JPH0680840B2 - Optical printer head - Google Patents
Optical printer headInfo
- Publication number
- JPH0680840B2 JPH0680840B2 JP16225684A JP16225684A JPH0680840B2 JP H0680840 B2 JPH0680840 B2 JP H0680840B2 JP 16225684 A JP16225684 A JP 16225684A JP 16225684 A JP16225684 A JP 16225684A JP H0680840 B2 JPH0680840 B2 JP H0680840B2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- conductive pattern
- printer head
- optical printer
- thick film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
- B41J2/447—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources
- B41J2/45—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources using light-emitting diode [LED] or laser arrays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
- H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Led Devices (AREA)
- Dot-Matrix Printers And Others (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
- Led Device Packages (AREA)
Description
【発明の詳細な説明】 イ)産業上の利用分野 本発明は発光ダイオードを1列に整列させて用いる光プ
リンタヘッドに関する。The present invention relates to an optical printer head that uses light emitting diodes arranged in a row.
ロ)従来の技術 従来光プリンタヘッドは特開昭58-125878号公報に記載
されているが、第2図に示すように整列された発光部
(15)(15)…を有する発光ダイオード(14)(14)を
整列配置していた。ところが、この整列状態が乱れると
そのまま印字の走査線(直線性)が乱れ、印字品質が低
下する。ところが光プリントヘッドはA4用で214mmの如
く有効記録長が200〜430mmと長いのに対し、発光部の間
隔(ドットピンチ)は0.07〜0.15mmと短いので、全長の
直線性を監視し乍ら発光ダイオード接続部のドットピッ
チを一定に保つような拡大鏡又はパターン認識装置は現
在では開発されていない。そこで発光部の整列性を重視
して発光ダイオードを整列させるが、100μm±10μm
が認識できる装置の視野は高々15mmであるから、全体的
にうねりが生じやすい。この為、先の公報では発光ダイ
オード載置部に溝(17)を設ける事を提案している。し
かし、発光ダイオードの巾と略等しい1〜2mmの巾の長
尺の溝を形成するのは機械的方法では直線性を保つのが
困難で、エッチング等では底面を平坦にするのが困難
で、発光ダイオードの表面が傾くなど不都合が生じやす
く、この不都合を解決すべく精密加工をすると極めて高
価となり、好ましくない。(B) Prior Art Although a conventional optical printer head is described in Japanese Patent Laid-Open No. 58-125878, a light emitting diode (14) having light emitting portions (15) (15) ... Aligned as shown in FIG. 2 is used. ) (14) were aligned. However, if this alignment state is disturbed, the scanning line (linearity) of printing is disturbed as it is, and the printing quality is degraded. However, while the optical print head for A4 has a long effective recording length of 200 to 430 mm like 214 mm, the interval (dot pinch) of the light emitting part is as short as 0.07 to 0.15 mm, so the linearity of the entire length should be monitored. No magnifying glass or pattern recognition device has been developed so far so as to keep the dot pitch of the light emitting diode connection part constant. Therefore, the light emitting diodes are aligned by placing importance on the alignment of the light emitting parts, but 100 μm ± 10 μm
The field of view of the device that can be recognized by is at most 15 mm, so waviness is likely to occur as a whole. Therefore, the above publication proposes to provide the groove (17) in the light emitting diode mounting portion. However, it is difficult to maintain linearity by a mechanical method to form a long groove having a width of 1 to 2 mm which is substantially equal to the width of the light emitting diode, and it is difficult to flatten the bottom surface by etching or the like. Inconveniences such as tilting of the surface of the light emitting diode are likely to occur, and precision processing to solve this inconvenience would be extremely expensive, which is not preferable.
ハ)発明が解決しようとする問題点 本発明は上述の点を考慮してなされたもので拡大鏡や認
識装置の視野内に入る基準線を比較的廉価に設けた光プ
リンタヘッドを提供するものである。(C) Problems to be Solved by the Invention The present invention has been made in consideration of the above points, and provides an optical printer head in which a reference line within the field of view of a magnifying glass or a recognition device is provided at a relatively low cost. Is.
ニ)問題点を解決するための手段 本発明は厚膜印刷の精度に着目してなされたもので、発
光ダイオードを載置する導電パターンの中に厚さ10μm
以下の印刷層を含むように形成し、その印刷層の端縁を
基準線とするものである。D) Means for Solving the Problems The present invention was made by paying attention to the accuracy of thick film printing, and has a thickness of 10 μm in the conductive pattern on which the light emitting diode is mounted.
It is formed so as to include the following printing layers, and the edges of the printing layers are used as reference lines.
ホ)作用 これにより、発光部の間隔(ドットピッチ)をそろえる
べく載置装置を利用すると、その載置部の外郭又はその
近傍に基準線が同時認識できるので直線性よく載置出
来、またその基準線は厚膜印刷により容易に得ることが
出来る。(E) Action As a result, when the placement device is used to align the intervals (dot pitches) of the light emitting parts, the reference line can be simultaneously recognized in the outer contour of the placement part or in the vicinity thereof, and the placement can be performed with good linearity. The reference line can be easily obtained by thick film printing.
