JPH0652828B2 - High current wiring board - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a large-current wiring board capable of connecting electrical components such as an inverter having both a high-voltage large-current circuit and a control circuit without wiring by electric wires. .

[Prior Art] Conventionally, in connection of an electric component having a large current circuit and a control circuit, the large current circuit is connected by an insulated wire or copper bar of about 22 mm ² , and the control circuit is connected by a small size insulated wire. ing.

In recent years, there has been a strong demand for rationalization of wiring of electric parts, automatic assembly, and downsizing, but it is impossible to satisfy such a requirement with an insulated wire or a copper bar.

For this reason, a wiring board unit in which a large-current shorting bar is added on a printed wiring board, the printed wiring is connected to a control circuit, and the large-current shorting bar is connected to a high-voltage large-current circuit has been partially put into practical use.

[Problems to be Solved by the Invention] However, since a large-current printed circuit board in which a large-current short bar is added on a printed circuit board having a control circuit has a complicated structure, the manufacturing has to rely on manpower. However, there is a problem in that the versatility is lacking because the cost becomes very high. Further, since it is a thin substrate, it is planar, and it is required that the connecting portion level of the electric parts to be connected be on the same plane, and the application is limited.

[Problems to be Solved by the Invention] The present invention has been made in view of the above circumstances, and an object thereof is to provide a large-current wiring board that can be simplified in structure and can be easily manufactured. .

[Means for Solving the Problems] The high-current wiring board of the present invention includes a control circuit formed on the surface of an injection-molded substrate by electroless plating and connected to control signal terminals of electric parts, and the above-mentioned injection-molded substrate. And a large current circuit composed of a short bar that is formed by being embedded in or fitted in and is connected to a power terminal of an electric component.

[Examples] A large-current wiring board of the present invention will be described below with reference to the accompanying drawings.

FIG. 1 shows one embodiment of a large current wiring board, 1 is an injection molded board, 2 is a control circuit, 3 is a through hole, 5 is a large current circuit, 6 is a connecting rod, and 7 is Grooves and 8 are mounting bosses.

As will be described later, the injection-molded substrate 1 is made of a thermoplastic resin containing a catalytic filler to form a first molded article,
It is manufactured by providing a second molded product on the outer periphery with a thermoplastic. In this case, the control circuit 2 and the through holes 3 and 4 are formed by exposing a part of the surface of the first molded product to the outside without covering it with the second molded product and adhering a metal thereto by electroless plating. To be done.

The large current circuit 5 is formed by fitting a short bar made of copper or the like into the groove 8 provided on the bottom surface of the injection molded substrate 1.

If necessary, the control circuit 2 and the large current circuit 5 are electrically connected by the connecting rod 6 through the through hole 4.

A series of steps for injection molding and electroless metal plating are
It can be automated with almost no manpower required, and the short bar can be easily fitted, so that a large current wiring board can be easily manufactured.

FIG. 2 shows an example in which electrical components are mounted on a large current wiring board. The electric component 12 is provided with a power terminal 13 and a control signal terminal 14. The control signal terminal 14 is inserted into the through hole 3 and the bolt 15 is sequentially inserted from the top of the windows 10 and 11 into the hole 9 and the power terminal 13. The high-current wiring board and the electric component 12 are integrated by being inserted into and screwed.

In this way, electrical components are mounted on the large-current wiring board by a very simple method of only locking a plurality of places with screws, and automation of assembly and downsizing are possible.

An example of manufacturing the high-current wiring board of the present invention is shown in FIGS.
It will be described with reference to the drawings.

FIG. 3 shows a first molded product for forming the control circuit 2 and the through holes 3 and 4.

The first molded product 16 is manufactured by injection molding of thermoplastics, and has a control circuit pattern 32, through hole patterns 33 and 34, and windows 10 and 11.

Examples of the thermoplastic used to form the first molded product 16 include polysulfone, polyether sulfone, polyaryl sulfone, polyetherimide, and acrylonitrile-butadiene-styrene copolymer.
The first molded product 16 is easily made adhesive by a treatment so that a metal can be deposited on its surface by electroless metal plating. To achieve this adhesiveness,
3-15% by weight of catalytic filler in thermoplastic
Is added. A typical example of the catalytic filler is powdered aluminum silicate treated with palladium. A thermoplastic containing a catalyst filler is commercially available from ICI Americas Limited under the trade name Victorex P200.

Next, the injection molded substrate 1 as shown in FIG. 4 can be obtained by forming a second molded product 17 by injection-molding a thermoplastic on the outer periphery of the first molded product 16. Examples of the plastic forming the second molded product 17 include polyester, polyphenylene sulfide, polyether ether ketone, polyvinyl chloride, polyethylene, polypropylene and the like. The second molded product 17 needs to be treated so as not to be adhesive and non-sticky, and it is preferable to use the above-mentioned crystalline thermoplastic.

A groove for fitting a short bar is formed on the bottom surface of the injection molded substrate 1, and the surfaces of the control circuit pattern 32 and the through hole pattern 33 are exposed to the outside.

