JPH0670211B2 - Vulcanizing adhesive for NBR and metal - Google Patents
Vulcanizing adhesive for NBR and metalInfo
- Publication number
- JPH0670211B2 JPH0670211B2 JP59189083A JP18908384A JPH0670211B2 JP H0670211 B2 JPH0670211 B2 JP H0670211B2 JP 59189083 A JP59189083 A JP 59189083A JP 18908384 A JP18908384 A JP 18908384A JP H0670211 B2 JPH0670211 B2 JP H0670211B2
- Authority
- JP
- Japan
- Prior art keywords
- nbr
- adhesive
- metal
- resin
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000853 adhesive Substances 0.000 title claims description 20
- 230000001070 adhesive effect Effects 0.000 title claims description 20
- 229910052751 metal Inorganic materials 0.000 title claims description 9
- 239000002184 metal Substances 0.000 title claims description 9
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 claims description 12
- 239000005011 phenolic resin Substances 0.000 claims description 12
- 239000000126 substance Substances 0.000 claims description 12
- 229920000642 polymer Polymers 0.000 claims description 7
- 239000004312 hexamethylene tetramine Substances 0.000 claims description 6
- 235000010299 hexamethylene tetramine Nutrition 0.000 claims description 6
- 229920003986 novolac Polymers 0.000 claims description 5
- 239000002245 particle Substances 0.000 claims description 4
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 12
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 6
- 238000004073 vulcanization Methods 0.000 description 6
- YACLQRRMGMJLJV-UHFFFAOYSA-N chloroprene Chemical compound ClC(=C)C=C YACLQRRMGMJLJV-UHFFFAOYSA-N 0.000 description 5
- 229960004011 methenamine Drugs 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000006229 carbon black Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 229910001209 Low-carbon steel Inorganic materials 0.000 description 2
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical group OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000012046 mixed solvent Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 235000010893 Bischofia javanica Nutrition 0.000 description 1
- 240000005220 Bischofia javanica Species 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- UVZGOOXAARJPHD-UHFFFAOYSA-N butan-2-one;methanol Chemical compound OC.CCC(C)=O UVZGOOXAARJPHD-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 229910000464 lead oxide Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical compound [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920000120 polyethyl acrylate Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 125000001010 sulfinic acid amide group Chemical group 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- KUAZQDVKQLNFPE-UHFFFAOYSA-N thiram Chemical compound CN(C)C(=S)SSC(=S)N(C)C KUAZQDVKQLNFPE-UHFFFAOYSA-N 0.000 description 1
- 229960002447 thiram Drugs 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、NBRと金属との加硫接着剤に関する。更に詳
しくは、フエノール樹脂系からなるNBRと金属との加硫
接着剤に関する。TECHNICAL FIELD The present invention relates to a vulcanizing adhesive of NBR and a metal. More specifically, it relates to a vulcanization adhesive of NBR made of a phenol resin system and a metal.
従来から、NBRと金属との加硫接着剤としてフエノール
樹脂系の接着剤が用いられているが、フエノール樹脂系
の加硫接着剤を用いた場合には、適度のベーキング処理
をしなければ、加硫成形時の熱と圧力で接着剤層が軟
化、流動し、接着目的を十分に達成し得ないという欠点
がみられた。Conventionally, a phenol resin adhesive is used as a vulcanizing adhesive between NBR and a metal, but when a phenol resin vulcanizing adhesive is used, unless a proper baking treatment is performed, There was a drawback that the adhesive layer was softened and flowed by heat and pressure during vulcanization, and the adhesive purpose could not be achieved sufficiently.
このような接着剤層の軟化、流動を防止することができ
れば、フエノール樹脂系の接着剤が本来有するすぐれた
接着性が十分に発揮されることになるが、本発明者らは
かかる接着剤層の軟化、流動を防止するために、特定の
高分子物質および粒状無機物質の少くとも一種をこれに
添加することが有効な解決手段であることを見出した。If such softening and flow of the adhesive layer can be prevented, the excellent adhesiveness originally possessed by the phenol resin adhesive will be sufficiently exhibited. It has been found that adding at least one of a specific polymer substance and a granular inorganic substance to this is an effective solution in order to prevent softening and flow of the substance.
