JPH0673324B2 - Manufacturing method of chip resistor - Google Patents
Manufacturing method of chip resistorInfo
- Publication number
- JPH0673324B2 JPH0673324B2 JP62059348A JP5934887A JPH0673324B2 JP H0673324 B2 JPH0673324 B2 JP H0673324B2 JP 62059348 A JP62059348 A JP 62059348A JP 5934887 A JP5934887 A JP 5934887A JP H0673324 B2 JPH0673324 B2 JP H0673324B2
- Authority
- JP
- Japan
- Prior art keywords
- resistor
- electrode
- green tape
- firing
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 239000000758 substrate Substances 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 13
- 238000010304 firing Methods 0.000 claims description 10
- 238000007639 printing Methods 0.000 claims description 10
- 230000001681 protective effect Effects 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 4
- 238000001035 drying Methods 0.000 claims description 4
- 238000007747 plating Methods 0.000 claims description 4
- 229910010293 ceramic material Inorganic materials 0.000 claims description 3
- 239000002952 polymeric resin Substances 0.000 claims description 3
- 229920003002 synthetic resin Polymers 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 2
- 239000003973 paint Substances 0.000 claims description 2
- 238000002360 preparation method Methods 0.000 claims 1
- 238000000034 method Methods 0.000 description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 229920000609 methyl cellulose Polymers 0.000 description 1
- 239000001923 methylcellulose Substances 0.000 description 1
- 235000010981 methylcellulose Nutrition 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明はチップ抵抗器の製造方法に関する。TECHNICAL FIELD The present invention relates to a method for manufacturing a chip resistor.
従来の技術 従来、チップ抵抗器等、チップ部品のセラミック基材と
して第２図に示すように分割用スリットの入った焼成済
の板状アルミナ基板１を用意し、アルミナ基板１上のチ
ップ個片の両端に第１電極２を形成し、その両端の一部
に重ねるようにして、抵抗体３を印刷・焼成した後、抵
抗値修正を施し、この抵抗体３をガラス保護膜で被覆焼
成し、アルミナ基板１を分割した後、第１電極２と接し
て、この分割基板４の両側面部に第２電極５を形成する
ことによりチップ抵抗器を得る製法が採られていた。2. Description of the Related Art Conventionally, a fired plate-shaped alumina substrate 1 having slits for division as shown in FIG. 2 has been prepared as a ceramic base material for chip components such as chip resistors, and the chip pieces on the alumina substrate 1 have been prepared. The first electrode 2 is formed on both ends of the, and the resistor 3 is printed and fired so as to be overlapped with a part of both ends thereof, and then the resistance value is corrected, and the resistor 3 is covered with a glass protective film and fired. After the alumina substrate 1 is divided, the chip electrode is contacted with the first electrode 2 and the second electrodes 5 are formed on both side surfaces of the divided substrate 4 to obtain a chip resistor.
発明が解決しようとする問題点 上記従来のチップ抵抗器は、基板を焼成した後、電極を
形成していたため、焼成による収縮により基材寸法にバ
ラツキが大きく生じ、基板の分類やその寸法に応じた電
極印刷用マスクを多数用意しなければならなかった。Problems to be Solved by the Invention In the above-described conventional chip resistor, since the electrodes are formed after firing the substrate, the shrinkage caused by firing causes a large variation in the base material size, and the substrate size and the size of the chip resistor are changed according to the size of the board. It was necessary to prepare many electrode printing masks.
本発明は、上記問題点を解決するもので、基板寸法のバ
ラツキにより、基板を分類したり電極印刷用マスクを多
数用意することなくチップ抵抗器を製造することを目的
とする。The present invention solves the above problems, and an object of the present invention is to manufacture a chip resistor without classifying substrates or preparing a large number of electrode printing masks due to variations in substrate dimensions.
問題点を解決するための手段 この問題点を解決するために本発明は、低温焼成用セラ
ミック材料を押出し成形した棒状の未焼成グリーンテー
プ基材の両側面部、それらに接続する上面及び底面の一
部に導体電極を印刷し乾燥する工程と、前記導体電極に
一部が重なるように抵抗体を印刷し乾燥する工程と、前
記グリーンテープ基材に分割用スリットを形成する工程
と、前記グリーンテープ基材、電極及び抵抗体を同時に
焼成する工程と、前記焼成済抵抗体の抵抗値をそろえる
ための抵抗値修正工程と、前記焼成済抵抗体及び抵抗修
正部分をポリマー樹脂塗料で塗装し焼付け硬化する保護
膜形成工程と、メッキの準備工程であり前記焼成基材を
分割する工程と、前記焼成済電極上にメッキ膜を形成す
る工程とを順次行うものである。Means for Solving the Problems In order to solve this problem, the present invention provides one of both side surfaces of a rod-shaped unfired green tape base material obtained by extruding a ceramic material for low temperature firing, and a top surface and a bottom surface connected to them. Printing a conductor electrode on the portion and drying it, printing a resistor so as to partially overlap the conductor electrode and drying it, forming a dividing slit on the green tape substrate, and the green tape A step of simultaneously firing the base material, the electrode and the resistor, a resistance value adjusting step for aligning the resistance values of the fired resistor, and a baking and curing of the fired resistor and the resistance correcting portion by coating with a polymer resin paint. The step of forming a protective film, the step of dividing the baked base material that is a step of preparing for plating, and the step of forming a plated film on the baked electrode are sequentially performed.