When the injection-molded substrate 1 is processed to promote adhesion, the control circuit pattern 32 and the through hole pattern 33 are formed.
The surface of is adhesive.

A preferred processing method for promoting adhesion when the first molded product is formed by Victrex P200 is as follows.

(1) Immerse in a solution of 90% dimethylformamide and 10% water.

(2) Soak in 0.4 g of Gafac RE610 / water solution.

(3) Immerse in 48% sulfuric acid aqueous solution at 60 ℃.

(4) Etching in an aqueous solution containing 400 g / chromium trioxide, 450 g / sulfuric acid, and 0.5 g / perfluoroalkyl sulfonate.

(5) Rinse.

(6) Immersion in a solution containing 1.8% sulfuric acid and 1.4% hydrogen peroxide.

(7) Wash with water.

By performing the above steps (1) to (7), the surface of the first molded product 16 becomes microporous and hydrophilic, and is activated for electroless metal plating.

Next, this is immersed in an electroless metal (for example, copper) plating solution to thinly deposit a metal layer on the surface, and the control circuit 2 and the through holes 3 and 4 are formed. Electroless plating solution is copper 0.05m /, ethylenediamine tetra-
2-propanol 0.08m /, formaldehyde 0.05m /
, Alkylphenoxyglycidol phosphate ester 0.0009 m, sodium cyanide 0.0002 m /, potassium selenosine 0.007 m /, and an alkali metal hydroxide can be used. After immersion in this solution, washing and drying are performed to complete electroless plating.

Further, as shown in FIG. 5, the short bar 18 is fitted into the groove 7 of the injection-molded substrate 1 and fixed, whereby a large current wiring substrate as shown in FIG. 1 is obtained.

As a method of fitting the short bar 18 into the groove 7 of the injection-molded substrate 1 and fixing it, a predetermined number of fixing pins 20 longer than the thickness of the short bar 18 are arranged in the groove 7 as shown in FIG. A method may be adopted in which the fixing pin 20 is inserted into the hole 19 of 18 and the head portion of the fixing pin 20 is crushed by heat so as to be larger than the hole 19.

The connection between the large current circuit 5 and the control circuit 2 is made by inserting the connecting rod 6 into the through hole 4 and fixing it with solder or silver brazing 21, as shown in FIG.

FIG. 8 shows an embodiment in which a large current circuit is formed by embedding a short bar in an injection-molded substrate, and the same names as those in FIG. 1 are designated by the same reference numerals. The manufacturing method in this case is essentially the same as that described above, except that the short bar is embedded during the injection molding of the second molded product.

[Effects of the Invention] As described above, the high-current wiring board of the present invention is an injection-molded board provided with a high-current circuit and a control circuit, and the electrical components are connected by electric wires or copper bars. Compared to the conventional example, it is possible to eliminate wiring of electric equipment, rationalize wiring (automatic assembly), and make electric equipment compact.

In addition, the injection molding substrate having a control circuit manufactured by a combination of injection molding and electroless plating has a very simple structure in which a short current bar is inserted or embedded to form a large current circuit, so that it is easy to perform. It can be manufactured.

[Brief description of drawings]

FIG. 1 is an explanatory view of an embodiment of a large current wiring board of the present invention,
FIG. 2 is an explanatory view of an example in which electric components are mounted on the large current wiring board of the present invention. 3 to 7 are explanatory views of an example of manufacturing a large-current wiring board according to the present invention. FIG. 3 is an explanatory view of a first molded product, and FIG. 4 is a second molded product on the outer periphery of the first molded product. FIG. 5 is an explanatory view of an injection-molded substrate on which a molded product is formed. FIG. 5 is an explanatory view of a case where a short bar is fitted and fixed to the injection-molded substrate,
FIG. 6 is an explanatory view of the groove for fixing the short bar, and FIG. 7 is an explanatory view of the connection between the control circuit and the large current circuit. FIG. 8 is an explanatory view of another embodiment of the large current wiring board of the present invention. 1: Injection-molded substrate 2: Control circuit 3, 4: Through hole 5: Large current circuit 6: Connection rod 7: Groove 8: Mounting boss 9: Hole 10, 11: Window 12: Electrical component 13: Power terminal 14 Control terminal 15: Bolt 16: First molded product 17: Second molded product 18: Short bar 19: Hole 20: Fixing pin 21: Solder 32: Control circuit pattern 33, 34: Through hole pattern

Front Page Continuation (72) Inventor Hideo Matsuo 5-1-1 Hidaka-cho, Hitachi City, Ibaraki Hitachi Cable Co., Ltd. Hidaka Plant (72) Inventor Junichi Aoi 2-1-2 Marunouchi, Chiyoda-ku, Tokyo (56) References JP 62-211987 (JP, A) JP 63-50482 (JP, A) JP 63-70483 (JP, A)

Claims (1)

[Claims] 1. A control circuit formed on the surface of an injection-molded substrate by electroless plating and connected to a control signal terminal of an electric component; A large-current wiring board comprising a large-current circuit including a short bar connected to a terminal.