JPH0658990B2 - Warpage correction method for printed wiring board - Google Patents
Warpage correction method for printed wiring boardInfo
- Publication number
- JPH0658990B2 JPH0658990B2 JP63101646A JP10164688A JPH0658990B2 JP H0658990 B2 JPH0658990 B2 JP H0658990B2 JP 63101646 A JP63101646 A JP 63101646A JP 10164688 A JP10164688 A JP 10164688A JP H0658990 B2 JPH0658990 B2 JP H0658990B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- surface side
- temperature
- warp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 55
- 238000001816 cooling Methods 0.000 claims description 50
- 239000011347 resin Substances 0.000 claims description 25
- 229920005989 resin Polymers 0.000 claims description 25
- 230000000052 comparative effect Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 230000009477 glass transition Effects 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000007664 blowing Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
本発明は、プリント配線板の加熱温度及び冷却温度を表
面側と裏面側とで異ならせて反りを矯正する方法に関す
る。The present invention relates to a method for correcting warpage by making a heating temperature and a cooling temperature of a printed wiring board different between a front surface side and a back surface side.
従来からプリント配線板は、たとえばエポキシ樹脂、フ
ェノール樹脂、ポリイミド樹脂等で形成される銅張積層
板に導体パターンを設け、スルーホールめっきなどを施
して製造されている。 このようなプリント配線板はその製造工程において、加
熱や加湿、加圧など種々の外的要因により反りが発生す
ることがある。プリント配線板の反りはプリント配線板
の機械的な歪みに起因するものであり、プリント配線板
の表面と裏面での導体パターンの面積の差や、多層プリ
ント配線板における内層の層構成のアンバランス等が反
りの原因になっている。 このプリント配線板の反りは、プリント配線板への実装
がリードでおこなわれる場合にはたいした問題とならな
いが、表面実装が増加するにつれてプリント配線板の反
りが大きな問題となっている。Conventionally, a printed wiring board is manufactured by providing a conductor pattern on a copper clad laminate formed of, for example, an epoxy resin, a phenol resin, a polyimide resin, etc., and performing through-hole plating or the like. Such a printed wiring board may warp in the manufacturing process due to various external factors such as heating, humidification, and pressure. The warpage of the printed wiring board is caused by mechanical distortion of the printed wiring board.The difference in the area of the conductor pattern on the front and back surfaces of the printed wiring board and the imbalance of the inner layer structure of the multilayer printed wiring board Etc. is the cause of the warp. The warp of the printed wiring board does not become a serious problem when the leads are mounted on the printed wiring board, but the warp of the printed wiring board becomes a serious problem as the surface mounting increases.
【発明が解決しようとする課題】 そして従来は、プリント配線板の反りを矯正するため
に、プリント配線板に加熱、冷却を施して残留応力を除
去することをおこなっているが、反りの矯正は不充分な
ものであった。 本発明は上記事情に鑑みて為されたものであり、その目
的とするところは、プリント配線板の反りを確実に矯正
することにある。Conventionally, in order to correct the warp of the printed wiring board, the printed wiring board is heated and cooled to remove the residual stress. It was insufficient. The present invention has been made in view of the above circumstances, and an object thereof is to reliably correct warpage of a printed wiring board.
