JPH0640536B2 - Bottomed tubular capacitor - Google Patents
Bottomed tubular capacitorInfo
- Publication number
- JPH0640536B2 JPH0640536B2 JP62067615A JP6761587A JPH0640536B2 JP H0640536 B2 JPH0640536 B2 JP H0640536B2 JP 62067615 A JP62067615 A JP 62067615A JP 6761587 A JP6761587 A JP 6761587A JP H0640536 B2 JPH0640536 B2 JP H0640536B2
- Authority
- JP
- Japan
- Prior art keywords
- ceramic body
- electrode
- bottomed cylindrical
- conductive paste
- capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000003990 capacitor Substances 0.000 title claims description 18
- 239000000919 ceramic Substances 0.000 claims description 37
- 238000007772 electroless plating Methods 0.000 claims description 8
- 239000002184 metal Substances 0.000 description 15
- 229910052751 metal Inorganic materials 0.000 description 15
- 238000007747 plating Methods 0.000 description 12
- 238000000034 method Methods 0.000 description 7
- 230000005012 migration Effects 0.000 description 3
- 238000013508 migration Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 229910020816 Sn Pb Inorganic materials 0.000 description 1
- 229910020922 Sn-Pb Inorganic materials 0.000 description 1
- 229910008783 Sn—Pb Inorganic materials 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Landscapes
- Ceramic Capacitors (AREA)
Description
【発明の詳細な説明】 (a)産業上の利用分野 この発明は、有底筒形セラミック素体の内面と外面に電
極を形成した有底筒形コンデンサに関する。TECHNICAL FIELD The present invention relates to a bottomed cylindrical capacitor in which electrodes are formed on the inner surface and the outer surface of a bottomed cylindrical ceramic body.
(b)従来の技術 従来、第２図に示すように円筒形セラミック素体１の内
外面にＡｇ等の厚膜７，８電極を形成することにより円
筒形のコンデンサが製造されている。(b) Conventional Technology Conventionally, as shown in FIG. 2, a cylindrical capacitor is manufactured by forming thick films 7 and 8 electrodes of Ag or the like on the inner and outer surfaces of the cylindrical ceramic body 1.
この種の筒形コンデンサにおいては、第３図に示すよう
にセラミック素体として有底の筒形セラミック素体を用
いれば、内部電極と外部電極間の対向面積を広くとるこ
とができ、取得容量が増大する。In this type of cylindrical capacitor, if a bottomed cylindrical ceramic body is used as the ceramic body as shown in FIG. 3, the facing area between the internal electrode and the external electrode can be widened, and the acquired capacitance can be increased. Will increase.
従来技術により、有底筒形セラミック素体に電極を形成
しようとすれば、導電性ペーストが塗布されたピンを筒
内に挿入することにより内面に導電性ペーストを付着さ
せ、また、導電性ペーストが塗布されたローラを筒の外
周に接触させ廻転させることにより外面に導電性ペース
トを転写し、その後焼き付けることによって内部電極と
外部電極が形成される。If an electrode is to be formed on a cylindrical ceramic body having a bottom by the conventional technique, the conductive paste is attached to the inner surface by inserting a pin coated with the conductive paste into the cylinder, and the conductive paste is also applied. The inner electrode and the outer electrode are formed by transferring the conductive paste to the outer surface by contacting the outer periphery of the cylinder with the roller coated with and rotating the roller, and then baking.
(c)発明が解決しようとする問題点 第２図，第３図に示した筒形コンデンサでは、筒形セラ
ミック素体の内面と外面のいずれの電極にもＡｇの導電
性ペーストを用いると、電極間のマイグレーションなど
外部環境に対する信頼性がそれほど高くなく、また、セ
ラミック素体の内面に形成される電極と外面に形成され
る電極のいずれも導電性ペーストが塗布される際に滲み
や波打ちが生じ、寸法精度が±０．１mm程度と低い。そ
のため、内面に形成される電極と外面に形成される電極
との対向面積が一定せず、静電容量が大きくばらつくと
いう問題があった。(c) Problems to be Solved by the Invention In the cylindrical capacitor shown in FIGS. 2 and 3, when the conductive paste of Ag is used for both the inner and outer electrodes of the cylindrical ceramic body, The reliability against the external environment such as migration between electrodes is not so high, and neither the electrode formed on the inner surface of the ceramic body nor the electrode formed on the outer surface is bleeded or wavy when the conductive paste is applied. Occurs and the dimensional accuracy is as low as ± 0.1 mm. Therefore, there is a problem in that the facing area between the electrode formed on the inner surface and the electrode formed on the outer surface is not constant, and the electrostatic capacitance greatly varies.
