JPH0651778B2 - High thermal conductivity epoxy resin molding material - Google Patents
High thermal conductivity epoxy resin molding materialInfo
- Publication number
- JPH0651778B2 JPH0651778B2 JP61266593A JP26659386A JPH0651778B2 JP H0651778 B2 JPH0651778 B2 JP H0651778B2 JP 61266593 A JP61266593 A JP 61266593A JP 26659386 A JP26659386 A JP 26659386A JP H0651778 B2 JPH0651778 B2 JP H0651778B2
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- molding material
- alumina
- thermal conductivity
- resin molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000003822 epoxy resin Substances 0.000 title claims description 17
- 229920000647 polyepoxide Polymers 0.000 title claims description 17
- 239000012778 molding material Substances 0.000 title claims description 15
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 19
- 239000000945 filler Substances 0.000 claims description 9
- 239000002344 surface layer Substances 0.000 claims description 9
- 239000003795 chemical substances by application Substances 0.000 claims description 7
- 229920003986 novolac Polymers 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- 229910002026 crystalline silica Inorganic materials 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 235000012239 silicon dioxide Nutrition 0.000 description 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- FVCSARBUZVPSQF-UHFFFAOYSA-N 5-(2,4-dioxooxolan-3-yl)-7-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C(C(OC2=O)=O)C2C(C)=CC1C1C(=O)COC1=O FVCSARBUZVPSQF-UHFFFAOYSA-N 0.000 description 1
- 229920001342 Bakelite® Polymers 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000004637 bakelite Substances 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
Landscapes
- Compounds Of Alkaline-Earth Elements, Aluminum Or Rare-Earth Metals (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、成形性、摩耗性、熱伝導性にバランスのとれ
たエポキシ樹脂成形材料に関するものであり、その特徴
は充填剤として、表層を特殊処理したα−アルミナを使
用するところにある。TECHNICAL FIELD The present invention relates to an epoxy resin molding material having a good balance of moldability, wear resistance, and thermal conductivity, the feature of which is to use a surface layer as a filler. This is where specially treated α-alumina is used.
現在使用されている高熱伝導性エポキシ樹脂成形材料
は、充填剤として結晶シリカを用いたものがほとんどで
ある。しかし、この方法ではできるだけシリカ量を増や
したとしても熱伝導性には限りがあり60cal×10− ４／c
m・sec・℃が上限である。Most of the high thermal conductivity epoxy resin molding materials currently used use crystalline silica as a filler. However, in this method there is limited thermal conductivity even increased as much as possible the amount of silica 60cal × 10 - 4 / c
The upper limit is m / sec / ° C.
一方、アルミナは、結晶シリカと比較し、熱伝導率が高
く、又、熱膨張係数が小さいことにより、高熱伝導性エ
ポキシ樹脂成形材料の充填材として有望なものの、金型
摩耗が極めて激しいという重大欠点を有しているため、
未だ実用化には至らない。Alumina, on the other hand, has a higher thermal conductivity and a smaller coefficient of thermal expansion than crystalline silica, so it is a promising filler for high-thermal-conductivity epoxy resin molding materials, but the mold wear is extremely severe. Because it has drawbacks
It has not yet been put to practical use.
本発明は、従来技術では得られなかった成形性、摩耗
性、高熱伝導性に優れたエポキシ樹脂成形材料を提供す
るものである。The present invention provides an epoxy resin molding material excellent in moldability, wear resistance, and high thermal conductivity, which has not been obtained by conventional techniques.
特殊処理にて表層がγ−アルミナで中心核がα−アルミ
ナである充填材を用いることにより、従来の結晶シリカ
を使用したエポキシ樹脂成形材料と同様の成形性、摩耗
性を有すると共に熱伝導性を大幅に向上させることを見
出したものである。By using a filler whose surface layer is γ-alumina and whose central nucleus is α-alumina in a special treatment, it has the same moldability and abrasion resistance as the epoxy resin molding material using conventional crystalline silica, and also has thermal conductivity. It has been found to significantly improve the.
即ち本発明は、エポキシ樹脂、表層がγ−アルミナで中
心核がα−アルミナである充填材及び硬化剤からなるこ
とを特徴とする高熱伝導性エポキシ樹脂成形材料であ
る。That is, the present invention is a high thermal conductivity epoxy resin molding material comprising an epoxy resin, a filler having a surface layer of γ-alumina and a central core of α-alumina, and a curing agent.
一般的にエポキシ樹脂成形材料は、エポキシ樹脂・充填
材・硬化剤・硬化促進剤・離型剤等より構成される。Generally, an epoxy resin molding material is composed of an epoxy resin, a filler, a curing agent, a curing accelerator, a release agent, and the like.
エポキシ樹脂とはエポキシ基を有する全ての対象とし、
ビスフェノール型エポキシ、フェノールノボラック型エ
ポキシ、クレゾールノボラック型エポキシ等を挙げるこ
とができる。半導体封止用としては特にクレゾールノボ
ラック型エポキシが望ましい。Epoxy resins are all objects that have an epoxy group,
Examples thereof include bisphenol type epoxy, phenol novolac type epoxy, and cresol novolac type epoxy. For semiconductor encapsulation, cresol novolac type epoxy is particularly desirable.
