JPH0686030B2 - Positioning jig for lead pin for pin grid array package and manufacturing method thereof - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to a package when a lead pin is brazed to a pin grid array package suitable for increasing the number of pins such as IC and LSI chips. The present invention relates to a positioning jig having a plurality of support holes for supporting a plurality of lead pins for positioning and a manufacturing method thereof.

<Prior Art> In recent years, as the density of ICs, LSI chips, and the like has increased, there are some that have a large number of lead pins provided in the package. As such a multi-pin package, there is a pin grid array package in which a plurality of lead pins are regularly arranged in a grid pattern.

By the way, when implanting the lead pins in the pin grid array package, a jig having a plurality of support holes regularly provided in a grid pattern is used to correspond the lead pins to predetermined mounting positions according to the design. By inserting the lead pins into the respective support holes, the lead pins are positioned and brazed to the package. In the above jig, a plurality of support holes are regularly formed in a grid pattern with a predetermined pitch. Conventionally, however, a metal plate is drilled one by one using a drill. 1000 for each jig
Since a large number of holes are drilled up to 1,500, it takes a long time to process, and it is necessary to replace the drill regularly to prevent the occurrence of poor hole diameter uniformity due to drill wear. There was a problem with that.

<Problems to be Solved by the Invention> In view of the problems of the conventional technology as described above, a main object of the present invention is to provide a lead pin positioning jig for a pin grid array package that can reduce processing cost and a manufacturing method thereof. To provide.

[Constitution of the Invention] <Means for Solving the Problems> According to the present invention, such an object is to position the plurality of lead pins individually when implanting the plurality of lead pins in the pin grid array package. A jig having a plurality of supporting holes for supporting, wherein the jig is formed by laminating a plurality of thin plates having a plurality of holes corresponding to the plurality of supporting holes. A method for positioning a lead pin for a package or a process of forming a plurality of holes in a thin plate, a process of laminating a plurality of the thin plates, and a plurality of the laminated thin plates are joined together by diffusion bonding to be integrated. Thus, when the plurality of lead pins are implanted in the pin grid array package, the holes are formed to support the plurality of lead pins for individually positioning. It is achieved by providing a method for manufacturing a positioning jig pin grid array package lead pin and having a step of forming a jig having a plurality of support holes are.

<Operation> In this way, when holes are formed in a thin plate, a large number of holes can be formed at once by etching, for example. By laminating a plurality of perforated thin plates and performing diffusion bonding. A jig having a predetermined thickness and having a plurality of lead pin supporting holes can be suitably formed by being joined to each other.
Processing time can be shortened as compared with the case of drilling holes by hole.

<Embodiment> Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a plan view showing a jig 1 for a pin grid array package based on the present invention, and FIG. 2 is a side sectional view of a main part thereof. As shown in FIGS. 1 and 2, the jig 1 has a plurality of, for example, 1000 to 1500 penetrating in the thickness direction.
The support holes 2 of a certain number are regularly arranged in a lattice pattern within a range shown by a chain double-dashed line in the figure, for example.

The jig 1 is formed by stacking, for example, about 15 SUS thin plates 3 having a thickness t (for example, 0.5 to 1 mm), and the thin plates 3 are joined to each other by, for example, diffusion bonding. As shown in FIG. 2, the support hole 2 has a small diameter of the same diameter (for example, diameter 0.36 mm) from one end surface on the upper side of the jig 1 in the drawing to a predetermined depth d (for example, 1.5 mm). Although the portion 2a is formed, from the lower end of the small diameter portion 2a to the other end surface on the lower side of the jig 1 in the figure, for example, a medium diameter portion 2b of 0.5 mm diameter and 1.6 mm
The large diameter portions 2c of the diameter are formed so as to be alternately arranged. Positioning pins 4 are press-fitted into the positioning holes 8 at four corners of the jig 1 so as to penetrate through the positioning holes 8.

As shown in FIG. 3, each lead pin 6 implanted in the pin grid array package 5 is inserted into the support hole 2,
Moreover, by positioning the pin grid array package 5 with the positioning pins 4, the lead pins 6 can be appropriately positioned using the jig 1. It should be noted that the jig 1 is not limited to the positioning pin 4 in positioning, and for example, four corners may be pressed against the positioning frame material. Then, the pin grid array package 5 is opposed to the jig 1, and each lead pin 6 is inserted into each mounting hole (not shown) of the pin grid array package 5 by, for example, a pressing plate (not shown), and the lead pin 6 is pre-mounted. Melt the brazing filler metal 7 that has been applied to each lead pin 6
Are brazed and planted in predetermined positions on the pin grid array package 5.

