JPH0659708B2 - Metal ceramics bonded body - Google Patents
Metal ceramics bonded bodyInfo
- Publication number
- JPH0659708B2 JPH0659708B2 JP60272318A JP27231885A JPH0659708B2 JP H0659708 B2 JPH0659708 B2 JP H0659708B2 JP 60272318 A JP60272318 A JP 60272318A JP 27231885 A JP27231885 A JP 27231885A JP H0659708 B2 JPH0659708 B2 JP H0659708B2
- Authority
- JP
- Japan
- Prior art keywords
- intermediate layer
- metal
- thermal expansion
- coefficient
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000919 ceramic Substances 0.000 title claims description 36
- 229910052751 metal Inorganic materials 0.000 title claims description 29
- 239000002184 metal Substances 0.000 title claims description 29
- 229910045601 alloy Inorganic materials 0.000 claims description 8
- 239000000956 alloy Substances 0.000 claims description 8
- 239000002131 composite material Substances 0.000 claims description 7
- 229910052758 niobium Inorganic materials 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 229910052750 molybdenum Inorganic materials 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 53
- 230000035882 stress Effects 0.000 description 13
- 230000008646 thermal stress Effects 0.000 description 11
- 239000000463 material Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 229910001220 stainless steel Inorganic materials 0.000 description 5
- 239000010935 stainless steel Substances 0.000 description 5
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 229910000975 Carbon steel Inorganic materials 0.000 description 2
- 239000010962 carbon steel Substances 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 229910000833 kovar Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000009864 tensile test Methods 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 1
- 229910000967 As alloy Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002905 metal composite material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000011225 non-oxide ceramic Substances 0.000 description 1
- 229910052575 non-oxide ceramic Inorganic materials 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000005297 pyrex Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
Landscapes
- Pressure Welding/Diffusion-Bonding (AREA)
- Laminated Bodies (AREA)
- Ceramic Products (AREA)
Description
【発明の詳細な説明】 ＜産業上の利用分野＞ この発明は、耐熱、耐蝕性構造部品等に応用されるセラ
ミックスと金属との接合体に関するものである。DETAILED DESCRIPTION OF THE INVENTION <Industrial field of application> The present invention relates to a bonded body of ceramics and metal applied to heat-resistant and corrosion-resistant structural parts and the like.
＜従来の技術とその問題点＞ 自動車用エンジン部品、化学プラント用耐熱、耐蝕性構
造材料としてAl2O3，Si3N4，SiO等のセラミックスが種
々開発されている。これらセラミックスは高融点で耐熱
性、耐蝕性が抜群であるが、一方機械的強度となると通
常の金属、合金に劣り使用分野に制約されることが多
い。このためセラミックスと金属とを接合した複合体と
して使用することが提案されている。<Conventional technology and its problems> Various ceramics such as Al 2 O 3 , Si 3 N 4 and SiO have been developed as heat resistant and corrosion resistant structural materials for automobile engine parts and chemical plants. These ceramics have a high melting point and are excellent in heat resistance and corrosion resistance, but on the other hand, when it comes to mechanical strength, they are inferior to ordinary metals and alloys and are often restricted to fields of use. Therefore, it has been proposed to use it as a composite body in which ceramics and metal are joined.
このセラミックスと金属との接合においては当然ながら
その接合強度が高いことが要求されることは勿論である
が、特に熱膨脹性率の差を解消することが問題となる。Needless to say, high joining strength is required for joining the ceramic and the metal, but it is a problem to eliminate the difference in coefficient of thermal expansion.
この解決方法として接合面に中間層を介して接合するこ
とが考えられる。その中間層としては、柔らかい金属
層（アルミ箔など）、発泡金属層、および複合材料
層などあるが、、は強度を多少犠牲にして中間層の
弾性変形、塑性変形によって熱膨脹歪を解消しようとす
る考え方であり、の方法は中間層にセラミックスと金
属との中間的な熱膨脹係数をもたせて緩衝層とする方法
である。しかしながら、従来の中間層を有する第２図
（イ）の如き構造の複合体では接合強度が不充分で実用
に耐えることができない。As a solution to this problem, joining to the joining surface via an intermediate layer can be considered. As the intermediate layer, there are soft metal layers (such as aluminum foil), foam metal layers, and composite material layers. However, it is attempted to eliminate thermal expansion strain by elastic deformation and plastic deformation of the intermediate layer at the expense of some strength. The above method is a method in which the intermediate layer has an intermediate coefficient of thermal expansion between ceramics and metal to form a buffer layer. However, the conventional composite having a structure as shown in FIG. 2 (a) having an intermediate layer has insufficient bonding strength and cannot be put to practical use.
