JPH064341B2 - Thermal head - Google Patents
Thermal headInfo
- Publication number
- JPH064341B2 JPH064341B2 JP63014175A JP1417588A JPH064341B2 JP H064341 B2 JPH064341 B2 JP H064341B2 JP 63014175 A JP63014175 A JP 63014175A JP 1417588 A JP1417588 A JP 1417588A JP H064341 B2 JPH064341 B2 JP H064341B2
- Authority
- JP
- Japan
- Prior art keywords
- mounting plate
- adhesive
- thermal head
- convex portion
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000853 adhesive Substances 0.000 claims description 27
- 230000001070 adhesive effect Effects 0.000 claims description 27
- 239000000758 substrate Substances 0.000 claims description 27
- 238000010438 heat treatment Methods 0.000 claims description 12
- 238000000034 method Methods 0.000 claims 1
- 239000000919 ceramic Substances 0.000 description 18
- 230000000694 effects Effects 0.000 description 7
- 239000010409 thin film Substances 0.000 description 4
- 239000010408 film Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000007651 thermal printing Methods 0.000 description 2
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- KGWWEXORQXHJJQ-UHFFFAOYSA-N [Fe].[Co].[Ni] Chemical compound [Fe].[Co].[Ni] KGWWEXORQXHJJQ-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
Landscapes
- Electronic Switches (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 この発明は，サーマルヘッドに係り，特に，セラミック
基板上に，薄膜パターンまたは厚膜パターンによる多数
の発熱素子を形成し，該発熱素子を選択的に発熱させて
感熱印刷させる感熱印刷装置に用いるサーマルヘッドに
関する。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermal head, and more particularly, to forming a large number of heating elements in a thin film pattern or a thick film pattern on a ceramic substrate and selecting the heating elements. The present invention relates to a thermal head for use in a thermal printing apparatus that heats the surface of the head to perform thermal printing.
サーマルヘッドは，セラミック基板上に薄膜抵抗体パタ
ーンまたは厚膜抵抗体パターンによる多数の発熱素子を
形成し，これを金属製の取付板に取付けて形成される。The thermal head is formed by forming a large number of heating elements with a thin film resistor pattern or a thick film resistor pattern on a ceramic substrate, and attaching these to a metal mounting plate.
このサーマルヘッドは，使用時には，発熱体の発熱で約
３０℃温度も上昇し，使用温度範囲を例えば５℃〜４０
℃とした場合には，最高約７０℃にも達することにな
る。このため，発熱素子が形成されるセラミック板と，
金属製等の取付板との間の熱膨張係数の差によってバイ
メタル効果が生じ，発熱素子と記録紙との当りが悪くな
り，サーマルヘッドの長手方向において印刷濃度むらが
生ずる等の問題点を生じていた。When this thermal head is used, the temperature of the heating element rises by about 30 ° C. due to the heat generated by the heating element.
When the temperature is set to ℃, the maximum temperature will be about 70 ℃. Therefore, the ceramic plate on which the heating element is formed,
Due to the difference in the coefficient of thermal expansion between the mounting plate made of metal or the like, a bimetal effect is generated, the contact between the heating element and the recording paper is deteriorated, and uneven printing density occurs in the longitudinal direction of the thermal head. Was there.
そのため，従来より，この薄膜パターンによる発熱素子
を形成したセラミック基板と，それを取付ける取付板の
接着構造によって，バイメタル効果を極力低く押さえて
いる。Therefore, conventionally, the bimetal effect is suppressed as low as possible by the bonding structure of the ceramic substrate on which the thin-film pattern heating element is formed and the mounting plate for mounting it.
第２図は，この従来例を示すものであり，(A)は斜視
図，(B)は断面図を示している。第２図において，１は
セラミック基板であり，図示はしていないが，この上に
薄膜抵抗体または厚膜抵抗体による発熱素子が形成され
ている。２は鉄板，或いは鉄−ニッケル−コバルト系合
金等よりなる取付板であり，中央部に溝７が形成されて
いる。この溝中に硬化後にゴム弾性を有する接着剤８
（以下ゴム系接着剤）を充てんし，これによって，セラ
ミック基板を接着する。FIG. 2 shows this conventional example, where (A) is a perspective view and (B) is a sectional view. In FIG. 2, reference numeral 1 denotes a ceramic substrate, which is not shown in the drawing, on which a heating element made of a thin film resistor or a thick film resistor is formed. Reference numeral 2 is an iron plate or a mounting plate made of an iron-nickel-cobalt alloy or the like, and a groove 7 is formed in the central portion. Adhesive 8 having rubber elasticity after curing in this groove
(Hereinafter referred to as rubber-based adhesive) is filled, and the ceramic substrate is bonded by this.