ヘ)実施例 第1図は本発明実施例の光プリンタヘッドの斜視図
(a)と断面図(b)で、(1)はセラミック等の基板
で表面に発光ダイオードの載置用の導電パターン(2)
と配線用のパターン(3)(3)…を具備している。
(4)(4)…は載置用の導電パターン(2)上に整列
され載置固着された発光ダイオードで、選択拡散によっ
てPN接合(5)′を形成し、それによって整列された発
光部(5)(5)…を設けてある。(6)(6)…は各
発光部(5)(5)…に配線を施こす金属細線で、。ワ
イヤボンド法等により接続される。F) Embodiment FIG. 1 is a perspective view (a) and a sectional view (b) of an optical printer head according to an embodiment of the present invention. (1) is a substrate made of ceramic or the like and a conductive pattern for mounting a light emitting diode on the surface. (2)
And wiring patterns (3) (3).
Numerals (4), (4), ... Are light emitting diodes aligned and mounted and fixed on the conductive pattern (2) for mounting. The PN junction (5) 'is formed by selective diffusion, and the aligned light emitting portions are formed. (5) (5) ... are provided. (6) (6) ... are thin metal wires for wiring the light emitting parts (5) (5). Connection is made by a wire bond method or the like.
載置用の導電パターン(2)は、電流容量を高めかつ低
抵抗化するための工夫がなされるので、金ペースト等を
用いる時には20〜35μmの厚みに印刷される。そこで本
発明ではこれを複数の厚膜印刷層(2a)(2b)(2c)に
分割して多重印刷し、そのうちの少なくとも1層を10μ
m以下にすると共に長辺側端縁を直線性よく印刷する。
スクリーン印刷をする場合、厚膜印刷層(2a)(2b)
(2c)が厚いと型くずれ(ダレ)を生じやすい。直線性
をよくするには印刷層厚をうすくすればよいが、導電パ
ターンの本来の必要性である太電流容量化、低抵抗化を
防げるのは好ましくない。また認識手段で、参照光源等
の特別の条件を付加しないために薄膜印刷又は蓄着によ
るものは好ましくない。従ってメッシュスクリーン版の
制約上やむを得ない値(例えば200μm)以上の型くず
れを生じないためには印刷層厚みは10μm以下に形成さ
れている。そして、積層された複数の厚膜印刷層(2a)
(2b)(2c)の中で、線巾が最も広い最下層(2c)の長
辺側端縁が発光ダイオード(4)の載置基準線となる様
に、最下層(2c)は厚さ0.3μm乃至5μmに形成され
ると、より好ましい。Since the mounting conductive pattern (2) is devised to increase the current capacity and reduce the resistance, it is printed to a thickness of 20 to 35 μm when gold paste or the like is used. Therefore, in the present invention, this is divided into a plurality of thick film printing layers (2a) (2b) (2c) and subjected to multiple printing, and at least one of them is 10 μm.
The length is set to m or less and the long side edge is printed with good linearity.
When screen printing, thick film printing layers (2a) (2b)
If the thickness of (2c) is thick, the mold is likely to lose its shape. The linearity can be improved by thinning the thickness of the printing layer, but it is not preferable to prevent the original necessity of the conductive pattern from increasing the current capacity and reducing the resistance. Further, it is not preferable to use thin film printing or deposition for the recognition means because special conditions such as a reference light source are not added. Therefore, the thickness of the printing layer is set to 10 μm or less in order to prevent the mold from being deformed more than the unavoidable value (for example, 200 μm) due to the restriction of the mesh screen plate. And a plurality of thick film printing layers (2a) stacked
In (2b) and (2c), the bottom layer (2c) is thick so that the long side edge of the bottom layer (2c) with the widest line width becomes the mounting reference line of the light emitting diode (4). It is more preferable that the thickness is 0.3 μm to 5 μm.
具体的な例として、A4版用光プリンタヘッド(発光ダイ
オード(4)(4)…は巾1mm長さ8mm発光部ドットピッ
チ100μm)の導電パターン(2)の最下層として、巾
1.8mm長さ240mmにわたり厚さ3μmとなるよう金(Au)
を導電物質として低融点ガラスをバインダとした導電ペ
ーストを印刷した。乾燥焼成後の直線性は全長にわたり
+80μm−5μm以内であった。As a concrete example, as the bottom layer of the conductive pattern (2) of the optical printer head for A4 plate (the light emitting diodes (4) (4) ... Width 1 mm, length 8 mm, light emitting part dot pitch 100 μm),
Gold (Au) with a thickness of 3 μm over a length of 1.8 mm and 240 mm
Conductive paste was printed using as a conductive substance and low melting point glass as a binder. The linearity after dry firing is
It was within +80 μm-5 μm.