＜問題点を解決するための手段＞ この発明は上述の如きセラミックスと金属の複合体にお
いて、強度も高く熱膨脹歪の問題を解消せんと、接合中
間層の応力解析を試み、その目的を達するものである。<Means for Solving the Problems> In the present invention, the composite of ceramic and metal as described above has high strength and solves the problem of thermal expansion strain. Is.
この発明のセラミックス金属複合体は第１図に示す構成
からなり、セラミックス１と金属又は合金２は２層の中
間層を介して接合されており、セラミックス１に接する
第１の中間層３として塑性変形しやすいNi、Ti、Nb、C
u、Mo、Ta、Fe等のソフト金属または合金を用い、金属
２に接する第２の中間層４としてはセラミックス１の熱
膨脹係数αに近いＷ等の金属または合金を使用すること
によって目的を達せされることを見出したものである。The ceramic-metal composite of the present invention has the structure shown in FIG. 1, and the ceramic 1 and the metal or alloy 2 are bonded together through two intermediate layers, and the first intermediate layer 3 which is in contact with the ceramic 1 is plastic. Deformable Ni, Ti, Nb, C
A soft metal or alloy such as u, Mo, Ta or Fe is used, and the second intermediate layer 4 in contact with the metal 2 is made of a metal or alloy such as W having a thermal expansion coefficient α close to that of the ceramic 1 to achieve the purpose. It was found that it will be done.
中間層４に用いる金属または合金は、セラミックス１の
熱膨脹係数αによって異なる。例えば、熱膨脹係数が特
に低いSi3N4（α＝3.0×10-6Ｋ-1），SiC（4.5×10-6Ｋ
-1），AlN（4.5×10-6Ｋ-1）等の非酸化物セラミックス
には、Ｗ（4.5×10-6Ｋ-1）やＷとNiやCuとの合金（4.5
〜６×10-6Ｋ-1）、あるいは、ＷＣにCo等を添加した所
謂超硬合金（4.2〜６×10-6Ｋ-1）等が有効である。The metal or alloy used for the intermediate layer 4 varies depending on the thermal expansion coefficient α of the ceramic 1. For example, Si 3 N 4 (α = 3.0 × 10 −6 K −1 ) and SiC (4.5 × 10 −6 K), which have a particularly low coefficient of thermal expansion.
-1 ), AlN (4.5 × 10 -6 K -1 ) and other non-oxide ceramics include W (4.5 × 10 -6 K -1 ) and alloys of W with Ni and Cu (4.5
˜6 × 10 −6 K −1 ) or so-called cemented carbide (4.2 to 6 × 10 −6 K −1 ) in which Co or the like is added to WC is effective.
一方、熱膨脹係数が７×10-6Ｋ-1程度のAl2O3には、コ
バール（７×10-6Ｋ-1）等の合金が有効である。また、
セラミックスより若干熱膨脹係数が低いMo（5.2×10-6
Ｋ-1）等も効果が高い。On the other hand, the thermal expansion coefficient of 7 × 10 -6 K -1 degree of Al 2 O 3 is Kovar (7 × 10 -6 K -1), such as alloy is effective. Also,
Mo (5.2 × 10 -6 ), which has a slightly lower coefficient of thermal expansion than ceramics
K -1 ) etc. are also highly effective.
尚、上記の熱膨脹係数は室温から100℃付近の平均値で
あり、多くの材料は、これより高温では高くなる傾向を
示す。The coefficient of thermal expansion is an average value from room temperature to around 100 ° C., and many materials tend to be higher at higher temperatures.
第２図（イ）の構成の接合体において、セラミックス１
にSi3N4を用い、金属２にステンレス鋼（SUS405L）を用
い、それぞれ直径５ｍｍ、高さ２ｍｍの円板同士の接合
体を作製した後、温度差を975℃（1000℃→25℃）を与
えた時の中間層に生じる最大引張応力を調べてみた。In the joined body having the structure shown in FIG.