作用 この構成により、本発明は押出し成形した棒状の未焼成
グリーンテープ基材の両側面部上面及び底面といったす
べての電極、さらに抵抗体を同時焼成することができ、
基材寸法のバラツキにより基板を分類したり電極および
抵抗印刷用マスクを多数用意することなくチップ抵抗器
を製造することが可能となる。With this configuration, the present invention can co-fire all the electrodes such as the top and bottom surfaces of both side surfaces of the extruded rod-shaped unfired green tape substrate, and the resistor.
It is possible to manufacture a chip resistor without classifying the substrates or preparing a large number of electrodes and resistance printing masks due to variations in the base material size.
実施例 本発明の一実施例を第１図に示す製造工程順に説明す
る。Embodiment An embodiment of the present invention will be described in the order of manufacturing steps shown in FIG.
まず、第１図に示すように低温焼成用セラミック材料
（CaO,PbO,B2O3，Si2O系）とバインダー（メチルセルロ
ーズ）と潤滑剤（ダイナマイトグリセリン）と水を混合
し、脱水，真空土練工程を経た後、矩形状のノズルを通
して、押出し成形を行ってグリーンテープ基材６を得、
熱風乾燥する。First, as shown in FIG. 1, low temperature firing ceramic material (CaO, PbO, B 2 O 3 , Si 2 O system), binder (methyl cellulose), lubricant (dynamite glycerin) and water are mixed to dehydrate, After the vacuum kneading step, extrusion molding is performed through a rectangular nozzle to obtain a green tape base material 6,
Dry with hot air.
次いで、グリーンテープ基材６の両側面部、及び上面の
一部、さらに底面の一部に高温焼成厚膜電極Pd−AgやAg
ペーストを、ロール印刷工法で塗膜を形成した後、熱風
乾燥して、第２電極7,8、第１電極9,10、第３電極11を
設ける。Then, the high temperature baked thick film electrodes Pd-Ag and Ag are formed on both side surfaces of the green tape substrate 6, a part of the upper surface, and a part of the bottom surface.
After forming a coating film of the paste by a roll printing method, it is dried with hot air to provide the second electrodes 7 and 8, the first electrodes 9 and 10, and the third electrode 11.
さらに、高温焼成厚膜抵抗（RuO2系）ペーストをスクリ
ーン印刷法や描画印刷法などで印刷した後、乾燥した抵
抗体12を前記第１電極9,10の一部に接続して形成する。Further, a high temperature fired thick film resistance (RuO 2 system) paste is printed by a screen printing method or a drawing printing method, and then a dried resistor 12 is connected to a part of the first electrodes 9 and 10 to be formed.
上記の電極，抵抗印刷済グリーンテープ基材を850℃〜9
50℃の空気雰囲気トンネル炉で同時焼成された抵抗体に
レーザトリミングを施し、所望の抵抗値を得る。850 ℃ ～ 9 with the above electrode and resistance printed green tape base material
The resistors simultaneously fired in an air atmosphere tunnel furnace at 50 ° C. are laser-trimmed to obtain a desired resistance value.
さらに、防湿および絶縁効果を目的に抵抗体修正部分を
ポリマー樹脂塗料を用いて塗付した後、焼付け硬化して
保護膜14を形成した。Further, a resistor modification portion was coated with a polymer resin coating for the purpose of preventing moisture and insulating, and then baked and cured to form a protective film 14.
上記チップ抵抗連を分割用スリット13に沿って基板分割
した分割片の電極部にニッケル下地メッキ後スズまたは
ハンダの何れかまたは組合せた電気メッキを施し洗浄・
乾燥後、抵抗値チェックを実施する。Electrode plating of either tin or solder or a combination of tin or solder is applied to the electrode portion of the divided piece obtained by dividing the chip resistor string into substrates along the dividing slit 13 for cleaning.
After drying, check the resistance value.
以上の製造工程により造られたチップ抵抗器が得られ
る。The chip resistor manufactured by the above manufacturing process is obtained.
発明の効果 以上のように本発明は、全電極が同時に印刷構成でき、
かつ同時焼成により電極，抵抗体とも１回の焼成で可能
であり、作業工数の削減が大幅になる上、セラミック基
材と電極，抵抗体が同時焼成のため、従来例に見られる
セラミック基板の熱収縮に伴う寸法バラツキの影響がな
いので、基板を寸法別に分類したり電極や抵抗印刷用マ
スクを多数用意する必要なく同一のマスクで容易に印刷
可能となりかつグリーンテープ基材を長手方向に分割す
るただ１回のみの分割工程を処すだけで、チップ抵抗器
を容易に生産できる。As described above, according to the present invention, all the electrodes can be printed at the same time,
Moreover, simultaneous firing enables both the electrode and the resistor to be fired once, which significantly reduces the number of work steps. In addition, since the ceramic base material and the electrode and the resistor are fired simultaneously, the ceramic substrate of the conventional example Since there is no effect of dimensional variation due to heat shrinkage, it is possible to easily print with the same mask without having to classify the substrates by size or prepare many electrodes or masks for resistance printing, and divide the green tape base material in the longitudinal direction. The chip resistor can be easily manufactured by performing the dividing process only once.