〔問題点を解決するための手段〕および〔作用〕 従つて、本発明はNBRと金属との加硫接着剤に係り、こ
の加硫接着剤は、ノボラツク型フエノール樹脂およびそ
れの硬化剤としてのヘキサメチレンテトラミンに、
(a)軟化温度が約100〜200℃の高分子物質、(b)粘
度(25℃)が約103ポアズ以上の高分子物質および
(c)粒径が約1〜100μmの粒状無機物質の少くとも
一種を添加してなる。[Means for Solving Problems] and [Action] Therefore, the present invention relates to a vulcanizing adhesive of NBR and a metal, and the vulcanizing adhesive is used as a novolak-type phenol resin and a curing agent thereof. Hexamethylenetetramine,
(A) a polymer substance having a softening temperature of about 100 to 200 ° C., (b) a polymer substance having a viscosity (25 ° C.) of about 10 3 poise or more, and (c) a granular inorganic substance having a particle size of about 1 to 100 μm. At least one is added.
ノボラツク型フエノール樹脂は、酸を触媒として1モル
のフエノールと1モル未満のホルムアルデヒドとを縮合
させて得られる可溶可融性のフエノール−ホルムアルデ
ヒド樹脂であり、それの軟化温度は一般には約80〜100
℃である。ノボラツク分子は、反応基(メチロール基)
を有していないので、単に加熱しただけでは分子間の縮
合が起らず、永久に熱可塑性を維持するが、硬化させる
ためのメチレン基供給源としてホルムアルデヒドまたは
ヘキサメチレンテトラミンを添加して加熱すると不溶不
融性となるが、このような状態になる以前に、加硫接着
時の熱および圧力によつて接着剤層が軟化、流動し、接
着層の剥れの原因を形成するが、以下の各成分の少くと
も一種を添加することによりかかる不良原因が効果的に
除去される。The novolak type phenol resin is a soluble and fusible phenol-formaldehyde resin obtained by condensing 1 mol of phenol and less than 1 mol of formaldehyde using an acid as a catalyst, and its softening temperature is generally about 80 to 100
℃. Novolac molecule is a reactive group (methylol group)
Since it does not have, it does not cause condensation between molecules by simply heating and permanently maintains thermoplasticity, but when formaldehyde or hexamethylenetetramine is added as a methylene group source for curing and heating is performed. It becomes insoluble and infusible, but before such a state, the adhesive layer softens and flows due to heat and pressure during vulcanization adhesion, and forms the cause of peeling of the adhesive layer. Addition of at least one of the above components effectively eliminates the cause of such defects.
(a)成分の軟化温度約100〜200℃の高分子物質として
は、例えばエポキシ樹脂、ポリウレタン樹脂、ポリアミ
ン樹脂、アクリルアミド樹脂、アミン変性フエノール樹
脂などが用いられる。(b)成分の粘度(25℃;高化式
フローテスターなどにより測定)が約103ポアズ以上の
高分子物質としては、例えばポリ−2−クロルブタジエ
ン、ポリメチルメタクリレート、ポチエチルアクリレー
ト、ポリブチルアクリレート、ポリビニルブチラール、
ポリ塩化ビニル、アクリル樹脂、エチレン−酢酸ビニル
共重合樹脂などが用いられる。また、(c)成分の粒径
が約1〜100μmの粒状無機物質としては、カーボンブ
ラツク、シリカ、タルク、炭酸カルシウム、酸化マグネ
シウム、酸化亜鉛、酸化チタン、酸化鉛、けいそう土な
どが用いられる。なお、上記(a)および(b)の両方
の成分に属するものも用いられ、例えばポリアミド樹脂
などはこれに該当する。As the polymer substance having a softening temperature of about 100 to 200 ° C. of the component (a), for example, an epoxy resin, a polyurethane resin, a polyamine resin, an acrylamide resin, an amine-modified phenol resin or the like is used. Examples of the polymer substance having a viscosity of component (b) (25 ° C .; measured with a Koka type flow tester) of about 10 3 poise or more include poly-2-chlorobutadiene, polymethyl methacrylate, potyethyl acrylate, polybutyl. Acrylate, polyvinyl butyral,
Polyvinyl chloride, acrylic resin, ethylene-vinyl acetate copolymer resin, etc. are used. Further, as the particulate inorganic substance having a particle diameter of the component (c) of about 1 to 100 μm, carbon black, silica, talc, calcium carbonate, magnesium oxide, zinc oxide, titanium oxide, lead oxide, diatomaceous earth and the like are used. . It should be noted that those belonging to both the above components (a) and (b) are also used, and for example, a polyamide resin or the like corresponds to this.
