JPH0690146B2 - Glue state detector - Google Patents
Glue state detectorInfo
- Publication number
- JPH0690146B2 JPH0690146B2 JP1229848A JP22984889A JPH0690146B2 JP H0690146 B2 JPH0690146 B2 JP H0690146B2 JP 1229848 A JP1229848 A JP 1229848A JP 22984889 A JP22984889 A JP 22984889A JP H0690146 B2 JPH0690146 B2 JP H0690146B2
- Authority
- JP
- Japan
- Prior art keywords
- light guide
- sensor
- state
- glue
- detecting device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000003292 glue Substances 0.000 title claims description 21
- 238000001514 detection method Methods 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 12
- 239000000853 adhesive Substances 0.000 claims description 10
- 238000004026 adhesive bonding Methods 0.000 claims description 10
- 230000001070 adhesive effect Effects 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 9
- 238000005452 bending Methods 0.000 claims description 7
- 238000006243 chemical reaction Methods 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 239000004033 plastic Substances 0.000 claims description 6
- 229920003023 plastic Polymers 0.000 claims description 6
- 238000005259 measurement Methods 0.000 claims description 5
- 239000011162 core material Substances 0.000 claims description 3
- 239000003365 glass fiber Substances 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 238000007772 electroless plating Methods 0.000 claims 1
- 230000001360 synchronised effect Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 3
- 239000000123 paper Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 235000019796 monopotassium phosphate Nutrition 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011111 cardboard Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 229910000402 monopotassium phosphate Inorganic materials 0.000 description 1
- PJNZPQUBCPKICU-UHFFFAOYSA-N phosphoric acid;potassium Chemical compound [K].OP(O)(O)=O PJNZPQUBCPKICU-UHFFFAOYSA-N 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000011896 sensitive detection Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Making Paper Articles (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、紙やダンボールあるいはプラスチックなどの
材料加工や組立て工程、例えば加工材料の接着に必要な
自動糊付けを行って製函しようとする場合に適用する装
置に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to a case where a box is manufactured by performing a material processing or assembling process of paper, cardboard, plastic or the like, for example, automatic gluing necessary for adhering a processing material. Relating to the device applied to.
殊に連続的な多量組立て工程などにおいては、糊付けの
不具合工程を自動的に正確に検知することが要求されて
いる。Particularly in a continuous large-scale assembly process, etc., it is required to automatically and accurately detect a defective process of gluing.
従来のこの種の糊付き検出装置においては、小型で高性
能の検出端が作れないことや、測定温度範囲が高いため
に糊の温度が一寸低下すると検出不能となり、従って加
工材料相互間の付着状態を高信頼度で検出する実用的に
有為なシステムが無かった。In this type of conventional glue-attached detection device, it is impossible to make a small and high-performance detection end, and because the measurement temperature range is high, it becomes impossible to detect when the temperature of the glue decreases a little, so that the adhesion between the processing materials There was no practically effective system to detect states with high reliability.
特に多量に連続的に行う製函工程等において、付着状態
を検出しようとする場所では概して糊の温度が極端に低
下するため正確な判断が困難であった。Particularly, in a box-making process or the like which is continuously performed in a large amount, the temperature of the glue is generally extremely lowered at a place where the adhered state is to be detected, which makes it difficult to make an accurate judgment.
また、加熱された糊から放射される遠赤外線によって糊
が適量付着したか否かを検出しようとする試みがある。
しかしながら、一般に例えば製函装置において共通の問
題である糊付け検出装置に係わる検出端の設置位置附近
が狭隘で小型の検出端しか設置することができないこと
が多い。There is also an attempt to detect whether or not an appropriate amount of glue is attached by far infrared rays emitted from the heated glue.
However, in general, for example, the installation position of the detection end related to the gluing detection device, which is a common problem in box making devices, is narrow, and only a small detection end can be installed in many cases.
