 3 inside and constantly scrapes the resin surface to a horizontal surface of an adjusted height.

Further, 8 is a height adjusting mechanism which is vertically mounted on the extension of the stamp base 5, and in this case, the height setting pin is projected upward by a manual operation rotation of the adjusting knob 8a.
The 8b can be moved up and down. The lower end of the adjusting lever 6 is brought into contact with the upper end surface of the height setting pin 8b by the elastic force of the spring 9 to eliminate the play of the adjusting lever 6.

Further, 10 is a stamp pin having a tip shape corresponding to the chip size, 11 is a plurality of stamp pins 10 (10a, 10b) for each chip size are mounted radially at equal angular intervals, and the rotating mechanism 12 is used. Then, a rotating member 13 which can be freely rotated in correspondence with each mounting angle is provided so that the rotating member 11 can be controlled and moved in the vertical direction shown by the arrow, and the substrate 1 side and the stamp tray 4 side can be moved. The stamp head is configured to be capable of reciprocating control movement as indicated by an arrow.

However, in the case of this conventional example configuration, first, the adjustment knob 8a of the height adjusting mechanism 8 is operated to adjust the upper protruding height of the height setting pin 8b to adjust the horizontal position of the squeegee 7. Is set as a predetermined value, and the rotation mechanism 12 of the stamp head 13 is
Is operated to rotate the rotating member 11, and the stamp pin corresponding to the chip size at that time, in this case the stamp pin 10
Select a.

That is, by these operations, in the former, the surface of the bonding resin 3 in the rotating stamp tray 4 is scraped by the squeegee 7, so that
It is kept in correspondence with the set height position, that is, the same plate 4
It is supplied while maintaining a constant thickness inside, and in the latter, the selected stamp pin 10a is located below.

Then, in this state, first, the stamp head 13 is controlled and driven to move on the stamp plate 4 and move up and down, and the inside of the stamp plate 4 is attached to the lower end of the stamp pin 10a selected corresponding to the chip size at this time. The required amount of the bonding resin 3 is attached and taken out.

Next, the stamp head 13 is moved from the stamp plate 4 side to the bonding stage 2 side and is similarly moved up and down to apply the required amount of the bonding resin 3 attached to the lower end of the stamp pin 10a to the bonding stage 2. A predetermined position on the mounted substrate 1, that is, a chip bonding position at that time is transferred and applied.

Subsequently, the stamp head 13 switches the previously selected stamp pin 10a to, for example, the stamp pin 10b corresponding to the next mounting chip size, and also moves the bonding stage 2 to the next mounting position. Then, the above operation is sequentially repeated, and the application operation of the resin 3 onto the substrate 1 is continuously performed for each of them.

A semiconductor chip is bonded in a separate step on the substrate 1 on which the required amount of the bonding resin 3 has been transferred and applied in this manner.

[Problems to be solved by the invention]

However, in the case of the conventional apparatus configured as described above, the resin 7 in the stamp plate 4 is moved by the stage 7.
, The tip pin size and shape of the stamp pin 10 are different depending on the target chip size. Therefore, when any one of them is selectively switched, the viscosity of the bonding resin 3 itself, etc. As a result, there is a difference in the amount of resin attached to the tip portion, and by extension, the amount of resin transferred and applied on the substrate 1. If the amount of application is too large, the chip is mounted during mounting of the semiconductor chip. If the resin wraps around to the surface side and the coating amount is small,
There is a problem that it causes inconvenience such as insufficient bonding strength.

The present invention has been made in order to solve such a conventional problem, and an object thereof is to provide a stamp pin having a different tip size and shape, which are selected according to the chip size. It is an object of the present invention to provide a bonding resin surface adjusting device in a resin bonding device of this type, which is capable of constantly applying a constant amount and thickness of resin onto a substrate.

[Means for solving problems]

In order to achieve the above object, a bonding resin surface adjusting device in a resin bonding device according to the present invention comprises:
A drive mechanism is provided which is controlled and driven in response to a command from the operating section in association with the selection switching of the stamp pin, and the height adjustment mechanism of the squeegee can be controlled and operated by this drive mechanism.

[Action]

That is, according to the present invention, the squeegee height adjusting mechanism is controlled and actuated by the drive mechanism interlocked with the selection switching of the stamp pin, and the squeegee height corresponding to the stamp pin selected at that time, that is, the chip size is controlled. The position can be adjusted automatically.

〔Example〕

An embodiment of a bonding resin surface adjusting device in a resin bonding device according to the present invention will be described in detail below with reference to FIG.

FIG. 1 is a perspective view showing a schematic structure of the apparatus of this embodiment. In the apparatus of FIG. 1 the same reference numerals as those of the apparatus of the prior art of FIG. 2 represent the same or corresponding parts.

In the apparatus of this embodiment, instead of the height adjusting mechanism 8 in the above-mentioned conventional example, a height adjusting mechanism 14 provided with an adjusting rotator for screwing an adjusting screw forward and backward as seen in, for example, a micrometer mechanism, Here, a height adjusting mechanism 14 having an adjusting rotator 14a whose surface is formed in the shape of a timing gear and an operating contactor 14b whose protrusion height is adjusted by the rotating operation of the adjusting rotator 14a. And a drive mechanism 15 whose rotation can be controlled by control signals such as a pulse motor and a stepping motor.