これらの各成分は、ノボラツク型フエノール樹脂100重
量部当り約5〜50重量部の割合で、約5〜20重量部のヘ
キサメチレンテトラミンと共に用いられる。上記(a)
および(b)成分の場合には、これらをケトン類、ケト
ン−アルコール混合系、ケトン−炭化水素混合系などに
よつて代表される可溶性溶剤に固型分濃度約3〜20%で
溶解させ、また(c)成分の場合には、これを予めノボ
ラツク型フエノール樹脂に熱ロールで練り込み、混練さ
れたコンパウンドを上記可溶性溶剤に溶解させ、更に硬
化剤としてヘキサメチレンテトラミンをノボラツク型フ
エノール樹脂100重量部当り約5〜20重量部の割合で添
加する。Each of these components is used in a proportion of about 5 to 50 parts by weight per 100 parts by weight of the novolak type phenol resin together with about 5 to 20 parts by weight of hexamethylenetetramine. Above (a)
In the case of the component (b), these are dissolved in a soluble solvent typified by a ketone, a ketone-alcohol mixed system, a ketone-hydrocarbon mixed system, etc. at a solid content concentration of about 3 to 20%, Further, in the case of the component (c), this is kneaded into a novolak-type phenol resin in advance with a hot roll, the kneaded compound is dissolved in the soluble solvent, and hexamethylenetetramine is further added as a curing agent to 100 weight of the novolak-type phenol resin. It is added at a rate of about 5 to 20 parts by weight per part.
加硫接着は、一般にかかる加硫接着剤を金属材料面側に
塗布した後、室温乃至約80℃の温度で約10分間程度乾燥
させて溶剤を除去してから、それにNBR製材料を接着さ
せる方法によつて行われる。For vulcanization adhesion, generally, after applying such a vulcanization adhesive to the metal material surface side, it is dried at room temperature to about 80 ° C for about 10 minutes to remove the solvent, and then the NBR material is adhered to it. It is done by the method.
本発明に係る加硫接着剤は、これをNBRと金属との接着
に用いた場合、ベーキング処理をすることなく用いるこ
とができ、その際接着剤の軟化、流動などがみられない
ので、フエノール系接着剤が本来有する接着性能が十分
に発揮される。The vulcanized adhesive according to the present invention, when used for bonding NBR and a metal, can be used without baking treatment, and at that time, the softening and flow of the adhesive are not observed, and therefore the phenol is used. The adhesive performance originally possessed by the system adhesive is sufficiently exhibited.
従つて、本発明の加硫接着剤は、軟鋼板製金属缶にNBR
を焼付けたオイルシール、バルブ、ガスケツト、パツキ
ンなどの製造に有効に用いることができる。Therefore, the vulcanizing adhesive of the present invention is applied to NBR made of mild steel plate.
It can be effectively used for manufacturing baked oil seals, valves, gaskets, packings and the like.
次に、実施例について本発明を説明する。 Next, the present invention will be described with reference to examples.
実施例1 ノボラツク型フエノール樹脂(軟化温度90℃)100部
(重量、以下同じ)、ヘキサメチレンテトラミン10部お
よびメチルエチルケトン−メタノール(1:1)混合溶剤
に固型分濃度10%で溶解させたエポキシ樹脂(エポキシ
当量3000以上、軟化温度150℃)20部よりなる接着剤を
用いて、NBR成形品と金属との接着を行なつた。Example 1 Epoxy resin dissolved in a mixed solvent of novolak type phenol resin (softening temperature 90 ° C.) 100 parts (weight, the same hereinafter), hexamethylene tetramine 10 parts and methyl ethyl ketone-methanol (1: 1) at a solid content concentration of 10%. An NBR molded product and a metal were bonded using an adhesive consisting of 20 parts of resin (epoxy equivalent of 3000 or more, softening temperature 150 ° C).
NBR成形品: NBR(日本ゼオン製品ニポールDN201)100部、FEFカーボ
ンブラツク50部、酸化亜鉛5部、ステアリン酸1部、イ
オウ0.8部、加硫促進剤(テトラメチルチウラムジスル
フイド)2部および同(N−シクロヘキシル−2−ベン
ゾチアジルスルフインアミド)2.5部を用い、165℃、60
Kg/cm2、15分間の条件下で、JIS K−6301−8項90°剥
離試験用テストピースを作製した。NBR molded product: NBR (Nippon DN201 manufactured by Zeon Corporation) 100 parts, FEF carbon black 50 parts, zinc oxide 5 parts, stearic acid 1 part, sulfur 0.8 parts, vulcanization accelerator (tetramethyl thiuram disulfide) 2 parts and Using 2.5 parts of the same (N-cyclohexyl-2-benzothiazyl sulfinamide), 165 ° C., 60
A test piece for JIS K-6301-8 item 90 ° peel test was prepared under the conditions of Kg / cm 2 and 15 minutes.
