JPH065672B2 - Work drying method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The disclosed technology belongs to a technical field of drying accompanying cleaning of ultra-precision electronic components and the like manufactured in a room in which dust and the like are shielded.

<Summary of Summary> Thus, the present invention is for drying water droplets remaining on the surface of a solid work formed into a predetermined precision shape such as a glass substrate, an optical lens, a wafer, or a disc after washing. , Is an invention relating to a drying method utilizing suction in a booth, and in particular, in a drying treatment method such as heating drying or cooling drying, water droplets attached to a surface of a work piece that relatively moves in the booth are noncontacting via a predetermined clearance. It is sucked to a negative pressure from the drying surface of the work by the facing nozzle and is led to the conduit to which the nozzle is connected along with the air in the booth, sucking fine water droplets in the booth or reattaching to the work. It is an invention relating to a method for drying a work which is prevented.

<Prior Art> Generally, drying is performed by vaporization and diffusion of water vapor into the atmosphere. The vaporization and diffusion is heated by infrared irradiation or hot-air drying, or in addition to this, volatility of an organic solvent is used. Drying efficiency is increased by the drying method
Alternatively, a spin drying method using centrifugal force, blow drying with high pressure air, and the like have been put into practical use.

Then, in the main process of the electronic equipment manufacturing factory, etc., which provides drying of works such as glass substrates, optical lenses and disks that have been precision cleaned in the preceding stage using such means, it is isolated from the outside air through the booth, and the inside of the booth is clean. Then, the optical lens, the glass substrate or the wafer, or the component such as the disc or the IC substrate is manufactured.

And in the booth, for example, as shown in FIG.
A predetermined infrared irradiation device 4 is arranged in the middle of the drying processing device 3 for the work 2 carried in by the conveyor 1 so that the outside air is shut off in the booth 5 so that the droplets 7 are vaporized and diffused in the air 6. There is.

<Problems to be Solved by the Invention> However, the diffusion of the steam 7 in the booth 5 is finite, and it is necessary to always keep the inside of the booth 5 in a clean state. Secondary treatment is required due to the installation of

In addition, since the inside of the booth 5 is a kind of processing environment, in the above-mentioned drying method, there is a structural defect in which the reattachment of dust or the like to the work 2 to be dried may be unavoidable. Further, drying with an organic solvent is accompanied by a problem of environmental pollution, and in the case of a flammable solvent, there is a restriction in that it is subject to various regulations and the like when used.

Then, for example, the spin drying method as in the invention of Japanese Patent Laid-Open No. 62-21227 has a drawback that the work may be damaged by the high speed rotation of the rotor in principle.

Further, there is also a disadvantage that the water droplets that have jumped adhere to the adjacent work and cause stains.

<Object of the Invention> An object of the present invention is to solve the problem of drying a work such as a precision component based on the above-mentioned conventional technique, and to ensure efficient drying without damaging the work. The process in the booth can be applied to various works, and drying that prevents re-adhesion of water droplets, dust, etc. can be performed, providing an excellent drying method that is useful in the field of cleaning technology application in the machine manufacturing industry. To do.

<Means and Actions for Solving the Problem> In order to solve the above-mentioned problems, the structure of the present invention having the above-mentioned object as a gist is provided with a nozzle for air suction in the booth, By forming a negative pressure in the vicinity of the nozzle tip by connecting a negative pressure generating device such as a suction pump to the surface of the work carried in by a conveyor or the like in the booth, or perform a predetermined clearance control, Technical means capable of drying the work by bringing the nozzle close to the work to suck the clean air held in the booth and forcibly sucking and removing the droplet liquid film on the surface of the work Was taken.

<Embodiment> Next, one embodiment of the present invention will be described below with reference to FIG. The description will be given using the same symbols as those in FIG.

3'is an apparatus used in the drying method according to the gist of the present invention, and is a booth 5 for holding an atmosphere filled with dust-free air 6 for a wafer 2 as a work placed on a conveyor 1 and carried in. It is provided for being dried.