また糊付け装置には、高温溶融状態の糊を一定温度に保
つチャンバーやその糊を適当なタイミングで噴射するノ
ズルなどが設けられている。しかるに塗布された糊の温
度は急速に低下するから、前記高温部分のなるべく近く
に検出端を設置することが望ましいが、その輻射熱によ
り半導体などのセンサや周辺電子回路などに温度上昇を
生じ検出精度を低下するなどの問題があった。Further, the gluing device is provided with a chamber that keeps the glue in a high-temperature molten state at a constant temperature and a nozzle that sprays the glue at an appropriate timing. However, the temperature of the applied glue drops rapidly, so it is desirable to install the detection end as close as possible to the high temperature part, but the radiation heat causes a rise in temperature in sensors such as semiconductors and peripheral electronic circuits, etc. There was a problem such as lowering.
さらに、従来の通常の光学系による測定法では長波長領
域が削除され低温領域の測定が不能となるなど多くの問
題があった。Furthermore, the conventional measurement method using an ordinary optical system has many problems such that the long wavelength region is deleted and the measurement in the low temperature region becomes impossible.
本発明の目的は、接着用の糊の付着状態を正確に判定す
るための検出手段を提供しようとするものである。殊に
比較的高温から低温にわたる広い温度領域にわたり、高
感度で応動する検出装置を提供することにある。An object of the present invention is to provide a detection means for accurately determining the adhered state of adhesive glue. In particular, it is an object of the present invention to provide a detection device which responds with high sensitivity over a wide temperature range from a relatively high temperature to a low temperature.
本発明の糊付け状態検出装置は、紙やプラスチックスな
どの加工材料に接着用の糊付けを行う組立て工程におい
て、塗布した加熱状態の糊から放射される遠赤外線を光
ガイドを備えたセンサおよび検出制御装置により捕捉し
て、前記糊の噴射状態および塗布状態の監視制御を行え
るように構成したことを特徴とするものである。The pasting state detection device of the present invention is a sensor provided with a light guide for far infrared rays radiated from the pasted paste applied in a process of assembling for adhering pasting to a processing material such as paper or plastics and detection control. It is characterized in that it is configured so that it can be captured by a device to monitor and control the spraying state and the coating state of the glue.
この場合、自動糊付け装置によって糊付けを行なおうと
する際に、ノズルが詰ったり温度が低下してしまい糊の
粘度が大きくなるなど糊付け装置の調子によって糊がよ
く噴射されないことがある。In this case, when attempting to perform gluing by the automatic gluing device, the nozzle may be clogged, the temperature may drop, and the viscosity of the gluing device may increase.
依って、その糊の噴射状態を監視制御とすると共に、糊
付け時点より検出動作までの時間間隔について自動また
は手動により適当なタイムラグを設定することのできる
検出制御装置を備えることにより、糊の付着状態をリア
ルタイムで判断できるようにしたものである。Therefore, while the adhesive injection state is monitored and controlled, and a detection control device that can set an appropriate time lag automatically or manually for the time interval from the time of gluing to the detection operation is provided, the adhesion state of the adhesive It enables to judge in real time.
そして、前記光ガイドとしては可撓性と自己保持性とを
有すると共に、比較的低温領域までの測定を可能にする
ため当該光ガイドの内面を平滑化した金属管や無電解鍍
金を施したプラスチックス管を使用して構成したもので
ある。Further, the light guide has flexibility and self-holding property, and in order to enable measurement up to a relatively low temperature region, a metal tube having an inner surface of the light guide smoothed or a plastic electroless plated It is configured by using a tube.
なお、前記光ガイドに対して、その曲げ加工時の屈曲点
における潰れを防止するために外周部を波状にしたり、
予め内部に芯材を挿入して成る光ガイドを用い屈曲加工
後に取り除くように構成されたことを特徴とするもので
ある。In addition, with respect to the light guide, in order to prevent crushing at a bending point during the bending process, the outer peripheral portion has a wavy shape,
It is characterized in that it is configured to be removed after bending processing by using an optical guide formed by inserting a core material in advance.