無電解メッキ法によって電極を形成することができれ
ば、前述の電極間のマイグレーションの問題は解消する
が、有底筒形セラミック素体に対しては、セラミック素
体をメッキ液に浸漬した際、筒内にメッキ液が入りにく
く、またメッキ液が入ったとしても、化学反応によって
発生したＨ２の気泡が放出されにくく、筒形セラミック
素体の内面にはメッキ金属膜が充分形成されない。尚、
無底筒形セラミック素体に対してはこのような無電解メ
ッキ法を用いることもできるが、比較的大容量の筒形コ
ンデンサを形成する際、有底筒形セラミック素体を用い
ることが必要となる。If the electrodes can be formed by the electroless plating method, the problem of migration between the electrodes described above can be solved, but for the cylindrical ceramic body with a bottom, when the ceramic body is immersed in the plating solution, It is difficult for the plating solution to enter the inside, and even if the plating solution enters, the bubbles of H 2 generated by the chemical reaction are difficult to be released, and the plated metal film is not sufficiently formed on the inner surface of the cylindrical ceramic body. still,
Such an electroless plating method can be used for a bottomless cylindrical ceramic element, but it is necessary to use a bottomed cylindrical ceramic element when forming a relatively large capacity cylindrical capacitor. Becomes
この発明の目的は、有底筒形セラミック素体を用い、し
かも無電解メッキ法によって電極を形成することにより
信頼性の向上と、静電容量のばらつきを低減することを
可能とした有底筒形コンデンサを提供することにある。An object of the present invention is to use a bottomed cylindrical ceramic body and to form an electrode by an electroless plating method to improve reliability and reduce variations in capacitance. Type capacitor.
(d)問題点を解決するための手段 この発明の有底筒形コンデンサは、有底筒形セラミック
素体の内面の略全面に導電性ペーストの塗布，焼き付け
から成る内部電極が形成され、前記有底筒形セラミック
素体の外面に無電解メッキ膜から成る外部電極が形成さ
れるとともに、前記有底筒形セラミック素体の開口端面
に形成された前記無電解メッキ膜が除去されてなる。(d) Means for Solving the Problems In the bottomed cylindrical capacitor of the present invention, an internal electrode formed by applying and baking a conductive paste is formed on substantially the entire inner surface of the bottomed cylindrical ceramic body, External electrodes made of an electroless plating film are formed on the outer surface of the bottomed cylindrical ceramic body, and the electroless plating film formed on the open end surface of the bottomed cylindrical ceramic body is removed.
(e)作用 この発明の有底筒形コンデンサにおいては、有底筒形セ
ラミック素体の内面に導電性ペーストの塗布，焼き付け
により、内部電極が形成され、また無電解メッキにより
セラミック素体の外面にメッキ金属膜からなる外部電極
が形成される。このとき筒形セラミック素体の開口端面
及び開口部付近にもメッキ金属膜が形成されるが、開口
端面のメッキ金属膜が除去されたことにより、内部電極
と外部電極が分離される。このように筒形セラミック素
体の開口端面のエッジ部分まで両電極が形成された有底
筒形コンデンサが構成される。(e) Action In the bottomed cylindrical capacitor of the present invention, internal electrodes are formed by applying and baking a conductive paste on the bottomed cylindrical ceramic body, and the outer surface of the ceramic body is electroless plated. An external electrode made of a plated metal film is formed on. At this time, a plated metal film is also formed on the opening end surface of the cylindrical ceramic body and in the vicinity of the opening. However, by removing the plating metal film on the opening end surface, the internal electrode and the external electrode are separated. In this way, a bottomed cylindrical capacitor in which both electrodes are formed up to the edge portion of the opening end surface of the cylindrical ceramic body is configured.
(f)実施例 第１図（Ａ）〜（Ｇ）はこの発明の有底筒形コンデンサ
を構成する際の各手順を表す図である。(f) Example FIGS. 1 (A) to 1 (G) are views showing each procedure for forming the bottomed tubular capacitor of the present invention.