本発明のプリント配線板の反り矯正方法は、樹脂積層板
で作成されたプリント配線板１を加熱し、次いで冷却す
るプリント配線板１の反り矯正方法であって、加熱工程
においては、プリント配線板１の反りが発生している表
面側１ａを裏面側１ｂよりも高い温度で加熱し、冷却工
程においては、プリント配線板１の表面側１ａを裏面側
１ｂよりも低い温度で冷却することを特徴とするもので
ある。A warp straightening method for a printed wiring board according to the present invention is a warp straightening method for a printed wiring board 1 in which a printed wiring board 1 made of a resin laminated board is heated and then cooled. 1 is heated at a temperature higher than that of the back surface side 1b, and the front surface side 1a of the printed wiring board 1 is cooled at a temperature lower than that of the back surface side 1b in the cooling step. It is what
樹脂積層板で作成されたプリント配線板１を加熱するに
あたって、プリント配線板１の反りが発生している表面
側１ａを裏面側１ｂよりも高い温度で加熱すると、反り
が発生している表面側１ａを裏面側１ｂよりも大きく熱
膨張させることができ、従ってプリント配線板１の反り
を緩和することができる。 次にこのように加熱したプリント配線板１を冷却するに
あたって、プリント配線板１の表面側１ａを裏面側１ｂ
よりも低い温度で冷却すると、裏面側１ｂよりも高温に
加熱されている表面側１ａの冷却速度は裏面側１ｂの冷
却速度よりも速くなる。 ここで、樹脂積層板は加熱すると熱膨張し、次に冷却す
ると収縮するが、このように加熱して熱膨張させた後に
樹脂積層板を冷却する際に、冷却速度を遅くして徐冷す
ると、樹脂積層板は元の寸法よりもさらに短い寸法に収
縮するという傾向があり、また冷却速度を速くして急冷
すると、樹脂積層板は元の寸法よりさらに収縮するとい
うことはなくなって、元の寸法付近にまで戻るか、ある
いは逆に元の寸法にまで戻らず元の寸法よりも長くなる
という傾向がある。（これらについては後述の第５図
（ａ）（ｂ）を参照。） 従ってプリント配線板１を冷却するにあたって上記のよ
うにプリント配線板１の表面側１ａの冷却速度を速く、
裏面側１ｂの冷却速度を遅くなるようにすると、裏面側
１ｂは表面側１ａよりも大きく収縮することになり、こ
の表面側１ａと裏面側１ｂの収縮の差によってプリント
配線板１に逆向きの反りを起こさせる力が作用し、プリ
ント配線板１の反りが相殺されて矯正される。When heating the printed wiring board 1 made of a resin laminated board, if the front surface side 1a where the warp of the printed wiring board 1 is generated is heated at a higher temperature than the back surface side 1b, the front surface side where the warp occurs The thermal expansion of 1a can be made larger than that of the back surface side 1b, so that the warp of the printed wiring board 1 can be alleviated. Next, in cooling the printed wiring board 1 thus heated, the front surface side 1a of the printed wiring board 1 is changed to the back surface side 1b.
When cooled at a lower temperature, the cooling rate of the front surface side 1a, which is heated to a higher temperature than the back surface side 1b, becomes faster than the cooling speed of the back surface side 1b. Here, the resin laminated plate thermally expands when heated, and then contracts when cooled, but when the resin laminated plate is cooled after being heated and thermally expanded in this way, the cooling rate is slowed and gradually cooled. , The resin laminate tends to shrink to a dimension shorter than the original dimension, and when the cooling rate is increased to quench the resin laminate, the resin laminate does not shrink further than the original dimension. There is a tendency that it returns to near the dimension, or conversely, it does not return to the original dimension and becomes longer than the original dimension. (Refer to FIGS. 5A and 5B described later for these.) Therefore, when cooling the printed wiring board 1, as described above, the cooling rate of the front surface side 1a of the printed wiring board 1 is high,
When the cooling rate of the back surface side 1b is slowed, the back surface side 1b contracts more than the front surface side 1a, and the difference in contraction between the front surface side 1a and the back surface side 1b causes the printed wiring board 1 to face in the opposite direction. A force that causes a warp acts, and the warp of the printed wiring board 1 is offset and corrected.
