JPH0651785B2 - Epoxy resin composition for semiconductor encapsulation - Google Patents
Epoxy resin composition for semiconductor encapsulationInfo
- Publication number
- JPH0651785B2 JPH0651785B2 JP20001386A JP20001386A JPH0651785B2 JP H0651785 B2 JPH0651785 B2 JP H0651785B2 JP 20001386 A JP20001386 A JP 20001386A JP 20001386 A JP20001386 A JP 20001386A JP H0651785 B2 JPH0651785 B2 JP H0651785B2
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin composition
- semiconductor encapsulation
- curing agent
- vinylphenol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000003822 epoxy resin Substances 0.000 title claims description 22
- 229920000647 polyepoxide Polymers 0.000 title claims description 22
- 239000000203 mixture Substances 0.000 title claims description 10
- 239000004065 semiconductor Substances 0.000 title claims description 8
- 238000005538 encapsulation Methods 0.000 title claims description 7
- 229920001296 polysiloxane Polymers 0.000 claims description 23
- 239000003795 chemical substances by application Substances 0.000 claims description 18
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 14
- 229920003986 novolac Polymers 0.000 claims description 12
- JESXATFQYMPTNL-UHFFFAOYSA-N 2-ethenylphenol Chemical compound OC1=CC=CC=C1C=C JESXATFQYMPTNL-UHFFFAOYSA-N 0.000 claims description 8
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims description 7
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 7
- 150000002989 phenols Chemical class 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000003054 catalyst Substances 0.000 claims description 4
- 239000000945 filler Substances 0.000 claims description 4
- 230000002378 acidificating effect Effects 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 7
- 239000007795 chemical reaction product Substances 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 4
- -1 phosphine compound Chemical class 0.000 description 4
- 230000035939 shock Effects 0.000 description 4
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Natural products P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229920002545 silicone oil Polymers 0.000 description 3
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Substances C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000003377 acid catalyst Substances 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000000746 purification Methods 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 2
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- FALRKNHUBBKYCC-UHFFFAOYSA-N 2-(chloromethyl)pyridine-3-carbonitrile Chemical compound ClCC1=NC=CC=C1C#N FALRKNHUBBKYCC-UHFFFAOYSA-N 0.000 description 1
- XBIUWALDKXACEA-UHFFFAOYSA-N 3-[bis(2,4-dioxopentan-3-yl)alumanyl]pentane-2,4-dione Chemical compound CC(=O)C(C(C)=O)[Al](C(C(C)=O)C(C)=O)C(C(C)=O)C(C)=O XBIUWALDKXACEA-UHFFFAOYSA-N 0.000 description 1
- FXNIUYYUCOQMQG-UHFFFAOYSA-N C1(C=C/C(=O)O1)=O.C1(=CC=CC=C1)P(C1=CC=CC=C1)C1=CC=CC=C1 Chemical compound C1(C=C/C(=O)O1)=O.C1(=CC=CC=C1)P(C1=CC=CC=C1)C1=CC=CC=C1 FXNIUYYUCOQMQG-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- XYOVOXDWRFGKEX-UHFFFAOYSA-N azepine Chemical compound N1C=CC=CC=C1 XYOVOXDWRFGKEX-UHFFFAOYSA-N 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- PVWYTIFUYYJMQO-UHFFFAOYSA-N butyl(phenyl)phosphane Chemical compound CCCCPC1=CC=CC=C1 PVWYTIFUYYJMQO-UHFFFAOYSA-N 0.000 description 1
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- GPAYUJZHTULNBE-UHFFFAOYSA-N diphenylphosphine Chemical compound C=1C=CC=CC=1PC1=CC=CC=C1 GPAYUJZHTULNBE-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical group 0.000 description 1
- 238000006459 hydrosilylation reaction Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 150000003003 phosphines Chemical class 0.000 description 1
- 150000004714 phosphonium salts Chemical class 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229940014800 succinic anhydride Drugs 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000012756 surface treatment agent Substances 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 235000010215 titanium dioxide Nutrition 0.000 description 1
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 1
- MYWQGROTKMBNKN-UHFFFAOYSA-N tributoxyalumane Chemical compound [Al+3].CCCC[O-].CCCC[O-].CCCC[O-] MYWQGROTKMBNKN-UHFFFAOYSA-N 0.000 description 1
- WLPUWLXVBWGYMZ-UHFFFAOYSA-N tricyclohexylphosphine Chemical compound C1CCCCC1P(C1CCCCC1)C1CCCCC1 WLPUWLXVBWGYMZ-UHFFFAOYSA-N 0.000 description 1
- MDDPTCUZZASZIQ-UHFFFAOYSA-N tris[(2-methylpropan-2-yl)oxy]alumane Chemical compound [Al+3].CC(C)(C)[O-].CC(C)(C)[O-].CC(C)(C)[O-] MDDPTCUZZASZIQ-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
Landscapes
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は熱衝撃を受けた場合の耐クラック性や、耐湿性
に優れる半導体封止用低応力エポキシ樹脂組成物に係わ
るものである。TECHNICAL FIELD The present invention relates to a low stress epoxy resin composition for semiconductor encapsulation, which is excellent in crack resistance when exposed to thermal shock and moisture resistance.
