JPH0654824B2 - Array type semiconductor laser device - Google Patents
Array type semiconductor laser deviceInfo
- Publication number
- JPH0654824B2 JPH0654824B2 JP62206109A JP20610987A JPH0654824B2 JP H0654824 B2 JPH0654824 B2 JP H0654824B2 JP 62206109 A JP62206109 A JP 62206109A JP 20610987 A JP20610987 A JP 20610987A JP H0654824 B2 JPH0654824 B2 JP H0654824B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor laser
- array type
- type semiconductor
- light
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 29
- 239000000758 substrate Substances 0.000 claims description 17
- 125000006850 spacer group Chemical group 0.000 description 5
- 238000003491 array Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
- H01S5/068—Stabilisation of laser output parameters
- H01S5/0683—Stabilisation of laser output parameters by monitoring the optical output parameters
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Lasers (AREA)
- Semiconductor Lasers (AREA)
Description
【発明の詳細な説明】 (産業上の利用分野) 本発明は半導体レーザによる光源装置に関し、特にアレ
イ型のレーザ装置に関するものである。Description: TECHNICAL FIELD The present invention relates to a light source device using a semiconductor laser, and more particularly to an array type laser device.
(従来の技術) 半導体レーザは小型であるから、光ディスク装置などの
光源としてガスレーザに代って広く用いられている。ま
た、近年複数の独立駆動が可能な発光源を備えたアレイ
型の半導体レーザが開発されている。このようなレーザ
を用いることにより、従来の装置より優れた特性を得る
ことが可能となり、例えば光ディスク装置においてはデ
ータ転送速度が増す。(Prior Art) Since a semiconductor laser is small, it is widely used as a light source for an optical disk device or the like instead of a gas laser. Further, in recent years, an array type semiconductor laser provided with a plurality of light sources capable of being independently driven has been developed. By using such a laser, it is possible to obtain better characteristics than the conventional device, and for example, the data transfer speed is increased in the optical disk device.
アレイ型の半導体レーザにおいては、個々の発光源を独
立に駆動するだけでなく、発光源の出力を独立にモニタ
することが実用上重要である。発光出力をレンズ系を介
して結像し、結像点で各発光源の出力をモニタすること
も考えられるが、この方式では光学系が必要であるから
光源が大型化してしまう。In an array type semiconductor laser, it is practically important not only to drive each light emitting source independently but also to monitor the output of the light emitting source independently. It is conceivable to form an image of the light emission output through a lens system and monitor the output of each light emission source at the image formation point, but this system requires an optical system, resulting in an increase in size of the light source.
第5図は従来のモニタ方式のアレイ型半導体レーザ装置
を示す斜視図である。ヒートシンク基板1に予め受光面
6を作りつけておき、アレイ型半導体レーザ2を図のよ
うに設置する。各発光源7からの出力をそれぞれの受光
面で受光し出力のモニタを行なう。また、第6図は従来
の他のモニタ方式のアレイ型半導体レーザ装置を示す側
面図である。この方式では、ヒートシンク基板1上に設
けたアレイ型半導体レーザ2の裏面に近接して複数の受
光面6を備えたアレイ型ディテクタ3が設置してある。FIG. 5 is a perspective view showing a conventional monitor type array type semiconductor laser device. The light-receiving surface 6 is formed in advance on the heat sink substrate 1, and the array type semiconductor laser 2 is installed as shown in the figure. The output from each light emitting source 7 is received by each light receiving surface and the output is monitored. FIG. 6 is a side view showing another conventional monitor type array type semiconductor laser device. In this method, an array-type detector 3 having a plurality of light-receiving surfaces 6 is installed in proximity to the back surface of the array-type semiconductor laser 2 provided on the heat sink substrate 1.
(発明が解決しようとする問題点) 第5図の例ではヒートシンク基板1上に受光面6が設け
てあるから、アレイ型半導体レーザ2をヒートシンク基
板1に接着するときに接着材として用いる金属などが受
光面6にはみ出すことがないように注意する必要があ
る。また、各レーザを独立に駆動するためのレーザ電極
5をヒートシンク基板1上に設ける場合、受光面6と重
ならないようにするために引出す電極の幅が制限され
る。半導体レーザは通常数10mA〜100mA以上の電流を必
要とするから、電極が細いと電極抵抗値などの影響を受
けてしまう。(Problems to be Solved by the Invention) In the example of FIG. 5, since the light receiving surface 6 is provided on the heat sink substrate 1, a metal or the like used as an adhesive when the array type semiconductor laser 2 is bonded to the heat sink substrate 1 is used. It is necessary to take care so that the light does not overflow on the light receiving surface 6. Further, when the laser electrode 5 for independently driving each laser is provided on the heat sink substrate 1, the width of the extracted electrode is limited so as not to overlap the light receiving surface 6. Since a semiconductor laser usually requires a current of several tens to 100 mA or more, if the electrode is thin, it will be affected by the electrode resistance value.
