JPH0638554B2 - Multilayer printed circuit board - Google Patents
Multilayer printed circuit boardInfo
- Publication number
- JPH0638554B2 JPH0638554B2 JP62174610A JP17461087A JPH0638554B2 JP H0638554 B2 JPH0638554 B2 JP H0638554B2 JP 62174610 A JP62174610 A JP 62174610A JP 17461087 A JP17461087 A JP 17461087A JP H0638554 B2 JPH0638554 B2 JP H0638554B2
- Authority
- JP
- Japan
- Prior art keywords
- pad
- wiring
- hole
- pattern
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、電子機器に用いられる多層プリント板に係
り、特に回路の接続を変更するに好適な多層プリント基
板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer printed board used in electronic equipment, and more particularly to a multilayer printed board suitable for changing circuit connections.
第２図は、従来の配線変更用パターンを有するプリント
基板の要部斜視図である。回路部品の端子３は、フラッ
ト形式になっていて、プリント基板の部品実装面１ａに
形成されたリフローパッド４に半田付けされている。リ
フローパッド４は、第１のスルーホール１２のランド５
ａと直接にパターン８で接続し、第１のスルーホール１
２を介して、裏面側のランド５ｂと接続される。第２の
スルーホール１３は、必要に応じて、内層信号線１４と
接続されており、第２のスルーホール１３の非部品搭載
面１ｂのランドと第１のスルーホール１２のランド５ｂ
とは、布線専用パッド６を介してパターン１０′，１
１′で接続されている。即ち、２つのスルーホールを用
い、第１のスルーホール１２は、回路部品の端子３と直
結し、また、第２のスルーホール１３は、内層信号線１
４に直結しており、２つのスルーホールは、布線専用パ
ッド６を介して接続された配線変更用パターン構造とな
っている。FIG. 2 is a perspective view of a main part of a conventional printed circuit board having a wiring changing pattern. The terminal 3 of the circuit component is flat and is soldered to the reflow pad 4 formed on the component mounting surface 1a of the printed circuit board. The reflow pad 4 is a land 5 of the first through hole 12.
The first through hole 1 is directly connected to a by the pattern 8.
2 is connected to the land 5b on the back surface side. The second through hole 13 is connected to the inner layer signal line 14 as necessary, and the land of the non-component mounting surface 1b of the second through hole 13 and the land 5b of the first through hole 12 are connected.
Is the pattern 10 ', 1 through the pad 6 for wiring.
They are connected by 1 '. That is, two through holes are used, the first through hole 12 is directly connected to the terminal 3 of the circuit component, and the second through hole 13 is the inner layer signal line 1.
4 is directly connected to each other, and the two through holes have a wiring changing pattern structure in which they are connected via a pad 6 dedicated to wiring.
配線変更を行なうには、布線専用パッド６と第２のスル
ーホール１３間を接続するパターン１０′の鎖線位置を
刃物で切断して、内層信号線１４から分離する。次に、
変更布線９をこの布線専用パッド６に半田付けをし、他
端を目的の個所へ接続する。To change the wiring, the chain line position of the pattern 10 ′ connecting between the wiring-dedicated pad 6 and the second through hole 13 is cut with a blade to separate it from the inner layer signal line 14. next,
The modified wiring 9 is soldered to the wiring-dedicated pad 6, and the other end is connected to a target location.
上記従来技術は、同一面上、即ち、非部品実装面で、容
易に配線変更ができるように、作業性のよい構造となっ
ている。しかし、内層信号線１４を切離す為のパターン
をカットする際、布線専用パッド６と第２のスルーホー
ル１３間のパターン１０′と、布線用パッド６と第１の
スルーホール１２間のパターン１１′とが同一形状とな
っている為、どちらかをカットするのか、表面のパター
ンだけでは、区別しにくい点については、配慮されてお
らず、誤カットが生じる問題があった。The above-mentioned conventional technology has a structure with good workability so that the wiring can be easily changed on the same surface, that is, on the non-component mounting surface. However, when the pattern for separating the inner layer signal line 14 is cut, the pattern 10 ′ between the wiring dedicated pad 6 and the second through hole 13 and between the wiring pad 6 and the first through hole 12 are cut. Since the pattern 11 'has the same shape, it is difficult to distinguish which one is to be cut or only the pattern on the surface is not taken into consideration, and there is a problem that an erroneous cut occurs.
本発明の目的は、このような問題を有効的に解消された
多層プリント基板を提供することにある。An object of the present invention is to provide a multilayer printed circuit board that effectively solves such problems.