近年、半導体関連技術の進歩はめざましく、LSIの集積
度は加速度的に向上し、それに伴い配線の微細化とチッ
プサイズの大型化が進んでいる。この傾向は樹脂防止LS
Iのアルミ配線変形、パッシブーションクラック、樹脂
クラックなどの故障を深刻化させた。これらの問題の解
決の為に、現在、半導体封止用樹脂の低応力化が強く求
められている。In recent years, semiconductor-related technologies have been remarkably advanced, and the degree of integration of LSIs has been improved at an accelerating rate. Along with this, the miniaturization of wiring and the increase in chip size have been progressing. This tendency is due to resin prevention LS
The problems such as deformation of aluminum wiring of I, passive crack, and resin crack were aggravated. In order to solve these problems, it is currently strongly required to reduce the stress of the resin for semiconductor encapsulation.
従来から、シリコーンを使用した低応力エポキシ樹脂組
成物は色々と検討されているが、シリコーンオイルや有
機変性シリコーンオイルを用いる方法〔特開昭58−2141
7、特開昭59−81328、特開昭60−30157、特開昭60−138
41〕では、いずれの場合も成形性（特に硬化性、バリ、
離型性）及び耐湿性等に問題があった。Conventionally, various studies have been made on low stress epoxy resin compositions using silicone, but a method using silicone oil or organically modified silicone oil [JP-A-58-2141]
7, JP-A-59-81328, JP-A-60-30157, JP-A-60-138
41], in any case, moldability (especially curability, burr,
There was a problem in releasability) and moisture resistance.
又、シリコーンを使用しない低応力樹脂組成物も色々と
検討されている。たとえば合成ゴムを添加したりエポキ
シ樹脂、硬化剤等に反応させる事が検討されて来た。
（特開昭58−176958、特開昭60−31251、特開昭60−831
5）しかしながら、シリコーンを用いる場合と同様の欠
点があった。In addition, various low stress resin compositions that do not use silicone have been investigated. For example, it has been considered to add synthetic rubber or to react it with an epoxy resin or a curing agent.
(JP-A-58-176958, JP-A-60-31251, JP-A-60-831
5) However, it had the same drawbacks as when using silicone.
本発明は従来、成形性、耐湿性等に問題があり、市場レ
ベルでの適用ができなかったシリコーンによる低応力エ
ポキシ樹脂組成物のこれらの欠点を改良し、産業工業レ
ベルでの適用、即ち、実用的製品の開発を目的として研
究した結果、ビニルフェノール変性フェノールノボラッ
クと水素基含有オルガノポリシロキサンの反応物を硬化
剤として用いる事により、熱衝撃を受けた場合の耐クラ
ック性、耐湿性に優れる低応力エポキシ樹脂組成物が得
られる事を見い出したものである。The present invention has conventionally been problematic in moldability, moisture resistance, etc., and improved these disadvantages of the low stress epoxy resin composition by silicone which could not be applied at the market level, and applied at the industrial level, that is, As a result of research aimed at the development of practical products, by using a reaction product of vinylphenol-modified phenol novolac and hydrogen group-containing organopolysiloxane as a curing agent, it has excellent crack resistance and moisture resistance when subjected to thermal shock. It was found that a low stress epoxy resin composition can be obtained.