これによれば，接着剤８が中央部に限定されており，さ
らに弾性を有することから，セラミック基板と取付板と
の間の膨張の差に基づくバイメタル作用の発生を最小限
に抑えることができる。According to this, since the adhesive 8 is limited to the central portion and further has elasticity, it is possible to minimize the occurrence of the bimetal action due to the difference in expansion between the ceramic substrate and the mounting plate. .
ところが，この従来のセラミック基板の取付け構造で
は，接着剤の塗布量を一定にすることが困難であり，安
定した特性を得ることが困難であるという問題点を有す
る。However, this conventional ceramic substrate mounting structure has a problem in that it is difficult to make the amount of adhesive applied constant and it is difficult to obtain stable characteristics.
例えば，接着剤が少ない場合は，両者の接着面積が少な
くなり接着力，熱伝導性に差が生ずることになる。ま
た，接着剤が多い場合は，接着剤が溝部以外に流れ出
し，溝以外での接着部分が多くなり，本来目的とするバ
イメタル効果の抑えが不十分となる。For example, when the amount of the adhesive is small, the adhesive area between the two becomes small, resulting in a difference in adhesive force and thermal conductivity. Further, when the amount of the adhesive is large, the adhesive flows out to other than the groove portion, and the adhesive portion other than the groove is increased, so that the originally intended bimetal effect is not sufficiently suppressed.
この発明は，このような点に鑑みてなされたものであ
り，セラミック基板と取付板との熱膨張率の差に基づく
バイメタル効果を極力低く抑さえると共に，接着剤塗布
量のバラツキを抑さえて，安定した特性のサーマルヘッ
ドを得ることを目的とする。The present invention has been made in view of the above point, and suppresses the bimetal effect based on the difference in the coefficient of thermal expansion between the ceramic substrate and the mounting plate as low as possible and also suppresses the variation in the amount of adhesive applied. The purpose is to obtain a thermal head with stable characteristics.
上述の課題を解決するため，この発明においては，取付
板に溝を設けると共に、該溝の中央部に凸部を設け、基
板を前記取付板側部上に載置すると共に、該凸部に付着
せしめた接着剤により、基板と取付板を接着せしめ、取
付板の溝中央部に設けた凸部の頂部は、取付板の表面よ
り低く構成する。In order to solve the above-mentioned problems, in the present invention, a groove is provided in the mounting plate, a convex portion is provided in the central portion of the groove, the substrate is placed on the side portion of the mounting plate, and the convex portion is provided. The substrate and the mounting plate are adhered by the adhered adhesive, and the top of the convex portion provided in the center of the groove of the mounting plate is lower than the surface of the mounting plate.
これによれば，接着剤の塗布を凸部頂点のみで行ない，
余分な接着剤を，その側部の溝部分に流し込むことがで
きるので，セラミック基板と取付板の接着面積を一定に
することができる。しかもこれにより凸部と基板との距
離や凸部の幅をかえてサーマルヘッドの印画濃度特性つ
まり熱特性を最適にすることができる。According to this, the adhesive is applied only at the apex of the convex portion,
Since the excess adhesive can be poured into the groove portion on the side portion, the adhesive area between the ceramic substrate and the mounting plate can be made constant. Moreover, this makes it possible to optimize the print density characteristic of the thermal head, that is, the thermal characteristic, by changing the distance between the convex portion and the substrate and the width of the convex portion.
第１図はこの発明の一実施例であり，第１図(A)は斜視
図，第１図(B)は断面図である。また，第２図の従来例
と同一の部材については同一の番号が付与してあるの
で，それらの部材についての詳細な説明は省く。FIG. 1 is an embodiment of the present invention. FIG. 1 (A) is a perspective view and FIG. 1 (B) is a sectional view. Further, since the same members as those of the conventional example shown in FIG. 2 are designated by the same reference numerals, detailed description of those members will be omitted.
この発明においては，セラミック基板１と取付板２とを
接着するための接着剤を充てんする溝として，中央部に
凸部５を有し，その両側に溝３，４を有する溝構造とし
ている。In the present invention, as a groove filled with an adhesive for bonding the ceramic substrate 1 and the mounting plate 2, a groove structure having a convex portion 5 in the central portion and grooves 3 and 4 on both sides thereof is adopted.
第１図(B)に示すように，幅Ｗ１セラミック基板に対
し，それより幅広のＷ２の取付板を接着固定する場合
に，巾ａの凸部５を中央に有し，その両側に溝３，４を
有する溝構造とする。そして，この凸部５の高さを，両
側より低くしている。即ち，溝３，４の底部から上面ま
での高さＢに対し，それよりも低い凸部５として，セラ
ミック基板１との間にｂだけ間隔がとれるようにし，こ
の部分に硬化後ゴム弾性を有する接着剤すなわちゴム系
の接着剤６を充てんさせている。As shown in FIG. 1 (B), with respect to the width W 1 ceramic substrate, when bonded from a wide W 2 of the mounting plate which has a convex portion 5 of the width a in the center, on both sides A groove structure having grooves 3 and 4 is adopted. And the height of this convex part 5 is made lower than both sides. That is, with respect to the height B from the bottom of the grooves 3 and 4 to the upper surface, a convex portion 5 lower than the height B is formed so that a space b is provided between the groove 3 and the ceramic substrate 1, and rubber elasticity after curing is provided in this portion. The existing adhesive, that is, the rubber-based adhesive 6 is filled.
このゴム系の接着剤６によって，セラミック基板１と取
付板２を接着固定する。このとき，接着剤６を少し多め
に塗布しておけば，余分な接着剤は凸部５の両側の溝
３，４中に流れ出すことになり，常に一定の安定した接
着を行なうことが可能となる。The ceramic substrate 1 and the mounting plate 2 are bonded and fixed by the rubber-based adhesive 6. At this time, if the adhesive 6 is applied in a slightly larger amount, the excess adhesive will flow out into the grooves 3 and 4 on both sides of the convex portion 5, and it is possible to always perform a constant and stable adhesion. Become.
また，この時，凸部５の巾寸法ａ，凸部５の頂部とセラ
ミック基板の底面との間隔寸法ｂを変えることにより，
セラミック基板から取付板への熱伝導抵抗を変化させ，
サーマルヘッドとしての最適効率を設定できる。At this time, by changing the width dimension a of the convex portion 5 and the gap dimension b between the top of the convex portion 5 and the bottom surface of the ceramic substrate,
Change the heat conduction resistance from the ceramic substrate to the mounting plate,
The optimum efficiency as a thermal head can be set.
第３図（Ａ）、（Ｂ）は本発明におけるサーマルヘッド
の熱特性を示すものである。これらのものは、第３図
（Ｃ）に示す如く、凸部の幅ａ及び凸部の上面と取付板
との間隔ｂとしたとき、ａ寸法を2.0mm、3.5mm、5.0m
m、ｂ寸法を0.05mm、0.2mm、0.4mmとし、発熱体位置が
凸部一端より0.5mmの位置にくるように発熱体の基板を
接着したヘッドを、印加電力0.8KWの条件で、印画濃度
を印字開始時の濃度との差として表現したものである。3A and 3B show the thermal characteristics of the thermal head according to the present invention. As shown in FIG. 3 (C), these products have a dimension of 2.0 mm, 3.5 mm, 5.0 m when the width a of the convex portion and the distance b between the upper surface of the convex portion and the mounting plate are set.
Print the head with m, b dimensions of 0.05 mm, 0.2 mm and 0.4 mm and the substrate of the heating element bonded so that the position of the heating element is 0.5 mm from one end of the convex part under the condition of applied power 0.8 KW. The density is expressed as a difference from the density at the start of printing.
第３図（Ａ）はｂ寸法を0.05mmを基準とした場合、ａ寸
法を変化させた場合の濃度変化を示し、同（Ｂ）はａ寸
法を5.0mmを基準とした場合、ｂ寸法を変化させた場合
の濃度変化を示す。FIG. 3 (A) shows the concentration change when the a dimension is changed when the b dimension is 0.05 mm, and the same (B) shows the b dimension when the a dimension is 5.0 mm. The change in concentration when changed is shown.
これらにより、ａ寸法、ｂ寸法を変えることによりサー
マルヘッドの熱特性が変わることが明らかであり、ａ寸
法、ｂ寸法を変えることにより、熱特性を最適にしたサ
ーマルヘッドの設計が可能となる。From these, it is clear that the thermal characteristics of the thermal head are changed by changing the a dimension and the b dimension. By changing the a dimension and the b dimension, it becomes possible to design the thermal head with the optimum thermal characteristics.