上記目的を達成する為、本発明は、部品実装面に設けら
れ、回路部品と接続する為のパッドと、該パッドと接続
する第１のスルーホールと、内層に設けられた信号線
と、該信号線と接続する第２のスルーホールと、非部品
実装面に設けられ、配線変更用の布線と接続する為の布
線変更用パッドとを有し、非部品実装面において、第１
のスルーホールと布線変更用パッドとを接続する第１の
接続パターンと、第２のスルーホールと布線変更用パッ
ドとを接続する第２の接続パターンとが設けられ、前記
バッドが前記布線変更用パッドを介して前記信号線と接
続する多層プリント基板において、第１の接続パターン
の幅と第２の接続パターンの幅とが相異なるものであ
る。In order to achieve the above object, the present invention provides a pad provided on a component mounting surface for connecting to a circuit component, a first through hole connecting to the pad, a signal line provided in an inner layer, It has a second through hole connected to the signal line and a wiring changing pad provided on the non-component mounting surface and connected to the wiring changing wiring.
And a second connection pattern for connecting the second through hole and the wiring change pad, the pad being the cloth. In the multilayer printed circuit board connected to the signal line via the line changing pad, the width of the first connection pattern and the width of the second connection pattern are different from each other.
表面のパターンのうち、配線変更によって、内層パター
ンと切り離す為にカットを必要とするパターンの幅と他
のパターンの幅とが異なっている為、表面上、カットす
るパターンとカットしてはならないパターンを容易に見
分けができ、誤カットすることがない。Of the patterns on the surface, the patterns that need to be cut to separate from the inner layer pattern due to wiring changes have different widths from other patterns.Therefore, patterns to be cut and patterns that should not be cut on the surface Can be easily identified and will not be cut by mistake.
以下、本発明の一実施例を第１図により説明する。 An embodiment of the present invention will be described below with reference to FIG.
第１図は、プリント基板における表面（部品実装面の裏
面側）の平面図である。第１のスルーホールは、第２図
の従来方法と同じように、部品搭載面側のリフローパッ
ド４と接続されている。（または、直接、部品の端子
が、スルーホール１２に挿入されて、半田付けされ
る。）第２のスルーホール１３は、第２図の従来構造と
同様で、内層信号線１４と接続されている。第１のスル
ーホール１２と布線専用パッド６とを接続するパターン
１１と第２のスルーホール１３と布線専用パッド６とを
接続するパターン１０とは、目で区別がつけられる程度
に第２のスルーホール１３と布線専用パッド６間のパタ
ーン１０の方を細くする。変更を行う時は、細いパター
ン１０側を刃物で切断し、内層信号線１４と切離し布線
９を専用パッドに接続する。本考案の場合、容易にカッ
トするパターンを区別でき、誤カットをなくす効果があ
る。FIG. 1 is a plan view of the front surface (the back surface side of the component mounting surface) of the printed circuit board. The first through hole is connected to the reflow pad 4 on the component mounting surface side, as in the conventional method shown in FIG. (Or, the terminal of the component is directly inserted into the through hole 12 and soldered.) The second through hole 13 has the same structure as the conventional structure shown in FIG. There is. The pattern 11 for connecting the first through-hole 12 and the wiring-dedicated pad 6 and the pattern 10 for connecting the second through-hole 13 and the wiring-dedicated pad 6 are second to the extent that they can be visually distinguished. The pattern 10 between the through hole 13 and the pad 6 for wiring is thinned. When making a change, the thin pattern 10 side is cut with a knife, and the inner layer signal line 14 and the separation wiring 9 are connected to a dedicated pad. In the case of the present invention, the patterns to be cut can be easily distinguished, and the effect of eliminating erroneous cuts can be obtained.
本発明によれば、配線変更により、カットを要するパタ
ーン側を全て細くしておくことで、容易にカットする側
のパターンを判断でき、誤カットをなくすことができ
る。According to the present invention, it is possible to easily determine the pattern on the side to be cut and eliminate erroneous cutting by making all the pattern sides that need to be cut thin by changing the wiring.
また、他の効果としては、刃物でパターンをカットする
際、太いパターンと細いパターンでは、細いパターンの
方がカットしやすく、また、基板に対しても、刃物でカ
ットした時に生じる表面のキズを小さくすることができ
る。Further, as another effect, when cutting the pattern with a blade, a thin pattern is easier to cut between a thick pattern and a thin pattern, and also for a substrate, a surface scratch caused when the blade is cut is used. Can be made smaller.