Then, the operating contact 14b of the height adjusting mechanism 14 is disposed so as to abut on the base end side of the lever 6 from below,
In the same manner as described above, the play of the lever 6 in the vertical direction is removed by the elastic force of the spring 9, and the adjusting rotator 14a of the height adjusting mechanism 14 and the drive Mechanism 15
Timing belt 16 between the output timing gear 15a
In order to make the driving mechanism 15 stretched and to interlock with the selective switching operation of each stamp pin 10 by the rotating mechanism 12, the driving mechanism 15 together with the rotating mechanism 12 is used. On the other hand, a signal path 17 for inputting a control signal from an external operation unit (not shown) is connected thereto.

Therefore, also in the configuration of this embodiment, the same operation as the configuration of the conventional example described above is performed, and the rotating mechanism 12 of the stamp head 13 is operated by a control signal input from an external operation unit, and at that time, Stamp pin for different chip sizes
When any one of 10 is selectively switched, the height adjustment mechanism 14 can be automatically adjusted in association with the selection switching operation as follows.

That is, in this case, for example, if the stamp pin 10a is selectively switched, a control signal is also input to the drive mechanism 15, the drive mechanism 15 is rotationally driven by a required amount, and the height adjustment is performed via the timing belt 16. Adjustment rotator of mechanism 14
By rotating 14a and adjusting the protrusion height of the actuating contact 14b by this operation, the contact height position of the squeegee 7 with respect to the bonding resin 3 surface is adapted to the tip size and shape of the selected stamp pin 10a. It can be automatically adjusted and set to do so.

That is, in this manner, the contact height position of the squeegee 7 with respect to the surface of the bonding resin 3 and thus the thickness of the bonding resin 3 in the stamp tray 4 can be adjusted to correspond to the stamp pin 10a at that time. As a result, a required amount of bonding resin 3 suitable for the tip size and shape of the stamp pin 10a can be taken out.

〔The invention's effect〕

As described in detail above, according to the present invention, in order to die-bond a plurality of types of semiconductor chips of different sizes onto a substrate such as a ceramic resin, a stamp plate that receives and rotates a bonding resin and an upper portion of the stamp plate are provided. A squeegee that is movable up and down so as to separate from and contact the stamp plate, and scrapes the resin surface inside the rotating stamp plate at the vertically moved height position, and a height adjustment mechanism that adjusts the height position of the squeegee. And a stamp member having a tip formed in a shape corresponding to the semiconductor chip size and a plurality of stamp pins provided on the rotating member for each semiconductor chip size on the rotating member, and switching selection is performed by the rotating operation of the rotating member. When a part of the bonding resin that has been scraped is taken out by the stamp pin that is operated, it is linked to the selection switching of the stamp pin by the command from the operation unit. A drive mechanism that is controlled and driven is provided, and the height adjustment mechanism is controlled and actuated by this drive mechanism so that the height position of the squeegee can be adjusted. Tip size of stamp pin corresponding to the size of semiconductor chip,
The thickness can be set in conformity with the shape, whereby the bonding resin can be transferred and applied onto the substrate without excess or deficiency.

[Brief description of drawings]

FIG. 1 is a perspective view showing a schematic structure of a resin bonding device to which an embodiment of a bonding resin surface adjusting device according to the present invention is applied, and FIG. 2 is a schematic structure of the same resin bonding device as a conventional device. 3 is a perspective view showing
The figure is a cross-sectional explanatory view of the stamp plate portion of the above. 1 ... Substrate, 2 ... Bonding stage, 3 ... Bonding resin, 4 ... Stamp plate, 5 ... Stamp base, 5a ... Rotation mechanism, 6 ... Adjustment lever, 7 ... Squeegee, 10, (10a, 10b) …… Stamp pin, 11 …… Rotating member, 12 …… Rotating mechanism, 13 …… Stamp head, 14 …… Height adjusting mechanism, 14a …… Adjusting rotator, 14b …… Activating Contactor,
15 …… Drive mechanism, 15a …… Output timing gear, 16 ……
Timing belt, 17 ... Signal path.

Claims (1)

[Claims] 1. A plurality of types of semiconductor chips of different sizes are resin die-bonded onto a substrate such as ceramics. Therefore, a stamp pan that receives and rotates a bonding resin, and a stamp plate above and below the stamp plate so as to separate and contact the stamp plate. A squeegee that is movably installed in the rotating stamp tray and scratches the resin surface in the rotating stamp tray at the height position that is moved up and down.
A height adjustment mechanism that moves the squeegee to adjust the height position of the squeegee from the stamp plate, and a tip is formed in a shape corresponding to the semiconductor chip size, and a plurality of protrusions are provided on the rotating member for each semiconductor chip size. In a resin bonding apparatus having a stamp pin, and a stamp pin that is switched and selected by the rotating operation of the rotating member to take out a part of the scraped resin, the stamp pin is instructed by an operation unit. A drive mechanism that is controlled and driven in conjunction with the selective switching of the above is provided, and the height drive mechanism is controlled by this drive mechanism so that the height position of the squeegee can be adjusted according to the chip size. A device for adjusting the bonding resin surface in a resin bonding device.