Si 3 N 4 is used for the metal, stainless steel (SUS405L) is used for the metal 2, and after producing a joined body of disks with a diameter of 5 mm and a height of 2 mm, the temperature difference is 975 ℃ (1000 ℃ → 25 ℃) The maximum tensile stress that occurs in the intermediate layer when the stress was given was examined.
まず中間層がない場合、第２図（ロ）のSi3N4中の最大
引張応力を測定すると図の矢印すなわち接合面に垂直の
方向で105ｋｇ／ｍｍ２の値となる。次に第２図（イ）
の如く中間層を入れることにより最大引張応力の働く要
素は多少変化するが多きなずれが無い。中間層の厚みを
変えることによってその応力は低下するが、実用上この
中間層の厚みは極力小さくする必要がある。First, when there is no intermediate layer, the maximum tensile stress in Si 3 N 4 in FIG. 2 (b) is measured and the value is 105 kg / mm 2 in the direction perpendicular to the arrow in the figure, that is, the joint surface. Next, Fig. 2 (a)
By including the intermediate layer as described above, the element on which the maximum tensile stress acts is slightly changed, but there is no large deviation. Although the stress is reduced by changing the thickness of the intermediate layer, it is necessary to reduce the thickness of this intermediate layer as practically as possible.
種々の検討の結果、接合面近傍に半径方向の熱膨脹応力
を加えれば薄い中間層でも応力緩和効果の高いことがわ
かり上述の構成の接合体の発明に到達した。As a result of various investigations, it was found that if a thermal expansion stress in the radial direction is applied in the vicinity of the joint surface, the stress relaxation effect is high even in a thin intermediate layer, and the invention of the joint body having the above-mentioned constitution was reached.
第４図は中間層を介したセラミックス１と金属２の接合
後の状況を少し誇張して示す。３は中間層３であり、４
は中間層４である。この図の●部のそれぞれの熱応力の
状況は概念的に で示したようになる。FIG. 4 shows the situation after the ceramic 1 and the metal 2 are joined together via the intermediate layer in a slightly exaggerated manner. 3 is the middle layer 3 and 4
Is the mid layer 4. The situation of each thermal stress of the ● part of this figure is conceptually It becomes as shown in.
同図（ロ）に示すようにセラミックスに近い中間層４の
みで中間層３を介在させない場合にはセラミックスの接
合面は接合面に垂直の方向に大きく湾曲する。その場合
の応力の関係は図に示したように垂直方向の法が極めて
大きい。As shown in FIG. 6B, when only the intermediate layer 4 close to the ceramic and no intermediate layer 3 is interposed, the ceramic joint surface is largely curved in a direction perpendicular to the joint surface. In this case, the stress relationship is extremely large in the vertical direction as shown in the figure.
これに対し同図（イ）のように中間層３と４を介在させ
ることによってそれらの相乗効果で垂直方向の熱応力が
大幅に減少し変形は生じない。又このことによって中間
層は薄くても垂直方向の熱応力は充分緩和される。On the other hand, by interposing the intermediate layers 3 and 4 as shown in (a) of the figure, the thermal stress in the vertical direction is greatly reduced by the synergistic effect thereof, and no deformation occurs. Further, by this, even if the intermediate layer is thin, the thermal stress in the vertical direction is sufficiently relaxed.
熱膨脹係数がセラミックスに近い中間層４を用いず、塑
性変形しやすい中間層３のみを介在させた場合には、熱
膨脹係数差が大きく極端に大きな塑性変形が必要である
ため、十分な効果が得られないことが多い。塑性変形を
小さくするために中間層を厚さを厚くすることが考えら
れるが、中間層とセラミックスの熱膨脹係数差による熱
応力が大きくなり、セラミックスが割れることによって
熱応力が緩和されることが多い。When the intermediate layer 4 having a thermal expansion coefficient close to that of ceramics is not used and only the intermediate layer 3 which is easily plastically deformed is interposed, the difference in thermal expansion coefficient is large and extremely large plastic deformation is required. Often not. It is possible to increase the thickness of the intermediate layer in order to reduce plastic deformation, but the thermal stress due to the difference in thermal expansion coefficient between the intermediate layer and the ceramics becomes large, and the thermal stress is often relieved by cracking the ceramics. .