プリント配線板１とは、樹脂積層板による電気絶縁性基
板の外層あるいは内層に電気良導体金属で転写再現され
た電気配線図形（導体パターン）を有し、通常スルーホ
ールめっきにより相互接続され、かつ搭載される回路部
品との接続と支持体を具備した総てのものを含む概念で
ある。 このプリント配線板１の反りを矯正するにあたっては、
まずプリント配線板１を加熱する。加熱温度はプリント
配線板１の樹脂積層板のガラス転移温度前後に設定する
のが好ましい。例えば樹脂積層板を構成する樹脂がエポ
キシ樹脂の場合には、そのガラス転移温度である１２０
〜１８０℃の前後に設定するのが好ましい。勿論、本発
明では加熱温度がガラス転移温度より低い場合でも反り
の矯正の効果を得ることができるが、加熱温度が高いほ
うが反りの矯正の効果は大きい。しかし、加熱温度が高
過ぎると樹脂積層板に変質その他の問題が生じるおそれ
があるために、加熱温度をガラス転移温度前後に設定す
るのが好ましいのである。 この加熱は第１図（ａ）に示すように加熱板２間にプリ
ント配線板１を配置しておこなうことができる。具体的
には、第２図に示すような加熱装置Ａによりおこなうこ
とができる。加熱装置Ａは複数の加熱板２を所定の間隔
をおいて加圧モータ３の正逆駆動により近接離間自在に
配置することによって構成してあり、加熱板２間にプリ
ント配線板１を挿入して加熱するようにしてある。 この加熱工程において加熱温度は、プリント配線板１の
反りが発生している表面側（凹面側）１ａの温度を、裏
面側（凸面側）１ｂの温度よりも高く設定するものであ
る。例えば、加熱板２に熱媒を供給循環して加熱をおこ
なうにあたって、高温側の加熱板２ａの温度を１６０
℃、低温側の加熱板２ｂの温度を１００℃に設定して、
プリント配線板１の反りが発生している表面側１ａを裏
面側１ｂよりも高い温度で加熱するものである。 プリント配線板１を加熱するとプリント配線板１は熱膨
張するが、このようにプリント配線板１の反りが発生し
ている表面側１ａを裏面側１ｂよりも高い温度で加熱す
ると、プリント配線板１の表面側１ａを裏面側１ｂより
も大きく熱膨張させることができ、この表面側１ａと裏
面側１ｂの熱膨張率の差でプリント配線板１の反りを緩
和することができ、あるいは反りを無くすことができ
る。 例えば、第３図の（Ａ）に示すようにｘの反りが生じて
いたプリント配線板１を上記のように反りが発生してい
る表面側１ａを裏面側１ｂよりも高い温度で加熱するこ
とによって、第３図の（Ｂ）（ａ）に示すようにｙの反
りまで緩和することができる。しかし、このように加熱
した後に、プリント配線板１を室温に放置するなどして
プリント配線板１の表面側１ａと裏面側１ｂが同じ条件
で冷却されると、プリント配線板１の表面側１ａと裏面
側１ｂは同じように収縮するので、表面側１ａと裏面側
１ｂの熱膨張率の差によるプリント配線板１の反りの緩
和は消失し、第３図（Ｂ）（ｂ）のようにプリント配線
板１はｘの反りに戻ってしまう。 そこで本発明では、上記のようにプリント配線板１を加
熱工程で加熱した後に、冷却工程でプリント配線板１を
冷却するにあたって、プリント配線板１の表面側１ａと
裏面側１ｂよりも低い温度で冷却するものである。 プリント配線板１の冷却は第１図（ｂ）に示すようにプ
リント配線板１を冷却板４間に配置しておこなうことが
できる。具体的には、第２図の加熱装置Ａにおいて加熱
板２の代わりに冷却板４を配置して構成される冷却装置
（図示省略）によりおこなうことができる。 例えば、低温側の冷却板４ａの温度を−２０℃〜３０℃
に、高温側の冷却板４ｂの温度を１０〜１００℃に設定
して、プリント配線板１の表面側１ａを裏面側１ｂより
も低い温度で冷却するものである。 前記の加熱工程ではプリント配線板１の表面側１ａを裏
面側１ｂよりも高い温度で加熱しており、プリント配線
板１の表面側１ａは裏面側１ｂよりも高い温度になって
いるが、このように、冷却工程でプリント配線板１の表
面側１ａを裏面側１ｂよりも低い温度で冷却すると、第
４図の温度曲線に示されるように、プリント配線板１の
表面側１ａは裏面側１ｂよりも急速に冷却されることに
なる。 そして、樹脂積層板は加熱及び冷却によって第５図
（ａ）（ｂ）に示すような寸法挙動を示す傾向がある。
すなわち、第５図（ａ）（ｂ）は、ガラス基材エポキシ
樹脂積層板（松下電工株式会社製「Ｒ−１７０５Ｓ
Ｘ」）の５０mm×６．５mm×１．６mmの試験片を用い、
これを１５０℃の熱板で６分間加熱した後、冷却したと
きの試験片の寸法挙動の変化を示すものであり、横軸に
試験片の温度、縦軸に試験片の寸法変化を示す。また
「たて」は試験片の長手方向を、「よこ」は試験片の短
手方向を示す。 そして第５図（ａ）は試験片を上記のように加熱した後
に冷却するにあたって、試験片を室温で放置して徐冷し
たときの寸法挙動の変化を示すものであり、加熱して試
験片の温度が上昇するに従って試験片は熱膨張し、次に
冷却して試験片の温度が低下するに従って試験片は収縮
するが、このように徐冷すると、試験片は元の寸法より
もさらに収縮して短くなる。これは、樹脂積層板を構成
する樹脂は部分的に結晶構造を有しているが、徐冷する
と結晶構造の部分が増加して結晶化度が高くなる、つま
り樹脂の分子の配列の規則性が高くなるために、徐冷す
ると樹脂は元の寸法よりも収縮するためであると説明さ
れている。 また第５図（ｂ）は試験片を加熱した後に冷却するにあ
たって、試験片に０℃付近の温度の冷風を試験片に吹き
当てて強制的に急冷したときの寸法挙動の変化を示すも
のであり、このように急冷するときには、試験片は元の
寸法よりもさらに収縮することはなく、元の寸法に戻る
（あるいは逆に元の寸法にまで戻らず元の寸法よりも長
くなることもある）。これは、急冷すると樹脂の結晶構
造の部分が少なくなって結晶化度が低くなる、つまり樹
脂の分子の配列の規則性が低くなるために、急冷すると
樹脂は元の寸法よりも収縮することはないためであると
説明されている。 尚、第５図（ａ）（ｂ）のような寸法挙動の傾向は樹脂
積層板の特定の樹脂にのみ、みられるのではなく、傾向
の大小はあるが樹脂一般にみられるものである。 そして、前記のように、プリント配線板１を冷却するに
あたって表面側１ａの冷却速度を速く、裏面側１ｂの冷
却速度を遅くなるようにすると、プリント配線板１の裏
面側１ｂは表面側１ａよりも大きく収縮することにな
り、この表面側１ａと裏面側１ｂの収縮の差によって、
表面側１ａが反っているプリント配線板１に逆向きの反
りを起こさせる力が作用し、これによって反りが相殺さ
れてプリント配線板１の反りを矯正することができるも
のである。 従って、第３図の（Ｂ）（ａ）から（Ｂ）（ｃ）へのよ
うにプリント配線板１の反りは矯正され、しかもこのよ
うに反りが矯正された状態でプリント配線板１は冷却さ
れているために、第３図の（Ｂ）（ｃ）から（Ｂ）
（ｄ）へのようにプリント配線板１の反りが戻るような
ことはなく、プリント配線板１の反りを矯正した状態に
固定することができるものである。 次に、具体例及び比較例を挙げて本発明の効果を例証す