本発明は、フェノールとホルマリンとビニルフェノール
を酸性触媒下縮合させたビニルフェノール変性フェノー
ルノボラックと水素基含有オルガノポリシロキサンとを
反応させてなる硬化剤を全硬化剤の一部又は全部として
用い、かつエポキシ樹脂、硬化促進剤、シリカ充填剤等
よりなる半導体封止用エポキシ樹脂組成物である。The present invention uses a curing agent obtained by reacting a vinylphenol-modified phenol novolac obtained by condensation of phenol, formalin and vinylphenol under an acidic catalyst with a hydrogen group-containing organopolysiloxane, as a part or all of all curing agents, and An epoxy resin composition for semiconductor encapsulation comprising an epoxy resin, a curing accelerator, a silica filler and the like.
本発明において用いられる水素基含有オルガノポリシロ
キサンとしては、側鎖又は末端にSi−Ｈ結合有するオル
ガノポリシロキサンを言い一般式 側鎖 末端 （Ｒはアルキル基、フェニル基） 等で表わされるものを言う。分子量については任意であ
り、一般にＨオイルと称されるシリコーンオイル状のも
のから、シリコーン生ゴムと言われる高分子量のもの迄
あらゆるものを用いることができる。The hydrogen group-containing organopolysiloxane used in the present invention is an organopolysiloxane having a Si—H bond at the side chain or at the terminal and is represented by the general formula End (R is an alkyl group, a phenyl group) and the like. The molecular weight is arbitrary, and anything from a silicone oil type generally called H oil to a high molecular weight silicone raw rubber can be used.
これら水素基含有オルガノポリシロキサンとビニルフェ
ノール起源の樹脂中のビニル基との反応はヒドロシリル
化反応であり、白金系の触媒等（例えば塩化白金酸）を
用いる事により容易に行なう事ができる。The reaction between the hydrogen group-containing organopolysiloxane and the vinyl group in the resin derived from vinylphenol is a hydrosilylation reaction and can be easily performed by using a platinum-based catalyst or the like (for example, chloroplatinic acid).
この反応を行なう事により、硬化物からシリコーンのブ
リードを防ぐ事が出来、かつモルフォロジー的にも均一
にシリコーンが硬化物中に分散した低応力エポキシ樹脂
組成物を得る事ができる。By carrying out this reaction, it is possible to prevent bleeding of silicone from the cured product, and to obtain a low stress epoxy resin composition in which silicone is evenly dispersed in the cured product in terms of morphology.
この様なエポキシ樹脂はオルガノポリシロキサン成分が
樹脂中に１μｍ以下の微粒子として分散した海島構造の
エポキシ樹脂であり熱衝撃を受けた耐クラック性に優れ
るだけでなく、オルガノポリシロキサン成分が樹脂と結
合している為、樹脂からブリードする事がない為、成形
性、耐湿性等にも優れている。Such an epoxy resin is a sea-island structure epoxy resin in which the organopolysiloxane component is dispersed as fine particles of 1 μm or less in the resin, and not only is it excellent in crack resistance against thermal shock, but also the organopolysiloxane component is bonded to the resin. Since it does not bleed from the resin, it has excellent moldability and moisture resistance.
この様にして得られる変性硬化剤は硬化剤の全部又は一
部として用いる事ができる。但し、硬化物中にオルガノ
ポリシロキサン成分として１重量％以上になる様に配合
する事が望ましく、これ以下だと応力特性が劣る場合が
見られる。又、硬化物中の樹脂成分（エポキシ樹脂と硬
化剤）の重量総量の１／２以上にオルガノポリシロキサ
ン成分がなる様に配合すると硬化特性に著しい劣化が見
られる。The modified curing agent thus obtained can be used as all or a part of the curing agent. However, it is desirable to add the organopolysiloxane component in the cured product in an amount of 1% by weight or more, and if the amount is less than this, stress characteristics may be deteriorated. Further, if the organopolysiloxane component is added to ½ or more of the total weight of the resin components (epoxy resin and curing agent) in the cured product, the curing characteristics will be significantly deteriorated.