この発明においては、熱膨脹係数がセラミックスに近い
中間層４を組合わせることによって塑性変形量を小さく
抑え、中間層３が薄い場合にも高い効果が得られる。In the present invention, the amount of plastic deformation is suppressed by combining the intermediate layer 4 having a coefficient of thermal expansion close to that of ceramics, and a high effect can be obtained even when the intermediate layer 3 is thin.
塑性変形層の降状応力については、小さいほど熱応力緩
和効果が高いが、Ａｌのように極めて簡単に変形する場
合には接合強度の低下につながる。このため、中間層の
選定においては、構成材料の熱膨脹係数だけでなく強度
にも注意を払う必要がある。As for the yield stress of the plastically deformed layer, the smaller the yield stress, the higher the thermal stress relaxation effect, but when it deforms extremely easily like Al, it leads to a decrease in the bonding strength. Therefore, in selecting the intermediate layer, it is necessary to pay attention to not only the coefficient of thermal expansion of the constituent materials but also the strength.
この発明は、熱膨脹係数の異なるセラミックスと金属の
接合全般に有効であるが、中でも熱膨脹係数の低い（６
×10-6Ｋ-1未満とりわけ4.5×10-6Ｋ-1以下）セラミッ
クス、例えば、Si3N4（α＝3.0×10-6Ｋ-1），SiC（4.5
×10-6Ｋ-1），AlN（4.5×10-6Ｋ-1）等のセラミックス
の接合に特に有効である。The present invention is effective for general joining of ceramics and metals having different thermal expansion coefficients, but among them, the thermal expansion coefficient is low (6
Less than × 10 -6 K -1 and especially 4.5 × 10 -6 K -1 or less) ceramics such as Si 3 N 4 (α = 3.0 × 10 -6 K -1 ), SiC (4.5
It is particularly effective for joining ceramics such as x10 -6 K -1 ) and AlN (4.5 x 10 -6 K -1 ).
これらのセラミックスの熱膨脹係数は金属で最も熱膨脹
係数の低いＷよりも低いか同等であり、被接合金属との
熱膨脹係数が大きく、この様な塑性変形しない金属のみ
を中間層４として用いた場合には厚みを非常に大きくす
ることが必要である。また、非常に厚くしても熱膨脹係
数を完全に一致させることができない場合（例えば、Si
3N4とＷ）には、接合面に垂直に発生する熱応力によっ
て、セラミックス部分の破壊を防ぎきれないこともあ
る。The coefficient of thermal expansion of these ceramics is lower than or equal to W, which has the lowest coefficient of thermal expansion of metals, has a large coefficient of thermal expansion with the metal to be joined, and when such a metal that does not undergo plastic deformation is used as the intermediate layer 4. Needs to be very thick. Also, if the coefficient of thermal expansion cannot be completely matched even if it is made extremely thick (for example, Si
3 N 4 and W) may not be able to prevent the destruction of the ceramic part due to the thermal stress generated perpendicularly to the joint surface.
これに対し、この発明では、中間層３をさらに介在させ
ることによって大きな熱膨脹係数差を効率的に緩和でき
るため中間層の厚さを実用レベルに留めることができる
のに加え、熱応力の発生方向の変化によってセラックス
の破壊を防止できる。On the other hand, in the present invention, by further interposing the intermediate layer 3, a large difference in coefficient of thermal expansion can be effectively relaxed, so that the thickness of the intermediate layer can be kept at a practical level, and in addition, the direction in which the thermal stress is generated. It is possible to prevent the destruction of Cerax by the change of.
Al2O3等の熱膨脹係数が比較的高い（６×10-6Ｋ-1以
上）のセラミックスの場合には、通常金属との熱膨脹係
数差が小さいのに加え、コバール等熱膨脹係数差がほと
んどない材料があり、これのみを介在させることで実用
的な厚さで十分な熱応力緩和が可能となることもある。In the case of ceramics with a relatively high coefficient of thermal expansion such as Al 2 O 3 (6 × 10 -6 K -1 or more), the difference in coefficient of thermal expansion with ordinary metal is small, and the difference in coefficient of thermal expansion with Kovar is almost the same. There is a material that does not exist, and interposing only this material may allow sufficient thermal stress relaxation with a practical thickness.
次に実施例によってその効果を説明する。Next, the effect will be described with reference to examples.
