JPH0634884U - Laser processing equipment - Google Patents

Abstract

(57) [Summary] [Object] The present invention provides a laser processing apparatus having both functions of varying the laser light intensity and varying the pulse width. A laser oscillator 1 and an optical attenuator 3 for varying the laser light intensity of the laser light emitted from the laser oscillator 1 are provided. The laser oscillator 1 includes an excitation flash lamp 5 and this excitation flash. An Nd: YAG laser rod 7 that absorbs light from the lamp 5 to form a photoexcited state and a Q switch element 9 that oscillates a predetermined pulse laser beam via the photoexcited laser rod 7 are provided. Further, the excitation flash lamp 5 is connected to an excitation flash lamp control power source 11 for controlling the lamp lighting voltage, and the Q switch element 9 is
Q for ON / OFF control of switches and applied voltage control
The switch control power supply 13 is connected.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a laser processing apparatus for cutting or processing a fine pattern by, for example, laser repairing.

[0002]

[Prior art]

 Conventionally, as disclosed in Japanese Patent Application Laid-Open No. 2-104487, a laser processing apparatus of this type has a structure in which a laser beam emitted from a laser oscillator is rotated by a mirror attached to a galvanometer and a scanning lens and The light is condensed near a predetermined position of the workpiece through a plurality of arranged minute light collecting lenses.

Such an apparatus is generally configured by applying an Nd: YAG Q switch pulse laser, and is used for manufacturing semiconductor integrated circuits, liquid crystal display elements, or the like, or for a metal film (Cr film) of a photomask. , FeO film, etc.) or a transparent electrode (ITO film) used in a liquid crystal display element or an aluminum electrode for repairing / processing (repairing) residual defects.

[0004]

[Problems to be solved by the device]

 In such laser processing, in order to perform the optimum processing, it is necessary to appropriately select the laser light intensity and the pulse width in accordance with the material, thickness, surface condition, etc. of the workpiece. In particular, it becomes an important requirement as the required processing accuracy increases.

However, a laser processing apparatus having both functions of varying the laser light intensity and varying the pulse width has not yet been proposed, and it is easy and highly accurate for a wide variety of workpieces. There is a problem in that it cannot be processed.

The present invention has been made to solve such a problem, and an object thereof is to provide a laser processing apparatus having both functions of varying the laser light intensity and varying the pulse width. .

[0007]

[Means for Solving the Problems]

 In order to achieve such an object, the laser processing apparatus of the present invention has a variable means for varying the pulse width of the laser light and a laser light whose pulse width is changed by the varying means to a desired value. And adjusting means for adjusting.

[0008]

[Action]

 The laser light whose pulse width is variably controlled by the variable means is controlled by the adjusting means to have a desired laser light intensity.

[0009]

【Example】

 Hereinafter, a laser processing apparatus according to an embodiment of the present invention will be described with reference to FIG.

As shown in FIG. 1, the laser processing apparatus of this embodiment includes a laser oscillator 1 and an optical attenuator 3 for varying the laser light intensity of the laser light emitted from the laser oscillator 1. The laser oscillator 1 includes an excitation flash lamp 5, an Nd: YAG laser rod 7 that absorbs light from the excitation flash lamp 5 and forms a photoexcitation state, and a laser rod 7 that is optically excited. And a Q switch element 9 for oscillating a predetermined pulse laser beam. Further, the excitation flash lamp 5 is connected to an excitation flash lamp control power supply 11 for controlling the lighting voltage of the lamp, and the Q switch element 9 is a Q switch control power supply 13 for performing ON / OFF control of the switch and applied voltage control. Are connected.

The Q switch element 9 is made of, for example, KDP or LiNbO ₃ crystal, and the optical attenuator 3 is made of, for example, an optical filter combined or two polarizing plates combined.

Further, FIG. 1 shows an optical resonator for maintaining a photoexcited laser rod in a high energy level state, and a condensing reflection for efficiently irradiating the laser rod 7 with light energy from the excitation flash lamp 5. A mirror and means for cooling the excitation flash lamp 5 and the laser rod 7 are omitted. Next, the operation of the laser processing apparatus of this embodiment will be described.

When a predetermined voltage is applied to the excitation flash lamp 5 from the excitation flash lamp control power supply 11, the Nd: Y AG laser rod 7 is optically excited by the excitation light emitted from the excitation flash lamp 5.

At this time, by applying a predetermined voltage from the Q switch control power supply 13 to the Q switch element 9 to perform the Q switch control, a predetermined pulse laser beam is oscillated. There are the following two methods for changing the pulse width of such pulsed laser light.

According to the first method, the pulse width of the pulsed laser light can be changed by changing the lighting voltage applied from the excitation flash lamp control power supply 11 to the excitation flash lamp 5 to change the light emission characteristics. it can.

According to the second method, the voltage applied from the Q switch control power supply 13 to the Q switch element 9 is changed while maintaining the lighting voltage applied to the excitation flash lamp 5 constant (the light emission characteristics are not changed). By doing so, the pulse width of the pulsed laser light can be changed.

The laser light emitted from the laser oscillator 1 with the pulse width changed by these methods is adjusted by the optical attenuator 3 to have a desired laser light intensity.

As described above, the laser processing apparatus according to the present embodiment is configured so that both the pulse width and the light intensity of the laser light can be controlled to desired values by using a simple means. Laser processing can be performed with high accuracy and easily according to the type.

Although the Q-switched Nd: YAG laser has been described in the above embodiment, the present invention is not limited to this, and it can be applied to other lasers such as a ruby laser and a glass laser. Needless to say.

[0020]

[Effect of device]

 Since the present invention is configured to have both functions of varying the laser light intensity and varying the pulse width, it is possible to perform laser processing with high precision and ease according to the type of workpiece. .

[Brief description of drawings]

FIG. 1 is a block diagram showing a configuration of a laser processing apparatus according to an embodiment of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Laser oscillator, 3 ... Optical attenuator, 5 ... Excitation flash lamp, 7 ... Nd: YAG laser rod, 9 ... Q switch element, 11 ... Excitation flash lamp control power supply, 1
3 ... Q switch control power supply.

Claims (1)

[Scope of utility model registration request] 1. A laser processing apparatus comprising: variable means for variably controlling the pulse width of laser light; and adjusting means for variably controlling the light intensity of the laser light whose pulse width is changed by the varying means to a desired value.