る。 （具体例１） プリント配線板１として、３５０mm×４００mm×１．６
mmのガラス基材エポキシ樹脂積層板（松下電工株式会社
製「Ｒ−１７０５ＳＸ」）の両面に銅箔で導体パターン
を設けて作成したものを用いた。このプリント配線板１
の反りを測定したところ、表面側１ａにα＝３．５mmの
反りが発生していた（反りは第１図（ａ）のαの寸法で
示される）。 そしてこのプリント配線板１を第１図（ａ）のように加
熱板２間に挿入し、高温側の加熱板２ａを１７０℃、低
温側の加熱板２ｂを１３０℃の温度に調整して３分間加
熱した。次に直ちにこの加熱したプリント配線板１を第
１図（ｂ）のように冷却板４の間に挿入し、低温側の冷
却板４ａを２０℃、高温側の冷却板４ｂを３０℃に調整
して１分間冷却した。 このようにして加熱及び冷却の処理をおこなった後、プ
リント配線板１の反りを測定したところ、α＝０，８mm
であった。 （具体例２） 上記具体例１と同様に作成したプリント配線板１を用
い、このプリント配線板１の反りを測定したところ、α
＝３．５mmであった。 そしてこのプリント配線板１を第１図（ａ）のように加
熱板２間に挿入し、高温側の加熱板２ａを１６０℃、低
温側の加熱板２ｂを１４０℃の温度に調整して３分間加
熱した。次に直ちにこの加熱したプリント配線板１を第
１図（ｂ）のように冷却板４の間に挿入し、低温側の冷
却板４ａを２０℃、高温側の冷却板４ｂを３０℃に調整
して１分間冷却した。 このようにして加熱及び冷却の処理をおこなった後、プ
リント配線板１の反りを測定したところ、α＝１．２mm
であった。 （比較例１） 上記具体例１と同様に作成したプリント配線板１を用
い、このプリント配線板１の反りを測定したところ、α
＝３．５mmであった。 そしてこのプリント配線板１を第１図（ａ）のように加
熱板２間に挿入し、高温側の加熱板２ａを１６０℃、低
温側の加熱板２ｂを１４０℃の温度に調整して３分間加
熱した。次に直ちにこの加熱したプリント配線板１を第
１図（ｂ）のように冷却板４の間に挿入し、冷却板４
ａ，４ｂを共に２０℃の同じ温度に調整して１分間冷却
した。 このようにして加熱及び冷却の処理をおこなった後、プ
リント配線板１の反りを測定したところ、α＝２．３mm
であった。 （比較例２） 上記具体例１と同様に作成したプリント配線板１を用
い、このプリント配線板１の反りを測定したところ、α
＝３．５mmであった。 そしてこのプリント配線板１を第１図（ａ）のように加
熱板２間に挿入し、加熱板２ａ，２ｂを共に１５０℃の
同じ温度に調整して３分間加熱した。次に直ちにこの加
熱したプリント配線板１を第１図（ｂ）のように冷却板
４の間に挿入し、低温側の冷却板４ａを２０℃、高温側
の冷却板４ｂを３０℃に調整して１分間冷却した。 このようにして加熱及び冷却の処理をおこなった後、プ
リント配線板１の反りを測定したところ、α＝２．７mm
であった。 （比較例３） 上記具体例１と同様に作成したプリント配線板１を用
い、このプリント配線板１の反りを測定したところ、α
＝３．５mmであった。 そしてこのプリント配線板１を第１図（ａ）のように加
熱板２間に挿入し、加熱板２ａ，２ｂを共に１５０℃の
同じ温度に調整して３分間加熱した。次に直ちにこの加
熱したプリント配線板１を第１図（ｂ）のように冷却板
４の間に挿入し、冷却板４ａ，４ｂを共に２０℃の同じ
温度に調整して１分間冷却した。 このようにして加熱及び冷却の処理をおこなった後、プ
リント配線板１の反りを測定したところ、α＝２．９mm
であった。 上記の比較例１〜３では反りの矯正の効果を十分に得る
ことができないのに対して、具体例１，２のように、加
熱工程ではプリント配線板１の反りが発生している表面
側１ａを裏面側１ｂよりも高い温度で加熱し、冷却工程
ではプリント配線板１の表面側１ａを裏面側１ｂよりも
低い温度で冷却することによって、反りの矯正を有効に
おこなうことができるものであった。The printed wiring board 1 has an electric wiring pattern (conductor pattern) reproduced and reproduced by a metal having good electrical conductivity on an outer layer or an inner layer of an electrically insulating substrate made of a resin laminated board, and is usually interconnected by through-hole plating and mounted. It is a concept that includes all that are provided with a support and a connection with circuit components that are formed. In correcting the warp of the printed wiring board 1,
First, the printed wiring board 1 is heated. The heating temperature is preferably set around the glass transition temperature of the resin laminated plate of the printed wiring board 1. For example, when the resin forming the resin laminate is an epoxy resin, its glass transition temperature is 120.
It is preferable to set the temperature around ˜180 ° C. Of course, in the present invention, the effect of correcting the warp can be obtained even when the heating temperature is lower than the glass transition temperature, but the higher the heating temperature, the greater the effect of correcting the warp. However, if the heating temperature is too high, deterioration or other problems may occur in the resin laminated plate, so it is preferable to set the heating temperature around the glass transition temperature. This heating can be performed by disposing the printed wiring board 1 between the heating plates 2 as shown in FIG. Specifically, the heating device A as shown in FIG. 2 can be used. The heating device A is configured by