JPH0680884B2 - Thick film drawing machine nozzle - Google Patents
Thick film drawing machine nozzleInfo
- Publication number
- JPH0680884B2 JPH0680884B2 JP60293791A JP29379185A JPH0680884B2 JP H0680884 B2 JPH0680884 B2 JP H0680884B2 JP 60293791 A JP60293791 A JP 60293791A JP 29379185 A JP29379185 A JP 29379185A JP H0680884 B2 JPH0680884 B2 JP H0680884B2
- Authority
- JP
- Japan
- Prior art keywords
- nozzle
- thick film
- discharge hole
- slit
- paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 14
- 239000004020 conductor Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 8
- 238000007650 screen-printing Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
Landscapes
- Coating Apparatus (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明は、ラジオ受信機,テレビ受像機,ビデオテープ
レコーダ,通信機器等の厚膜回路の形成に用いる厚膜描
画機のノズルに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a nozzle of a thick film drawing machine used for forming a thick film circuit of a radio receiver, a television receiver, a video tape recorder, a communication device and the like.
従来の技術 厚膜回路は、スクリーン版を用いて基板面に厚膜ペース
トを所望の形状に印刷し、乾燥・焼成工程を経て形成す
るスクリーン印刷法で行なうのが一般的である。2. Description of the Related Art A thick film circuit is generally formed by a screen printing method in which a thick plate paste is printed in a desired shape on a substrate surface using a screen printing plate, and a drying and baking process is performed to form the thick film paste.
さらに近年多品種少量生産用として、ノズル先端部の吐
出孔からペーストを吐出し、ノズルを基板に対して相対
的に移動させながら導体や抵抗体を形成する描画法が提
案されている。描画法はコンピュータ制御により短時間
のうちにパターンの切り替えが行なえるほか、プログラ
ムデーターを作成するだけで回路試作が行なえるので、
開発期間の大幅な短縮が図れ、スクリーン印刷法に代わ
る有力な厚膜回路形成法と考えられる。Furthermore, in recent years, a drawing method has been proposed in which a paste is discharged from a discharge hole at the tip of a nozzle and a conductor or a resistor is formed while moving the nozzle relative to a substrate for high-mix low-volume production. In the drawing method, patterns can be switched in a short time by computer control, and circuit prototypes can be made simply by creating program data.
The development period can be greatly shortened, and it is considered to be a powerful thick film circuit formation method that replaces the screen printing method.
上記の厚膜描画機で第4図と第5図にノズル先端部を示
す。第4図は円形ノズル1aで、一般的に直径が100μm
〜300μmのペースト吐出孔10が設けられている。第5
図はペースト吐出孔11をスリット形状にし、その長手方
向がノズル進行方向に対して90°となる様に配設し、比
較的幅の広い導体又は抵抗体を短時間に且つ高精度に形
成する描画用ノズル1bである。これは線幅を何本か隣接
させることにより、薄くて幅の広い線を描画する円形ノ
ズルよりも効率が良い。The nozzle tip portion is shown in FIGS. 4 and 5 in the above thick film drawing machine. Figure 4 shows a circular nozzle 1a with a typical diameter of 100 μm.
A paste discharge hole 10 of about 300 μm is provided. Fifth
In the figure, the paste discharge hole 11 is formed in a slit shape, and its longitudinal direction is arranged at 90 ° with respect to the nozzle advancing direction, and a relatively wide conductor or resistor is formed in a short time with high accuracy. The drawing nozzle 1b. This is more efficient than a circular nozzle that draws thin and wide lines by adjoining several line widths.
発明が解決しようとする問題点 上記のスリット形状の吐出孔では、導体,抵抗体の幅が
固定的になり、量産時にあらかじめ必要とする数種のス
リット幅のノズルにペーストを充填しておき、使用時に
取り替えるか、抵抗幅,導体幅ごとに描画機を用意し待
機させるなどの方法が取られる。いずれの方法も、ノズ
ルか描画機の保有数を多くする必要がある。DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention In the above slit-shaped discharge holes, the widths of the conductor and the resistor are fixed, and the paste is filled in the nozzles of several kinds of slit widths required in advance in mass production, It is possible to replace it at the time of use, or prepare a drawing machine for each resistance width and conductor width and put it on standby. Either method requires a large number of nozzles or drawing machines.
