JPH0668927B2 - Jig for aligning thin plate ceramics and manufacturing method thereof - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a thin plate ceramic alignment jig used for processing thin plate ceramics, which is widely used mainly for electronic parts, and a manufacturing method thereof.

(Prior art) Conventionally, as an alignment jig, a lower stainless plate having a thickness of 0.5 mm and an upper stainless plate having a thickness of 0.05 mm are individually etched and processed, and then both are spot-welded or glued. One that is made into an integrated structure by sticking together, or one that is etched from both sides of a single stainless steel plate material.Although it is rarely used in practice, it is machined with high precision using a machine tool such as a milling machine or a drilling machine. There were things to make.

(Problems to be solved by the invention) In the case where the lower plate stainless steel and the upper plate stainless steel are integrated by spot welding, the gap between the lower plate stainless steel and the upper plate stainless steel is It has the drawback that ceramic thin plates get in. Further, when spot welding an ultra-thin plate having an upper plate of 50 μm or less, the ultra-thin plate becomes wavy and the alignment jig lacks accuracy due to elongation due to heat during welding. In addition, there is a drawback in use that it bends during processing.

Further, in the case where the both are integrated with an adhesive, there is a drawback that the adhesive protrudes into a concave region where the ceramic thin plate is arranged and is solidified so that the bottom surface is not formed flat.

When a ceramic thin plate is placed on such an alignment jig, the upper surface of the ceramic thin plate and the upper surface of the alignment jig tend not to be flush with each other. Therefore, a paste such as silver or palladium is printed on the ceramic thin plate. However, there is a disadvantage that the printing screen and the printing surface of the ceramic plate do not come into contact with each other at the time of printing, so that they cannot be practically used.

Also, when etching is performed from both sides of a single stainless steel plate material, the bottom of the concave region where the ceramic plate is arranged is not formed flat, the etching depth is not constant, and further there is a curved portion at the bottom corner. Since the remaining portion and the side wall surface taper upward, the ceramic thin plate is not horizontal when it is placed in the concave region, and there is a drawback that the ceramic thin plate is likely to come out of the concave region and cause processing errors and obstacles.

Milling machine with an alignment jig that does not easily cause the above defects.
Although it can be manufactured by high precision machining using a drilling machine, etc., it is not used at present because it cannot be mass-produced and is expensive.

In any case, these had various drawbacks in use as an alignment jig for automated processing of thin plate ceramics.

The object of the present invention is to eliminate all of the above-mentioned drawbacks, to stably and stably seat the thin plate ceramics in the arrangement position, and to perform the automated processing of the thin plate ceramics easily. A jig and a manufacturing method thereof are provided.

(Means for Solving Problems) The present invention will be described below with reference to the embodiment drawings shown in the drawings.

As shown in FIG. 2, first, a stainless steel metal substrate (1)
On the other hand, through holes (4) which are regularly arranged in advance are formed by etching, and a non-conductive photoresist (6) is applied to a portion of the surface of the metal substrate (1) where the concave region (2) is to be formed. When the metal substrate (1) coated with the non-conductive photoresist (6) is used as a cathode and the nickel plate (9) is used as an anode in the plating bath (8) (nickel sulfamate bath), nickel plating is performed. Since the conductive photoresist (6) is not conductive, a recessed area (2) without plating is formed, while nickel plating is deposited and grown on the part where the non-conductive photoresist (6) is not applied. As a result, a convex region (3) is formed. When the metal plating film layer (7) is formed in this way, the reverse tapered side wall (5) is formed on the outer periphery of the concave region (2) as shown in FIG. 1, and thus the reverse tapered side wall is formed.
When the thin plate ceramic is arranged in the concave region (2) formed in (5), the thin plate ceramic sits stably. As the plating bath, a nickel sulfamate bath capable of high-speed thickening is used, and in order to maintain the adhesion strength of the plating layer, a stainless steel metal substrate (1) whose surface is previously roughened by mechanical polishing is used.

Conventionally, a nickel plating film deposited by a generally used plating method has a difference in film thickness between respective parts of a thin plate ceramic alignment jig. As a cause of this, as in the case of a jig for arranging thin ceramics, there is a difference in the area of the adhered part of the nickel plating film, and as a result, the part with a large adhered area
In (a), the plating film deposition rate is slow because the current density at the time of depositing the plating film is low, and conversely, in the portion (b) where the deposition area is narrow, the plating film deposition rate is high because the current density is high.