第１図は本発明の一実施例の平面図、第２図は、従来に
おける配線変更用パターンの要素斜視図である。 １……プリント基板，１ａ……部品実装面，１ｂ……非
部品実装面，２……回路部品，３……回路部品の端子，
４……リフローパッド，５，５ａ，５ｂ，７……ラン
ド，６……布線専用パッド，８，１０，１１……パター
ン，９……変更用布線，１２，１３……スルーホール，
１４……内層パターン。FIG. 1 is a plan view of an embodiment of the present invention, and FIG. 2 is an element perspective view of a conventional wiring changing pattern. 1 ... Printed circuit board, 1a ... Component mounting surface, 1b ... Non-component mounting surface, 2 ... Circuit component, 3 ... Circuit component terminal,
4 ... Reflow pad, 5, 5a, 5b, 7 ... Land, 6 ... Wiring pad, 8, 10, 11 ... Pattern, 9 ... Change wiring, 12, 13 ... Through hole,
14 ... Inner layer pattern.
Claims (1)
る為のパッドと、該パッドと接続する第１のスルーホー
ルと、内層に設けられた信号線と、該信号線と接続する
第２のスルーホールと、非部品実装面に設けられ、配線
変更用の布線と接続する為の布線変更用パッドとを有
し、非部品実装面において、前記第１のスルーホールと
前記布線変更用パッドとを接続する第１の接続パターン
と、前記第２のスルーホールと前記布線変更用パッドと
を接続する第２の接続パターンとが設けられ、前記パッ
ドが前記布線変更用パッドを介して前記信号線と接続す
る多層プリント基板において、 前記第１の接続パターンの幅と前記第２の接続パターン
の幅とが相異なることを特徴とする多層プリント基板。1. A pad provided on a component mounting surface for connecting to a circuit component, a first through hole connecting to the pad, a signal line provided on an inner layer, and a first line connecting to the signal line. 2 through holes and a wiring changing pad provided on the non-component mounting surface for connecting to a wiring for wiring change, and the first through hole and the cloth on the non-component mounting surface. A first connection pattern for connecting the wire changing pad and a second connection pattern for connecting the second through hole and the wiring changing pad are provided, and the pad is for the wiring changing. In the multilayer printed circuit board connected to the signal line via a pad, the width of the first connection pattern and the width of the second connection pattern are different from each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62174610A JPH0638554B2 (en) | 1987-07-15 | 1987-07-15 | Multilayer printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62174610A JPH0638554B2 (en) | 1987-07-15 | 1987-07-15 | Multilayer printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6419790A JPS6419790A (en) | 1989-01-23 |
| JPH0638554B2 true JPH0638554B2 (en) | 1994-05-18 |
Family
ID=15981598
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62174610A Expired - Lifetime JPH0638554B2 (en) | 1987-07-15 | 1987-07-15 | Multilayer printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0638554B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04132292A (en) * | 1990-09-21 | 1992-05-06 | Nec Corp | Polyimide resin multilayer wiring board |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5211331B2 (en) * | 1972-02-07 | 1977-03-30 | ||
| JPS5110871B2 (en) * | 1973-02-26 | 1976-04-07 | ||
| JPS5626216U (en) * | 1979-08-07 | 1981-03-11 | ||
| JPS6110969Y2 (en) * | 1980-07-18 | 1986-04-08 | ||
| JPS6021850B2 (en) * | 1982-03-26 | 1985-05-29 | 日本プラスト株式会社 | Manufacturing method of shift lever boots |
-
1987
- 1987-07-15 JP JP62174610A patent/JPH0638554B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6419790A (en) | 1989-01-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| GB1501500A (en) | Multilayer printed circuit boards | |
| JP2004502296A (en) | Via-free printed circuit boards | |
| JPH10313157A (en) | Printed board | |
| JPH0638554B2 (en) | Multilayer printed circuit board | |
| JPH1075022A (en) | Circuit board | |
| JPH09307208A (en) | Flexible printed circuit board connection end structure | |
| CA1080856A (en) | Multilayer printed wiring board | |
| JPH10340747A (en) | Surface-mounted jumper | |
| JPS62155585A (en) | Electronic equipment | |
| JPH0497589A (en) | Printed wiring board | |
| JPH0997956A (en) | Printed-circuit board | |
| JPS63283182A (en) | flexible printed wiring board | |
| JPH0621270Y2 (en) | Printed wiring board | |
| JPH0752790B2 (en) | Parent-child board mounting method | |
| JPH053160B2 (en) | ||
| JPS6246296Y2 (en) | ||
| JPS6015353Y2 (en) | Printed circuit board bonding device | |
| JPH0822853A (en) | Printed circuit board for changing pin assignment | |
| JPH09214080A (en) | Printed wiring board | |
| JPH0389589A (en) | Printed circuit board | |
| JPS587657Y2 (en) | multilayer printed wiring board | |
| JPS5951589A (en) | Printed board | |
| JPS63168074A (en) | Method of forming resistors on electronic circuit boards | |
| JPS5926620Y2 (en) | printed wiring board | |
| JPH056680Y2 (en) |