JPH0630319B2 - Manufacturing method of bottomed cylindrical capacitor - Google Patents
Manufacturing method of bottomed cylindrical capacitorInfo
- Publication number
- JPH0630319B2 JPH0630319B2 JP62067613A JP6761387A JPH0630319B2 JP H0630319 B2 JPH0630319 B2 JP H0630319B2 JP 62067613 A JP62067613 A JP 62067613A JP 6761387 A JP6761387 A JP 6761387A JP H0630319 B2 JPH0630319 B2 JP H0630319B2
- Authority
- JP
- Japan
- Prior art keywords
- bottomed cylindrical
- plating
- ceramic body
- film
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000003990 capacitor Substances 0.000 title claims description 17
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 238000007747 plating Methods 0.000 claims description 29
- 239000000919 ceramic Substances 0.000 claims description 26
- 238000007772 electroless plating Methods 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 description 11
- 239000002184 metal Substances 0.000 description 11
- 239000007788 liquid Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000010304 firing Methods 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000013508 migration Methods 0.000 description 2
- 230000005012 migration Effects 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- RNWHGQJWIACOKP-UHFFFAOYSA-N zinc;oxygen(2-) Chemical compound [O-2].[Zn+2] RNWHGQJWIACOKP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Ceramic Capacitors (AREA)
Description
【発明の詳細な説明】 (a)産業上の利用分野 この発明は、有底筒形セラミック素体の内面と外面に電
極を形成した有底筒形コンデンサの製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application The present invention relates to a method of manufacturing a bottomed cylindrical capacitor in which electrodes are formed on the inner surface and the outer surface of a bottomed cylindrical ceramic body.
(b)従来の技術 従来、円筒形セラミック素体の内外面に電極を形成する
ことにより、円筒形のチップコンデンサが製造されてい
る。第３図はそのコンデンサの構造を表す断面図であ
る。１は円筒形セラミック素体であり、その外面と内面
に導電性ペーストの塗布，焼成からなる電極２ａ，２ｂ
が形成されていて、これらの電極上にさらに無電解Ｃｕ
メッキによる金属膜３ａ，３ｂが形成されている。(b) Conventional Technology Conventionally, a cylindrical chip capacitor is manufactured by forming electrodes on the inner and outer surfaces of a cylindrical ceramic body. FIG. 3 is a sectional view showing the structure of the capacitor. Reference numeral 1 is a cylindrical ceramic body, and electrodes 2a and 2b formed by coating and firing a conductive paste on the outer surface and the inner surface thereof.
Are formed, and electroless Cu is further formed on these electrodes.
Metal films 3a and 3b are formed by plating.
(c)発明が解決しようとする問題点 この種の筒形コンデンサにおいては、セラミック素体と
して有底の筒形セラミック素体を用いれば、内部電極と
外部電極間の対向面積を広くとることができ、取得容量
が増大する。ところが、有底の筒形セラミック素体をメ
ッキ液に浸漬して無電解メッキを行おうとしても、筒内
部の気泡が放出されにくいため、メッキ液が筒内に侵入
しにくく、またメッキ液が入ったとしても化学反応によ
って発生したＨ２の気泡が筒外に放出されにくい。その
結果、たとえば、有底筒形セラミック素体をそのままメ
ッキ液中に浸漬したとしても第４図に示すように、有底
筒形セラミック素体１の外周面にのみメッキ金属膜４が
形成されるのみであり、内面には形成されない。従っ
て、有底筒形セラミック素体を用いる場合は、内面は導
電性ペーストによる厚膜電極のまま用いなければならな
い。そのため、内部電極として亜鉛ペーストをそのまま
用いた場合は、等価直列抵抗（ＥＳＲ）が大きくなり、
また銀ペーストをそのまま用いた場合はマイグレーショ
ンの問題が生じ、品質や信頼性の面での問題が生じる。(c) Problems to be Solved by the Invention In this type of cylindrical capacitor, if a cylindrical ceramic body with a bottom is used as the ceramic body, the facing area between the internal electrode and the external electrode can be widened. This increases the acquisition capacity. However, even if the bottomed cylindrical ceramic body is immersed in the plating solution for electroless plating, the bubbles in the cylinder are hard to be released, so the plating solution does not easily enter the cylinder and the plating solution Even if it enters, the bubbles of H 2 generated by the chemical reaction are not easily released to the outside of the cylinder. As a result, for example, even if the bottomed cylindrical ceramic element body is immersed in the plating solution as it is, the plated metal film 4 is formed only on the outer peripheral surface of the bottomed cylindrical ceramic element body 1 as shown in FIG. However, it is not formed on the inner surface. Therefore, when using the bottomed cylindrical ceramic body, the inner surface must be used as it is as a thick film electrode made of a conductive paste. Therefore, when the zinc paste is used as it is as the internal electrode, the equivalent series resistance (ESR) becomes large,
Further, when the silver paste is used as it is, a migration problem occurs, which causes problems in terms of quality and reliability.