In order to improve such unevenness of the plating film thickness, as shown in FIG. 3, a metal is placed between the cathode metal substrate (1) and the anode metal plate (9) at a position close to the cathode metal substrate (1). Reticulated auxiliary electrode
(10) was provided and nickel plating was performed. As a result, the current flux, which tends to concentrate in a narrow space, is partially captured by the metal mesh-shaped auxiliary electrode (10), and the current flux is averaged at any position on the cathode metal substrate (1) where the plating is applied. Be converted.
That is, an unnecessary amount of nickel deposited on a narrow portion of the cathode metal substrate (1) is deposited on the metal mesh-shaped auxiliary electrode (10).

In the above metal plating process, it is desirable that the metal mesh-shaped auxiliary electrode (10) is located as close to the metal substrate (1) as possible so that the metal mesh-shaped auxiliary electrode (10) does not come into contact with the metal substrate (1). Therefore, as shown in FIG. Mounting plate (1
It is also possible to use the one in which the metal substrate (1) is fixed to the surface (1) and the metal substrate (1) and the metal mesh-like auxiliary electrode (10) are integrated. As a result of various experiments, the mesh of the metal mesh-shaped auxiliary electrode (10) is preferably relatively coarse in order to make the plating film thickness uniform. A table comparing the nickel plating film thickness with the conventional one is as follows.

For convenience of explanation, in the above description, silver on the thin plate ceramic,
Paradium, the case of printing a paste was described, but after forming a partial circuit pattern on a thin ceramic plate, a gold paste, a resistor paste, an insulator paste, a photoresist, a solder resist, This is a jig for arranging thin plate ceramics, which can be used in an extremely wide range when printing an adhesive, in the case of die bonding of semiconductor chips, wire bonding, and the like.

The material for the thin plate ceramic aligning jig may be metal such as copper alloy other than stainless steel, and the plating film may be copper instead of nickel.

(Effects of the Invention) As described above, the present invention forms a through hole by etching in a portion corresponding to each recessed region of a metal substrate that is a plating adherend, and previously forms a non-conductive photoresist in the recessed region. After depositing, the metal plating film layer is formed on a portion other than the concave region in the plating bath to manufacture a thin plate ceramic alignment jig, whereby the metal plating film layer and the upper surface of the metal substrate are separated from each other. Completely integrated, the troubles caused by the gap between the lower plate and the upper plate as in the past can be avoided, and the surface of the thin plate ceramic alignment jig is extremely flat, and the depth of the concave region where the ceramic plate is placed is deep. The paste can be printed satisfactorily, and the metal plating layer can easily and accurately control the film thickness according to the plate thickness of the plate to be printed, that is, the thin ceramic plate. It can be done.

In the thin plate ceramic aligning jig obtained by the manufacturing method of the present invention, since the side wall of the reverse taper is formed on the outer periphery of the concave region, when the thin plate ceramics are arrayed in a large number, the thin plate ceramics are stably seated and are not processed. Moreover, it is possible to effectively prevent the protrusion from the alignment jig.

[Brief description of drawings]

The drawings show an embodiment of the present invention. FIG. 1 is an enlarged sectional view of a jig for aligning thin plate ceramics, FIG. 2 is a perspective view of a metal substrate, and FIG. 3 is for forming a metal plating coating layer. FIG. 4 is a sectional view showing a metal substrate and a metal net-shaped auxiliary electrode integrally. (1) …… Metal substrate (2) …… Concave region (3) …… Convex region (4) …… Through hole (5) …… Inverse taper side wall (6) …… Non-conductive photoresist ( 7) …… Metal plating film layer (8) …… Plating bath (9) …… Anode metal plate (10) …… Metal mesh auxiliary electrode

Claims (6)

[Claims] 1. A jig for arranging a thin plate ceramic, comprising a concave area and a convex area aligned on an upper surface of a metal substrate, and one or a plurality of through holes being formed in the metal substrate in the concave area.
A jig for aligning thin plate ceramics, characterized in that a convex region made of the electroplated layer is laminated on the upper surface of a metal substrate and an inversely tapered side wall is formed on the outer periphery of the concave region. 2. A through hole is formed by etching in a portion corresponding to each recessed region of a metal substrate which is a plating adherend, and a non-conductive photoresist is deposited in advance in the recessed region, and the plating bath is placed in a plating bath. A method for manufacturing a thin plate ceramic aligning jig, characterized in that a non-conductive photoresist deposited on the concave region is removed after forming a metal plating film layer on a portion other than the concave region. 3. A metal mesh-shaped auxiliary electrode is provided between a cathode metal substrate and an anode metal plate, which are adherends to be plated, in a plating bath. Method for manufacturing jig for aligning thin plate ceramics. 4. A method for manufacturing a thin plate ceramic alignment jig according to claim 2, wherein the plating bath is a nickel sulfamate bath. 5. The method for manufacturing a thin plate ceramic arranging jig according to claim 2, wherein the metal plating film layer is nickel. 6. The method for manufacturing a thin plate ceramic arranging jig according to claim 2, wherein the metal plating film layer is copper.