問題点を解決するための手段 本発明は上記問題点を解決するため、ノズル先端部の吐
出孔からペーストを圧力を加えた状態で吐出させ、同時
に基板に対しノズルを相対的に移動させながら前記基板
上に導体又は抵抗体を形成する厚膜描画機において、ノ
ズルの吐出孔をスリット形状に形成し、ノズル進行方向
に対してスリット状吐出孔の長手方向が略90°となるよ
うに配設し、前記吐出孔の端部にスリット幅を狭める方
向に付勢された可動片を配したことを特徴としている。Means for Solving the Problems In order to solve the above problems, the present invention allows the paste to be discharged from a discharge hole at the tip of the nozzle under pressure while simultaneously moving the nozzle relative to the substrate. In a thick film drawing machine that forms conductors or resistors on a substrate, the nozzle discharge holes are formed in a slit shape, and the slit discharge holes are arranged so that the longitudinal direction is approximately 90 ° with respect to the nozzle advancing direction. However, it is characterized in that a movable piece urged in the direction of narrowing the slit width is arranged at the end of the discharge hole.
ペーストに加える圧力としては、エアー圧、プランジャ
ーによる機械的圧力などがあり、これら圧力を任意に変
えられるように圧力調整装置が備えられることが好まし
い。又、可動片は前記吐出孔の両端部の夫々に配するこ
とが最適であるが、一方の端部にのみ配してもよい。更
に、可動片をスリット幅を狭める方向に付勢する手段と
しては、コイルばね,板ばね,マグネットなどを採用す
ることができる。The pressure applied to the paste includes air pressure, mechanical pressure by a plunger, and the like, and it is preferable to provide a pressure adjusting device so that these pressures can be arbitrarily changed. Further, the movable pieces are optimally arranged at both ends of the discharge hole, but may be arranged only at one end. Further, a coil spring, a leaf spring, a magnet, or the like can be used as a means for urging the movable piece in the direction of narrowing the slit width.
作用 本発明においてスリット状吐出孔は、ノズル本体内に充
填したペーストを厚膜状に成形しながら吐出させ基板面
に付着させるものである。スリット端部の可動片はペー
ストが基板面に到達したときに発生する背圧で可変する
もので、コイルバネなどによるスリット幅を狭める方向
の付勢力とのつり合いによりスリット寸法が定まり、形
成される導体又は抵抗体の幅をペーストに加える圧力の
調節により任意に変化させることができる。Function In the present invention, the slit-shaped discharge holes are for discharging the paste filled in the nozzle body while forming it into a thick film and adhering it to the substrate surface. The movable piece at the end of the slit is variable by the back pressure generated when the paste reaches the substrate surface. Alternatively, the width of the resistor can be arbitrarily changed by adjusting the pressure applied to the paste.
実施例 以下、本発明を実施例にもとづき説明する。Examples Hereinafter, the present invention will be described based on Examples.
第1図において、1は本体ノズル、2はペースト、3は
コイルバネ、4は可動片、5は絶縁基板である。In FIG. 1, 1 is a main nozzle, 2 is a paste, 3 is a coil spring, 4 is a movable piece, and 5 is an insulating substrate.
まず可動片4は本体ノズル1に少なくとも基板5上に落
下しない形状に取り付けておく。可動片4はスリット状
吐出孔6の全スペースをスライドするようにスベリ効果
を持たせ本体ノズル1の両端と可動片4の空スペースに
コイルバネ3を取り付ける。可動片4はコイルバネ3に
押され、スリット状吐出孔6を閉じようとする動作を行
なう。次に上記ノズルにペースト2を充填し厚膜描画機
ヘッドに取り付け、絶縁基板5とノズル先端が少なくと
も50μm以下となる様に近づける。この場合に距離を一
定にするため、ダイヤモンドチップを用いた接触子(図
示省略)をノズル先端部に取り付け基板5に追従させる
のが望ましい。First, the movable piece 4 is attached to the main body nozzle 1 at least in a shape that does not drop on the substrate 5. The movable piece 4 has a sliding effect so as to slide over the entire space of the slit-shaped ejection hole 6, and the coil spring 3 is attached to both ends of the main body nozzle 1 and the empty space of the movable piece 4. The movable piece 4 is pushed by the coil spring 3 and tries to close the slit-shaped discharge hole 6. Next, the above-mentioned nozzle is filled with the paste 2 and attached to a thick film writer head, and the insulating substrate 5 and the tip of the nozzle are brought close to each other so as to be at least 50 μm or less. In this case, in order to keep the distance constant, it is desirable to make a contact (not shown) using a diamond tip follow the mounting substrate 5 at the tip of the nozzle.
上記条件下でエアー圧力によりペースト2を吐出させる
と、これが基板5面に到達したと同時に背圧が発生し、
可動片4を押し開く動作が行なわれる。コイルバネ3の
圧力と背圧のつり合った所でスリット状吐出孔6のスリ
ット幅が定まる。所定の抵抗体幅,導体幅を得るに必要
なスリット幅はエアー圧力を調節して選定することがで
きる。When the paste 2 is discharged by the air pressure under the above conditions, the back pressure is generated at the same time when the paste 2 reaches the surface of the substrate 5,
An operation of pushing open the movable piece 4 is performed. The slit width of the slit-shaped discharge hole 6 is determined at the place where the pressure of the coil spring 3 and the back pressure are balanced. The slit width required to obtain the predetermined resistor width and conductor width can be selected by adjusting the air pressure.
発明の効果 以上説明したように本発明は、任意の幅の抵抗体や導体
を単一のノズルで容易且つ迅速に形成できるため、厚膜
描画機およびノズルの保有数を大幅に削減し、厚膜回路
基板のコストダウンにつながるばかりでなく、装置切り
替え時間を大幅に短縮することができる。EFFECTS OF THE INVENTION As described above, the present invention can easily and quickly form a resistor or conductor of any width with a single nozzle. Not only can the cost of the membrane circuit board be reduced, but the device switching time can be greatly shortened.
第1図は本発明の一実施例における描画ノズルの断面
図、第2図は本発明の一実施例における描画用ノズルの
底面図、第3図は本発明の一実施例における描画用ノズ
ルの側面から見た断面図、第4図および第5図は従来の
描画用ノズルの斜視図である。 2……ペースト、3……コイルバネ、4……可動片、5
……基板、6……吐出孔。FIG. 1 is a sectional view of a drawing nozzle in one embodiment of the present invention, FIG. 2 is a bottom view of the drawing nozzle in one embodiment of the present invention, and FIG. 3 is a drawing nozzle of the embodiment in the present invention. FIG. 4 and FIG. 5 are cross-sectional views seen from the side, and are perspective views of a conventional drawing nozzle. 2 ... Paste, 3 ... Coil spring, 4 ... Movable piece, 5
…… Substrate, 6 …… Discharge hole.
Claims (1)
を加えた状態で吐出させ、同時に基板に対し、ノズルを
相対的に移動させながら前記基板上に導体又は抵抗体を
形成する厚膜描画機において、ノズルの吐出孔をスリッ
ト形状に形成し、ノズル進行方向に対してスリット状吐
出孔の長手方向が略90°となるように配設し、前記吐出
孔の端部にスリット幅を狭める方向に付勢された可動片
を配したことを特徴とする厚膜描画機のノズル。Claim: What is claimed is: 1. A thick film drawing method, wherein a paste is discharged from a discharge hole at the tip of a nozzle while pressure is applied, and at the same time, a conductor or a resistor is formed on the substrate while moving the nozzle relative to the substrate. In the machine, the discharge hole of the nozzle is formed in a slit shape, and the slit-shaped discharge hole is arranged so that the longitudinal direction thereof is approximately 90 ° with respect to the nozzle traveling direction, and the slit width is narrowed at the end of the discharge hole. A nozzle for a thick film drawing machine, which is provided with a movable piece biased in a direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60293791A JPH0680884B2 (en) | 1985-12-26 | 1985-12-26 | Thick film drawing machine nozzle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60293791A JPH0680884B2 (en) | 1985-12-26 | 1985-12-26 | Thick film drawing machine nozzle |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62154693A JPS62154693A (en) | 1987-07-09 |
| JPH0680884B2 true JPH0680884B2 (en) | 1994-10-12 |
Family
ID=17799209
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60293791A Expired - Lifetime JPH0680884B2 (en) | 1985-12-26 | 1985-12-26 | Thick film drawing machine nozzle |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0680884B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2542893Y2 (en) * | 1991-06-20 | 1997-07-30 | 富士通テン株式会社 | Viscous liquid supply device |
-
1985
- 1985-12-26 JP JP60293791A patent/JPH0680884B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62154693A (en) | 1987-07-09 |
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