arranging a plurality of heating plates 2 at predetermined intervals so that they can be moved closer to and away from each other by driving the pressurizing motor 3 forward and backward, and the printed wiring board 1 is inserted between the heating plates 2. It heats up. In this heating step, the heating temperature is set such that the temperature of the front surface side (concave surface side) 1a where the warpage of the printed wiring board 1 occurs is higher than the temperature of the back surface side (convex surface side) 1b. For example, when the heating medium is heated by supplying and circulating the heating medium to the heating plate 2, the temperature of the heating plate 2a on the high temperature side is set to 160.
℃, set the temperature of the low temperature side heating plate 2b to 100 ℃,
The front surface side 1a where the warpage of the printed wiring board 1 is generated is heated at a higher temperature than the back surface side 1b. When the printed wiring board 1 is heated, the printed wiring board 1 thermally expands. However, when the front surface side 1a in which the warp of the printed wiring board 1 is generated is heated at a higher temperature than the back surface side 1b, the printed wiring board 1 is heated. The front side 1a of the printed wiring board 1 can be thermally expanded more than the back side 1b, and the difference in the coefficient of thermal expansion between the front side 1a and the back side 1b can reduce the warp of the printed wiring board 1 or eliminate the warp. be able to. For example, as shown in FIG. 3 (A), the printed wiring board 1 in which the warp of x has occurred is heated at a temperature higher than the front surface side 1a in which the warp occurs as described above than the back surface side 1b. As a result, as shown in FIGS. 3B and 3A, the warp of y can be alleviated. However, if the front surface side 1a and the back surface side 1b of the printed wiring board 1 are cooled under the same conditions by, for example, leaving the printed wiring board 1 at room temperature after heating in this way, the front surface side 1a of the printed wiring board 1 Since the back surface side 1b and the back surface side 1b contract in the same manner, the relaxation of the warp of the printed wiring board 1 due to the difference in the coefficient of thermal expansion between the front surface side 1a and the back surface side 1b disappears, and as shown in FIG. 3 (B) (b). The printed wiring board 1 returns to the warp of x. Therefore, in the present invention, after the printed wiring board 1 is heated in the heating step as described above, when the printed wiring board 1 is cooled in the cooling step, the temperature is lower than that of the front surface side 1a and the back surface side 1b of the printed wiring board 1. It is to cool. The printed wiring board 1 can be cooled by arranging the printed wiring board 1 between the cooling plates 4 as shown in FIG. Specifically, it can be performed by a cooling device (not shown) configured by disposing a cooling plate 4 instead of the heating plate 2 in the heating device A of FIG. For example, the temperature of the cooling plate 4a on the low temperature side is -20 ° C to 30 ° C.