また前記光ガイドを備えたセンサとして、遠赤外線を入
射させる当該光ガイドの末端部に、無機の誘電体や半導
体材料、例えば燐酸二水素カリウム（KH2PO4略称KDP）
の如き強誘電体結晶あるいはYAGレーザのような非線形
光学効果を利用する波長可変レーザー素子等の波長変換
素子を装着して成る変換装置を備え、その変換装置の出
力側から通常のガラスファイバー等を経由して比較的短
波長側の可視域波長で検出が可能な光検出用のセンサと
電子回路を用いることにより、当該装置を安価に提供で
きるように構成したことを特徴とするものである。Further, as a sensor equipped with the light guide, an inorganic dielectric or semiconductor material such as potassium dihydrogen phosphate (KH 2 PO 4 abbreviated as KDP) is provided at the end of the light guide for injecting far infrared rays.
Equipped with a conversion device that is equipped with a wavelength conversion element such as a wavelength tunable laser element that uses a nonlinear optical effect such as a ferroelectric crystal or a YAG laser, such as a normal glass fiber from the output side of the conversion device. It is characterized in that the device can be provided at low cost by using a sensor for light detection and an electronic circuit capable of detecting in a visible wavelength range on the relatively short wavelength side via the device.
紙やプラスチックなどの材料に自動装置によって糊付け
を行なう場合に、ノズルが詰ったり温度が低下して糊の
粘度が大きくなるなどの原因により糊付け装置から糊が
調子よく噴射されないことがある。When an adhesive is applied to a material such as paper or plastic by an automatic device, the adhesive may not be properly ejected from the adhesive device due to factors such as clogging of a nozzle or a decrease in temperature and an increase in viscosity of the adhesive.
本発明は加熱した糊から放射される遠赤外線あるいは赤
外線をセンサを含む電子装置によって検出し、糊の付着
状態をリアルタイムで判断しようとするものである。The present invention is intended to detect far infrared rays or infrared rays radiated from heated glue by an electronic device including a sensor and judge the adhesion state of the glue in real time.
第１図により本発明の実施例を説明をする。An embodiment of the present invention will be described with reference to FIG.
紙製の筐体１は製函装置とコンベア２によって搬送され
ながら、筐体１の蓋部１′の糊代の部分に自動糊付け装
置によって高温の糊３が5mmφ程度の点状に間欠的に噴
射される。While the paper-made casing 1 is being conveyed by the box-making device and the conveyor 2, the high-temperature glue 3 is intermittently applied to the glue margin portion of the lid 1'of the casing 1 by the automatic gluing device in the form of dots of about 5 mmφ. Is jetted.
この糊３から放射される遠赤外線はサファイヤなど遠赤
外線に対する高透過度材料で作られたレンズ４によって
集光し、銅などの金属管５をガイドとしてセンサ６に入
射させる。The far infrared rays radiated from the glue 3 are condensed by a lens 4 made of a material having a high transparency to far infrared rays such as sapphire, and are incident on the sensor 6 using a metal tube 5 such as copper as a guide.
このガイドとなる金属管５は反射損失を減少させる目的
から内部が滑らかであり、かつ金鍍金を施こしたものが
良い。また、このような金属管５の先端を検出に都合の
よい設置点まで屈曲等を行って導く場合、その屈曲部の
潰れ等により内面の平滑性が失われると遠赤外線の伝導
効率を著しく阻害する。この対策としては種々の方法が
あるが、例えばガイドの外周部を波型にしておくとか、
予めガイド内に挿入しておいた芯を屈曲加工後に抜き出
すなどの手段を用いればよい。For the purpose of reducing the reflection loss, the metal tube 5 serving as the guide is preferably smooth inside and plated with gold. Further, when the tip of the metal tube 5 is bent and guided to an installation point that is convenient for detection, if the smoothness of the inner surface is lost due to the collapse of the bent portion, the far infrared ray conduction efficiency is significantly impaired. To do. There are various methods to prevent this, for example, to make the outer periphery of the guide corrugated,
Means may be used, such as extracting the core that has been previously inserted into the guide after the bending process.