この発明の目的は、有底筒形セラミック素体を用い、し
かも無電解メッキ法によって電極を形成することを可能
とした有底筒形コンデンサの製造方法を提供することに
ある。An object of the present invention is to provide a method of manufacturing a bottomed cylindrical capacitor, which uses a bottomed cylindrical ceramic body and is capable of forming electrodes by electroless plating.
(d)問題点を解決するための手段 この発明の有底筒形コンデンサの製造方法は、帯状の間
隔を隔てて有底筒形セラミック素体の内外面に導電性ペ
ーストを塗布し焼き付けることによって下地電極膜を形
成した後、前記有底筒形セラミック素体を超音波振動が
印加されたメッキ液中に浸漬し、無電解メッキすること
により前記有底筒形セラミック素体の内外面の前記下地
電極膜上にメッキ電極膜を形成することを特徴としてい
る。(d) Means for Solving Problems The method for manufacturing a bottomed cylindrical capacitor of the present invention is a method of applying a conductive paste to the inner and outer surfaces of a bottomed cylindrical ceramic body with a band-shaped interval, and baking it. After forming the base electrode film, the bottomed cylindrical ceramic body is immersed in a plating liquid to which ultrasonic vibration is applied, and electroless plating is performed to form the bottomed cylindrical ceramic body on the inner and outer surfaces. The feature is that a plated electrode film is formed on the base electrode film.
(e)作用 この発明の有底筒形コンデンサの製造方法においては、
帯状の間隔を隔てて有底筒形セラミック素体の内外面に
導電性ペーストの塗布・焼き付けによる下地電極膜が形
成されるため、その後の無電解メッキの工程で、下地電
極膜上にメッキ電極膜が確実に析出して、短時間に所定
膜厚の電極を有する有底筒形コンデンサが得られる。ま
た、超音波振動が印加されたメッキ液中で無電解メッキ
されるため、筒内に溜まる気泡がメッキ液中に容易に放
出され、メッキ液が有底セラミック素体の筒内部に侵入
し、これによりセラミック素体の内面に形成されている
下地電極膜上にもメッキ電極膜が確実に形成される。(e) Action In the method for manufacturing a bottomed cylindrical capacitor of the present invention,
Since the base electrode film is formed by applying and baking a conductive paste on the inner and outer surfaces of the bottomed cylindrical ceramic body with a band-shaped space, plating electrodes are formed on the base electrode film in the subsequent electroless plating process. A film is reliably deposited, and a bottomed cylindrical capacitor having an electrode having a predetermined film thickness can be obtained in a short time. Further, since electroless plating is performed in the plating liquid to which ultrasonic vibration is applied, the air bubbles accumulated in the cylinder are easily released into the plating liquid, and the plating liquid enters the cylinder of the bottomed ceramic body, This ensures that the plated electrode film is also formed on the base electrode film formed on the inner surface of the ceramic body.
(f)実施例 第１図はこの発明の有底筒形コンデンサの製造方法によ
り製造された有底筒形コンデンサの製造を表す断面図で
ある。同図において１は有底筒形セラミック素体であ
り、その内面と外面には導電性ペーストの塗布，焼成に
よる厚膜下地電極２ａ，２ｂが形成され、この下地電極
の表面にさらに無電解メッキ法による金属膜３ａ，３ｂ
がそれぞれ形成されている。(f) Example FIG. 1 is a sectional view showing the manufacture of a bottomed cylindrical capacitor manufactured by the method of manufacturing a bottomed cylindrical capacitor of the present invention. In the figure, reference numeral 1 is a bottomed cylindrical ceramic body, and thick film base electrodes 2a and 2b are formed on the inner surface and the outer surface by applying and firing a conductive paste, and the surface of the base electrode is further electroless plated. Metal films 3a, 3b by the method
Are formed respectively.
