JPH0682930B2 - Method for manufacturing electric laminate - Google Patents
Method for manufacturing electric laminateInfo
- Publication number
- JPH0682930B2 JPH0682930B2 JP6151788A JP6151788A JPH0682930B2 JP H0682930 B2 JPH0682930 B2 JP H0682930B2 JP 6151788 A JP6151788 A JP 6151788A JP 6151788 A JP6151788 A JP 6151788A JP H0682930 B2 JPH0682930 B2 JP H0682930B2
- Authority
- JP
- Japan
- Prior art keywords
- hole
- resin
- prepreg
- metal plate
- impregnated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 238000000034 method Methods 0.000 title description 4
- 229910052751 metal Inorganic materials 0.000 claims description 40
- 239000002184 metal Substances 0.000 claims description 40
- 239000011347 resin Substances 0.000 claims description 36
- 229920005989 resin Polymers 0.000 claims description 36
- 238000007747 plating Methods 0.000 claims description 23
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 16
- 239000000843 powder Substances 0.000 claims description 12
- 239000002245 particle Substances 0.000 claims description 8
- 239000002253 acid Substances 0.000 claims description 7
- 239000003513 alkali Substances 0.000 claims description 7
- 238000004080 punching Methods 0.000 claims description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M sodium hydroxide Inorganic materials [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 239000011521 glass Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 239000000945 filler Substances 0.000 description 7
- 230000002093 peripheral effect Effects 0.000 description 6
- 229920001721 polyimide Polymers 0.000 description 6
- 239000009719 polyimide resin Substances 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 5
- 239000011888 foil Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 239000002966 varnish Substances 0.000 description 5
- 239000007864 aqueous solution Substances 0.000 description 4
- 239000008187 granular material Substances 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical class O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910001679 gibbsite Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
本発明は、金属板を基板として用いた多層の電気積層板
に関するものである。The present invention relates to a multilayer electric laminate using a metal plate as a substrate.
金属板を基板とする電気積層板においては、スルーホー
ルを形成するために孔明きの金属板が基板として用いら
れる。すなわち、金属板にスルーホールを形成すべき箇
所においてスルーホールの径よりも大きな通孔を設けて
おき、複数枚の金属板をプリプレグを介して重ねて加熱
加圧成形をおこなうことによって、プリプレグに含浸し
た樹脂を硬化させて各金属板を積層接着すると共にプリ
プレグに含浸した樹脂を金属板の各通孔に流入充填させ
て硬化させる。このとき各金属板の間には片面プリント
配線板や両面プリント配線板、多層プリント配線板など
の回路を形成した回路板をプリプレグを介して重ねてあ
り、多層の回路板を金属板間に積層接着するようにして
ある。 そして金属板の通孔に充填させた樹脂の部分においてス
ルーホールを穿孔加工することによって、通孔内の樹脂
で金属板との間の絶縁性が確保されたスルーホールを形
成することができるのである。さらにスルーホールの内
周にはメッキを施してスルーホールメッキ層が形成され
る。In an electric laminate using a metal plate as a substrate, a perforated metal plate is used as a substrate to form a through hole. That is, a through hole having a diameter larger than that of the through hole is provided at a position where the through hole is to be formed in the metal plate, and a plurality of metal plates are overlapped with each other via the prepreg to perform heat and pressure molding, thereby forming a prepreg. The impregnated resin is cured to laminate and bond the metal plates, and the resin impregnated in the prepreg is caused to flow into and fill each through hole of the metal plate to be cured. At this time, a circuit board on which circuits such as a single-sided printed wiring board, a double-sided printed wiring board, and a multilayer printed wiring board are stacked between the metal plates through a prepreg, and the multilayer circuit boards are laminated and bonded between the metal plates. Is done. Since the through hole is formed in the resin portion filled in the through hole of the metal plate, the resin in the through hole can form a through hole in which insulation with the metal plate is secured. is there. Further, the inner periphery of the through hole is plated to form a through hole plating layer.