この金属管５に入射した遠赤外線は、管内壁を反射しな
がら進行しPbSなどの遠赤外線に感度のある物質を使用
したセンサ６に入射し、電気信号に変換される。The far infrared rays that have entered the metal tube 5 travel while reflecting on the inner wall of the tube and enter the sensor 6 that uses a substance that is sensitive to far infrared rays, such as PbS, and is converted into an electric signal.
この場合、温度変化に起因するセンサ６の暗電流のドリ
フトを抑制するための通常の方法として、 （１）同じ素子を２個用いてブリッジ回路とする （２）入射光をチョッパで断続し、交流増幅のゝち同期
整流する （３）温度制御をして素子を第１定温度に保つ などの手段を使用する。本例では第（２）項の手段の一
つとして回転型チョッパを用いており、モータ７によっ
て駆動している。In this case, as a normal method for suppressing the drift of the dark current of the sensor 6 caused by the temperature change, (1) a bridge circuit is formed by using two same elements (2) the incident light is interrupted by a chopper, AC rectification, ie, synchronous rectification (3) Temperature control is used to keep the element at the first constant temperature. In this example, a rotary chopper is used as one of the means of the item (2), and is driven by the motor 7.
すなわち第２図に示す如き開口部を有するチョッパ８に
よってセンサ６に入射する遠赤外線を断続すると共に、
フォトインタラプタ９（投光器とセンサ素子が対向して
おり、間に入ったものを検出する）によって同期検波の
ための同期信号Esを発生している。センサ６の出力は交
流増幅器10によって増幅したのち、同期信号Esを参照し
て動作する同期検波回路11によって同期検波をし、ロー
パスフイルタ12によってチョッパ８で継続されたゝめに
生じた高周波成分を除去する。That is, the chopper 8 having an opening as shown in FIG. 2 interrupts far infrared rays incident on the sensor 6, and
A photo interrupter 9 (a projector and a sensor element are opposed to each other, and detects an intervening one) generates a synchronization signal Es for synchronous detection. The output of the sensor 6 is amplified by the AC amplifier 10, and then is synchronously detected by the synchronous detection circuit 11 which operates by referring to the synchronous signal Es, and the low-pass filter 12 causes the chopper 8 to continue to generate a high-frequency component. Remove.
この信号E1は次にコンパレータ13に印加されてボリュー
ム15により調節される参照電圧Erと比較される。そして
E1＞Erの場合に糊有り信号E2を送出し、筐体１がレンズ
４による検出面を通過することをタイミングセンサ14に
よって認識して、この信号Ｔが波形成形回路16によって
成形された信号Ｔ′によってゲート回路17を制御する。
筐体１が検出面を通過している時のみゲート17を開いて
信号E3のみを有効とすることによって、糊の付着の良否
を検出することができる。第３図に各部の波形を示す。This signal E 1 is then applied to the comparator 13 and compared with a reference voltage Er regulated by the volume 15. And
When E 1 > Er, the signal E 2 with glue is sent, the timing sensor 14 recognizes that the casing 1 passes the detection surface of the lens 4, and this signal T is shaped by the waveform shaping circuit 16. The gate circuit 17 is controlled by the signal T '.
By only opening the gate 17 and enabling only the signal E 3 when the casing 1 is passing through the detection surface, it is possible to detect the quality of adhesion of the adhesive. FIG. 3 shows the waveform of each part.
またシステムの感度が十分であれば、工程の都合によっ
ては筐体１の蓋部１′が自動閉蓋機によって閉蓋された
のち測定してもよいが、この場合は閉蓋後あまり早く測
定すると十分に温度が蓋部１′の裏面から表面に伝導し
ないので表面の温度が低い。If the sensitivity of the system is sufficient, the lid 1'of the housing 1 may be measured after it is closed by an automatic lid closing machine depending on the process, but in this case, the measurement is performed too soon after the lid is closed. Then, the temperature is not sufficiently conducted from the back surface of the lid 1'to the surface, so that the surface temperature is low.
反面遅過ぎると蓋部１′を透過した熱が冷めてしまう。
従って適当なタイムラグを手動または自動的に設定して
検出動作を実行することのできる検出時間制御装置を備
えた電子装置を適用することにより精度の良い検出が可
能になった。On the other hand, if it is too late, the heat transmitted through the lid 1'will be cooled.
Therefore, by applying an electronic device equipped with a detection time control device capable of manually or automatically setting an appropriate time lag and executing a detection operation, accurate detection becomes possible.
なお、本例においてチョッパ８はモータによって駆動さ
れるものを使用したが、近年セラミックのバイモルフを
利用した振動型のものが開発されており、寿命と信頼性
および小型化等の面から非常に有利な構成が可能になっ
た。Although the chopper 8 used in this example is driven by a motor, a vibration type using a ceramic bimorph has been developed in recent years, which is extremely advantageous in terms of life, reliability and downsizing. Various configurations are possible.
従来この種の糊付け検出装置においては、小型で高性能
の検出端が作れないことや、測定可能な温度範囲が高い
ために糊の温度が一寸低下すると検出不能となり、従っ
て付着状態を高信頼度で有効に検出するシステムが無か
った。特に前述のように製函後は蓋部の裏面から表面に
伝導してくる糊の温度が極端に低いために付着状態を検
出することが殆ど不可能であったが、本発明の装置によ
って解決できるようになった。In the past, this type of glue detection device cannot make a small and high-performance detection end, and because the measurable temperature range is high, it becomes impossible to detect when the temperature of the glue drops a little, so the adhesion state is highly reliable. There was no system to detect effectively in. In particular, as described above, after the box was made, it was almost impossible to detect the adhered state because the temperature of the glue that was conducted from the back surface of the lid to the surface was extremely low, but this was solved by the device of the present invention. I can do it now.
また前記糊の塗布面を被覆した他の加工材料を透過して
放射される遠赤外線を、検出時間制御装置を備えた前記
電子装置によって、適当なタイムラグをもって精度よく
検出できるようになった。Further, the far infrared rays emitted through the other processing material coated on the adhesive application surface can be accurately detected with an appropriate time lag by the electronic device equipped with the detection time control device.
しかも本発明によれば小型で高感度の検出端と信頼性の
高い処理装置を構成することができ、依って生産効率の
良い組立て工程が構成できるなど大きな効用が期待でき
る。Moreover, according to the present invention, it is possible to construct a small-sized and highly sensitive detection end and a highly reliable processing device, so that an assembly process with high production efficiency can be constructed and great effects can be expected.
なお、赤外線線を入射させる当該光ガイドの末端部に可
視域波長変換装置を備えることにより、通常のガラスフ
ァイバー等を経由して比較的短波長側で検出を可能にし
たので、高速高性能化の技術的効果と共に大きな経済的
効果が得られる。It should be noted that by providing a visible wavelength conversion device at the end of the light guide that makes infrared rays incident, detection was possible on the relatively short wavelength side via ordinary glass fiber, etc. A large economic effect can be obtained with the technical effect of.
第１図は本発明に係わる糊付け状態検出装置の実施例を
表す概要図、第２図はチョッパの一例を表す図面、第３
図は各部の波形を示したものである。 符号１は筐体、１′は蓋部、 ２はコンベア、３は糊、 ４はレンズ、５は金属管、 ６はセンサ、７はモータ、 ８はチョッパ、９はフォトインタラプタ、 10は交流増幅器、11は同期検波回路、 12はローパスフイルタ、13はコンパレータ、 14はボリューム、15はタイミングセンサ、 16は波形成形回路、17はゲート回路 を表す。FIG. 1 is a schematic view showing an embodiment of a pasting state detecting device according to the present invention, FIG. 2 is a view showing an example of a chopper, and FIG.