In addition, the temperature of the cooling plate 4b on the high temperature side is set to 10 to 100 ° C. to cool the front surface side 1a of the printed wiring board 1 at a temperature lower than the back surface side 1b. In the above heating step, the front surface side 1a of the printed wiring board 1 is heated at a higher temperature than the back surface side 1b, and the front surface side 1a of the printed wiring board 1 is at a higher temperature than the back surface side 1b. As described above, when the front surface side 1a of the printed wiring board 1 is cooled at a temperature lower than that of the back surface side 1b in the cooling step, the front surface side 1a of the printed wiring board 1 becomes the back surface side 1b as shown in the temperature curve of FIG. Will be cooled more rapidly than. The resin laminated plate tends to show dimensional behavior as shown in FIGS. 5 (a) and 5 (b) by heating and cooling.
That is, FIGS. 5 (a) and 5 (b) are glass-based epoxy resin laminates (“R-1705S” manufactured by Matsushita Electric Works, Ltd.).
X ") 50 mm x 6.5 mm x 1.6 mm test piece,
This shows the change in the dimensional behavior of the test piece when it was cooled after heating it with a hot plate at 150 ° C. for 6 minutes, the horizontal axis shows the temperature of the test piece, and the vertical axis shows the dimensional change of the test piece. Further, "vertical" indicates the longitudinal direction of the test piece, and "horizontal" indicates the lateral direction of the test piece. FIG. 5 (a) shows the change in dimensional behavior when the test piece is left to stand at room temperature and then gradually cooled when the test piece is cooled after being heated as described above. The test piece thermally expands as the temperature of the test piece rises, and then shrinks as the temperature of the test piece decreases by cooling and then gradually cools, so that the test piece shrinks more than its original size. And become shorter. This is because the resin that constitutes the resin laminate has a partially crystalline structure, but when gradually cooled, the crystal structure portion increases and the degree of crystallinity increases, that is, the regularity of the resin molecule arrangement. It is explained that the resin shrinks from the original size when it is slowly cooled due to the increase in the temperature. Further, FIG. 5 (b) shows a change in dimensional behavior when the test piece is cooled after being heated and cooled by blowing cold air having a temperature near 0 ° C. onto the test piece forcibly and rapidly cooling. Yes, when quenched in this way, the test piece does not shrink further than the original dimensions and may return to the original dimensions (or conversely, it may become longer than the original dimensions without returning to the original dimensions) ). This is because when the material is cooled rapidly, the crystal structure portion of the resin is reduced and the degree of crystallinity is low, that is, the regularity of the molecular arrangement of the resin is low, and therefore the resin does not shrink from its original size when it is rapidly cooled. It is explained that it is because there is no. Incidentally, the tendency of dimensional behavior as shown in FIGS. 5 (a) and 5 (b) is not found only in a specific resin of the resin laminated plate, but is found in general resins although there is a large and small tendency. As described above, when cooling the printed wiring board 1 by increasing the cooling rate on the front surface side 1a and slowing the cooling rate on the back surface side 1b, the back surface side 1b of the printed wiring board 1 is more than the front surface side 1a. Also greatly contracts, and due to the difference in contraction between the front surface side 1a and the rear surface side 1b,
A force that causes a warp in the opposite direction is exerted on the printed wiring board 1 whose front surface side 1a is warped, whereby the warp is offset and the warp of the printed wiring board 1 can be corrected. Therefore, the warp of the printed wiring board 1 is corrected as shown in FIGS. 3 (B) (a) to (B) (c), and the printed wiring board 1 is cooled in the state where the warp is corrected. Therefore, since (B) (c) to (B) in FIG.