In the drying device 3 ', a nozzle 10 having slit-shaped intakes formed on the surface of each wafer 2 held by the work holders 9, 9 ... Installed so that the nozzle 10 has a conduit
11 is connected, and the conduit 11 is connected to an air suction pump 13 via a well-known moisture separator 12 so that the air 6 is discharged to the outside of the predetermined booth 5.

Further, the booth 5 is provided with a ventilation port 14 so that the pure air 6 is introduced from the outside.

The air 6 discharged from the booth 5 is made to conduct to the ventilation port 14 via the filter 15.

Further, an appropriate photoelectric sensor 16 is provided along the path of the work holder 9 on the conveyor 1, and is electrically connected to the operation control circuit device 17 of the air suction pump 13 of the photoelectric sensor 16.

In the above-mentioned configuration, the air suction pump 13 is activated every time the sensor 16 detects the work holder 9 on the conveyor 1 in accordance with the driving of the conveyor 1, and the wafer 2 as the work on the work holder 9 and the nozzle 10 are separated. Negative pressure is generated near the clearance formed between them.

Due to the negative pressure, the liquid droplet 7 and the liquid film on the surface of the wafer 2 are sucked into the nozzle 10 together with the air 6 in the booth 5.

Then, the sucked droplets 6 are filtered by the water separator 12 and discharged to the outside of the drying device 3'in a predetermined manner.

In the process, since the droplet 7 on the work 2 and the air 6 are sucked into the nozzle 10, the atmosphere in the booth 5 is not disturbed, and the air 6 in the booth 5 is not disturbed.
Does not hit the work surface.

Needless to say, the embodiment of the present invention is not limited to the above-mentioned embodiment, and the suction port of the suction nozzle may have a slit shape or a spot shape depending on the shape of the work, or may enhance the air suction efficiency in the booth. For example, a multi-hole nozzle can be freely used.

Further, it is also possible to move the nozzle in a scanning manner with respect to the work surface.

<Effects of the Invention> As described above, according to the present invention, the drying process after the precision cleaning process is basically performed on the electronic parts in the booth, and the work surface without generating turbulent air flow in the booth. The vapor that diffuses and separates from the droplet can be sucked in the vicinity of the nozzle, and therefore, an excellent effect that the drying process can be performed quickly is exhibited.

As a result of the nozzle facing the droplet on the surface of the work piece so that a negative pressure can be generated, the droplet separates from the surface of the work piece together with the air in the booth and is prevented from adhering to the work piece, that is, dried. Since air, air, and liquid droplets are discharged from the nozzle to the outside of the booth system, the atmosphere in the booth is not disturbed and dust or water droplets can be prevented from reattaching to the work surface. That is an excellent effect.

In addition, it is effective to irradiate the work with infrared rays while sucking the air in the booth, or to supplementarily use other heat sources to enhance the vaporization efficiency, and it is also possible to preheat the work itself. It has an excellent effect that it is effective in the drying process and that a wide range of aspects of the drying process such as an application example of the present invention can be freely adopted.

Further, since there is no mechanical action such as rotation on the work due to spin drying or the like, the work is not damaged, and the structure of the drying device itself is simplified, so that the drying effect is enhanced. .

Further, since the drying action is air suction, there is also an excellent effect that water droplets are not scattered due to spraying and the like, and thus the scattered water droplets are not reattached to the adjacent work.

[Brief description of drawings]

FIG. 1 is a schematic partial sectional view of a drying device showing an embodiment of the present invention, and FIG. 2 is a schematic partial sectional view of a drying device showing a conventional mode. 2 ... Work, 5 ... Booth, 4 ... Forced diffusion device, 3, 3 '... Work drying device, 10 ... Suction nozzle, 13 ... Air negative pressure generator

Claims (1)

[Claims] 1. A method for drying a work, in which droplets adhering to the work are sucked in a booth to perform a drying process, wherein an intake negative pressure is applied to at least a local surface of the work through a predetermined clearance. A method for drying a work, which is characterized in that it works.