＜実施例１＞ いずれも直径が５ｍｍ，厚みが２ｍｍのSi3N4とステン
レス鋼（SUS 405L）の円板を用意し、これらを接合する
中間層としてNb板のみおよびNbとＷの重ね板を用いて接
合して比較した。<Example 1> In each case, a disk of Si 3 N 4 and stainless steel (SUS 405L) having a diameter of 5 mm and a thickness of 2 mm was prepared, and only an Nb plate or an Nb / W laminated plate was used as an intermediate layer for joining them. Were used for comparison and compared.
中間層の直径は５ｍｍでNbのみの場合もNb，Ｗを重ねた
場合も総厚を１ｍｍとした。Nb，Ｗを重ねた場合はSi3N
4に接してNbを配しNb／Ｗ厚み比率を変えた重ね板を接
せしめ、この接合対をパイレックスガラス製の封入容器
に真空封入した後HIP（熱間静水圧成型機）を用いて、1
300℃、30分、100MPaで接合した。次にこの接合体のＷ
に接する面にステンレス鋼（直径５ｍｍ、厚み２ｍ
ｍ）、を合わせて封入し、同じくHIPで900℃、100MPa、
30分の条件で接合しSi3N4／Nb／Ｗ／ステンレス鋼の接
合体を得た。The diameter of the intermediate layer was 5 mm, and the total thickness was 1 mm both when Nb was used alone and when Nb and W were layered. Si 3 N when Nb and W are stacked
4 allowed contact a leaf of varying Nb / W thickness ratio arrange Nb in contact, the bonding pairs using HIP (hot isostatic molding machine) was vacuum sealed in sealed container made of Pyrex glass, 1
Bonding was performed at 300 ° C. for 30 minutes at 100 MPa. Next, the W of this joint
Stainless steel (diameter 5 mm, thickness 2 m
m), and enclose, and also with HIP at 900 ° C, 100MPa,
Bonding was performed for 30 minutes to obtain a bonded body of Si 3 N 4 / Nb / W / stainless steel.
比較例として中間層としてＷのみ、一層を１ｍｍ厚では
さんでSi3N4／Ｗ／ステンレスの接合体を作成した。得
られた接合体に生じている最大引張応力（熱応力）と中
間層のNb厚みに対する変化を第３図に示す。図より中間
層が一層の場合に比べてNb／Ｗ２層にした方が応力が下
がり最小応力が存在することがわかる。尚、第３図と同
様の関係が、中間層３と４を別の組み合せにしても得ら
れることがわかった。次に接合体を0.5ｍｍ／min速度で
引張試験したところＷ一層では接合強度は0.5〜1kg／ｍ
ｍ２であるのに対し、Nb／Ｗの２層では5kg／ｍｍ２以
上であった。As a comparative example, a joined body of Si 3 N 4 / W / stainless steel was prepared by sandwiching only 1 W as an intermediate layer and 1 mm in thickness. The maximum tensile stress (thermal stress) occurring in the obtained bonded body and the change with respect to the Nb thickness of the intermediate layer are shown in FIG. From the figure, it can be seen that the stress is lower in the Nb / W2 layer than in the case where the intermediate layer is a single layer, and the minimum stress exists. It has been found that the same relationship as in FIG. 3 can be obtained even if the intermediate layers 3 and 4 are combined in a different combination. Next, the bonded body was subjected to a tensile test at a speed of 0.5 mm / min, and the bonding strength of the W layer was 0.5 to 1 kg / m.
While it was m 2 , it was 5 kg / mm 2 or more in the two layers of Nb / W.
また、SEMで接合界面近傍を組織観察しても熱歪などに
よるクラックは一切みられなかった。Moreover, cracks due to thermal strain were not observed at all even when the structure near the bonding interface was observed by SEM.