充填剤としては、表層がγ−アルミナで中心核がα−ア
ルミナを用いることが必須である。このアルミナは、例
えばα−アルミナをプロパンガスと共に噴射し、火炎中
に極短時間滞留させ、表層のみを瞬時に溶融することに
より得ることができる。本願発明のアルミナは、単に表
層がγ−アルミナに変化しているだけでなく瞬時に溶融
することにより、原料アルミナの角がとれ丸味をおびる
ため、従来のα−アルミナに比較し、格段の摩耗性向上
効果がある。As the filler, it is essential to use γ-alumina for the surface layer and α-alumina for the central nucleus. This alumina can be obtained, for example, by injecting α-alumina together with propane gas, allowing it to stay in a flame for an extremely short time, and instantaneously melting only the surface layer. The alumina of the present invention is not only the surface layer is changed to γ-alumina, but is also instantly melted, so that the raw material alumina has sharp corners and roundness, so that it is much more worn than conventional α-alumina. There is an effect of improving the sex.
又、硬化剤としては、エポキシ樹脂と反応可能なもの全
てをいいアミン類、酸無水物類、フェノールノボラック
類等があるが半導体封止用としてはフェノールノボラッ
クが好ましい。Further, as the curing agent, all that can react with the epoxy resin are mentioned, and amines, acid anhydrides, phenol novolacs, etc. are mentioned, but phenol novolac is preferable for semiconductor encapsulation.
本発明方法に従うと表層が、従来アルミナよりも柔らか
く且つ丸味をおびた表層がγ−アルミナで中心核がα−
アルミナを用いる為、成形性、摩耗性、高熱伝導性にバ
ランスのとれた優れた高熱伝導性エポキシ樹脂成形材料
が得られる。即ち、従来同様に加工のできる成形材料を
提供するものであり産業上の利用価値は極めて大きい。According to the method of the present invention, the surface layer is γ-alumina whose surface layer is softer and more rounded than conventional alumina and whose central nucleus is α-.
Since alumina is used, an excellent highly heat-conductive epoxy resin molding material having a good balance of moldability, wearability, and high heat conductivity can be obtained. That is, it provides a molding material that can be processed in the same manner as in the past, and has an extremely high industrial utility value.
以下、半導体封止用エポキシ樹脂成形材料としての検討
例で説明を行なう。尚、例で用いた原料は次の通りであ
る。Hereinafter, description will be made with reference to a study example as an epoxy resin molding material for semiconductor encapsulation. The raw materials used in the examples are as follows.
エポキシ樹脂 大日本インキ化学工業（エピクロン N
-665-EXP） 130重量部 硬化剤 住友ベークライト（フェノールノボラ
ック） 60重量部 硬化促進剤 四国化成（2MZ） ２重量部 カップリング剤 信越化学（KBM-403） ４重量部 離型剤 ヘキストジャパン（ヘキストワックス
Ｅ） ４重量部 充填材 （表１） 800重量部 原料配合後100℃の熱ロールで３分間混練し４種の成形
材料を得た。Epoxy resin Dainippon Ink and Chemicals (Epiclon N
-665-EXP) 130 parts by weight Curing agent Sumitomo Bakelite (phenol novolac) 60 parts by weight Curing accelerator Shikoku Kasei (2MZ) 2 parts by weight Coupling agent Shin-Etsu Chemical (KBM-403) 4 parts by weight Release agent Hoechst Japan (Hoechst) Wax E) 4 parts by weight Filler (Table 1) 800 parts by weight After blending the raw materials, the mixture was kneaded with a hot roll at 100 ° C. for 3 minutes to obtain four types of molding materials.
成形材料としての評価結果を表１に示すが、本発明によ
る検討例１は従来技術２〜４に比べ、あらゆる面でバラ
ンスのとれた成形材料といえる。The evaluation results as a molding material are shown in Table 1, and it can be said that Examination Example 1 according to the present invention is a molding material that is well balanced in all aspects as compared with Prior Art 2 to 4.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 // Ｃ０１Ｆ 7/02 Ｚ 9040−4Ｇ Ｈ０１Ｌ 23/29 23/31 ─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. 5 Identification number Office reference number FI technical display location // C01F 7/02 Z 9040-4G H01L 23/29 23/31
Claims (1)
核がα−アルミナである充填材及び硬化剤からなること
を特徴とする高熱伝導性エポキシ樹脂成形材料。1. A high thermal conductivity epoxy resin molding material comprising an epoxy resin, a filler having a surface layer of γ-alumina and a central core of α-alumina, and a curing agent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61266593A JPH0651778B2 (en) | 1986-11-11 | 1986-11-11 | High thermal conductivity epoxy resin molding material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61266593A JPH0651778B2 (en) | 1986-11-11 | 1986-11-11 | High thermal conductivity epoxy resin molding material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63120725A JPS63120725A (en) | 1988-05-25 |
| JPH0651778B2 true JPH0651778B2 (en) | 1994-07-06 |
Family
ID=17432963
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61266593A Expired - Lifetime JPH0651778B2 (en) | 1986-11-11 | 1986-11-11 | High thermal conductivity epoxy resin molding material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0651778B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021187415A1 (en) | 2020-03-16 | 2021-09-23 | 三菱マテリアル株式会社 | Inorganic filler powder, thermally conductive polymer composition, and method for manufacturing inorganic filler powder |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5137175B2 (en) * | 1973-05-09 | 1976-10-14 | ||
| JPS6164756A (en) * | 1984-09-05 | 1986-04-03 | Nippon Steel Corp | Inorganic filler-contaning resin composition |
| JPS61171724A (en) * | 1985-01-24 | 1986-08-02 | Mitsubishi Electric Corp | Epoxy resin composition |
| JPS61203121A (en) * | 1985-03-06 | 1986-09-09 | Fujitsu Ltd | Epoxy resin composition for sealing semiconductor |
-
1986
- 1986-11-11 JP JP61266593A patent/JPH0651778B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021187415A1 (en) | 2020-03-16 | 2021-09-23 | 三菱マテリアル株式会社 | Inorganic filler powder, thermally conductive polymer composition, and method for manufacturing inorganic filler powder |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63120725A (en) | 1988-05-25 |
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