金属: 軟鋼板SPCC(25×60×1.6mm)を溶剤で脱脂し、シヨツ
トプラスト処理したもの 接着方法: 上記接着剤を2〜3μm程度の厚さに刷毛塗りする 実施例2 実施例1において、エポキシ樹脂混合溶剤溶液の代り
に、同じ固型分濃度のポリ−2−クロルブタジエン(粘
度104ポアズ)のメチルエチルケトン溶液が用いられ
た。Metal: Mild steel plate SPCC (25 × 60 × 1.6 mm) degreased with a solvent and treated with Shouttoplast Adhesion method: Brushing the above adhesive to a thickness of about 2 to 3 μm Example 2 In Example 1, the epoxy was used. Instead of the resin mixed solvent solution, a solution of poly-2-chlorobutadiene (viscosity 10 4 poise) of the same solid content concentration in methyl ethyl ketone was used.
実施例3 実施例2において、ポリ−2−クロルブタジエンの代り
に、ポリアクリル酸エチル(粘度104ポアズ)が用いら
れた。Example 3 In Example 2, instead of poly-2-chlorobutadiene, polyethyl acrylate (viscosity 10 4 poise) was used.
実施例4 実施例2において、ポリ−2−クロルブタジエンのメチ
ルエチルケトン溶液の代りに、カーボンブラツク(粒径
10μm)の10%メチルエチルケトン10%分散液が用いら
れた。Example 4 In Example 2, instead of the methyl ethyl ketone solution of poly-2-chlorobutadiene, a carbon black (particle size
10 μm) 10% methyl ethyl ketone 10% dispersion was used.
比較例 実施例2において、ポリ−2−クロルブタジエンが用い
られず、メチルエチルケトンのみが用いられた。Comparative Example In Example 2, poly-2-chlorobutadiene was not used and only methyl ethyl ketone was used.
以上の各実施例および比較例で接着された接着物につい
て、JIS K−6301、90°剥離試験法に従つてそれの剥離
強度が測定された。得られた結果は、次の表に示され
る。なお、この表には、剥離開始個所の観察結果も併記
されている。The peel strengths of the adhesives adhered in the above Examples and Comparative Examples were measured according to JIS K-6301, 90 ° peel test method. The results obtained are shown in the following table. In addition, the observation result of the peeling start point is also shown in this table.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 FI 技術表示箇所 (C09J 161/06 131:00) ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Office reference number FI technical display location (C09J 161/06 131: 00)
Claims (1)
硬化剤としてのヘキサメチレンテトラミンに、(a)軟
化温度が約100〜200℃の高分子物質、(b)粘度(25
℃)が約103ポアズ以上の高分子物質および(c)粒径
が約1〜100μmの粒状無機物質の少くとも一種を添加
してなるNBRと金属との加硫接着剤。1. A novolak type phenol resin and hexamethylenetetramine as a curing agent for the same, (a) a polymer substance having a softening temperature of about 100 to 200 ° C., and (b) a viscosity (25).
A vulcanizing adhesive of NBR and a metal, which is obtained by adding at least one of a polymer substance having a temperature of about 10 3 poise or more and (c) a granular inorganic substance having a particle size of about 1 to 100 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59189083A JPH0670211B2 (en) | 1984-09-10 | 1984-09-10 | Vulcanizing adhesive for NBR and metal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59189083A JPH0670211B2 (en) | 1984-09-10 | 1984-09-10 | Vulcanizing adhesive for NBR and metal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6166776A JPS6166776A (en) | 1986-04-05 |
| JPH0670211B2 true JPH0670211B2 (en) | 1994-09-07 |
Family
ID=16235027
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59189083A Expired - Lifetime JPH0670211B2 (en) | 1984-09-10 | 1984-09-10 | Vulcanizing adhesive for NBR and metal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0670211B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005087889A1 (en) * | 2004-03-18 | 2005-09-22 | Siew Puat Yeo | Adhesive composition |
| JP2008266355A (en) * | 2007-04-16 | 2008-11-06 | Nok Corp | Vulcanized adhesive composition |
| JP5258466B2 (en) * | 2008-09-08 | 2013-08-07 | 日東電工株式会社 | Thermosetting adhesive composition, thermosetting adhesive tape or sheet, and flexible circuit board |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59213784A (en) * | 1983-05-18 | 1984-12-03 | Matsushita Electronics Corp | Adhesive for base of electric bulb |
| JPS60137981A (en) * | 1983-12-27 | 1985-07-22 | Dainippon Ink & Chem Inc | Binder for grinding whetstone |
-
1984
- 1984-09-10 JP JP59189083A patent/JPH0670211B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6166776A (en) | 1986-04-05 |
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