JPH065262B2 - IC tester cooling system test head - Google Patents
IC tester cooling system test headInfo
- Publication number
- JPH065262B2 JPH065262B2 JP61183623A JP18362386A JPH065262B2 JP H065262 B2 JPH065262 B2 JP H065262B2 JP 61183623 A JP61183623 A JP 61183623A JP 18362386 A JP18362386 A JP 18362386A JP H065262 B2 JPH065262 B2 JP H065262B2
- Authority
- JP
- Japan
- Prior art keywords
- test head
- cooling
- tester
- pin
- cooling system
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000001816 cooling Methods 0.000 title claims description 34
- 230000000694 effects Effects 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
Landscapes
- Tests Of Electronic Circuits (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明はテストヘッドに係り、特に多ピン実装時におけ
るピンエレクトロニクスカード（以下ピンカードと略
す）発熱による温度上昇を押さえ、効率的に冷却できる
超ＬＳＩテスタ用冷却システム内蔵テストヘッドに関す
る。Description: TECHNICAL FIELD The present invention relates to a test head, and particularly suppresses a temperature rise due to heat generation of a pin electronics card (hereinafter abbreviated as “pin card”) during multi-pin mounting and enables efficient cooling. The present invention relates to a test head with a built-in cooling system for a VLSI tester.
従来のＩＣテスタのテストヘッドの構造としては、ピン
カードの冷却が単にファンによる空冷式で、外部へ直接
排熱されている。また、ピンカードの実装用コネクタ
は、テストヘッド底部に設置されるため、冷却風の流路
を妨げており、冷却効率を悪化させる構造となってい
た。As a structure of a test head of a conventional IC tester, a pin card is simply cooled by air by a fan, and heat is directly discharged to the outside. In addition, since the pin card mounting connector is installed at the bottom of the test head, it obstructs the flow path of the cooling air, resulting in poor cooling efficiency.
前述した従来の冷却システムによるテストヘッドは、次
のような欠点がある。The test head using the conventional cooling system described above has the following drawbacks.
(1)ピンカード同志が隣接して実装されているため、ピ
ンカードの発熱量は相乗効果により増大しやすい。(1) Since the pin cards are mounted adjacent to each other, the heat generation amount of the pin cards tends to increase due to the synergistic effect.
(2)ファンにより、直接テストヘッドの外部へ排熱する
ので、ヘッド周囲の温度が上昇し、被測定ＩＣの測定環
境に悪影響を与える。(2) Since the fan directly exhausts heat to the outside of the test head, the temperature around the head rises, which adversely affects the measurement environment of the IC to be measured.
(3)ピンカードの実装構造は、テストヘッド底部にある
コネクタに挿入する方式のため、このコネクタがピンカ
ードを冷却する冷却風の流路を妨げる構造となってい
る。(3) The mounting structure of the pin card is such that it is inserted into the connector at the bottom of the test head, so that this connector obstructs the flow path of the cooling air that cools the pin card.
本発明の目的は、前記欠点を解消し、排熱効果を良好に
したＩＣテスタ冷却システムのテストヘッドを提供する
ことにある。It is an object of the present invention to provide a test head for an IC tester cooling system in which the above-mentioned drawbacks are eliminated and the heat exhaust effect is improved.
本発明のＩＣテスタ冷却システムのテストヘッドの構成
は、ピンエレクトロニクスカードの実装部の間に冷却フ
ィンを設け、この冷却フィンの下方に向けて冷却用ファ
ンを設け、この冷却用ファンの下方に熱交換器を設け、
前記実装部内の側壁に前記カードを装着するコネクタを
設けたことを特徴とする。In the configuration of the test head of the IC tester cooling system of the present invention, the cooling fin is provided between the mounting parts of the pin electronics card, the cooling fan is provided toward the lower side of the cooling fin, and the heat is provided below the cooling fan. With an exchange,
A connector for mounting the card is provided on a side wall of the mounting portion.