ト)考案の効果 上述の様に本発明は、複数の厚膜印刷層の中で線巾が最
も広い最下層の厚さを0.3μm以上に設ける事により層
の断線を防止し、かつ最下層の厚さを5μm以下と比較
的薄く設ける事により、この層は型くずれ(ダレ)を生
じない。故にこの層の長辺側端縁は正確な直線性を有す
るので、この端縁を発光ダイオードの載置基準線とする
事が出来る。従って、発光ダイオードを容易に直線上に
載置する事が出来る。従って、発光ダイオードを容易に
直線上に載置する事が出来るので、印字品質の高い光プ
リンタヘッドが得られる。更に、導電パターンは複数の
厚膜印刷層が積層されたものであるので、導電パターン
の全体の厚さは厚く(例えば20〜35μm)する事が出来
るから、大電流容量化と低抵抗化が得られる。また個々
の厚膜印刷層は比較的薄く設ける事が出来るので、表面
が平坦に形成出来るから、発光ダイオードを傾く事なく
厚膜印刷層上に載置出来る。G) Effect of the Invention As described above, the present invention prevents the disconnection of the layer by providing the thickness of the lowermost layer having the widest line width among the plurality of thick film printing layers to 0.3 μm or more, and By providing a relatively small thickness of 5 μm or less, this layer does not lose its shape. Therefore, since the long side edge of this layer has a correct linearity, this edge can be used as the mounting reference line of the light emitting diode. Therefore, the light emitting diode can be easily placed on a straight line. Therefore, since the light emitting diode can be easily placed on the straight line, an optical printer head with high printing quality can be obtained. Further, since the conductive pattern is formed by laminating a plurality of thick film printed layers, the total thickness of the conductive pattern can be made large (for example, 20 to 35 μm), which results in large current capacity and low resistance. can get. Further, since each thick film printing layer can be provided relatively thinly, the surface can be formed flat, so that the light emitting diode can be placed on the thick film printing layer without tilting.
第1図は本発明実施例の光プリンタヘッドの斜視図
(a)と断面図(b)で、第2図は従来の光プリンタヘ
ッドの要部斜視図である。 (1)…基板、(2)…(載置用の)導電パターン、
(2a)(2b)(2c)…厚膜印刷層、(3)(3)…パタ
ーン、(4)(4)…発光ダイオード、(5)(5)…
発光部、(5)′…PN接合、(6)(6)…金属細線。FIG. 1 is a perspective view (a) and a sectional view (b) of an optical printer head according to an embodiment of the present invention, and FIG. 2 is a perspective view of a main part of a conventional optical printer head. (1) ... substrate, (2) ... conductive pattern (for mounting),
(2a) (2b) (2c) ... Thick film printed layer, (3) (3) ... Pattern, (4) (4) ... Light emitting diode, (5) (5) ...
Light emitting part, (5) '... PN junction, (6) (6) ... Metal thin wire.
Claims (1)
と、導電パターン上に整列載置固着された複数の発光ダ
イオードとを有し、前記導電パターンは複数の厚膜印刷
層が積層され、かつその厚膜印刷層の中で線巾が最も広
い最下層の長辺側端縁が前記発光ダイオードの載置基準
線となる様に、前記最下層は厚さ0.3μm乃至5μmに
形成されている事を特徴とする光プリンタヘッド。1. A substrate, a conductive pattern provided on the substrate, and a plurality of light emitting diodes aligned and mounted on the conductive pattern. The conductive pattern is formed by laminating a plurality of thick film printing layers. In addition, the bottom layer is formed to have a thickness of 0.3 to 5 μm so that the long side edge of the bottom layer having the widest line width in the thick film printing layer serves as a mounting reference line for the light emitting diode. An optical printer head that is characterized by
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16225684A JPH0680840B2 (en) | 1984-07-31 | 1984-07-31 | Optical printer head |
| US06/742,584 US4733127A (en) | 1984-06-12 | 1985-06-07 | Unit of arrayed light emitting diodes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16225684A JPH0680840B2 (en) | 1984-07-31 | 1984-07-31 | Optical printer head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6140069A JPS6140069A (en) | 1986-02-26 |
| JPH0680840B2 true JPH0680840B2 (en) | 1994-10-12 |
Family
ID=15750973
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16225684A Expired - Lifetime JPH0680840B2 (en) | 1984-06-12 | 1984-07-31 | Optical printer head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0680840B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5570029A (en) * | 1994-03-30 | 1996-10-29 | Fluke Corporation | Cable crosstalk measurement system |
| JP2009099715A (en) * | 2007-10-16 | 2009-05-07 | Fujikura Ltd | Light emitting device |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5638770Y2 (en) * | 1974-11-29 | 1981-09-10 | ||
| JPS5633650U (en) * | 1979-08-21 | 1981-04-02 | ||
| JPS58112376A (en) * | 1981-12-25 | 1983-07-04 | Ricoh Co Ltd | Light emitting element array |
| JPS58209265A (en) * | 1982-05-31 | 1983-12-06 | Olympus Optical Co Ltd | Light emitting diode array device |
-
1984
- 1984-07-31 JP JP16225684A patent/JPH0680840B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6140069A (en) | 1986-02-26 |
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