また第6図の例では、レーザ出射端面に平行に受光面6
が設けられているから受光面6からの反射光がレーザに
戻り、出力レベルや雑音特性を不安定にしてしまう。Further, in the example of FIG. 6, the light receiving surface 6 is parallel to the laser emitting end surface.
Is provided, the reflected light from the light-receiving surface 6 returns to the laser, making the output level and noise characteristics unstable.
本発明の目的は上記のような問題点を生じることがな
い。モニタ機能付のアレイ型半導体レーザ装置を得るこ
とにある。The object of the present invention does not cause the above problems. To obtain an array type semiconductor laser device with a monitor function.
(問題点を解決するための手段) 本発明のアレイ型半導体レーザ装置は、ヒートシンク基
板と、複数の発光源を有するアレイ型半導体レーザと、
このアレイ型半導体レーザの発光源とほぼ等しい間隔で
独立な受光面を有するアレイ型ディテクタとを有し、前
記ヒートシンク基板上面に前記アレイ型半導体レーザが
設置してあり、このアレイ型半導体レーザの片側端面に
近接して、前記受光面と前記ヒートシンク基板上面とが
所定の間隔を持って互いに向かい合う状態で、かつ前記
半導体レーザの発光位置が前記所定の間隔の中に存在す
るように前記アレイ型ディテクタが設置されていること
を特徴とする。(Means for Solving Problems) An array type semiconductor laser device of the present invention includes a heat sink substrate, an array type semiconductor laser having a plurality of light emitting sources,
The array type semiconductor laser has a light emitting source and an array type detector having independent light receiving surfaces at substantially equal intervals, and the array type semiconductor laser is installed on an upper surface of the heat sink substrate. One side of the array type semiconductor laser The array-type detector is arranged so that the light receiving surface and the upper surface of the heat sink substrate face each other with a predetermined gap close to the end face, and the light emitting position of the semiconductor laser exists within the predetermined gap. Is installed.
(作用) 第2図に本発明の基本的な構成例を側面図で示す。アレ
イ型ディテクタ3は受光面6が下向きにヒートシンク基
板1と間を空けて設置されている。受光面6の高さは、
アレイ型半導体レーザ2の発光源7より上であればよ
い。レーザの端面からの出射光の一部は受光面6に吸収
され、残りはヒートシンク基板1上面のディテクタ3下
面で反射をする。本発明の配置であれば反射光が発光源
に戻ることはないためレーザ出力を不安定にすることな
く出力モニタが可能となる。第3図のように受光面6と
ヒートシンク基板1の上面は平行である必要はなく、出
射光が発光源に戻らない角度であればよい。(Operation) FIG. 2 is a side view showing a basic configuration example of the present invention. The array-type detector 3 is installed so that the light-receiving surface 6 faces downward and is spaced apart from the heat sink substrate 1. The height of the light receiving surface 6 is
It may be above the light emission source 7 of the array type semiconductor laser 2. Part of the light emitted from the end face of the laser is absorbed by the light receiving surface 6, and the rest is reflected by the lower surface of the detector 3 on the upper surface of the heat sink substrate 1. With the arrangement according to the present invention, since the reflected light does not return to the light emitting source, the output can be monitored without making the laser output unstable. As shown in FIG. 3, the light receiving surface 6 and the upper surface of the heat sink substrate 1 do not have to be parallel to each other, but may be at an angle at which emitted light does not return to the light emitting source.
第4図は、第2図のアレイ型半導体レーザ装置における
レーザ出射光に対する受光面6の位置を示す平面図であ
る。各発光源からの出射光が重ならない位置に受光面を
設けることで各出射光を独立に受光することが出来る。
本図では4個のアレイの例を示しているが、本発明では
アレイの数に制限はない。またアレイの間隔が付均一で
あっても原理的には同じように各出射光を独立に受光す
ることができる。FIG. 4 is a plan view showing the position of the light receiving surface 6 with respect to the laser emission light in the array type semiconductor laser device of FIG. By providing the light receiving surface at a position where the emitted lights from the respective light emitting sources do not overlap, the emitted lights can be independently received.
Although this figure shows an example of four arrays, the present invention does not limit the number of arrays. Even if the arrays are evenly spaced, each emitted light can be independently received in principle in the same manner.