次に本発明を図面を参照しながら詳細に説明する。 Next, the present invention will be described in detail with reference to the drawings.
第１図は本発明の実施例のステーションテスト・ヘッド
を示す上面図、第２図は第１図のステーションテスト・
ヘッドをＡ−Ａ′線に沿って切断して見た断面図であ
る。これら図において、本実施例のテストヘッドは、冷
却フィン１がピンカード５の発生する熱を吸収し、ファ
ン２による冷却風によって冷却される。このファン２に
より外部へ放出される温風は、熱交換器３により冷却さ
れる。ピンカード５は、第２図に示すように、ガイド６
に沿って挿入され、側壁に設置されたコネクタ４に実装
され、上下方向の冷却風の流れを妨げないようになって
いる。FIG. 1 is a top view showing a station test head of an embodiment of the present invention, and FIG. 2 is a station test head of FIG.
FIG. 6 is a cross-sectional view of the head taken along the line AA ′. In these figures, in the test head of the present embodiment, the cooling fins 1 absorb the heat generated by the pin cards 5 and are cooled by the cooling air from the fan 2. The hot air discharged to the outside by the fan 2 is cooled by the heat exchanger 3. The pin card 5 has a guide 6 as shown in FIG.
And is mounted on the connector 4 installed on the side wall so as not to obstruct the flow of the cooling air in the vertical direction.
本実施例の冷却システム内蔵のテストヘッドは、次のよ
うな特徴を有する。The test head with a built-in cooling system of this embodiment has the following features.
(A)高密度に実装されたピンカード５の発生する熱を効
率よく吸収し、ピンカード相互の熱影響を防ぐため、ピ
ンカード間に冷却フィン１を有する。(A) The cooling fins 1 are provided between the pin cards in order to efficiently absorb the heat generated by the pin cards 5 mounted at high density and to prevent the mutual influence of heat on the pin cards.
(B)ファン２により外部へ放出される排熱風がテスタ周
囲の環境温度を上昇させるのを防ぐため、テスト・ヘッ
ド下部に排熱風を冷却する熱交換器３を有する。(B) In order to prevent the exhaust hot air discharged to the outside by the fan 2 from raising the environmental temperature around the tester, the heat exchanger 3 for cooling the exhaust hot air is provided under the test head.
(C)冷却風のスムーズな流通を得るために、ステーショ
ンテスト・ヘッドのピンカード実装用コネクタ４は側壁
に設置されている。(C) The pin card mounting connector 4 of the station test head is installed on the side wall in order to obtain a smooth flow of cooling air.
以上説明したように、本発明によれば、熱伝導率の優れ
た材質から成る冷却フィンにより、ピンカードが発生す
る熱を、従来の冷却方式と比較して効率良く吸収し、ピ
ンカードの温度を低く抑えることが可能で、ピンカード
の熱を吸収したフィンはファンによる冷却風で冷却さ
れ、またピンカードの実装コネクタを側壁に設置したこ
とにより冷却風の流れがスムーズになり、冷却効果を上
げることが可能で、フィンを冷却した後の温度の高い排
熱風は熱交換機により冷却されるので、テスタ環境温度
を上昇させず、テスタの動作及び被測定ＩＣに悪影響を
与えないという効果が得られる。As described above, according to the present invention, the heat generated by the pin card is efficiently absorbed by the cooling fins made of the material having excellent thermal conductivity as compared with the conventional cooling method, and the temperature of the pin card The fins that have absorbed the heat of the pin card are cooled by the cooling air from the fan, and by installing the pin card mounting connector on the side wall, the flow of the cooling air becomes smooth and the cooling effect is improved. It is possible to raise the temperature, and the exhaust hot air that has a high temperature after cooling the fins is cooled by the heat exchanger. Therefore, the environment temperature of the tester is not raised and the operation of the tester and the IC under test are not adversely affected To be
第１図は本発明の実施例であるステーションテストヘッ
ドの上面図、第２図は第１図のＡ−Ａ′線に沿って切断
して見た断面図である。 １……冷却フィン、２……ファン、３……熱交換器、４
……コネクタ、５……ピンカード、６……ガイド。FIG. 1 is a top view of a station test head according to an embodiment of the present invention, and FIG. 2 is a sectional view taken along the line AA 'in FIG. 1 ... Cooling fin, 2 ... Fan, 3 ... Heat exchanger, 4
...... Connector, 5 ...... Pin card, 6 ...... Guide.