＜実施例２＞ 表１に示す直径10ｍｍ・厚さ５ｍｍのセラミックス試料
と、同表に示す材質・厚さの中間層を第１図の順序で介
在させ、実施例１と同様、パイレックスガラス製の封入
容器に真空封入し、HIPを用いて、1300℃，30分，100MP
aで接合した。尚、セラミックスがAl2O3の場合には、温
度は1050℃とした。得られた接合体の中間層側を研磨し
た後、セラミックス試料と同じ形状の炭素鋼を銀鑞（Ag
−Cu）を用いて、真空中、800℃で15分熱処理して接合
し、最終的なセラミックス−炭素鋼接合体を得た。接合
強度は、実施例１と同様の引張試験により評価した。結
果を第１表に併記する。<Example 2> A ceramic sample having a diameter of 10 mm and a thickness of 5 mm shown in Table 1 and an intermediate layer having a material and a thickness shown in the table are interposed in the order shown in FIG. It is vacuum sealed in the sealed container of HIP, and using HIP, 1300 ℃, 30 minutes, 100MP
Joined with a. When the ceramic was Al 2 O 3 , the temperature was 1050 ° C. After polishing the intermediate layer side of the obtained bonded body, carbon steel of the same shape as the ceramic sample was silver brazed (Ag
-Cu) was heat-treated in vacuum at 800 ° C for 15 minutes to bond them to obtain a final ceramic-carbon steel bonded body. The bonding strength was evaluated by the same tensile test as in Example 1. The results are also shown in Table 1.
以上述べたように、この発明のように中間層として塑性
変形層と熱膨脹係数の近い層を併用することにより、中
間層の厚さが薄い場合にも高い熱応力緩和効果を示し、
その結果欠陥のない高強度接合体が得られた。この構造
は、特に、熱膨脹係数が低いセラミックスの接合に有効
であった。 As described above, by using a plastically deformable layer and a layer having a close thermal expansion coefficient as the intermediate layer as in the present invention, a high thermal stress relaxation effect is exhibited even when the intermediate layer is thin,
As a result, a high-strength bonded body having no defects was obtained. This structure was particularly effective for joining ceramics having a low coefficient of thermal expansion.
【図面の簡単な説明】 第１図はこの発明の複合体の正面断面図、第２図は従来
の複合体の正面断面図及び第３図はこの発明の実施例の
結果を示す線図、第４図は接合時の金属とセラミックス
の状態を誇張して示した正面図である。 １……セラミックス、２……金属 ３，４……中間層BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a front sectional view of a composite body of the present invention, FIG. 2 is a front sectional view of a conventional composite body, and FIG. 3 is a diagram showing a result of an embodiment of the present invention. FIG. 4 is a front view showing an exaggerated state of metal and ceramics at the time of joining. 1 ... Ceramics, 2 ... Metal 3,4 ... Intermediate layer
───────────────────────────────────────────────────── フロントページの続き (72)発明者 小村 修 兵庫県伊丹市昆陽北１丁目１番１号 住友 電気工業株式会社伊丹製作所内 (56)参考文献 特開 昭59−212251（ＪＰ，Ａ) ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Osamu Omura 1-1-1 Kunyokita, Itami City, Hyogo Prefecture Sumitomo Electric Industries, Ltd. Itami Works (56) Reference JP-A-59-212251 (JP, A)
Claims (1)
された複合体において、中間層が２層からなり、セラミ
ックスに接する中間層がNi、Ti、Nb、Cu、Mo、Ta、Fe等
の金属または合金であり、該金属に接する中間層が該セ
ラミックスに近い熱膨張係数を有する金属または合金で
あることを特徴とする金属セラミックス接合体。1. A composite body in which a metal and a ceramic are bonded via an intermediate layer, the intermediate layer is composed of two layers, and the intermediate layer in contact with the ceramic is made of Ni, Ti, Nb, Cu, Mo, Ta, Fe or the like. A metal / ceramic joined body, which is a metal or an alloy, and an intermediate layer in contact with the metal is a metal or an alloy having a thermal expansion coefficient close to that of the ceramic.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60272318A JPH0659708B2 (en) | 1985-12-03 | 1985-12-03 | Metal ceramics bonded body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60272318A JPH0659708B2 (en) | 1985-12-03 | 1985-12-03 | Metal ceramics bonded body |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62130843A JPS62130843A (en) | 1987-06-13 |
| JPH0659708B2 true JPH0659708B2 (en) | 1994-08-10 |
Family
ID=17512209
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60272318A Expired - Lifetime JPH0659708B2 (en) | 1985-12-03 | 1985-12-03 | Metal ceramics bonded body |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0659708B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102909910A (en) * | 2011-08-05 | 2013-02-06 | 深圳市富兴科技有限公司 | Self-cleaning toughened cellphone lens |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59212251A (en) * | 1983-05-18 | 1984-12-01 | 株式会社日立製作所 | Components with ceramic coating layer |
-
1985
- 1985-12-03 JP JP60272318A patent/JPH0659708B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62130843A (en) | 1987-06-13 |
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