しかし、金属板２の通孔１に充填した樹脂４の部分にお
いて穿孔加工して形成したスルーホール５の内周面は樹
脂面であるためにスルーホールメッキ層６との密着性が
悪い。このために第２図に示すように、スルーホール５
の内周において樹脂４の面に形成するスルーホールメッ
キ層６が剥がれて、スルーホール信頼性が低下するおそ
れがあるという問題があった。そこで、プリプレグを調
製する樹脂中にAl2O3などの充填剤を含有させておくこ
とによって、樹脂４の部分に穿孔して形成するスルーホ
ールの内周面にこの充填剤が露出されるようにし、スル
ーホールの内周面が充填剤で凹凸粗面となるようにして
スルーホールメッキ層６の密着性を高める試みがなされ
ている。しかしながら充填剤の存在による凹凸では密着
性を高めるアンカー効果が十分ではなく、スルーホール
メッキ層６の密着性を高める効果を十分に得られていな
いのが現状である。 本発明は上記の点に鑑みて為されたものであり、スルー
ホールの内周の樹脂面に対するスルーホールメッキの密
着性を十分に高めることができる電気積層板の製造方法
を提供することを目的とするものである。However, since the inner peripheral surface of the through hole 5 formed by punching the resin 4 filled in the through hole 1 of the metal plate 2 is a resin surface, the adhesion with the through hole plating layer 6 is poor. For this purpose, as shown in FIG.
There is a problem that the through-hole plating layer 6 formed on the surface of the resin 4 is peeled off on the inner periphery of the above, and the through-hole reliability may be reduced. Therefore, by including a filler such as Al 2 O 3 in the resin for preparing the prepreg, the filler is exposed on the inner peripheral surface of the through hole formed by perforating the resin 4 portion. Attempts have been made to increase the adhesiveness of the through-hole plating layer 6 by making the inner peripheral surface of the through-hole a rough surface with a filler. However, the unevenness due to the presence of the filler does not have a sufficient anchor effect to enhance the adhesiveness, and the effect of enhancing the adhesiveness of the through-hole plating layer 6 is not sufficiently obtained under the present circumstances. The present invention has been made in view of the above points, and an object of the present invention is to provide a method for manufacturing an electric laminate capable of sufficiently enhancing the adhesion of through-hole plating to the resin surface of the inner periphery of the through-hole. It is what
上記課題を解決するために本発明は、通孔１を設けた複
数枚の金属板２をプリプレグ３を介して重ね、加熱加圧
成形してプリプレグ３に含浸した樹脂を硬化させて各金
属板２を積層接着すると共にプリプレグ３に含浸した樹
脂を金属板２の各通孔１に流入充填させて硬化させ、通
孔１内の樹脂４の部分においてスルーホール５を穿孔加
工するにあたって、プリプレグ３に含浸する樹脂として
Al2O3・3H2Oの粉粒体を配合したものを用い、スルーホ
ール５を穿孔加工したのちに酸もしくはアルカリでスル
ーホール５内を処理し、しかるのちにスルーホール５の
内周にスルーホールメッキ層６を形成するようにしたこ
とを特徴とするものである。 以下本発明を詳細に説明する。プリプレグ３はガラスペ
ーパー（ガラス不織布）やガラスクロス（ガラス織布）
などの基材にエポキシ樹脂などの熱硬化性樹脂を含浸し
て乾燥することによって調製されるものであるが、ガラ
スペーパーはガラスクロスに比べて組織が疎であって、
含浸される樹脂を浸透させて十分な量で保有することが
できるために、ガラスペーパーを基材としてプリプレグ
３を調製するようにするのがよい。また基材に含浸する
樹脂にはAl2O3・3H2O（ギブサイト型水酸化アルミニウ
ム）の粉粒体を配合したものを用いる。Al2O3・3H2Oの
配合量は20〜150PHRの範囲に設定するのが好ましい。配
合量が20PHR未満であるとAl2O3・3H2Oを配合した効果が
十分に得られないものであり、また150PHRを超えると後
述する積層成形の際の樹脂の流動性が低下して金属板２
の通孔１への充填性が悪くなり、ボイドが発生してスル
ーホール５と金属板２との間の絶縁性を確保することが
できなくなるおそれがある。またAl2O3・3H2O粉粒体の
粒径は特に限定されるものではないが、金属板１の通孔
２への樹脂の充填性や樹脂中のAl2O3・3H2O粉粒体の分
散性とメッキ密着性の向上効果とのバランスを考慮すれ
ば、0.1μ〜50μの範囲のものが好ましい。 しかしてこのようにAl2O3・3H2Oを配合した樹脂を含浸
して調製したプリプレグ３を用い、金属板２を基板とす
る電気積層板を製造するにあたっては、まず、銅板など
金属板２にスルーホール５を形成する箇所においてパン
チ加工やドリル加工などで通孔１を形成する。通孔１は
スルーホール５の直径よりも大きな直径で形成されるも
のである。そして第１図（ａ）のようにプリプレグ３を
介して金属板２を数枚重ね、さらに上下にプリプレグ３
を介して銅箔など金属箔９を重ねる。このときさらに各
金属板２の間には片面プリント配線板や両面プリント配
線板、多層プリント配線板などの回路を形成した回路板
10がプリプレグ３を介して重ねてある。そしてこれを加
熱加圧成形することによって、プリプレグ３に含浸した
樹脂を硬化させて各金属板２と回路板10とを交互に積層
接着させると共に最外層に金属箔９を積層接着させ、ま
たプリプレグ３に含浸した樹脂の一部を金属板２の各通
孔１内に流入させて第１図（ｂ）のようにこの樹脂４を
通孔１内に充填させる。このようにして金属板２の通孔
１に樹脂４を充填させた状態で各金属板２を積層すると
共に上下にそれぞれ金属箔９を積層したのちに、ドリル
加工やパンチ加工などで第１図（ｃ）のようにスルーホ
ール５を穿孔加工する。スルーホール５は第２図（ａ）
に示すように、通孔１に充填した樹脂４の部分において
通孔１の直径よりも小さい直径で形成されるものであ
り、従ってスルーホール５の内周と金属板２との間の電
気絶縁性は樹脂４によって確保されることになる。尚、
上記実施例では一部の金属板２にスルーホール５を貫通
させてアースなどをとることができるようにしてある
（第２図においては回路板の図示を省略してある）。 上記のようにスルーホール５を加工したのちに、酸もし
くはアルカリによってスルーホール５の内周を処理す
る。この酸やアルカリとしては、Al2O3・3H2Oを溶解す
ることができるものであればよく、例えば酸としては硫
酸や塩酸、硝酸などの水溶液を用いることができ、アル
カリとしては水酸化ナトリウムや水酸化カリウムなどの
水溶液を用いることができる。このようにして酸やアル
カリでスルーホール５の内周を処理すると、スルーホー
ル５の内周面に露出するAl2O3・3H2Oの粉粒体が溶解さ
れ、第２図（ｂ）のようにAl2O3・3H2Oの粉粒体が溶脱
された部分が凹となって、スルーホール５の内周面には
複雑な凹凸が形成されることになる。そしてこののち
に、スルーホール５の内周にスルーホールメッキを施し
てスルーホールメッキ層６を形成し、また金属箔９をエ
ッチング処理して回路を形成したりなどすることによっ
て、金属板２を基板とし回路板10に形成された多層の内
層回路と金属箔の加工で形成される外層回路がそれぞれ
設けられた電気積層板に仕上げるのである。このように
して得られる電気積層板において、スルーホール５の内
周に形成されるスルーホールメッキ層６は第２図（ｃ）
に示すように、一部がスルーホール５の内周の凹みに食
い込んだ状態で形成されることになり、アンカー効果に
よってスルーホール５の内周に対するスルーホールメッ
キ層６の密着性を高めることができるものである。MEANS TO SOLVE THE PROBLEM In order to solve the said subject, several metal plates 2 which provided the through-hole 1 were piled up via the prepreg 3, and it heat-pressed and hardened the resin with which the prepreg 3 was impregnated, and each metal plate. 2 is laminated and adhered, and the resin impregnated in the prepreg 3 is flown and filled into each through hole 1 of the metal plate 2 to be cured, and when the through hole 5 is punched in the resin 4 portion in the through hole 1, the prepreg 3 As resin to be impregnated into
Using a mixture of Al 2 O 3 · 3H 2 O powder and granules, the through hole 5 is perforated, then the inside of the through hole 5 is treated with an acid or alkali, and then the inner circumference of the through hole 5 is processed. The through-hole plating layer 6 is formed. The present invention will be described in detail below. Prepreg 3 is glass paper (glass non-woven fabric) or glass cloth (glass woven fabric)
It is prepared by impregnating a base material such as a thermosetting resin such as an epoxy resin and drying it, but the structure of glass paper is sparser than that of glass cloth,
Since the resin to be impregnated can be permeated and retained in a sufficient amount, it is preferable to prepare the prepreg 3 using glass paper as a base material. As the resin with which the base material is impregnated, a mixture of Al 2 O 3 · 3H 2 O (gibbsite type aluminum hydroxide) powder is used. The compounding amount of Al 2 O 3 .3H 2 O is preferably set in the range of 20 to 150 PHR. If the blending amount is less than 20 PHR, the effect of blending Al 2 O 3 .3H 2 O cannot be sufficiently obtained, and if it exceeds 150 PHR, the fluidity of the resin at the time of laminate molding to be described later decreases. Metal plate 2
There is a risk that the filling properties of the through holes 1 will deteriorate and voids will occur, making it impossible to ensure the insulation between the through holes 5 and the metal plate 2. Further, the particle size of the Al 2 O 3 · 3H 2 O powder is not particularly limited, but the filling properties of the resin into the through holes 2 of the metal plate 1 and the Al 2 O 3 · 3H 2 O in the resin are Considering the balance between the dispersibility of the powder and granules and the effect of improving the plating adhesion, it is preferably in the range of 0.1 μ to 50 μ. In order to manufacture an electric laminate using the prepreg 3 prepared by impregnating a resin containing Al 2 O 3 · 3H 2 O as described above, a metal plate such as a copper plate is first manufactured. The through hole 1 is formed by punching, drilling, or the like at the position where the through hole 5 is formed in the second hole 2. The through hole 1 is formed with a diameter larger than that of the through hole 5. Then, as shown in FIG. 1 (a), several metal plates 2 are piled up with the prepreg 3 interposed therebetween, and the prepreg 3 is further vertically arranged.
A metal foil 9 such as a copper foil is overlaid via. At this time, a circuit board on which circuits such as a single-sided printed wiring board, a double-sided printed wiring board, and a multilayer printed wiring board are formed between the metal plates 2.
10 are stacked via the prepreg 3. By heat-pressing this, the resin impregnated in the prepreg 3 is cured so that the metal plates 2 and the circuit board 10 are alternately laminated and adhered, and the metal foil 9 is laminated and adhered to the outermost layer. Part of the resin impregnated in 3 is made to flow into each through hole 1 of the metal plate 2, and the resin 4 is filled in the through hole 1 as shown in FIG. In this way, the metal plates 2 are laminated with the resin 4 filled in the through holes 1 of the metal plate 2 and the metal foils 9 are laminated on the upper and lower sides, respectively, and then drilled or punched. The through hole 5 is punched as shown in FIG. Through hole 5 is shown in FIG. 2 (a).
As shown in FIG. 2, the resin 4 filled in the through hole 1 is formed with a diameter smaller than the diameter of the through hole 1, and therefore the electrical insulation between the inner periphery of the through hole 5 and the metal plate 2 is achieved. The property is ensured by the resin 4. still,
In the above-described embodiment, the through holes 5 are made to penetrate through a part of the metal plate 2 so as to be able to be grounded (the circuit board is not shown in FIG. 2). After processing the through hole 5 as described above, the inner circumference of the through hole 5 is treated with acid or alkali. The acid or alkali may be any as long as it can dissolve Al 2 O 3 .3H 2 O. For example, as the acid, an aqueous solution of sulfuric acid, hydrochloric acid, nitric acid or the like can be used, and as the alkali, hydroxide can be used. An aqueous solution such as sodium or potassium hydroxide can be used. When the inner periphery of the through hole 5 is treated with an acid or alkali in this manner, the Al 2 O 3 .3H 2 O powder particles exposed on the inner peripheral surface of the through hole 5 are dissolved, and FIG. As described above, the portion from which the Al 2 O 3 .3H 2 O powder particles have been leached becomes concave, and complicated irregularities are formed on the inner peripheral surface of the through hole 5. Then, after this, through hole plating is applied to the inner periphery of the through hole 5 to form the through hole plating layer 6, and the metal foil 9 is etched to form a circuit. The electric laminate is finished by providing a multilayer inner layer circuit formed on the circuit board 10 as a substrate and an outer layer circuit formed by processing a metal foil. In the thus obtained electric laminate, the through hole plating layer 6 formed on the inner periphery of the through hole 5 is shown in FIG. 2 (c).
As shown in FIG. 5, a part of the through hole 5 is formed so as to penetrate into the recess of the inner periphery of the through hole 5, and the adhesion of the through hole plating layer 6 to the inner periphery of the through hole 5 can be enhanced by the anchor effect. It is possible.
以下本発明を実施例によって具体的に説明する。 実施例 末端官能型イミド樹脂（住友化学社製TMS-20）200重量
部、液状エポキシ樹脂149重量部、ブロム化ノボラック
樹脂136重量部、ルイス酸化合物82重量部、不飽和ビス
マレイミド20重量部を混合し、90℃で50分間加熱したの
ちに常温にまで冷却して30分間撹拌下反応させることに
よってエポキシ変性ポリイミド樹脂ワニスを調製した。
そしてこのエポキシ変性ポリイミド樹脂ワニスに充填剤
として中心粒径（粒径分布の中央値）が10μのAl2O3・3
H2O粉粒体を50PHRの配合量で配合して混合した。 次にこのエポキシ樹脂変性ポリイミド樹脂ワニスに基材
としてガラスペーパー（日本バイリーン製EP-4075:75g/
m2）を浸漬し、次いで乾燥することによって、780g/m2
のプリプレグを作成した。ここで乾燥の条件はプリプレ
グ中の樹脂の熔融粘度が300〜700ポイズに、グリニス
（樹脂流れ性）が20〜25％なるように設定した。 一方、金属板として500mm×400mm×0.5mmの銅板を用
い、直径が1.5mmの通孔を1.8mmピッチで縦100×横60の
個数設けた。そしてこの金属板を３枚、両面銅張ポリイ
ミド樹脂積層板の銅箔をエッチング加工して回路を設け
ることによって形成した両面プリント配線板を回路板と
して２枚用い、これらを第１図（ａ）のように上記プリ
プレグを介して交互に重ねると共に上下にプリプレグを
介して銅箔を重ね、20kg/cm2の加圧条件を維持しつつ14
0℃で20分間、170℃で90分間加熱すると共に20分間を要
して冷却して積層成形をおこなうことによって、金属板
と回路板とを交互に積層し表面に銅箔を張った多層積層
板を得た。 こののちに金属板の通孔の部分において多層積層板に直
径が0.9mmのスルーホールをドリル加工し、次いで多層
積層板を80℃に調整した10％のNaOH水溶液に15分間浸漬
してスルーホールの内周にNaOHを作用させた。そしてさ
らに銅メッキをおこなってスルーホールの内周にスルー
ホールメッキを施した。 比較例１ 実施例と同様にして多層積層板を成形してスルーホール
を加工したのち、NaOH水溶液で処理をおこなうことなく
スルーホールメッキをおこなうようにした他は、実施例
と同様にした。 比較例２ 充填剤として中心粒径（粒径分布の中央値）が10μのAl
2O3粉粒体を用いてエポキシ変性ポリイミド樹脂ワニス
に配合するようにした他は、実施例と同様にした。 従来例 エポキシ変性ポリイミド樹脂ワニスに充填剤を配合しな
いで用いてプリプレグを作成するようにした他は、実施
例と同様にした。 上記実施例、比較例１〜２及び従来例で得た多層積層板
についてスルーホールメッキの密着性を試験した。試験
は260℃の温度で60秒間熱処理したのちのスルーホール
でのメッキ剥がれの有無を観察することによっておこな
った。結果を第１表に示す。 第１表の結果にみられるように、Al2O3・3H2O粉粒体を
配合しかつNaOHで処理することによってはじめて、メッ
キ密着性を高めてメッキの剥がれを防ぐことが可能にな
ることが確認される。The present invention will be specifically described below with reference to examples. Example Terminal functional imide resin (TMS-20 manufactured by Sumitomo Chemical Co., Ltd.) 200 parts by weight, liquid epoxy resin 149 parts by weight, brominated novolac resin 136 parts by weight, Lewis acid compound 82 parts by weight, unsaturated bismaleimide 20 parts by weight An epoxy-modified polyimide resin varnish was prepared by mixing, heating at 90 ° C. for 50 minutes, cooling to room temperature, and reacting for 30 minutes with stirring.
This epoxy-modified polyimide resin varnish is used as a filler for Al 2 O 3 · 3 with a central particle size (median particle size distribution) of 10μ.
The H 2 O powder and granules were blended at a blending amount of 50 PHR and mixed. Next, this epoxy resin-modified polyimide resin varnish was used as a substrate for glass paper (Japan Vilene EP-4075: 75 g /
780 g / m 2 by dipping m 2 ) and then drying
I made a prepreg. Here, the drying conditions were set so that the melt viscosity of the resin in the prepreg was 300 to 700 poise and the Glinis (resin flowability) was 20 to 25%. On the other hand, a copper plate of 500 mm × 400 mm × 0.5 mm was used as a metal plate, and through holes having a diameter of 1.5 mm were provided in a number of 100 × 60 in width at a 1.8 mm pitch. Then, three of these metal plates and two double-sided printed wiring boards formed by etching the copper foil of the double-sided copper-clad polyimide resin laminated plate to form a circuit are used as circuit boards, and these are shown in FIG. 1 (a). As shown above, the copper foils are alternately laminated through the prepreg and the copper foils are laminated on the upper and lower prepregs while maintaining the pressure condition of 20 kg / cm 2.
Multilayer lamination in which metal plates and circuit boards are alternately laminated and copper foil is stretched on the surface by heating at 0 ° C for 20 minutes and 170 ° C for 90 minutes and cooling for 20 minutes for lamination molding. I got a plate. After that, a through hole with a diameter of 0.9 mm was drilled in the through hole of the metal plate in the multilayer laminated plate, and then the multilayer laminated plate was immersed in a 10% NaOH aqueous solution adjusted to 80 ° C for 15 minutes to form the through hole. NaOH was applied to the inner circumference. Then, copper plating was further performed, and through holes were plated on the inner circumference of the through holes. Comparative Example 1 Similar to the example, except that after forming a multilayer laminated plate and processing the through holes in the same manner as in the example, the through hole plating was performed without treatment with a NaOH aqueous solution. Comparative Example 2 Al having a central particle size (median of particle size distribution) of 10μ as a filler
The same procedure as in Example was carried out except that 2 O 3 powder and granules were used and blended in the epoxy-modified polyimide resin varnish. Conventional Example The same procedure as in Example was carried out except that a prepreg was prepared by using an epoxy-modified polyimide resin varnish without compounding a filler. The multilayer laminates obtained in the above Examples, Comparative Examples 1 and 2 and the conventional example were tested for adhesion by through-hole plating. The test was performed by observing the presence or absence of peeling of the plating in the through hole after heat treatment at a temperature of 260 ° C. for 60 seconds. The results are shown in Table 1. As can be seen from the results in Table 1, it is only by adding Al 2 O 3 · 3H 2 O powder and treating with NaOH that the plating adhesion can be improved and the peeling of the plating can be prevented. Is confirmed.
上述のように本発明にあっては、プリプレグに含浸する
樹脂としてAl2O3・3H2O粉粒体を配合したものを用い、
スルーホールを穿孔加工したのちに酸もしくはアルカリ
でスルーホール内を処理し、しかるのちにスルーホール
の内周にスルーホールメッキ層を形成するようにしたの
で、酸やアルカリでスルーホールの内周を処理すると、
スルーホールの内周面に露出するAl2O3・3H2O粉粒体が
溶解されてスルーホールの内周面には深い凹凸が形成さ
れることになり、スルーホールの内周に形成されるスル
ーホールメッキ層は一部がスルーホールの内周の凹みに
食い込んで、アンカー効果によってスルーホールの内周
面へのスルーホールメッキ層の密着性を高めることがで
きるものである。As described above, in the present invention, using a mixture of Al 2 O 3 .3H 2 O powder as a resin to impregnate the prepreg,
After the through hole is punched, the inside of the through hole is treated with acid or alkali, and then the through hole plating layer is formed on the inner circumference of the through hole. When processed,
Al 2 O 3 · 3H 2 O powder that is exposed on the inner surface of the through hole is dissolved, and deep irregularities are formed on the inner surface of the through hole. The through-hole plating layer partially penetrates into the recess of the inner circumference of the through-hole, and the adhesion of the through-hole plating layer to the inner peripheral surface of the through-hole can be enhanced by the anchor effect.
第１図（ａ）（ｂ）（ｃ）は電気積層板の製造の各工程
を示す断面図、第２図（ａ）（ｂ）（ｃ）は同上の製造
の他の各工程を示す一部の拡大断面図、第３図は従来例
の一部の拡大断面図である。 １は通孔、２は金属板、３はプリプレグ、４は通孔内の
樹脂、５はスルーホール、６はスルーホールメッキ層で
ある。FIGS. 1 (a), (b) and (c) are cross-sectional views showing respective steps of manufacturing the electric laminate, and FIGS. 2 (a), (b) and (c) are other steps showing the same manufacturing step. FIG. 3 is an enlarged cross-sectional view of a part, and FIG. 3 is a partial enlarged cross-sectional view of a conventional example. 1 is a through hole, 2 is a metal plate, 3 is a prepreg, 4 is resin in the through hole, 5 is a through hole, and 6 is a through hole plating layer.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０５Ｋ 3/46 Ｇ 6921−4Ｅ ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Office reference number FI technical display location H05K 3/46 G 6921-4E
Claims (1)
を介して重ね、加熱加圧成形してプリプレグに含浸した
樹脂を硬化させて各金属板を積層接着すると共にプリプ
レグに含浸した樹脂を金属板の各通孔に流入充填させて
硬化させ、通孔内の樹脂の部分においてスルーホールを
穿孔加工するにあたって、プリプレグに含浸する樹脂と
してAl2O3・3H2Oの粉粒体を配合したものを用い、スル
ーホールを穿孔加工したのちに酸もしくはアルカリでス
ルーホール内を処理し、しかるのちにスルーホールの内
周にスルーホールメッキ層を形成することを特徴とする
電気積層板の製造方法。1. A resin in which a plurality of metal plates having through holes are stacked via a prepreg, heat-pressed to cure the resin impregnated in the prepreg, and the metal plates are laminated and adhered and the prepreg is impregnated. Is poured into each through hole of the metal plate and cured, and when the through hole is drilled in the resin portion in the through hole, Al 2 O 3 · 3H 2 O powder particles are impregnated into the prepreg as the resin. Using a blended product, after punching the through hole, treating the inside of the through hole with acid or alkali, and then forming a through hole plating layer on the inner periphery of the through hole Production method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6151788A JPH0682930B2 (en) | 1988-03-15 | 1988-03-15 | Method for manufacturing electric laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6151788A JPH0682930B2 (en) | 1988-03-15 | 1988-03-15 | Method for manufacturing electric laminate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01235293A JPH01235293A (en) | 1989-09-20 |
| JPH0682930B2 true JPH0682930B2 (en) | 1994-10-19 |
Family
ID=13173360
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6151788A Expired - Fee Related JPH0682930B2 (en) | 1988-03-15 | 1988-03-15 | Method for manufacturing electric laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0682930B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10603844B2 (en) * | 2017-10-18 | 2020-03-31 | The Boeing Company | Apparatus and methods for injecting filler material into a hole in a composite layer |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100962371B1 (en) * | 2008-07-02 | 2010-06-10 | 삼성전기주식회사 | Printed circuit board and manufacturing method thereof |
-
1988
- 1988-03-15 JP JP6151788A patent/JPH0682930B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10603844B2 (en) * | 2017-10-18 | 2020-03-31 | The Boeing Company | Apparatus and methods for injecting filler material into a hole in a composite layer |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01235293A (en) | 1989-09-20 |
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