Next, a process of manufacturing the jig 1 will be described below with reference to FIG. First, in step ST1, a small-diameter portion 2a or a medium-diameter portion for forming the support hole 2 by etching the thin plate 3 is formed.
Drilling is performed corresponding to 2b and the large diameter portion 2c. Since the holes are formed by etching in this manner, a large number of holes can be formed at one time, and burrs unlike the case of using a drill do not occur.

In the next step ST2, a predetermined number of thin plates 3 are stacked, and as described above, the thin plates 3 corresponding to each are stacked so as to appropriately combine the small diameter part 2a with the medium diameter part 2b or the large diameter part 2c. This makes it possible to easily form the jig 1 having various holes with different diameters. Therefore, it is possible to easily form the jig 1 having the through hole having the same diameter and the support hole 2 having a diameter difference on the way.

Then, as shown in FIG. 5, in step ST3,
It is press-fitted into the positioning pin 4 and the positioning hole 8 in a penetrating state, and in step ST4, the bonding jigs 9 are pressed against the upper and lower end surfaces of the laminated thin plates 3, respectively, and the thin plates 3 are sandwiched by both bonding jigs 9. It is fixed by a fixing jig (not shown). In step ST5, the thin plates 3 fixed by the joining jigs 9 as described above are joined to each other by a known diffusion bonding method in which a predetermined pressure contact force is applied in a vacuum or an inert gas at a predetermined temperature. To join. In this way
The plurality of thin plates 3 are easily integrated to complete the jig 1 having a large number of supporting holes 2.

As described above, since the support holes 2 are opened for each thin plate 3, the holes can be easily formed by etching unless the thickness of the support plate 2 is large relative to the hole diameter. When the thin plates 3 are joined together by using a binder such as a brazing material, the binder flows into the support holes 2 to close the holes, but in this embodiment, the support holes 2 are formed by diffusion joining. The thin plates 3 can be joined to each other without being blocked.

In the jig 1 configured in this way, the machining time can be extremely shortened as compared with the case of drilling with a drill, so that the machining cost can be reduced and burrs due to the drill do not occur. Further, since it is not necessary to perform periodical replacement due to wear of the drill or replacement due to breakage, the running cost can be reduced. The support hole 2 may be punched by pressing. Even in this case, since the thin plates 3 can be punched one by one,
It can save labor compared to drilling.

As described above, according to the present invention, a positioning jig for a lead pin for a pin grid array package can be formed without performing a drilling process, and a drilling process is performed for each hole. On the other hand, the processing cost can be reduced by shortening the processing time. Also, without causing the binder to flow into the support holes when joined using a binder, it is possible to inexpensively manufacture a jig of a predetermined thickness having a plurality of support holes using a thin plate, The effect is extremely large.

[Brief description of drawings]

FIG. 1 is a plan view showing a jig according to the present invention. FIG. 2 is a side sectional view taken along the line II-II in FIG. FIG. 3 is a cross-sectional view of an essential part showing a usage example of the jig. FIG. 4 is a flow chart showing a manufacturing process of a jig based on the present invention. FIG. 5 is a schematic view showing one embodiment of a jig manufacturing process. 1 ... Jig, 2 ... Support hole 2a ... Small diameter part, 2b ... Medium diameter part 2c ... Large diameter part, 3 ... Thin plate 4 ... Positioning pin 5 ... Pin grid array package 6 ... Lead pin , 7 ... Brazing material 8 ... Positioning hole, 9 ... Joining jig

Claims (2)

[Claims] 1. A jig having a plurality of support holes for supporting a plurality of lead pins so as to individually position the plurality of lead pins when implanting the plurality of lead pins in a pin grid array package, the jig comprising: A jig for positioning a lead pin for a pin grid array package, characterized in that a plurality of thin plates having a plurality of holes corresponding to the plurality of supporting holes are laminated and joined together by diffusion joining. 2. A plurality of holes are formed in the thin plate, a plurality of the thin plates are stacked, and the plurality of stacked thin plates are joined together by diffusion bonding to form a plurality of thin plates. Forming a jig having a plurality of support holes formed by the holes to support the plurality of lead pins for individually positioning when the lead pins are implanted in the pin grid array package. A method for manufacturing a positioning jig for a lead pin for a featured pin grid array package.