The warp of the printed wiring board 1 does not return as in (d), and the warp of the printed wiring board 1 can be fixed in a corrected state. Next, the effects of the present invention will be illustrated with reference to specific examples and comparative examples. (Specific Example 1) As the printed wiring board 1, 350 mm x 400 mm x 1.6
A glass-based epoxy resin laminated plate (“R-1705SX” manufactured by Matsushita Electric Works, Ltd.) having a thickness of mm and a conductor pattern formed of copper foil on both sides was used. This printed wiring board 1
As a result of measurement of the warp, a warp of α = 3.5 mm occurred on the front surface side 1a (the warp is indicated by the dimension of α in FIG. 1 (a)). Then, the printed wiring board 1 is inserted between the heating plates 2 as shown in FIG. 1 (a), the heating plate 2a on the high temperature side is adjusted to 170 ° C., and the heating plate 2b on the low temperature side is adjusted to 130 ° C. Heated for minutes. Next, immediately insert the heated printed wiring board 1 between the cooling plates 4 as shown in FIG. 1 (b), and adjust the cooling plate 4a on the low temperature side to 20 ° C and the cooling plate 4b on the high temperature side to 30 ° C. And cooled for 1 minute. After the heating and cooling processes were performed in this manner, the warp of the printed wiring board 1 was measured, and α = 0,8 mm
Met. (Specific Example 2) When the printed wiring board 1 produced in the same manner as in the above-mentioned specific example 1 was used and the warp of the printed wiring board 1 was measured, α
= 3.5 mm. Then, the printed wiring board 1 is inserted between the heating plates 2 as shown in FIG. 1 (a), the heating plate 2a on the high temperature side is adjusted to 160 ° C., and the heating plate 2b on the low temperature side is adjusted to 140 ° C. Heated for minutes. Next, immediately insert the heated printed wiring board 1 between the cooling plates 4 as shown in FIG. 1 (b), and adjust the cooling plate 4a on the low temperature side to 20 ° C and the cooling plate 4b on the high temperature side to 30 ° C. And cooled for 1 minute. After the heating and cooling processes were performed in this way, the warp of the printed wiring board 1 was measured, and α = 1.2 mm
Met. (Comparative Example 1) Using the printed wiring board 1 prepared in the same manner as in Specific Example 1 above, the warpage of the printed wiring board 1 was measured.
= 3.5 mm. Then, the printed wiring board 1 is inserted between the heating plates 2 as shown in FIG. 1 (a), the heating plate 2a on the high temperature side is adjusted to 160 ° C., and the heating plate 2b on the low temperature side is adjusted to 140 ° C. Heated for minutes. Then, the heated printed wiring board 1 is immediately inserted between the cooling plates 4 as shown in FIG.
Both a and 4b were adjusted to the same temperature of 20 ° C. and cooled for 1 minute. After the heating and cooling processes were performed in this manner, the warp of the printed wiring board 1 was measured, and α = 2.3 mm
Met. (Comparative Example 2) Using the printed wiring board 1 prepared in the same manner as in the specific example 1 above, the warpage of the printed wiring board 1 was measured.
= 3.5 mm. Then, this printed wiring board 1 was inserted between the heating plates 2 as shown in FIG. 1 (a), both heating plates 2a and 2b were adjusted to the same temperature of 150 ° C. and heated for 3 minutes. Next, immediately insert the heated printed wiring board 1 between the cooling plates 4 as shown in FIG. 1 (b), and adjust the cooling plate 4a on the low temperature side to 20 ° C and the cooling plate 4b on the high temperature side to 30 ° C. And cooled for 1 minute. After the heating and cooling processes were performed in this manner, the warp of the printed wiring board 1 was measured, and α = 2.7 mm
Met. (Comparative Example 3) When the printed wiring board 1 produced in the same manner as in the specific example 1 was used and the warp of the printed wiring board 1 was measured, α
= 3.5 mm. Then, this printed wiring board 1 was inserted between the heating plates 2 as shown in FIG. 1 (a), both heating plates 2a and 2b were adjusted to the same temperature of 150 ° C. and heated for 3 minutes. Next, the heated printed wiring board 1 was immediately inserted between the cooling plates 4 as shown in FIG. 1 (b), both cooling plates 4a and 4b were adjusted to the same temperature of 20 ° C. and cooled for 1 minute. After the heating and cooling treatments were performed in this manner, the warp of the printed wiring board 1 was measured and found that α = 2.9 mm.
Met. In Comparative Examples 1 to 3 described above, the effect of correcting the warp cannot be sufficiently obtained, whereas as in Examples 1 and 2, the printed wiring board 1 is warped in the heating step. Warping can be effectively performed by heating 1a at a temperature higher than the back surface side 1b and cooling the front surface side 1a of the printed wiring board 1 at a temperature lower than the back surface side 1b in the cooling step. there were.