本発明において用いられるエポキシ樹脂としては、ビス
フェノールＡエポキシ樹脂、ノボラック型エポキシ樹
脂、脂環式エポキシ樹脂等のタイプを使用し、これらの
エポキシ樹脂は単独で使用しても、二種以上混合して使
用してもよい。As the epoxy resin used in the present invention, types such as bisphenol A epoxy resin, novolac type epoxy resin and alicyclic epoxy resin are used. These epoxy resins may be used alone or in combination of two or more kinds. May be used.
併用する場合の硬化剤としては多塩基性カルボン酸無水
物を単独もしくは、二種以上混合して使用する。これら
の例としては無水フタル、無水ヘキサヒドロフタル酸、
無水テトラヒドロフタル酸、無水コハク酸、無水マレイ
ン酸等がある。あるいは硬化剤として、フェノールノボ
ラック樹脂を使用してもよい。また硬化剤のエポキシ樹
脂に配合する量は、１エポキシ当量に対して、0.5〜1.2
当量が望ましく、それ以外では成形性に重大な欠陥を起
こす事がある。As the curing agent used in combination, polybasic carboxylic acid anhydrides may be used alone or in combination of two or more. Examples of these are phthalic anhydride, hexahydrophthalic anhydride,
Examples include tetrahydrophthalic anhydride, succinic anhydride, maleic anhydride, and the like. Alternatively, a phenol novolac resin may be used as the curing agent. The amount of the curing agent mixed with the epoxy resin is 0.5 to 1.2 per 1 epoxy equivalent.
An equivalent amount is desirable, and otherwise, serious defects may occur in formability.
硬化促進剤としては 第３級アミン又この誘導体 トリメチルアミン、トリエチルアミン、２、３、４、
６、７、８、９、10−オクタハイドロ−ピラミド（1,2
−ａ）アゼピン等又は、これらの第４級アンモニウム塩 有機ホスフィン化合物 (ａ)第１、第２、第３ホスフィン：オクチルホスフィ
ン、ジフェニルホスフィン、ブチルフェニルホスフィ
ン、トリシクロヘキシルホスフィン、トリフェニルホス
フィン等、 (ｂ)有機第３ホスフィンとπ結合を有する化合物のベタ
イン型付加物：無水マレイン酸−トリフェニルホスフィ
ン付加物、チオイソシアネート−トリフェニルホスフィ
ン付加物、ジアジフェニルメタン−トリフェニルホスフ
ィン付加物等 (ｃ)有機ホスホニウム塩：〔φ３PCH２φ〕 Cl 、
〔φ３PEt〕 Ｉ 、〔φ３PEt〕 Br etc 有機アルミニウム化合物 (ａ)Al（OR）３〔R:H、アルキル基、アリール基、アリ
ール基含有炭化水素基〕：アルミニウムイソプロポキシ
ド、アルミニウムｎ−ブトキシド、アルミニウムtert−
ブトキシド、アルミニウムsec−ブチレート、アルミニ
ウムベンゾエート等、 (ｂ)アルミニウムのβジケトン錯体（アルミニウムキレ
ート）：アルミニウムアセチルアセトナト、アルミニウ
ムトリフルオロアセチルアセトナト、アルミニウムペン
タフルオロアセチルアセトナト等、 チタン化合物 ブチルチタネート、チタン白等、 酸 類 パラトルエンスルホン酸 等をあげることができる。As a curing accelerator, a tertiary amine or its derivative trimethylamine, triethylamine, 2, 3, 4,
6,7,8,9,10-octahydro-pyramide (1,2
-A) Azepine or the like or a quaternary ammonium salt thereof Organic phosphine compound (a) First, second and third phosphines: octylphosphine
Amine, diphenylphosphine, butylphenylphosphine
, Tricyclohexylphosphine, triphenylphos
Fin, etc., (b) Solid of compound having π bond with organic third phosphine
In-type adduct: maleic anhydride-triphenylphosphine
Adduct, thioisocyanate-triphenylphosphine
Adduct, diadiphenylmethane-triphenylphosphine
(C) Organic phosphonium salt: [φThreePCHTwoφ] Cl ,
(ΦThreePEt] I , [ΦThreePEt] Br etc Organoaluminum compound (a) Al (OR)Three[R: H, alkyl group, aryl group, ant
Group-containing hydrocarbon group]: Aluminum isopropoxy
Aluminum, aluminum n-butoxide, aluminum tert-
Butoxide, aluminum sec-butyrate, aluminum
(B) β-diketone complex of aluminum (aluminum
): Aluminum acetylacetonate, aluminum
Mutrifluoroacetylacetonate, aluminum pen
Examples thereof include tafluoroacetylacetonato and the like, titanium compound butyl titanate, titanium white and the like, acids paratoluenesulfonic acid and the like.