(実施例) 第1図は本発明の一実施例を示す斜視図である。この実
施例では、ヒートシンク基板1上にアレイ型半導体レー
ザ2とスペーサ4を介してアレイ型ディテクタ3が設け
られている。レーザ電極5はディテクタ3の受光面の下
にも設けることができるから、十分な幅を確保すること
ができる。電極5へのボンディング位置は散乱光を避け
るためにできるだけ横の方がよい。(Embodiment) FIG. 1 is a perspective view showing an embodiment of the present invention. In this embodiment, an array type semiconductor laser 2 and an array type detector 3 are provided on a heat sink substrate 1 via a spacer 4. Since the laser electrode 5 can be provided below the light receiving surface of the detector 3, it is possible to secure a sufficient width. The bonding position to the electrode 5 should be as lateral as possible to avoid scattered light.
ディテクタ3の保持の構造は実施のものに限られない。
例えばディテクタ3の表面に予めスペーサとなるような
凹凸を設けておいてもよい。また各受光面の間に遮光効
果のあるようなスペーサを設け、隣接発光源からのクロ
ストークをさらに低減することもできる。The structure for holding the detector 3 is not limited to the implementation.
For example, the surface of the detector 3 may be previously provided with irregularities to serve as spacers. Further, a spacer having a light blocking effect may be provided between the light receiving surfaces to further reduce crosstalk from adjacent light emitting sources.
ディテクタ3の電極は、スペーサを介してヒートシンク
基板1上に導く構成としてもよい。The electrodes of the detector 3 may be configured to be guided onto the heat sink substrate 1 via the spacer.
(発明の効果) 本発明により、レーザ特性に影響を与えることなく独立
にモニタが可能なアレイ型半導体レーザ装置を得ること
ができる。(Effects of the Invention) According to the present invention, it is possible to obtain an array type semiconductor laser device that can be independently monitored without affecting the laser characteristics.
第1図は本発明の一実施例を示す斜視図、第2図〜第4
図は本発明の構成を説明する図、第5図および第6図は
従来例を示す図である。 1……ヒートシンク基板、2……アレイ型半導体レー
ザ、3……アレイ型ディテクタ、4……スペーサ、5…
…レーザ電極、6……受光面、7……発光源。FIG. 1 is a perspective view showing an embodiment of the present invention, and FIGS.
FIG. 5 is a diagram for explaining the configuration of the present invention, and FIGS. 5 and 6 are diagrams showing a conventional example. 1 ... Heat sink substrate, 2 ... Array type semiconductor laser, 3 ... Array type detector, 4 ... Spacer, 5 ...
... laser electrode, 6 ... light receiving surface, 7 ... light emitting source.
Claims (1)
るアレイ型半導体レーザと、このアレイ型半導体レーザ
の発光源とほぼ等しい間隔で独立な受光面を有するアレ
イ型ディテクタとを有し、前記ヒートシンク基板上面に
前記アレイ型半導体レーザが設置してあり、このアレイ
型半導体レーザの片側端面に近接して、前記受光面と前
記ヒートシンク基板上面とが所定の間隔を持って互いに
向かい合う状態で、かつ前記半導体レーザの発光位置が
前記所定の間隔の中に存在するように前記アレイ型ディ
テクタが設置してあることを特徴とするアレイ型半導体
レーザ装置。1. A heat sink comprising: a heat sink substrate; an array type semiconductor laser having a plurality of light emitting sources; and an array type detector having an independent light receiving surface at substantially the same intervals as the light emitting sources of the array type semiconductor laser. The array type semiconductor laser is installed on the upper surface of the substrate, and the light receiving surface and the upper surface of the heat sink substrate face each other with a predetermined distance in close proximity to one end surface of the array type semiconductor laser, and An array type semiconductor laser device, wherein the array type detector is installed so that a light emitting position of the semiconductor laser exists within the predetermined interval.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62206109A JPH0654824B2 (en) | 1987-08-19 | 1987-08-19 | Array type semiconductor laser device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62206109A JPH0654824B2 (en) | 1987-08-19 | 1987-08-19 | Array type semiconductor laser device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6449291A JPS6449291A (en) | 1989-02-23 |
| JPH0654824B2 true JPH0654824B2 (en) | 1994-07-20 |
Family
ID=16517950
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62206109A Expired - Lifetime JPH0654824B2 (en) | 1987-08-19 | 1987-08-19 | Array type semiconductor laser device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0654824B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19614526A1 (en) * | 1996-04-12 | 1997-10-16 | Sick Ag | Laser arrangement for generating a main and a reference light beam |
| JP2012094765A (en) * | 2010-10-28 | 2012-05-17 | Sanyo Electric Co Ltd | Semiconductor laser device and optical device |
| JP5779214B2 (en) * | 2013-10-01 | 2015-09-16 | ウシオオプトセミコンダクター株式会社 | Multi-beam semiconductor laser device |
-
1987
- 1987-08-19 JP JP62206109A patent/JPH0654824B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6449291A (en) | 1989-02-23 |
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