以上述べてきたとおり，この発明によれば，バイメタル
効果を最小とすることができる外， １．接着剤塗布面積を安定化できるため，熱変化に対す
るバイメタル効果の発生を安定的に把握することがで
き，最適設計が容易である， ２．凸部の幅寸法ａ、凸部の頂部と基板の底面との間隔
寸法ｂを変えることによってセラミック基板から取付板
への熱伝導抵抗を変化させることができるので，サーマ
ルヘッドとしての最適効率を容易に設定できる、しかも
基板を取付板側部上に載置しているので、これらの寸
法、特に寸法ｂを正確に定めることができる、 ３．接着層の上，下のみで接着されるため，接着樹脂そ
のものの伸びや内部応力が単純化し，それだけゴム弾性
としての本来の特性が得やすくなり寿命も長くなる， 等の効果を有する。As described above, according to the present invention, the bimetal effect can be minimized. Since the adhesive application area can be stabilized, the occurrence of the bimetal effect with respect to thermal changes can be grasped in a stable manner, and optimal design is easy. Since the heat conduction resistance from the ceramic substrate to the mounting plate can be changed by changing the width a of the convex portion and the distance b between the top of the convex portion and the bottom surface of the substrate, optimum efficiency as a thermal head can be easily achieved. 2. Moreover, since the substrate is placed on the side of the mounting plate, it is possible to accurately determine these dimensions, particularly the dimension b. Since the adhesive is adhered only above and below the adhesive layer, the elongation and internal stress of the adhesive resin itself are simplified, and the original characteristics of rubber elasticity are more easily obtained and the service life is extended.
第１図はこの発明の実施例，第２図は従来例を、第３図
はこの発明の熱特性説明図を示す。 １…セラミック基板， ２…取付板， ３，４…溝， ５…凸部， ６…接着剤。FIG. 1 shows an embodiment of the present invention, FIG. 2 shows a conventional example, and FIG. 3 shows a thermal characteristic explanatory diagram of the present invention. 1 ... Ceramic substrate, 2 ... Mounting plate, 3, 4 ... Groove, 5 ... Convex part, 6 ... Adhesive.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 箸尾 幸之助 東京都中央区日本橋１丁目13番１号 ティ ーディーケイ株式会社内 (56)参考文献 特開 昭57−24272（ＪＰ，Ａ) 実開 昭61−140844（ＪＰ，Ｕ) ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Konosuke Kashio 1-13-1 Nihonbashi, Chuo-ku, Tokyo, TDK Corporation (56) References JP-A-57-24272 (JP, A) 61-140844 (JP, U)
Claims (2)
取り付ける取付板より成るサーマルヘッドにおいて、前
記取付板に溝を設けると共に、該溝の中央部に凸部を設
け、前記基板を前記取付板側部上に載置すると共に、該
凸部に付着せしめた接着剤により、前記基板と取付板を
接着せしめ、取付板の溝中央部に設けた凸部の頂部は、
取付板の表面より低く構成されていることを特徴とする
サーマルヘッド。1. A thermal head comprising a substrate on which a heating element is formed and a mounting plate for mounting the substrate, wherein a groove is formed in the mounting plate and a convex portion is formed at the center of the groove, and the substrate is formed by the above-mentioned method. While being placed on the side of the mounting plate, the substrate is attached to the mounting plate by the adhesive attached to the convex portion, and the top of the convex portion provided in the center of the groove of the mounting plate is
A thermal head characterized by being constructed lower than the surface of the mounting plate.
接着剤を用いたことを特徴とする請求項１記載のサーマ
ルヘッド。2. The thermal head according to claim 1, wherein an adhesive having rubber elasticity when cured is used as the adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63014175A JPH064341B2 (en) | 1988-01-25 | 1988-01-25 | Thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63014175A JPH064341B2 (en) | 1988-01-25 | 1988-01-25 | Thermal head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01190467A JPH01190467A (en) | 1989-07-31 |
| JPH064341B2 true JPH064341B2 (en) | 1994-01-19 |
Family
ID=11853808
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63014175A Expired - Lifetime JPH064341B2 (en) | 1988-01-25 | 1988-01-25 | Thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH064341B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0244046U (en) * | 1988-09-06 | 1990-03-27 | ||
| US5285216A (en) * | 1989-09-27 | 1994-02-08 | Kyocera Corporation | Thermal head |
| JP4476669B2 (en) | 2004-03-30 | 2010-06-09 | アルプス電気株式会社 | Thermal head and manufacturing method thereof |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5724272A (en) * | 1980-07-18 | 1982-02-08 | Ricoh Co Ltd | Thermal head |
| JPH0539891Y2 (en) * | 1985-02-21 | 1993-10-08 |
-
1988
- 1988-01-25 JP JP63014175A patent/JPH064341B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01190467A (en) | 1989-07-31 |
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