このようなコンデンサを製造する際、先ずＡｇペースト
やＺｎペーストなどの導電性ペーストが塗布されたピン
を筒内部に挿入することにより、導電性ペーストを転写
し、また、導電性ペーストが塗布されたローラを外面に
接触させ、回転することにより転写し、その後、焼成す
ることにより筒の内外面に下地電極を形成する。次に第
１図に示すＢの部分に帯状のメッキレジスト膜を塗布等
により形成した後、Ｃｕのメッキ液中に浸漬し、無電解
メッキを行う。この際、メッキ槽あるいはメッキ液に対
して直接超音波振動が印加される。セラミック素体の筒
内の気泡はこの超音波振動により放出されるとともにメ
ッキ液が侵入し、筒内部にも無電解メッキが行われる。
メッキの化学反応により、Ｈ２の気泡が発生するが、連
続的に超音波振動を印加することにより筒内部にはＨ２
の気泡が溜ることなく、順次放出され、円滑かつ確実に
メッキ金属膜が形成される。In manufacturing such a capacitor, first, a pin coated with a conductive paste such as Ag paste or Zn paste is inserted into the cylinder to transfer the conductive paste, and the conductive paste is coated. The roller is brought into contact with the outer surface, is transferred by rotating, and is then baked to form a base electrode on the inner and outer surfaces of the cylinder. Next, a band-shaped plating resist film is formed on the portion B shown in FIG. 1 by coating or the like, and then immersed in a Cu plating solution to perform electroless plating. At this time, ultrasonic vibration is directly applied to the plating tank or the plating solution. Air bubbles in the cylinder of the ceramic body are released by this ultrasonic vibration, and the plating solution penetrates into the cylinder, and electroless plating is performed inside the cylinder.
By chemical reaction of the plating, but bubbles H 2 is generated, the inner cylindrical portion by applying a continuous ultrasonic vibrations H 2
The bubbles are sequentially discharged without accumulating, and the plated metal film is formed smoothly and surely.
下地電極がＡｇの場合、Ｃｕのメッキ膜の膜厚が０．５
μｍに達するまで、また下地電極がＺｎの場合、２μｍ
に達するまで上記無電解メッキを行った後、第１図に示
すＢの部分に予め形成しておいたメッキレジスト膜を除
去することにより、内部電極と外部電極を分離する。な
お、実験によれば厚膜電極が部分的に形成されたセラミ
ック素体に対して無電解メッキする場合、超音波振動の
作用により、メッキ金属膜は厚膜電極上に析出し易く、
セラミック素体上に析出し難いことが判明している。し
たがって、前述のメッキレジスト膜は必ずしも必要では
なく、条件によって下地電極膜上にのみメッキ金属膜を
選択的に形成することが可能である。When the base electrode is Ag, the thickness of the Cu plating film is 0.5
up to μm, or 2 μm when the base electrode is Zn
After the above electroless plating is performed, the internal electrode and the external electrode are separated by removing the plating resist film previously formed in the portion B shown in FIG. According to the experiment, when electroless plating is performed on the ceramic body in which the thick film electrode is partially formed, the plated metal film is easily deposited on the thick film electrode by the action of ultrasonic vibration,
It has been found that it is difficult to deposit on the ceramic body. Therefore, the above-mentioned plating resist film is not always necessary, and it is possible to selectively form the plating metal film only on the base electrode film depending on the conditions.
次に無電解メッキ条件と形成される膜厚について示す。
第２図は、第１図に示した寸法（単位mm）の有底筒形セ
ラミック素体に対してＡｇペーストの塗布，焼成により
形成された下地電極上に無電解Ｃｕメッキを２０分間に
行った場合の筒内面中央部（矢印Ａ部）のメッキ膜厚に
ついて表している。図に示すように、大気圧の下で無電
解メッキを行った場合、超音波出力が２６０Ｗ／のと
き0.3μｍの膜厚が得られる。因みに筒外面の下地電極
上に形成されるＣｕの膜厚は、大気圧の下で超音波振動
を印加しない状態で0.49μｍであり、超音波振動を印加
することにより、筒内面も外面と同等の膜厚が得られる
ことがわかる。さらに、大気圧中で素体をメッキ液中に
投入し、減圧状態で無電解メッキを行った場合、あるい
は大気圧中で部品をメッキ液中に投入し、加圧状態で無
電解メッキを行うことにより、メッキ膜の析出が促進さ
れる。例えば７２０mmＨｇに減圧するとともに２６０Ｗ
／の超音波振動が加えることにより、０．４８μｍの
膜厚が得られ、また４kg／cm2に加圧するとともに２６
０Ｗ／の超音波の出力を加えることにより、０．８０
μｍの膜厚が得られる。このような超音波振動の出力を
ある程度以上に設定することにより筒内部にもメッキ金
属膜が形成され、さらに減圧または加圧して筒内部の気
泡の放出を速やかに行うことにより、短時間にメッキ金
属膜を形成することができる。Next, the electroless plating conditions and the film thickness formed will be shown.