同図（Ｇ）において１は有底筒形セラミック素体であ
り、その内面に導電性ペーストの塗布，焼き付けによる
電極２が形成され、外面にメッキ金属膜からなる電極３
が形成されている。電極３の外周面には絶縁性樹脂４が
コーティングされている。筒内部には導電性ペースト５
が充填されている。導電性ペースト５とメッキ金属膜３
の露出部分に更にメッキ金属膜６が形成されている。In FIG. 1G, reference numeral 1 is a bottomed cylindrical ceramic body, on the inner surface of which an electrode 2 is formed by applying and baking a conductive paste, and on the outer surface thereof an electrode 3 made of a plated metal film.
Are formed. An insulating resin 4 is coated on the outer peripheral surface of the electrode 3. Conductive paste 5 inside the cylinder
Is filled. Conductive paste 5 and plated metal film 3
A plated metal film 6 is further formed on the exposed portion of the.
次に前述の有底筒形コンデンサの製造工程について第１
図（Ａ）〜（Ｇ）の図番と対応させて説明する。Next, regarding the manufacturing process of the above-mentioned bottomed cylindrical capacitor,
Description will be made in correspondence with the drawing numbers in FIGS.
（Ａ）有底円筒形セラミック素体を形成する。(A) A bottomed cylindrical ceramic body is formed.
（Ｂ）セラミック素体の内面にＡｇペースト等の導電性
ペーストをピン方式等で塗布し、焼き付けることにより
厚膜電極２を形成する。なお、厚膜電極２がセラミック
素体の開口端に付着することがあるが、これは後述する
研磨により除去されるため問題とはならないが、あらか
じめ溶剤によって除去しておくことが好ましい。(B) The thick film electrode 2 is formed by applying a conductive paste such as Ag paste by a pin method or the like to the inner surface of the ceramic body and baking it. The thick film electrode 2 may adhere to the open end of the ceramic body, but this is not a problem because it is removed by polishing described later, but it is preferably removed in advance with a solvent.
（Ｃ）セラミック素体全体をメッキ液に浸漬し無電解Ｎ
ｉメッキ、または無電解Ｃｕメッキもしくは無電解Ｎｉ
メッキをした後、Ｃｕの電気メッキを行い、メッキ金属
膜３を形成する。このとき、筒内にはメッキ液が浸入せ
ず、セラミック素体の外面と開口部付近の内側に金属膜
が形成される。(C) Electroless N by immersing the whole ceramic body in the plating solution
i plating, electroless Cu plating or electroless Ni
After plating, Cu electroplating is performed to form a plated metal film 3. At this time, the plating solution does not penetrate into the cylinder, and a metal film is formed on the outer surface of the ceramic body and the inside of the vicinity of the opening.
（Ｄ）セラミック素体の開口端面をラップ研磨法によっ
て機械的に研磨して、セラミック素体の開口端面に形成
されていたメッキ金属膜３を除去する。これにより内面
の電極２と外面の電極３とが分離される。これにより形
成される電極の寸法精度は±０．０１mm程度であり、静
電容量のばらつきを低くおさえることができる。尚、こ
の研磨量を調整することにより、所定の静電容量に設定
することができる。(D) The open end surface of the ceramic body is mechanically polished by a lapping method to remove the plated metal film 3 formed on the open end surface of the ceramic body. As a result, the electrode 2 on the inner surface and the electrode 3 on the outer surface are separated. The dimensional accuracy of the electrode formed by this is about ± 0.01 mm, and the variation in capacitance can be suppressed to a low level. By adjusting this polishing amount, it is possible to set a predetermined electrostatic capacity.
（Ｅ）セラミック素体の底部を把持してエポキシ系塗料
等のコーティング樹脂中に浸漬し、乾燥硬化することに
より、外周面に絶縁膜４を形成する。その後、この絶縁
膜上に静電容量の値等を表すカラーコードを転写する。(E) The insulating film 4 is formed on the outer peripheral surface by gripping the bottom of the ceramic body, immersing it in a coating resin such as epoxy-based paint, and drying and hardening. After that, a color code representing the value of capacitance or the like is transferred onto this insulating film.
（Ｆ）セラミック素体の開口端部をＮｉ，Ｃｕ，Ｚｎ等
の導電性ペーストに浸漬し、例えば圧入により、導電性
ペースト５を筒内部に充填するとともに開口端部に塗布
する。その後、１５０℃前後で加熱して乾燥硬化させ
る。もちろんこの時筒内全部に充填しなくとも開口部を
ふさぐ程度でも同様の効果は得られる。(F) The opening end of the ceramic body is dipped in a conductive paste such as Ni, Cu, or Zn, and the conductive paste 5 is filled into the inside of the cylinder and pressed onto the opening end by, for example, press fitting. Then, it is heated at around 150 ° C. to dry and cure. Of course, at this time, the same effect can be obtained even if the inside of the cylinder is not completely filled with the opening.
（Ｇ）前記導電性ペースト５の乾燥後、セラミック素体
全体をメッキ液に浸漬して電気メッキを行う。例えば、
Ｎｉメッキを行い、下地金属膜を形成した後、更にＳｎ
またはＳｎ−Ｐｂのメッキを行う。(G) After the conductive paste 5 is dried, the entire ceramic body is immersed in a plating solution to perform electroplating. For example,
Ni plating is performed to form a base metal film, and then Sn is further applied.
Alternatively, Sn-Pb plating is performed.
以上のようにして両端に接続端子６，６が形成された筒
形コンデンサが得られる。尚、この後必要に応じてこの
コンデンサの両端に金属キャップを冠着してキャップ付
コンデンサを構成することもできる。As described above, the cylindrical capacitor having the connection terminals 6 and 6 formed at both ends is obtained. After that, if necessary, a metal cap may be attached to both ends of the capacitor to form a capacitor with a cap.
（ｇ）発明の効果 以上のようにこの発明によれば、有底筒形セラミック素
体でありながら無電解メッキ法により形成した金属膜を
電極として用いることができるため、Ａｇの厚膜電極に
よる電極間のマイグレーションが生ずることなく、信頼
性が向上し、しかも電極の寸法精度が高くなるため、静
電容量のばらつきを低くをおさえることができる。ま
た、有底筒形セラミック素体き底面にもメッキ金属膜が
形成されるため、取得容量が向上する。(G) Effect of the Invention As described above, according to the present invention, since the metal film formed by the electroless plating method can be used as the electrode even though it is the bottomed cylindrical ceramic body, the thick film electrode of Ag is used. Since there is no migration between the electrodes, the reliability is improved, and moreover, the dimensional accuracy of the electrodes is high, so that the variation in capacitance can be suppressed. Further, since the plated metal film is formed on the bottom surface of the bottomed cylindrical ceramic element body, the acquisition capacity is improved.
第１図（Ａ）〜（Ｇ）はこの発明の実施例である有底筒
形コンデンサとその製造工程を表す断面図である。第２
図，第３図は従来の筒形コンデンサを表す側断面図であ
る。 １−有底筒形セラミック素体、 ２−導電性ペースト、 ３−メッキ金属膜、４−絶縁膜、 ５−導電性ペースト、６−メッキ金属膜。1 (A) to 1 (G) are cross-sectional views showing a bottomed cylindrical capacitor according to an embodiment of the present invention and its manufacturing process. Second
FIG. 3 and FIG. 3 are side sectional views showing a conventional cylindrical capacitor. 1-bottomed cylindrical ceramic body, 2-conductive paste, 3-plated metal film, 4-insulating film, 5-conductive paste, 6-plated metal film.
Claims (1)
導電性ペーストの塗布，焼き付けから成る内部電極が形
成され、前記有底筒形セラミック素体の外面に無電解メ
ッキ膜から成る外部電極が形成されるとともに、前記有
底筒形セラミック素体の開口端面に形成された前記無電
解メッキ膜が除去されてなる有底筒形コンデンサ。1. An internal electrode formed by applying and baking a conductive paste is formed on substantially the entire inner surface of a bottomed cylindrical ceramic body, and an electroless plating film is formed on the outer surface of the bottomed cylindrical ceramic body. A cylindrical capacitor with a bottom formed by forming an external electrode and removing the electroless plating film formed on the open end surface of the cylindrical ceramic body with a bottom.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62067615A JPH0640536B2 (en) | 1987-03-20 | 1987-03-20 | Bottomed tubular capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62067615A JPH0640536B2 (en) | 1987-03-20 | 1987-03-20 | Bottomed tubular capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63233515A JPS63233515A (en) | 1988-09-29 |
| JPH0640536B2 true JPH0640536B2 (en) | 1994-05-25 |
Family
ID=13350043
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62067615A Expired - Fee Related JPH0640536B2 (en) | 1987-03-20 | 1987-03-20 | Bottomed tubular capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0640536B2 (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6236523U (en) * | 1985-08-22 | 1987-03-04 |
-
1987
- 1987-03-20 JP JP62067615A patent/JPH0640536B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63233515A (en) | 1988-09-29 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |