JPH0649784B2 - Film or sheet phenolic resin - Google Patents
Film or sheet phenolic resinInfo
- Publication number
- JPH0649784B2 JPH0649784B2 JP60013884A JP1388485A JPH0649784B2 JP H0649784 B2 JPH0649784 B2 JP H0649784B2 JP 60013884 A JP60013884 A JP 60013884A JP 1388485 A JP1388485 A JP 1388485A JP H0649784 B2 JPH0649784 B2 JP H0649784B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- phenolic resin
- sheet
- weight
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000005011 phenolic resin Substances 0.000 title claims description 26
- 229920001568 phenolic resin Polymers 0.000 title claims description 24
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 title claims description 21
- 238000000034 method Methods 0.000 claims description 11
- 229920000642 polymer Polymers 0.000 claims description 6
- 239000004952 Polyamide Substances 0.000 claims description 4
- 239000004642 Polyimide Substances 0.000 claims description 4
- 229920000058 polyacrylate Polymers 0.000 claims description 4
- 229920002647 polyamide Polymers 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 claims description 4
- 239000004962 Polyamide-imide Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 229920002312 polyamide-imide Polymers 0.000 claims description 3
- 229920000728 polyester Polymers 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 2
- 239000011134 resol-type phenolic resin Substances 0.000 claims description 2
- 239000010408 film Substances 0.000 description 25
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 7
- 239000007787 solid Substances 0.000 description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- FUGYGGDSWSUORM-UHFFFAOYSA-N 4-hydroxystyrene Chemical compound OC1=CC=C(C=C)C=C1 FUGYGGDSWSUORM-UHFFFAOYSA-N 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000010680 novolac-type phenolic resin Substances 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- BYLSIPUARIZAHZ-UHFFFAOYSA-N 2,4,6-tris(1-phenylethyl)phenol Chemical compound C=1C(C(C)C=2C=CC=CC=2)=C(O)C(C(C)C=2C=CC=CC=2)=CC=1C(C)C1=CC=CC=C1 BYLSIPUARIZAHZ-UHFFFAOYSA-N 0.000 description 1
- WUQYBSRMWWRFQH-UHFFFAOYSA-N 2-prop-1-en-2-ylphenol Chemical class CC(=C)C1=CC=CC=C1O WUQYBSRMWWRFQH-UHFFFAOYSA-N 0.000 description 1
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- LLEMOWNGBBNAJR-UHFFFAOYSA-N biphenyl-2-ol Chemical compound OC1=CC=CC=C1C1=CC=CC=C1 LLEMOWNGBBNAJR-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 150000001896 cresols Chemical class 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000008098 formaldehyde solution Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 150000003739 xylenols Chemical class 0.000 description 1
Landscapes
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
- Phenolic Resins Or Amino Resins (AREA)
Description
【発明の詳細な説明】 ＜産業上の利用分野＞ 本発明は接着、表面コート、塗料等に用いられるフェノ
ール系樹脂に関するものであり、上記各種用途での工程
の簡素化、一体成型が可能なフィルム状（シート状）フ
ェノール系樹脂である。DETAILED DESCRIPTION OF THE INVENTION <Industrial field of application> The present invention relates to a phenolic resin used for adhesion, surface coating, paints, etc., and simplifies the process for the above-mentioned various uses and enables integral molding. It is a film (sheet) phenolic resin.
＜従来技術＞ 従来のフェノール系樹脂は、固形、粉末、液状等の形状
をしており、接着、表面コート、塗料等に用いる場合、
各種用途に応じた溶媒に溶解し、さらに、塗布、乾燥、
プレキュアー（Ｂ化）等の工程を経て接着するなどとい
う、非常に煩雑なものである。<Prior Art> Conventional phenolic resins are in the form of solid, powder, liquid, etc. When used for adhesion, surface coating, paint, etc.,
Dissolves in solvents suitable for various purposes, and then coats, dries,
It is very complicated, such as bonding through a process such as precure (B conversion).
しかし、フィルム状（シート状）のフェノール系樹脂を
使用できれば、溶解、塗布、乾燥、プレキュアー（Ｂ
化）までの工程が不必要となり、直接、被着物に接着、
または、コートすることが可能で、一体成型、工程の簡
素化がはかれ、非常に有効であるが従来のフェノール系
樹脂は硬くて脆くフィルム状（シート状）にすることは
不可能であった。However, if a film-shaped (sheet-shaped) phenolic resin can be used, dissolution, coating, drying, pre-cure (B
Process is unnecessary and can be directly adhered to the adherend.
Alternatively, it can be coated, and it is very effective because it can be integrally molded and the process can be simplified. However, conventional phenolic resins were hard and brittle, and it was impossible to make them into a film (sheet). .
＜発明が解決しようとする問題点＞ フィルム状（シート状）のフェノール系樹脂が製造出来
れば産業上極めて有利であり、この製造法の開発が急が
れている。<Problems to be Solved by the Invention> If a film-shaped (sheet-shaped) phenolic resin can be manufactured, it will be extremely advantageous in the industry, and development of this manufacturing method is urgent.
＜問題点を解決するための手段＞ 本発明者は鋭意検討の結果本願発明に到達した。即ち本
願発明はフェノール系樹脂に、柔軟性付与剤として、ポ
リアミド、ポリアミドイミド、ポリイミド、アクリルポ
リマー、ポリエステルから選ばれる鎖状高分子を反応或
いは混合させ、柔軟性を持たせることを特徴とするフェ
ノール系樹脂フィルム（シート）である。<Means for Solving Problems> The present inventors have arrived at the present invention as a result of earnest studies. That is, the present invention is characterized in that a phenolic resin is made to have flexibility by reacting or mixing a chain polymer selected from polyamide, polyamideimide, polyimide, acrylic polymer and polyester as a flexibility-imparting agent. It is a resin film (sheet).
本発明において得られるフィルム（シート）は、フェノ
ール系樹脂であることから熱硬化型であり、フェノール
系樹脂の特性である耐熱性、電気特性、機械特性に優れ
ており、さらに上記鎖状高分子による柔軟性を有し、フ
ィルム特性として優れたものである。The film (sheet) obtained in the present invention is a thermosetting type because it is a phenolic resin, and it has excellent heat resistance, electrical properties, and mechanical properties that are characteristics of the phenolic resin. It has flexibility and excellent film characteristics.
本発明に従ってフェノール系樹脂１００重量部と鎖状高
分子１重量部〜５００重量部より成るフェノール系樹脂
組成物が提供される。本発明に使用出来るフェノール系
樹脂には、フェノール、クレゾール類、キシレノール
類、オクチルフェノー類等のC1〜C20のアルキル基を有
するアルキルフェノール類、ビスフェノールＡ、フェニ
ルフェノール、スチレン化フェノール等のアルキルフェ
ノール類似構造を有するフェノール類、ｐ−ビニルフェ
ノール、イソプロペニルフェノール類等のアルケニルフ
ェノール類をホルムアルデヒド水溶液、ペラホルム等と
酸及びアルカリで反応させてフェノール系樹脂としたも
のである。According to the present invention, there is provided a phenolic resin composition comprising 100 parts by weight of a phenolic resin and 1 to 500 parts by weight of a chain polymer. Phenolic resins that can be used in the present invention include alkylphenols having a C 1 to C 20 alkyl group such as phenol, cresols, xylenols and octylphenols, bisphenol A, phenylphenol, styrenated phenol and similar structures. And alkenylphenols such as p-vinylphenol, isopropenylphenols and the like having the above are reacted with an aqueous formaldehyde solution, peraform and the like with an acid and an alkali to obtain a phenolic resin.
また、柔軟性付与剤として用いられるものは、ポリアミ
ド、ポリアミドイミド、ポリイミド、飽和、不法波ポリ
エステル、アクリルポリマーから選ばれる鎖状高分子で
ある。該鎖状高分子を上記フェノール系樹脂と反応或い
は混合させて本願発明のフィルム状（シート状）フェノ
ール系樹脂を得る。また、上記鎖状高分子をフェノール
系樹脂に配合する割合は、フェノール系樹脂に対し、１
重量部〜５００重量部であるが、好ましくは、１０重量
部〜２５０重量部である。１重量部未満の時は柔軟性に
かけフィルム化が難しい。５００重量部を越ればフェノ
ール系樹脂の特性がうしなわれる。Also, what is used as the flexibility-imparting agent is a chain polymer selected from polyamide, polyamide-imide, polyimide, saturated, square-wave polyester, and acrylic polymer. The chain polymer is reacted or mixed with the above phenolic resin to obtain the film (sheet) phenolic resin of the present invention. In addition, the ratio of the chain polymer to be blended with the phenol resin is 1 with respect to the phenol resin.
The amount is from 500 to 500 parts by weight, preferably from 10 to 250 parts by weight. When it is less than 1 part by weight, it is difficult to form a film due to its flexibility. If it exceeds 500 parts by weight, the characteristics of the phenolic resin are deteriorated.
次に、本発明フェノール系樹脂フィルム（シート）は、
各種用途、要求に応じて硬化度合いを変えることができ
る。本発明フェノール系樹脂をカレンダー法、カーテン
コーター法等で代表される一般的フィルム製造法によ
り、任意の厚さに成膜し、５０℃〜２５０℃の温度で、
数分〜数十分熱処理を行ない、各種用途、要求に応じた
硬化度合いのフィルム（シート）を得ることが可能であ
る。ここで、膜厚は、数ミクロン〜数千ミクロンまで任
意に変えることができるが、好ましくは、１０〜５００
ミクロンのものが用いられる。Next, the phenolic resin film (sheet) of the present invention is
The degree of curing can be changed according to various applications and requirements. The phenolic resin of the present invention is formed into a film having an arbitrary thickness by a general film production method typified by a calender method, a curtain coater method and the like, and at a temperature of 50 ° C to 250 ° C.
By performing heat treatment for several minutes to several tens of minutes, it is possible to obtain a film (sheet) having a curing degree according to various applications and requirements. Here, the film thickness can be arbitrarily changed from several microns to several thousands microns, but is preferably 10 to 500.
The micron type is used.
実施例１ ・レゾール型フェノール樹脂 １００重量部 ・不飽和ポリエステル １５０ 〃 上記原料をメチルエチルケトン（以下ＭＥＫ）に溶解し
固形分濃度５０％とする。この溶液をロールコーター法
により成膜し、しかる後８０℃で１５分乾燥して膜厚８
０μｍのフィルムを得た。Example 1 Resol type phenolic resin 100 parts by weight Unsaturated polyester 150 〃 The above raw materials are dissolved in methyl ethyl ketone (hereinafter MEK) to have a solid content concentration of 50%. A film was formed from this solution by a roll coater method, and then dried at 80 ° C. for 15 minutes to obtain a film thickness of 8
A 0 μm film was obtained.
実施例２ ・ノボラック型フェノール樹脂 １００重量部 ・ポリイミド １００ 〃 上記原料をＭＥＫに溶解し固形分濃度５０％とする。こ
の溶液をカレンダー法により成膜し、しかる後８０％で
５分、さらに１５０℃で２０分乾燥して、膜厚５０μｍ
のフィルムを得た。Example 2 Novolak type phenolic resin 100 parts by weight Polyimide 100 〃 The above raw materials are dissolved in MEK to a solid content concentration of 50%. A film was formed from this solution by a calendar method, and then dried at 80% for 5 minutes and further at 150 ° C. for 20 minutes to give a film thickness of 50 μm.
I got a film of.
実施例３ ・ノボラック型フェノール樹脂 １００重量部 ・ビスフェノール型エポキシ樹脂 ２０ 〃 ・ポリアミド ２００重量部 上記原料をＭＥＫに溶解し固形分濃度を３０％とする。
この溶液をカーテンコーター法により成膜し、しかる
後、７０℃で２０分乾燥して膜厚２０μｍのフィルムを
得た。Example 3 100 parts by weight of novolac type phenolic resin 20 parts of bisphenol type epoxy resin 200 parts by weight of polyamide The above raw materials are dissolved in MEK to have a solid content concentration of 30%.
A film was formed from this solution by a curtain coater method and then dried at 70 ° C. for 20 minutes to obtain a film having a film thickness of 20 μm.
実施例４ ・ノボラック型フェノール樹脂 １００重量部 ・ビスフェノール型エポキシ樹脂 ５０ 〃 ・アクリルポリマー ３００ 〃 上記原料をＭＥＫに溶解し、固形分濃度を５０％とす
る。この溶液をロールコーター法により成膜し、しかる
後７０℃で１５分、１５０℃で２０分乾燥して、膜厚６
０μｍのフィルムを得た。Example 4 100 parts by weight of novolac type phenolic resin Bisphenol type epoxy resin 50 〃 Acrylic polymer 300 〃 The above raw materials are dissolved in MEK to make the solid content concentration 50%. A film was formed from this solution by a roll coater method and then dried at 70 ° C. for 15 minutes and 150 ° C. for 20 minutes to obtain a film thickness of 6
A 0 μm film was obtained.
実施例１〜４のフィルムの特性値を次に示す。The characteristic values of the films of Examples 1 to 4 are shown below.
＜本発明の効果＞ 通常のフェノール系樹脂では薄膜のフィルムは得られな
いが本発明によれば容易に薄膜が製造出来産業上極めて
有益である。 <Effects of the Present Invention> Although a thin film cannot be obtained with a usual phenolic resin, the present invention is capable of easily producing a thin film and is extremely useful in industry.
フロントページの続き (72)発明者 後閑 恭一 群馬県高崎市大八木町622 群栄化学工業 株式会社内 (72)発明者 槇山 信助 群馬県高崎市大八木町622 群栄化学工業 株式会社内 (56)参考文献 特開 昭48−66140（ＪＰ，Ａ)Front page continuation (72) Inventor Kyoichi Kyoichi 622 Oyagi-cho, Gunma Prefecture Takasaki-shi Gunei Chemical Industry Co., Ltd. (72) Inventor Shinsuke Makiyama 622 Oyagi-cho, Gunma Prefecture Gunei Chemical Industry Co., Ltd. (56) Reference Document JP-A-48-66140 (JP, A)
Claims (1)
ールコータ、カレンダー法等で成膜し、しかるのち熱処
理を行って得られるフェノール系樹脂フィルム（シー
ト）の製造方法において、前記フェノール系樹脂として
ノボラック型又はレゾール型フェノール系樹脂を用い、
ポリアミド、ポリアミドイミド、ポリイミド、アクリル
ポリマー、ポリエステルから選ばれる鎖状高分子を反応
或いは、混合し、柔軟性を持たせることを特徴とするフ
ィルム状（シート状）フェノール系樹脂。1. A method for producing a phenolic resin film (sheet) obtained by forming a phenolic resin into a film by a curtain coater, a roll coater, a calender method, etc., and then subjecting it to heat treatment. Or using a resol type phenolic resin,
A film-shaped (sheet-shaped) phenolic resin characterized by reacting or mixing a chain polymer selected from polyamide, polyamideimide, polyimide, acrylic polymer, and polyester to give flexibility.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60013884A JPH0649784B2 (en) | 1985-01-28 | 1985-01-28 | Film or sheet phenolic resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60013884A JPH0649784B2 (en) | 1985-01-28 | 1985-01-28 | Film or sheet phenolic resin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61174235A JPS61174235A (en) | 1986-08-05 |
| JPH0649784B2 true JPH0649784B2 (en) | 1994-06-29 |
Family
ID=11845626
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60013884A Expired - Lifetime JPH0649784B2 (en) | 1985-01-28 | 1985-01-28 | Film or sheet phenolic resin |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0649784B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2560611B2 (en) * | 1993-07-26 | 1996-12-04 | 日本電気株式会社 | Protective film and manufacturing method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5128103B2 (en) * | 1971-12-15 | 1976-08-17 |
-
1985
- 1985-01-28 JP JP60013884A patent/JPH0649784B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61174235A (en) | 1986-08-05 |
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