また、本発明のグリーンテープ基材は成形押出し法によ
り、ノズル形状に応じて任意形状にできるため、基材の
上面，底面の両側面部の４角に丸みをもたせることがで
き、チップ抵抗器をプリント基板上に半田付けしたとき
半田が底面の一部に廻り込んで半田付後の強度が向上す
る等の利点が得られる。In addition, since the green tape substrate of the present invention can be formed into an arbitrary shape according to the nozzle shape by the molding extrusion method, it is possible to round the four corners of both the top and bottom surfaces of the substrate and to form the chip resistor. When soldered on a printed circuit board, the solder wraps around a part of the bottom surface to improve the strength after soldering.
第１図は本発明の一実施例によるチップ抵抗器の製造方
法を示す工程説明図、第２図は従来のチップ抵抗器の製
造方法を示す工程説明図である。 ６……低温焼成グリーンテープ基材、7,8……第２電
極、9,10……第１電極、11……第３電極、12……抵抗
体、13……分割用スリット、14……保護膜。FIG. 1 is a process explanatory view showing a method of manufacturing a chip resistor according to an embodiment of the present invention, and FIG. 2 is a process explanatory view showing a method of manufacturing a conventional chip resistor. 6 ... Low temperature green tape base material, 7,8 ... second electrode, 9,10 ... first electrode, 11 ... third electrode, 12 ... resistor, 13 ... dividing slit, 14 ... …Protective film.
Claims (2)
た棒状の未焼成グリーンテープ基材の両側面部、それら
に接続する上面及び底面の一部に導体電極を印刷し乾燥
する工程と、前記導体電極に一部が重なるように抵抗体
を印刷し乾燥する工程と、前記グリーンテープ基材に分
割用スリットを形成する工程と、前記グリーンテープ基
材、電極及び抵抗体を同時に焼成する工程と、前記焼成
済抵抗体の抵抗値をそろえるための抵抗値修正工程と、
前記焼成済抵抗体及び抵抗修正部分をポリマー樹脂塗料
で塗装し焼付け硬化する保護膜形成工程と、メッキの準
備工程であり前記焼成基材を分割する工程と、前記焼成
済電極上にメッキ膜を形成する工程とを順次行うことを
特徴とするチップ抵抗器の製造方法。1. A step of printing and drying a conductor electrode on both side surfaces of a rod-shaped unfired green tape base material extruded from a ceramic material for low temperature firing and a part of an upper surface and a bottom surface connected to them, and the conductor electrode. A step of printing a resistor so that a part of the green tape substrate is dried, a step of forming a slit for dividing the green tape substrate, a step of simultaneously firing the green tape substrate, the electrode and the resistor, A resistance value correction step for aligning the resistance values of the fired resistors,
A protective film forming step of coating the baked resistor and the resistance correction portion with a polymer resin paint and baking and curing, a step of dividing the baked base material which is a preparation step of plating, and a plating film on the baked electrode. A method of manufacturing a chip resistor, which comprises sequentially performing a forming step.
し、抵抗体焼成温度より低い温度で焼成する工程である
ことを特徴とする特許請求の範囲第１項記載のチップ抵
抗器の製造方法。2. The method of manufacturing a chip resistor according to claim 1, wherein the protective film forming step is a step of coating with a glass paste and firing at a temperature lower than a resistor firing temperature. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62059348A JPH0673324B2 (en) | 1987-03-13 | 1987-03-13 | Manufacturing method of chip resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62059348A JPH0673324B2 (en) | 1987-03-13 | 1987-03-13 | Manufacturing method of chip resistor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63224305A JPS63224305A (en) | 1988-09-19 |
| JPH0673324B2 true JPH0673324B2 (en) | 1994-09-14 |
Family
ID=13110695
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62059348A Expired - Lifetime JPH0673324B2 (en) | 1987-03-13 | 1987-03-13 | Manufacturing method of chip resistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0673324B2 (en) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5574105A (en) * | 1978-11-29 | 1980-06-04 | Tdk Electronics Co Ltd | Method of fabricating chip resistor |
| JPS5810843B2 (en) * | 1980-04-22 | 1983-02-28 | 松下電器産業株式会社 | How to manufacture chip resistors |
| JPS57188808A (en) * | 1981-05-18 | 1982-11-19 | Nippon Electric Co | Method of producing resistor |
-
1987
- 1987-03-13 JP JP62059348A patent/JPH0673324B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63224305A (en) | 1988-09-19 |
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