JPH0682925B2 - Printed wiring board - Google Patents

Description

Description: FIELD OF THE INVENTION The present invention relates to a printed wiring board.

(Background of the Invention) In a conventional printed wiring board, for example, Japanese Utility Model Publication 57-5
As described in Japanese Patent No. 2949 and shown in FIGS. 2 and 3, 1 is a multilayer printed board and 2 is a signal layer of an inner layer, which is formed from a signal line 2a. Numerals 3 and 4 are terminal insertion holes and component terminal insertion lands, which are arranged on the intersection 5c of the main reference grid lines 5a, 5b in two directions (vertical and horizontal directions) perpendicular to each other. With the above configuration, for example, when the grating pitch P between the intersections 5c is set to 2.54 mm, the maximum number n of signal lines 2a between one grating can be set to four, which was generally two in the past. Similarly, when the grating pitch P is set to 1.27 mm, the maximum number n of signal lines 2a between one grating is 0, which is not 0 in the conventional case, but 1 or 2 can be passed. . Therefore, the density of the printed wiring can be increased. As described above, in the conventional printed wiring board, consideration is given to increasing the density of the printed wiring. However, when a via hole dedicated to signal line connection for connecting signal lines of different signal layers is provided. In addition, it must be placed on the intersection 5c of the main reference grid lines 5a and 5b, which may hinder high density,
If a via hole is provided between 5a and 5b, the amount of gap between the signal lines 2a becomes uneven, which means that no consideration is given to evenly arranging the amount of gap. A difference occurs depending on the position, which causes deterioration of the entire insulation characteristic.

(Object of the Invention) It is an object of the present invention to provide a printed wiring board which solves the above-mentioned conventional problems and can improve the insulating characteristics of the entire printed wiring board.

(Summary of the Invention) In order to achieve the above object, the present invention includes a first signal layer having first and second signal lines arranged on the same plane and substantially parallel to each other, and a first signal layer. A second signal layer having third and fourth signal lines arranged on different planes substantially parallel to each other, a first signal line in the first signal layer and a third signal line in the second signal layer. A first via hole for electrically connecting the signal line and a second signal line for electrically connecting the second signal line in the first signal layer and the fourth signal line in the second signal layer. It has a bay hall. And
Each signal line of the first signal layer is arranged so as to intersect with each signal line of the second signal layer, and the first via hole is a first signal line and a third signal line. Is provided in a direction away from the intersection of the second signal line and the fourth signal line, the second via hole, the first from the intersection of the second signal line and the fourth signal line The signal lines and the third signal line are provided so as to be displaced in the direction away from each other.

(Embodiment of the Invention) Hereinafter, FIG. 1 showing an embodiment of the present invention will be described. The same parts as in the prior art are indicated by the same reference numerals as in FIGS. 2 and 3. As shown in the figure, the terminal insertion hole 3 and the component terminal insertion land 4 of the mounted component are arranged at the intersection 5c of the main reference grid lines 5a and 5b in the vertical and horizontal directions perpendicular to each other. Sub-grid lines 6a and 6b are arranged at positions equally dividing the main reference grid lines 5a and 5b between the terminal insertion holes 3 and the component terminal insertion lands 4 of these mounted parts into two, which are adjacent to the most central part. The signal lines 2a, 2b and the signal lines 2c, 2d are arranged on the sub-lattice lines 6a, 6b of / 5 and 3/5, and the positions are deviated from the intersection of these signal lines 2a, 2b, 2c, 2d by a certain dimension. In addition, a via hole 7 dedicated to connecting the signal lines 2a, 2b, 2c, 2d having a hole diameter smaller than the diameter of the terminal insertion hole 3 of the mounted component and the diameter of the component terminal insertion land 4 is provided. In general, the signal lines 2a, 2b
Are often formed on the same signal layer, and the signal lines 2c and 2d are often formed on the surface of a signal layer different from 2a and 2b. Because of the above configuration,
Signal lines 2a, 2b and signal lines 2c, 2d on the sub-lattice lines 6a, 6b,
The conductor lines 2e between the signal lines 2a, 2b and the signal lines 2c, 2d and the via holes 7 disposed near the intersections of the signal lines 2a, 2b are arranged on the two sub-lattice lines 6a, 6b adjacent to each other. , And signal line 2
The gap amount 2f between the signal lines 2a and 2b and the gap amount 2f between the signal lines 2c and 2d when c and 2d run in parallel are substantially equal. Therefore, even if each of the via holes 7 and 7 is provided, the gap amount 2f between the signal lines 2a and 2b and the signal line 2 are determined by the outer circumference of the via hole.
The gap amount 2f between c and 2d does not become partially narrowed, and the gap amount between adjacent signal lines 2a and 2b or between 2c and 2d is averaged at any place, so that the insulation characteristics are not limited. In this case, the difference is small, and the insulating property of the printed circuit board can be improved.

(Effect of the Invention) As described above, according to the present invention, the gap amount between two adjacent signal lines is made uniform at any place, and an electrically insulating load between two adjacent signal lines is also provided. It is uniformized, and thereby, the difference in the insulating property depending on the place can be reduced and the insulating property of the printed wiring board can be improved. Further, even when a plurality of signal lines are arranged between the terminal insertion holes of the mounted parts and the component terminal insertion lands to achieve high density of the printed wiring, it is possible to apply a high voltage between two adjacent signal lines. can do.

[Brief description of drawings]

FIG. 1 is a plan view of a printed wiring board showing an embodiment of the present invention, FIG. 2 is a plan view of a conventional printed wiring board, and FIG. 3 is a longitudinal sectional view thereof. 1 ... Multilayer printing board, 2 ... Signal layer, 2a, 2b, 2c, 2d ... Signal line, 3 ... Mounting terminal terminal insertion hole, 4 ... Component terminal insertion land, 5a, 5b ... Main standard Lattice line, 6a, 6b ... Sub-lattice line, 7 ... Buyer hole.

Claims (2)

[Claims] 1. A first signal layer having first and second signal lines arranged substantially parallel to each other on the same plane, and arranged substantially parallel to each other on a plane different from the first signal layer. A first signal layer electrically connecting a second signal layer having third and fourth signal lines, a first signal line in the first signal layer and a third signal line in the second signal layer And a second via hole for electrically connecting the second signal line in the first signal layer and the fourth signal line in the second signal layer, the first signal layer Each of the signal lines is arranged so as to intersect with each of the signal lines of the second signal layer, and the first via hole is located at a second point from the intersection of the first signal line and the third signal line. Of the second signal line and the fourth signal line in a direction away from each other. Printed circuit board, characterized in that provided displaced in the direction away from the intersection between the signal line to the first signal line and the third signal line. 2. Each of the first and second via holes,
The first signal line and the second signal line, the signal line between the signal line, and the third signal line and the signal line between the fourth signal are arranged so as to be substantially uniform Claims No. 1
The printed wiring board according to the item.