Claims (1)
に冷却フィンを設け、この冷却フィンの下方に熱交換器
を設け、前記冷却フィンから前記熱交換器へ空気を流す
ように、前記冷却フィンと前記熱交換器との間に冷却用
ファンを設け、前記実装部内の側壁に前記カードを装着
するコネクタを設けたことを特徴とするＩＣテスタ冷却
システムのテストヘッド。1. A cooling fin is provided between mounting parts of a pin electronics card, a heat exchanger is provided below the cooling fin, and the cooling fin and the cooling fin are provided so that air flows from the cooling fin to the heat exchanger. A test head for an IC tester cooling system, wherein a cooling fan is provided between the heat exchanger and a connector for mounting the card on a side wall of the mounting portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61183623A JPH065262B2 (en) | 1986-08-04 | 1986-08-04 | IC tester cooling system test head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61183623A JPH065262B2 (en) | 1986-08-04 | 1986-08-04 | IC tester cooling system test head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6338185A JPS6338185A (en) | 1988-02-18 |
| JPH065262B2 true JPH065262B2 (en) | 1994-01-19 |
Family
ID=16139010
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61183623A Expired - Lifetime JPH065262B2 (en) | 1986-08-04 | 1986-08-04 | IC tester cooling system test head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH065262B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR19990042528A (en) * | 1997-11-27 | 1999-06-15 | 윤종용 | Semiconductor Package Test Device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0438305Y2 (en) * | 1985-12-13 | 1992-09-08 |
-
1986
- 1986-08-04 JP JP61183623A patent/JPH065262B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6338185A (en) | 1988-02-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105992476B (en) | A kind of sealed cabinet with multimode independence heat dissipation wind channel | |
| EP0020912A1 (en) | Air cooled electronic assemblies | |
| US11968805B2 (en) | Heatsink having air partitioning baffle | |
| JP3856511B2 (en) | Gantry for positron CT system | |
| JPH0677677A (en) | Forced-cooling type inverter device | |
| JPH065262B2 (en) | IC tester cooling system test head | |
| JP3156375B2 (en) | Forced air-cooled inverter | |
| CN219679050U (en) | Heat radiation structure for laser radar and laser radar | |
| CN212084098U (en) | Computer hardware heat abstractor | |
| JPS63192256A (en) | Integrated circuit cooling constitution | |
| JP5440061B2 (en) | Air-cooled power semiconductor device | |
| CN113655871A (en) | Computer heat conduction device | |
| JP3261820B2 (en) | Heating element mounting board | |
| JPH10190268A (en) | Electronic equipment cooling device | |
| CN223859476U (en) | Heat radiation structure and photovoltaic grid-connected inverter comprising same | |
| JPS5936960Y2 (en) | Cooling structure for electronic equipment | |
| JPH0228355A (en) | Semiconductor system device equipped with cooling structure | |
| JPH10311891A (en) | Cooling system for reactor pressure vessel support skirt base | |
| CN218497457U (en) | Vertical CPU radiator | |
| JPH07288391A (en) | High heating element cooling structure | |
| JPH01185460A (en) | Ic tester | |
| CN108633234A (en) | A kind of radiator for electronic equipment | |
| CN210579786U (en) | Condenser for accelerating heat dissipation of frequency converter | |
| JPS6317257Y2 (en) | ||
| JPS61117894A (en) | Cooling box body housing heat-generating electronic apparatus |