このように本発明に従うと、成形性、耐湿性に優れ、か
つ熱衝撃を受けた場合の耐クラック性等にすぐれる低応
力エポキシ樹脂組成物を得ることができる。特に、半導
体封止用途では今後ますますプラスチックパッケージ化
が予想され、又、そのためにプラスチックの低応力化が
要求されている今日において本発明の産業的意味役割は
非常に大きい。As described above, according to the present invention, it is possible to obtain a low stress epoxy resin composition which is excellent in moldability and moisture resistance and is excellent in crack resistance and the like when subjected to thermal shock. In particular, in the field of semiconductor encapsulation, plastic packaging is expected more and more in the future, and the stress reduction of plastics is required for that purpose, and the industrial significance of the present invention is very large.
以下、半導体封止用成形性材料での検討例で説明する。
例で用いた部は全て重量部である。本発明による実施例
は従来の技術による比較例に比べ成形性・耐湿性、耐ク
ラック性の点で優れており工業的に利用できる高付加価
値を有している。Hereinafter, description will be made on a study example using a moldable material for semiconductor encapsulation.
All parts used in the examples are parts by weight. The examples according to the present invention are superior to the comparative examples according to the prior art in terms of moldability, moisture resistance, and crack resistance, and have a high added value that can be industrially used.
例で用いた水素基含有オルガノポリシロキサンは次の通
りである。The hydrogen group-containing organopolysiloxane used in the examples is as follows.
オルガノポリシロキサンa:平均構造式 オルガノポリシロキサンb:平均構造式 例で用いたビニルフェノール変性フェノールノボラック
と水素基含有オルガノポリシロキサンの反応物は次の通
りである。Organopolysiloxane a: average structural formula Organopolysiloxane b: average structural formula The reaction products of vinylphenol-modified phenol novolac and hydrogen group-containing organopolysiloxane used in the examples are as follows.
反応物（硬化剤） フェノールとホルムアルデヒドとビニルフェノール（モ
ル比で0.7:0.75:0.3）を硫酸触媒下反応後精製したビニ
ルフェノール変性フェノールノボラック80部に対しオル
ガノポリシロキサンa20部を塩化白金酸触媒下反応させ
精製する事により得た反応物、軟化点90℃。Reactant (curing agent) Phenol, formaldehyde and vinylphenol (molar ratio 0.7: 0.75: 0.3) were reacted under sulfuric acid catalyst and purified after reaction with 80 parts of vinylphenol-modified phenol novolac and 20 parts of organopolysiloxane a under chloroplatinic acid catalyst. Reaction product obtained by reaction and purification, softening point 90 ° C.
反応物（硬化剤） 上記と同様にして得たビニルフェノール変性フェノール
ノボラック80部に対しオルガノポリシロキサンb20部を
塩化白金酸触媒下反応させ精製する事により得た反応
物、軟化点95℃。Reaction product (curing agent) A reaction product obtained by reacting 80 parts of vinylphenol-modified phenol novolac obtained in the same manner as above with 20 parts of organopolysiloxane b in the presence of a chloroplatinic acid catalyst for purification, and a softening point of 95 ° C.
硬化剤 フェノールノボラック：群栄化学 MP−120 例で用いた原料は次の通りである。Hardener Phenol novolac: Gunei Chemical MP-120 The raw materials used in the examples are as follows.
