JPH0644666B2 - Printed wiring board having an opening with copper plating and method of manufacturing the same - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a double-sided or multilayer printed wiring board and a method for manufacturing the same.

(Prior Art) In this type of printed wiring board, an opening other than a general through hole is formed in the board in order to attach high frequency circuit parts and the like or to join the printed wiring board itself, and Copper plating is applied to the front and back surfaces and the opening edges so as to join them. As shown in FIG. 2, conventionally, such formation work of the opening portion 10 of the printed wiring board 12 is performed by a router controlled by NC or the molds 13 and 14. In order to electrically connect the front and back surfaces of the opening to each other, a metal plate or the like is added to the periphery of the opening for electrical connection.

(Problems to be Solved by the Invention) When the opening is formed by punching or the like as described above, the copper plating cannot be formed at the portion along the cutting edge of the opening due to the properties of the finished surface like a general through hole. Therefore, when it is necessary to add a ground pattern to the outer shape of the board when mounting high-frequency circuit parts, etc., there is no choice but to add another mechanical part such as a metal plate for soldering or screwing. It was a cause of increase in space on the board and man-hours.

(Means for Solving Problems) A printed wiring board according to the present invention is provided with an opening penetrating in a plate surface of the substrate, and a part of the opening part is provided with the opening part. A plurality of continuous arc-shaped portions bulging outward from the contour line of the contour are formed, conductor contours are applied to the contour edges of the continuous arc-shaped portions, and the conductor mesh is formed at positions near both ends of the continuous arc-shaped portions. It is formed by forming a small hole portion that can be removed.

The steps for manufacturing the printed wiring board as described above include:
During the drilling process for general through holes, the center is placed on the outline line that defines the opening, that is, the opening contour planned line or a straight line parallel thereto, and the sheet is sent by a pitch having the hole diameter or less, The step of making a hole so that a continuous arc-shaped portion is formed outside the contour line, and after the through-hole plating, the continuous arc-shaped portion of the continuous arc-shaped portion is formed outside both end holes of the formed continuous arc-shaped portion. And drilling two drill holes centered at a distance less than or equal to the hole radius.

(Examples) Next, examples of the present invention will be described with reference to the drawings.

FIG. 1 (a) is a perspective view of a printed wiring board 12 manufactured by the method of the present invention, and FIG. 1 (b) is a continuous hole portion of the printed wiring board of the present invention and its inner peripheral contour portion. FIG. 6 is an enlarged plan view of a mating portion formed in FIG. The printed base material 1 of the printed wiring board 12 has a rectangular opening 10 formed substantially in the center thereof, and has a copper plated portion 4 at a part of the contour edge of the opening 10, and the copper pattern on the front surface side at this portion. 2 and the back side copper pattern 3 are connected. Reference numeral 5 is a general through hole, which is well-known to be plated and the front and back surfaces are connected. The contour portion of the opening 10 where the copper plated portion 4 is formed is located outside the linear opening contour planned line (finished contour line) 11 that defines a rectangular opening, as described later.
It protrudes in a bellows shape, more precisely in a continuous arc shape.

A method of forming the copper plating portion 4 and the manufacturing process of the printed wiring board of FIG. 1 (a) will be described with reference to FIG. 1 (b). First, before the rectangular opening 10 is formed, a continuous hole 7 (which is centered on an extension of the opening contour line 11 and has a radius of a and is sent by a pitch P smaller than 2a to be holed ( In the illustrated embodiment, 7 holes are formed. Such continuous holes 7 are formed on two opposite sides of the opening 10, but at this time, the final outer shape of the rectangular opening 10 is not processed as described above, that is, the rectangular shape is formed on the print substrate. The opening 10 has not yet been formed outside the drawing, and has a continuous appearance of hole drilling as shown by a broken line 9.
After that, copper plating is applied to the through hole 5 (FIG. 1A), the plate surface portion around the opening and the hole edge of the continuous hole 7. By adopting the continuous drilling method in this way, the machine tool used in the conventional process can be used as it is, and it is possible to form a machined cross section that is as smooth as an ordinary through hole. As a result, a stable copper plating part 4 having good adhesion in the copper plating treatment and being stable can be obtained.

Next, after the copper plating process for the through hole and the continuous hole 7 is completed, a small hole 6 is drilled at a position near both ends of the continuous hole 7.
Drill holes. This step is located on the base material plate surface outside the holes located at both ends of the continuous hole 7, and is separated from the peripheral edge of the continuous hole 7 by a distance d smaller than the hole radius b dimension of itself (small hole 6). The hole is centered at the specified position. The two small holes 6 at both ends of the continuous hole play a role of partially breaking the copper plating 4 at positions near both ends of the continuous hole. If there is no such breakage or interruption of the copper plating, there is a risk that the copper plating continuous portion may be largely peeled off and broken during the punching process of the rectangular opening in the subsequent step. However, by performing the small copper plating rupture process as described above in advance, it is possible to prevent the copper plating part from being continuously damaged in a wide range by the router or the mold in the subsequent final contour processing step of the opening. It In other words, even if the copper plated end portion 8 at the outermost end of the continuous hole is damaged at the time of final contour processing, the plated portion is interrupted by the small hole 6, so that the influence of the damage does not reach beyond that. After this small hole processing, final outer shape processing of the rectangular opening is performed.

(Effects of the Invention) As described above, the present invention has the same equipment as that used in the conventional manufacturing process of a printed wiring board, and copper plating is applied to the opening portion along the outline of the printed substrate opening. Can be applied. As a result, when a high-frequency circuit component or the like is attached or the printed wiring board itself is joined, it can be directly soldered to the cross section of the printed wiring board, and the number of manufacturing steps can be reduced and the characteristics can be improved.

[Brief description of drawings]

FIG. 1 (a) is a perspective view of a printed wiring board manufactured by the method of the present invention, and FIG. 1 (b) is an enlarged plane view of a copper-plated continuous hole portion of the printed wiring board of the present invention. FIG. 2 and FIG. 2 are perspective views of a mold showing the operation of forming a substrate opening by the conventional method. DESCRIPTION OF SYMBOLS 1 ... Printed base material, 2, 3 ... Copper pattern, 4 ... Copper plating part, 5 ... Through hole, 6 ... Small hole, 7 ... Continuous hole, 10 ... Opening part, 11 ... Scheduled outline of opening part, 12 ... Printed wiring substrate.

Claims (2)

[Claims] 1. A substrate is provided with an opening penetrating the plate surface, and a plurality of continuous expanded portions projecting outward from a contour line of the opening are formed in a part of the opening, A printed wiring board, wherein a conductor edge is formed on the contour edge of the continuous expanded portion, and cutouts are formed at positions near both ends of the continuous expanded portion to cut off the conductive groove. 2. A method of manufacturing a printed wiring board by forming an opening in a plate surface of a substrate and applying a conductor plating along a contour line of the opening, wherein a hole of a general through hole other than the opening is formed. During the drilling process, a plurality of continuous holes with a center defined on the planned contour line of the opening or on a straight line parallel to this is drilled with a pitch of the hole diameter or less, and after the continuous holes and the through holes are plated, A small hole is formed outside the both ends of the continuous hole so as to partially cover the contour of the continuous hole,
A method for manufacturing a printed wiring board, characterized by punching the opening thereafter.