上記のように本発明は、加熱工程においては、プリント
配線板の反りが発生している表面側を裏面側よりも高い
温度で加熱し、冷却工程においては、プリント配線板の
表面側を裏面側よりも低い温度で冷却するようにしたの
で、プリント配線板を加熱した後に冷却する際の、プリ
ント配線板の表面側と裏面側の冷却速度に差を付けるこ
とができ、この冷却速度の差によるプリント配線板の表
面側と裏面側の寸法変化の差を利用して、プリント配線
板の反りを確実に矯正することができるものである。As described above, in the present invention, in the heating step, the front surface side of the printed wiring board in which the warpage has occurred is heated at a higher temperature than the back surface side, and in the cooling step, the front surface side of the printed wiring board is the back surface side. Since the cooling is performed at a lower temperature than the above, it is possible to make a difference in the cooling rate between the front surface side and the back surface side of the printed wiring board when the printed wiring board is cooled after being heated. By utilizing the difference in dimensional change between the front surface side and the back surface side of the printed wiring board, the warpage of the printed wiring board can be reliably corrected.
第１図（ａ）（ｂ）は本発明の加熱工程及び冷却工程を
示す概略図、第２図は同上における加熱装置を示す概略
図、第３図は本発明における反りの矯正の説明図、第４
図は本発明の加熱工程及び冷却工程におけるプリント配
線板の表面側と裏面側の温度変化を示すグラフ、第５図
（ａ）（ｂ）は樹脂積層板の徐冷の場合と急冷の場合の
寸法変化の挙動を示すグラフである。 １はプリント配線板、１ａは表面側、１ｂは裏面側、２
は加熱板、４は冷却板である。1 (a) and 1 (b) are schematic views showing a heating step and a cooling step of the present invention, FIG. 2 is a schematic view showing a heating device in the same as above, and FIG. 3 is an explanatory view of warping correction in the present invention, Fourth
FIG. 5 is a graph showing temperature changes on the front surface side and the back surface side of the printed wiring board in the heating step and the cooling step of the present invention, and FIGS. 5 (a) and 5 (b) show a case where the resin laminated plate is gradually cooled and a case where it is rapidly cooled. It is a graph which shows the behavior of dimensional change. 1 is a printed wiring board, 1a is a front side, 1b is a back side, 2
Is a heating plate, and 4 is a cooling plate.
Claims (1)
加熱し、次いで冷却するプリント配線板の反り矯正方法
であって、加熱工程においては、プリント配線板の反り
が発生している表面側を裏面側よりも高い温度で加熱
し、冷却工程においては、プリント配線板の表面側を裏
面側よりも低い温度で冷却することを特徴とするプリン
ト配線板の反り矯正方法。1. A method of straightening a warp of a printed wiring board, comprising heating a printed wiring board made of a resin laminated board and then cooling the printed wiring board. In the heating step, the warp of the printed wiring board occurs on the surface side. Is heated at a temperature higher than that of the back surface side, and in the cooling step, the front surface side of the printed wiring board is cooled at a temperature lower than that of the back surface side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63101646A JPH0658990B2 (en) | 1988-04-25 | 1988-04-25 | Warpage correction method for printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63101646A JPH0658990B2 (en) | 1988-04-25 | 1988-04-25 | Warpage correction method for printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01272189A JPH01272189A (en) | 1989-10-31 |
| JPH0658990B2 true JPH0658990B2 (en) | 1994-08-03 |
Family
ID=14306143
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63101646A Expired - Fee Related JPH0658990B2 (en) | 1988-04-25 | 1988-04-25 | Warpage correction method for printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0658990B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9059240B2 (en) | 2012-06-05 | 2015-06-16 | International Business Machines Corporation | Fixture for shaping a laminate substrate |
| US9048245B2 (en) | 2012-06-05 | 2015-06-02 | International Business Machines Corporation | Method for shaping a laminate substrate |
| US9129942B2 (en) | 2012-06-05 | 2015-09-08 | International Business Machines Corporation | Method for shaping a laminate substrate |
| JP2015226020A (en) * | 2014-05-29 | 2015-12-14 | 富士通株式会社 | Circuit board manufacturing apparatus and circuit board manufacturing method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6189694A (en) * | 1984-10-09 | 1986-05-07 | ソニー株式会社 | Method and apparatus for correcting shape of printed circuitboard |
-
1988
- 1988-04-25 JP JP63101646A patent/JPH0658990B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01272189A (en) | 1989-10-31 |
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