The figure shows the waveform of each part. Reference numeral 1 is a housing, 1'is a lid portion, 2 is a conveyor, 3 is glue, 4 is a lens, 5 is a metal tube, 6 is a sensor, 7 is a motor, 8 is a chopper, 9 is a photo interrupter, and 10 is an AC amplifier. , 11 is a synchronous detection circuit, 12 is a low-pass filter, 13 is a comparator, 14 is a volume, 15 is a timing sensor, 16 is a waveform shaping circuit, and 17 is a gate circuit.
Claims (4)
用の糊付けを行う組立て工程において、塗布した加熱状
態の糊から放射される遠赤外線を光ガイドを備えたセン
サおよび検出制御装置により捕捉して、前記糊の噴射状
態および塗布状態の監視制御を行えるように構成したこ
とを特徴とする糊付け状態検出装置1. A far-infrared ray radiated from an applied paste in a heated state is captured by a sensor and a detection control device equipped with a light guide in an assembly process in which an adhesive paste is applied to a processed material such as paper or plastics. And a glued state detecting device configured to monitor and control the jetting state and the coating state of the glue.
を有し、比較的低温領域までの測定を可能にするため当
該光ガイドの内面を平滑化した金属管や無電解鍍金を施
したプラスチックス管を使用したことを特徴とする請求
項１記載の糊付け状態検出装置2. The light guide has flexibility and self-holding property, and is provided with a metal tube or an electroless plating whose inner surface is smoothed in order to enable measurement up to a relatively low temperature range. The glued state detecting device according to claim 1, characterized in that a plastic pipe is used.
曲点における潰れを防止するために外周部を波状にした
り、予め内部に芯材を挿入して成る光ガイドを用い屈曲
加工後に取り除くように構成されたことを特徴とする請
求項１記載の糊付け状態検出装置3. A light guide formed by corrugating the outer peripheral portion of the light guide in order to prevent the light guide from being crushed at a bending point during the bending work, or by removing the light guide after the bending work by using a light guide formed by previously inserting a core material therein. The gluing state detecting device according to claim 1, wherein
外線を入射させる当該光ガイドの末端部に波長変換素子
を装着した変換装置を備え、その変換装置からは通常の
ガラスファイバー等を経由して比較的短波長側で検出が
可能なセンサと電子回路を用いるように構成したことを
特徴とする糊付け状態検出装置4. A conversion device having a wavelength conversion element attached to the end portion of the light guide, into which far infrared rays are incident, as a sensor equipped with the light guide, and from the conversion device, a normal glass fiber or the like is passed. Of a pasting state detecting device characterized by being configured to use a sensor and an electronic circuit capable of detecting on the relatively short wavelength side
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1229848A JPH0690146B2 (en) | 1989-09-05 | 1989-09-05 | Glue state detector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1229848A JPH0690146B2 (en) | 1989-09-05 | 1989-09-05 | Glue state detector |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0392752A JPH0392752A (en) | 1991-04-17 |
| JPH0690146B2 true JPH0690146B2 (en) | 1994-11-14 |
Family
ID=16898635
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1229848A Expired - Lifetime JPH0690146B2 (en) | 1989-09-05 | 1989-09-05 | Glue state detector |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0690146B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000046033A1 (en) * | 1999-02-04 | 2000-08-10 | Matsushita Electric Industrial Co., Ltd. | Object-to-be-printed detector and print detecting method |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5476577B2 (en) * | 2008-12-10 | 2014-04-23 | 芳野マシナリー株式会社 | Glue inspection device |
| KR102448715B1 (en) * | 2017-12-22 | 2022-09-29 | 주식회사 히타치엘지 데이터 스토리지 코리아 | Combination of dust sensor and gas sensor |
-
1989
- 1989-09-05 JP JP1229848A patent/JPH0690146B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000046033A1 (en) * | 1999-02-04 | 2000-08-10 | Matsushita Electric Industrial Co., Ltd. | Object-to-be-printed detector and print detecting method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0392752A (en) | 1991-04-17 |
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