FIG. 2 shows electroless Cu plating for 20 minutes on the base electrode formed by coating and firing Ag paste on the bottomed cylindrical ceramic body having the dimensions (unit: mm) shown in FIG. In this case, the plating film thickness at the center portion (arrow portion A) of the cylinder inner surface is shown. As shown in the figure, when electroless plating is performed under atmospheric pressure, a film thickness of 0.3 μm can be obtained when the ultrasonic output is 260 W /. By the way, the film thickness of Cu formed on the base electrode on the outer surface of the cylinder is 0.49 μm without applying ultrasonic vibration under atmospheric pressure. By applying ultrasonic vibration, the inner surface of the cylinder is also equal to the outer surface. It can be seen that the film thickness is obtained. Furthermore, when the element body is placed in the plating solution at atmospheric pressure and electroless plating is performed under reduced pressure, or when the parts are placed in the plating solution at atmospheric pressure and electroless plating is performed under pressure. As a result, the deposition of the plating film is promoted. For example, decompress to 720mmHg and 260W
By applying ultrasonic vibration of /, a film thickness of 0.48 μm can be obtained, and while applying a pressure of 4 kg / cm 2 ,
0.80 by adding 0 W / ultrasonic power
A film thickness of μm is obtained. By setting the output of such ultrasonic vibration above a certain level, a plated metal film is also formed inside the cylinder, and further depressurization or pressurization is performed to rapidly discharge the air bubbles inside the cylinder, thereby plating in a short time. A metal film can be formed.
(g)発明の効果 以上のようにこの発明によれば、有底筒形セラミック素
体でありながら無電解メッキ法により筒の内面にメッキ
金属膜を形成することができるため、Ｚｎ電極のＥＳＲ
の問題やＡｇ電極によるマイグレーションの問題が生ず
ることなく、品質の良い信頼性の高いコンデンサを製造
することができる。(g) Effects of the Invention As described above, according to the present invention, since the plated metal film can be formed on the inner surface of the cylinder by the electroless plating method even though it is the bottomed cylindrical ceramic body, the ESR of the Zn electrode is reduced.
It is possible to manufacture a high-quality and highly reliable capacitor without causing the above problem and the problem of migration due to the Ag electrode.
第１図はこの発明の実施例である有底筒形コンデンサの
製造方法により製造されたコンデンサの構造を表す断面
図、第２図は各種メッキ条件と形成される金属膜の膜厚
との関係を表す図、第３図は従来の筒形コンデンサの構
造を表す断面図、第４図は従来技術を説明するための図
である。 １……有底筒形セラミック素体、 ２ａ，２ｂ……下地電極、 ３ａ，３ｂ……メッキ金属膜。FIG. 1 is a sectional view showing the structure of a capacitor manufactured by the method for manufacturing a bottomed cylindrical capacitor according to an embodiment of the present invention, and FIG. 2 is a relationship between various plating conditions and the film thickness of a metal film to be formed. FIG. 3, FIG. 3 is a sectional view showing the structure of a conventional cylindrical capacitor, and FIG. 4 is a view for explaining the conventional technique. 1 ... bottomed cylindrical ceramic body, 2a, 2b ... base electrode, 3a, 3b ... plated metal film.
Claims (1)
体の内外面に導電性ペーストを塗布し焼き付けることに
よって下地電極膜を形成した後、前記有底筒形セラミッ
ク素体を超音波振動が印加されたメッキ液中に浸漬し、
無電解メッキすることにより前記有底筒形セラミック素
体の内外面の前記下地電極膜上にメッキ電極膜を形成す
ることを特徴とする有底筒形コンデンサの製造方法。1. A base electrode film is formed by applying and baking a conductive paste on the inner and outer surfaces of a bottomed cylindrical ceramic body at intervals of a strip shape, and then the bottomed cylindrical ceramic body is subjected to ultrasonic waves. Immerse in the plating solution to which vibration is applied,
A method for manufacturing a bottomed cylindrical capacitor, characterized in that a plating electrode film is formed on the inner and outer surfaces of the bottomed cylindrical ceramic body by electroless plating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62067613A JPH0630319B2 (en) | 1987-03-20 | 1987-03-20 | Manufacturing method of bottomed cylindrical capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62067613A JPH0630319B2 (en) | 1987-03-20 | 1987-03-20 | Manufacturing method of bottomed cylindrical capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63232408A JPS63232408A (en) | 1988-09-28 |
| JPH0630319B2 true JPH0630319B2 (en) | 1994-04-20 |
Family
ID=13349979
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62067613A Expired - Fee Related JPH0630319B2 (en) | 1987-03-20 | 1987-03-20 | Manufacturing method of bottomed cylindrical capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0630319B2 (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57154920U (en) * | 1981-03-23 | 1982-09-29 | ||
| JPS6236523U (en) * | 1985-08-22 | 1987-03-04 |
-
1987
- 1987-03-20 JP JP62067613A patent/JPH0630319B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63232408A (en) | 1988-09-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |