JPH0684463B2 - Laminated phenol resin varnish - Google Patents
Laminated phenol resin varnishInfo
- Publication number
- JPH0684463B2 JPH0684463B2 JP60291931A JP29193185A JPH0684463B2 JP H0684463 B2 JPH0684463 B2 JP H0684463B2 JP 60291931 A JP60291931 A JP 60291931A JP 29193185 A JP29193185 A JP 29193185A JP H0684463 B2 JPH0684463 B2 JP H0684463B2
- Authority
- JP
- Japan
- Prior art keywords
- phenol resin
- varnish
- water
- resin varnish
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000005011 phenolic resin Substances 0.000 title claims description 37
- 239000002966 varnish Substances 0.000 title claims description 26
- 150000002989 phenols Chemical class 0.000 title description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 22
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 17
- 239000002904 solvent Substances 0.000 claims description 13
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 11
- 229920001568 phenolic resin Polymers 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 229920003987 resole Polymers 0.000 claims description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 18
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 10
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 9
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 8
- 238000005470 impregnation Methods 0.000 description 8
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 description 6
- 239000000123 paper Substances 0.000 description 5
- 239000002383 tung oil Substances 0.000 description 5
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 4
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 4
- 238000009835 boiling Methods 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- BTANRVKWQNVYAZ-UHFFFAOYSA-N butan-2-ol Chemical compound CCC(C)O BTANRVKWQNVYAZ-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000002655 kraft paper Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000012046 mixed solvent Substances 0.000 description 3
- 238000004080 punching Methods 0.000 description 3
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 235000019492 Cashew oil Nutrition 0.000 description 2
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 2
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000005062 Polybutadiene Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 229940059459 cashew oil Drugs 0.000 description 2
- 239000010467 cashew oil Substances 0.000 description 2
- 235000019438 castor oil Nutrition 0.000 description 2
- 239000004359 castor oil Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 230000018044 dehydration Effects 0.000 description 2
- 238000006297 dehydration reaction Methods 0.000 description 2
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 2
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 description 2
- 239000000944 linseed oil Substances 0.000 description 2
- 235000021388 linseed oil Nutrition 0.000 description 2
- 239000003607 modifier Substances 0.000 description 2
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 2
- 229920002857 polybutadiene Polymers 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- -1 that is Substances 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 240000002834 Paulownia tomentosa Species 0.000 description 1
- 235000010678 Paulownia tomentosa Nutrition 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- VIJMMQUAJQEELS-UHFFFAOYSA-N n,n-bis(ethenyl)ethenamine Chemical compound C=CN(C=C)C=C VIJMMQUAJQEELS-UHFFFAOYSA-N 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 239000011134 resol-type phenolic resin Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Paints Or Removers (AREA)
Description
【発明の詳細な説明】 ［産業上の利用分野］ 本発明は、クラフト紙、リンター紙、これらの混沙紙等
のセルローズ系積層板用基材への含浸性のすぐれたフェ
ノール樹脂ワニスに関するものである。TECHNICAL FIELD The present invention relates to a phenol resin varnish having excellent impregnability into a base material for a cellulosic laminate such as kraft paper, linter paper, and mixed paper thereof. Is.
［従来技術］ 一般に積層板用フェノール樹脂は変性剤、即ちカシュー
油またはそれらの精製品、桐油、アマニ油、ヒマシ油、
ノニルフェノール、アニリン、ポリブタジエン等とフェ
ノール、クレゾール等のフェノール類をパラトルエンス
ホン酸等の酸性触媒下で反応させ、中和後ホルムアルデ
ヒド及び塩基性触媒を添加してレゾール化反応を行い、
変性フェノール樹脂を得た後減圧下にて脱水濃縮し、メ
タノール、エタノール、トルエン等で希釈し含浸用ワニ
スとしている。[Prior Art] Generally, a phenolic resin for laminated boards is a modifier, that is, cashew oil or a refined product thereof, tung oil, linseed oil, castor oil,
Nonylphenol, aniline, polybutadiene, etc. and phenol, phenols such as cresol are reacted under an acidic catalyst such as paratoluene sulfonic acid, and after neutralization, formaldehyde and a basic catalyst are added to perform a resolization reaction,
After obtaining the modified phenolic resin, it is dehydrated and concentrated under reduced pressure and diluted with methanol, ethanol, toluene or the like to obtain a varnish for impregnation.
次に、このワニスをクラフト紙、リンター紙、これらの
混沙紙等のセルローズ系積層板基材に含浸し乾燥して積
層板用プリプレグを得ている。Next, the varnish is impregnated into a cellulosic laminated plate base material such as kraft paper, linter paper, or mixed paper thereof, and dried to obtain a prepreg for laminated plate.
ところが、従来のワニスは積層板用基材への樹脂分の含
浸性が悪く、得られた積層板は煮沸後の絶縁抵抗、誘電
率、誘電正接等の電気性能や給水率が低下し、実用に供
し得ないものであった。However, the conventional varnish has a poor impregnation property of the resin component into the laminate base material, and the obtained laminate has poor electrical performance such as insulation resistance after boiling, dielectric constant, dielectric loss tangent, and water supply rate, and is practically used. It could not be used for.
この対策として、低分子量の水溶性フェノール樹脂やメ
ラミン樹脂等による１次含浸処理の後、前記の如きフェ
ノール樹脂ワニスによる２次含浸処理を行い、積層板用
プリプレグとする方法が一般的に行われているが、１次
含浸する樹脂が硬く積層板の打抜性に問題があり、また
２回含浸処理するので生産性にも問題がある。As a countermeasure for this, a method of making a prepreg for a laminated plate is generally carried out by performing a primary impregnation treatment with a low molecular weight water-soluble phenolic resin or a melamine resin, and then a secondary impregnation treatment with a phenolic resin varnish as described above. However, the resin to be impregnated first is hard and there is a problem in the punchability of the laminated plate, and since it is impregnated twice, there is also a problem in productivity.
従来のワニスを使用し、１回の含浸のみで含浸処理時間
を長くすることが試みられたが、含浸速度が大幅に低下
し、生産性を低下させる欠点がある。Although it has been attempted to use a conventional varnish to lengthen the impregnation treatment time by only one impregnation, there is a drawback that the impregnation rate is significantly reduced and the productivity is reduced.
［発明の目的］ 本発明は、１回の含浸処理のみで基材へ十分に含浸する
含浸性のよいフェノール樹脂ワニスを提供することを目
的とする。[Object of the Invention] An object of the present invention is to provide a phenol resin varnish having a good impregnating property, which can sufficiently impregnate a substrate with only one impregnation treatment.
［発明の構成］ 本発明は、積層板用フェノール樹脂ワニスにおいて、フ
ェノール樹脂がレゾール型フェノール樹脂であり、ワニ
ス中の樹脂分が45〜75重量％、溶剤が25〜55重量％であ
り、かつ溶剤は、C1〜C3のアルコール 20〜80重量％、
C4〜C6のアルコール 10〜70重量％、水10〜40重量％か
らなることを特徴とする積層板用フェノール樹脂ワニス
を要旨とするものである。[Structure of the Invention] The present invention relates to a phenol resin varnish for a laminate, wherein the phenol resin is a resol type phenol resin, the resin content in the varnish is 45 to 75% by weight, and the solvent is 25 to 55% by weight, and solvents are alcohols 20 to 80 wt% of C 1 -C 3,
A phenol resin varnish for laminated boards, which is characterized by comprising 10 to 70% by weight of C 4 to C 6 alcohol and 10 to 40% by weight of water.
ここで、レゾール型フェノール樹脂は、変性剤、即ちカ
シュー油またはその精製品、桐油、アマニ油、ヒマシ
油、ノニルフェノール、アニリン、ポリブタジエン等と
フェノール、クレゾール等のフェノール類をパラトルエ
ンスホン酸等の酸性触媒下で反応させ、中和後ホルムア
ルデヒド及び塩基性触媒をレゾール化反応を行い、変性
フェノール樹脂を得た後減圧下にて脱水濃縮して得られ
るものである。本発明ではフェノール樹脂として、桐油
変性レゾール型フェノール樹脂を使用するのが好まし
い。Here, the resol type phenol resin is a modifier, that is, cashew oil or a refined product thereof, tung oil, linseed oil, castor oil, nonylphenol, aniline, polybutadiene and the like, and phenols such as cresol and acidic compounds such as paratoluene sulfonic acid. After being reacted under a catalyst and neutralized, formaldehyde and a basic catalyst are subjected to a resolization reaction to obtain a modified phenol resin, which is then dehydrated and concentrated under reduced pressure. In the present invention, it is preferable to use a tung oil-modified resol type phenol resin as the phenol resin.
このフェノール樹脂を前記溶剤にて希釈する。溶剤のう
ち、C1〜C3のアルコール（以下、低級アルコールとい
う）とは炭素数１〜３の樹脂族のモノアルコールをい
い、メタノール、エタノール、１−プロパノール、２−
プロパノールであるが、特にメタノール、１−プロパノ
ールが好ましい。C4〜C6のアルコール（以下、中級アル
コールという）とは炭素数４〜６の脂肪族のモノアルコ
ールをいい、１−ブタノール、２−ブタノール、イソブ
タノール、tert−ブタノール、１−ペンタノール、１−
ヘキサノール等であり、１−ブタノール、tert−ブタノ
ール、１−ヘキサノールが好ましい。The phenol resin is diluted with the solvent. Among the solvents, C 1 to C 3 alcohol (hereinafter referred to as lower alcohol) means a monoalcohol of a resin group having 1 to 3 carbon atoms, such as methanol, ethanol, 1-propanol, 2-
Among propanols, methanol and 1-propanol are particularly preferable. The C 4 to C 6 alcohol (hereinafter referred to as intermediate alcohol) means an aliphatic monoalcohol having 4 to 6 carbon atoms, 1-butanol, 2-butanol, isobutanol, tert-butanol, 1-pentanol, 1-
Hexanol and the like, with 1-butanol, tert-butanol and 1-hexanol being preferred.
本発明の主たる特徴は、これらのアルコール類とともに
水を使用することである。ワニス中の上記溶剤とフェノ
ール樹脂樹脂との割合は、溶剤25〜55重量％（以下、％
という）に対してフェノール樹脂45〜75％である。The main feature of the present invention is the use of water with these alcohols. The ratio of the solvent and the phenolic resin in the varnish is 25 to 55% by weight of the solvent (hereinafter,%
That is) 45 to 75% phenol resin.
溶剤中のアルコールと水の割合は、低級アルコール20〜
80％、中空アルコール10〜70％、水10〜40％であるが、
低級アルコール30〜60％、中空アルコール20〜60％、水
10〜30％が好ましい。The proportion of alcohol and water in the solvent is lower alcohol 20-
80%, hollow alcohol 10-70%, water 10-40%,
Lower alcohol 30-60%, hollow alcohol 20-60%, water
10 to 30% is preferable.
桐油変性レゾール型フェノール樹脂の場合は、低級アル
コール40〜60％、中級アルコール30〜50％、水10〜30％
がより好ましい。In case of tung oil modified resol type phenolic resin, lower alcohol 40-60%, intermediate alcohol 30-50%, water 10-30%
Is more preferable.
即ち、本発明は溶剤として低級アルコールの他に中級ア
ルコールを加えることにより、水の割合をより多くする
ことが可能となり、これによりセルロース系積層板用基
材へのレゾール型フェノール樹脂の含浸性が向上する。That is, in the present invention, it is possible to increase the proportion of water by adding a medium alcohol in addition to the lower alcohol as a solvent, whereby the impregnability of the resol-type phenol resin into the cellulosic laminate substrate is improved. improves.
なお、水に関して、最後ワニス中に存在する水の一部又
は全部を、フェノール樹脂製造後脱水する際樹脂中に残
存させる場合も本発明に含まれるものである。Regarding the water, the present invention also includes the case where a part or all of the water present in the final varnish is left in the resin during dehydration after the production of the phenol resin.
また、かかる溶剤に他の溶剤、たとえばアセトン、トル
エン等を10％以下加える場合も本発明に含まれる。The present invention also includes the case where another solvent such as acetone or toluene is added to the solvent in an amount of 10% or less.
［発明の効果］ 発明のフェノール樹脂ワニスは積層板用基材への含浸性
がすぐれているので、このワニスを用いて得られた積層
板の特性、特に煮沸後の絶縁抵抗等の電気特性、打抜性
が給水率すぐれたものとなる。[Effects of the Invention] The phenol resin varnish of the present invention has excellent impregnating ability to the base material for laminates, so the characteristics of the laminate obtained using this varnish, particularly the electrical characteristics such as insulation resistance after boiling, The punchability is excellent at the water supply rate.
更には、従来のワニスのように２回含浸の必要がなくな
る。Furthermore, it is not necessary to impregnate twice, unlike the conventional varnish.
［実施例］ フェノール樹脂ワニスの製造例 桐油40部（重量部、以下同じ）、フェノール60部、パラ
トルエンスルホン酸0.5部を反応釜に仕込み、100℃にて
２時間反応させ、アンモニア0.6部にて中和した。[Example] Production Example of Phenol Resin Varnish 40 parts of tung oil (parts by weight, the same applies hereinafter), 60 parts of phenol and 0.5 part of paratoluenesulfonic acid were charged in a reaction kettle and reacted at 100 ° C for 2 hours to give 0.6 part of ammonia. Neutralized.
次いで、37％ホルマリン40部、トリエチレンアミン６部
を添加し、100℃にて３時間反応させた。その後500mmHg
にて減圧脱水を行い、桐油変性フェノール樹脂（以下、
フェノール樹脂Ａという）を得た。Then, 40 parts of 37% formalin and 6 parts of triethyleneamine were added and reacted at 100 ° C. for 3 hours. Then 500 mmHg
Dehydration under reduced pressure with a tung oil modified phenolic resin (hereinafter,
Phenolic resin A) was obtained.
実施例１ フェノール樹脂A100部をメタノール:1−ブタノール：水
＝4:4:2の混合溶剤100部にて希釈してフェノル樹脂ワニ
スを得た。Example 1 100 parts of phenol resin A was diluted with 100 parts of a mixed solvent of methanol: 1-butanol: water = 4: 4: 2 to obtain a phenol resin varnish.
実施例２ フェノール樹脂A100部を１−プロパノール:1−ヘキサノ
ール：水＝8:1:1の混合溶剤100部にて希釈してフェノー
ル樹脂ワニスを得た。Example 2 100 parts of phenol resin A was diluted with 100 parts of a mixed solvent of 1-propanol: 1-hexanol: water = 8: 1: 1 to obtain a phenol resin varnish.
比較例１ フェノール樹脂A100部をメタノール100部にて希釈して
フェノール樹脂ワニスを得た。Comparative Example 1 100 parts of phenol resin A was diluted with 100 parts of methanol to obtain a phenol resin varnish.
比較例２ フェノール樹脂A100部をメタノール：水＝8:2の混合溶
剤100部にて希釈してフェノール樹脂ワニスを得た。Comparative Example 2 100 parts of phenol resin A was diluted with 100 parts of a mixed solvent of methanol: water = 8: 2 to obtain a phenol resin varnish.
各例で得られたフェノール樹脂樹脂ワニスの樹脂分及び
溶剤成分比は第１表とおりであった。The resin content and solvent component ratio of the phenol resin varnish obtained in each example are shown in Table 1.
各フェノール樹脂ワニスをクラフト紙に含浸乾燥した。
このフェノール樹脂含浸紙を８枚重ね合わせて170℃、1
40Kg/cm2にて100分間加熱加圧してフェノール樹脂積層
を得た。 Kraft paper was impregnated with each phenol resin varnish and dried.
Eight sheets of this phenol resin-impregnated paper are piled up at 170 ℃, 1
A phenol resin laminate was obtained by heating and pressurizing at 40 Kg / cm 2 for 100 minutes.
得られた積層板について、第２表に示す特性を測定し
た。The properties shown in Table 2 were measured for the obtained laminate.
各特性の測定方法は次のとおりである。 The measuring method of each characteristic is as follows.
煮沸後の絶縁抵抗及び誘電率、吸水率:JIS K 6911によ
る。Insulation resistance, dielectric constant and water absorption after boiling: according to JIS K 6911.
打抜加工性：パンチング金型で、60℃にて200個の穴を
同時にパンチングし、穴周辺の層間剥離数をみる。Punching workability: Using a punching die, punch 200 holes at 60 ° C at the same time and check the number of delaminations around the holes.
以上のように、実施例の積層板は比較例のものに比べ、
煮沸後の絶縁抵抗、誘電率、打抜加工性及び吸水率にお
いてすぐれたものであることがわかる。As described above, the laminated plate of the example is
It can be seen that the insulation resistance, dielectric constant, punching workability and water absorption after boiling are excellent.
Claims (1)
フェノール樹脂がレゾール型フェノール樹脂であり、ワ
ニス中の樹脂分が45〜75重量％、溶剤が25〜55重量％で
あり、 溶剤は、C1〜C3のアルコール 20〜80重量％ C4〜C6のアルコール 10〜70重量％ 水 10〜40重量％ からなることを特徴とする積層板用フェノール樹脂ワニ
ス。1. A phenolic resin varnish for a laminate, comprising:
Phenolic resin is a resole phenolic resin, the resin content in the varnish is 45 to 75 wt%, the solvent is 25 to 55 wt%, the solvent is 20 to 80 wt% alcohol C 1 ~C 3 C 4 ~ laminates for phenolic resin varnish, characterized in that it consists of 10 to 70 wt% water 10 to 40 wt% alcohol C 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60291931A JPH0684463B2 (en) | 1985-12-26 | 1985-12-26 | Laminated phenol resin varnish |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60291931A JPH0684463B2 (en) | 1985-12-26 | 1985-12-26 | Laminated phenol resin varnish |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62151471A JPS62151471A (en) | 1987-07-06 |
| JPH0684463B2 true JPH0684463B2 (en) | 1994-10-26 |
Family
ID=17775319
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60291931A Expired - Fee Related JPH0684463B2 (en) | 1985-12-26 | 1985-12-26 | Laminated phenol resin varnish |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0684463B2 (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54107953A (en) * | 1978-02-13 | 1979-08-24 | Matsushita Electric Works Ltd | Molding phenolic resin material |
| JPS6096643A (en) * | 1983-10-31 | 1985-05-30 | Matsushita Electric Works Ltd | Improvement of storage stability of phenolic resin |
-
1985
- 1985-12-26 JP JP60291931A patent/JPH0684463B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62151471A (en) | 1987-07-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |