JPS5137175B2 - - Google Patents

Info

Publication number: JPS5137175B2
Authority: JP; Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

JP48050766A

Other languages

Japanese (ja)

Other versions

JPS502045A (en

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1973-05-09

Filing date

1973-05-09

Publication date

1976-10-14

1973-05-09 Application filed filed Critical

1973-05-09 Priority to JP48050766A priority Critical patent/JPS5137175B2/ja

1975-01-10 Publication of JPS502045A publication Critical patent/JPS502045A/ja

1976-10-14 Publication of JPS5137175B2 publication Critical patent/JPS5137175B2/ja

Status Expired legal-status Critical Current

Links

Landscapes

Compositions Of Macromolecular Compounds (AREA)
Epoxy Resins (AREA)
Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Sealing Material Composition (AREA)

JP48050766A 1973-05-09 1973-05-09 Expired JPS5137175B2 (en)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP48050766A JPS5137175B2 (en)	1973-05-09	1973-05-09

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP48050766A JPS5137175B2 (en)	1973-05-09	1973-05-09

Publications (2)

Publication Number	Publication Date
JPS502045A JPS502045A (en)	1975-01-10
JPS5137175B2 true JPS5137175B2 (en)	1976-10-14

Family

ID=12867947

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP48050766A Expired JPS5137175B2 (en)	1973-05-09	1973-05-09

Country Status (1)

Country	Link
JP (1)	JPS5137175B2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5085261U (en) *	1973-12-05	1975-07-21
JPS6040189B2 (en) *	1979-09-21	1985-09-10	株式会社日立製作所	Resin-encapsulated semiconductor device
JPS57122549A (en) *	1980-11-08	1982-07-30	Plessey Overseas	Plastic sealed electronic equipment
JPS60141776A (en) *	1983-12-29	1985-07-26	Toshiba Ceramics Co Ltd	Filler for ic plastic package
JPH0651778B2 (en) *	1986-11-11	1994-07-06	住友ベークライト株式会社	High thermal conductivity epoxy resin molding material

1973
- 1973-05-09 JP JP48050766A patent/JPS5137175B2/ja not_active Expired

Also Published As

Publication number	Publication date
JPS502045A (en)	1975-01-10

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