・オルトクレゾールノボラック型エポキシ樹脂： 日本化薬 EOCN−1025−65 ・硬化剤／フェノールノボラック： 群栄化学 MP−120 ・硬化促進剤： ケ−アイ化成PP−360／四国化成2MZ＝９／１ ・充填材： 龍 森 溶融シリカ ・表面処理剤： 日本ユニカー Ａ−186 ・離型剤： ヘキストジャパン ヘキストOP／ヘキストＳ＝１／１ 適応例 硬化剤として、、、／＝１／１、／＝１
／１なる５水準を取りこれにエポキシ樹脂をエポキシ基
／フェノール性水酸基＝１／１（モル比）比率で合計が
30部になるよう仕込む、さらに硬化促進剤0.2部、充填
材70部、表面処理材0.5部、離型剤0.4部を加え混合後二
軸押出機を用い混練し材料化を行った。計５種の成形
性、耐クラック性、耐湿性を比較検討した結果、本発明
による樹脂組成物を用いた場合、従来のフェノールノボ
ラックを硬化剤として単独で用いる場合に比べ、いずれ
も特性が極めて優れることが判った。-Orthocresol novolac type epoxy resin: Nippon Kayaku EOCN-1025-65-Curing agent / phenol novolac: Gunei Chemical MP-120-Curing accelerator: KA Kasei PP-360 / Shikoku Kasei 2MZ = 9 / 1- Filler: Ryu Mori Fused silica-Surface treatment agent: Nippon Unicar A-186-Release agent: Hoechst Japan Hoechst OP / Hoechst S = 1/1 Adaptation example As a curing agent, / = 1/1, / = 1
/ 5 levels of / 1 and epoxy resin / epoxy group = 1/1 (molar ratio)
The mixture was charged to 30 parts, 0.2 parts of a curing accelerator, 70 parts of a filler, 0.5 part of a surface treatment material and 0.4 part of a release agent were added and mixed, and then kneaded using a twin-screw extruder to form a material. As a result of comparing 5 types of moldability, crack resistance, and moisture resistance in comparison, when the resin composition according to the present invention is used, the characteristics are extremely excellent as compared with the case where a conventional phenol novolac is used alone as a curing agent. It turned out to be excellent.
表−１に結果をまとめた。The results are summarized in Table-1.
Claims (1)
ビニルフェノールを酸性触媒下縮合させたビニルフェノ
ール変性フェノールノボラックと水素基含有オルガノポ
リシロキサンとを反応させてなる硬化剤、硬化促進剤、
シリカ充填剤を必須成分とすることを特徴とする半導体
封止用エポキシ樹脂組成物。1. A curing agent and a curing accelerator obtained by reacting an epoxy resin, a vinylphenol-modified phenol novolac obtained by condensing phenol, formalin and vinylphenol under an acidic catalyst with a hydrogen group-containing organopolysiloxane.
An epoxy resin composition for semiconductor encapsulation, comprising a silica filler as an essential component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20001386A JPH0651785B2 (en) | 1986-08-28 | 1986-08-28 | Epoxy resin composition for semiconductor encapsulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20001386A JPH0651785B2 (en) | 1986-08-28 | 1986-08-28 | Epoxy resin composition for semiconductor encapsulation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6356515A JPS6356515A (en) | 1988-03-11 |
| JPH0651785B2 true JPH0651785B2 (en) | 1994-07-06 |
Family
ID=16417345
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20001386A Expired - Fee Related JPH0651785B2 (en) | 1986-08-28 | 1986-08-28 | Epoxy resin composition for semiconductor encapsulation |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0651785B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2541015B2 (en) * | 1990-12-11 | 1996-10-09 | 信越化学工業株式会社 | Epoxy resin composition for semiconductor device encapsulation and semiconductor device |
| JP2727888B2 (en) * | 1992-05-14 | 1998-03-18 | 信越化学工業株式会社 | Silicone-modified aralkyl resin |
| JP3615929B2 (en) * | 1998-04-03 | 2005-02-02 | 松下電器産業株式会社 | Fixed resistor paint |
| JP4721736B2 (en) * | 2005-03-17 | 2011-07-13 | 三洋電機株式会社 | Embedded ceiling air conditioner |
-
1986
- 1986-08-28 JP JP20001386A patent/JPH0651785B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6356515A (en) | 1988-03-11 |
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