JPH069306B2 - Soldering device for mounted parts - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to an apparatus for soldering mounted components to a printed circuit board.

(Prior Art) FIG. 2 (a) shows an example of a mounting structure of a conventional mounted component on a plant board, in which a printed circuit board 1 has a recessed portion 3 having substantially the same shape as the mounted component 2. Further, connection pads 5a and 5b continuous with the patterns 4a and 4b are provided on the bottom surface of the recessed portion 3, and the mounting component 2 is press-fitted into the recessed portion 3 and its electrodes 6a and 6b are pressed. Connect pad 5
It was designed to be attached by soldering to a and 5b respectively.

Further, FIG. 2 (b) shows another example of the conventional mounting structure for mounting components on a printed circuit board. In the mounting structure described above, the mounting components and the recessed portions have a directional shape, for example, The trapezoidal mounting component 7 and the recessed portion 8 prevent the mounting directions from being reversed.

Furthermore, in the mounting structure shown in FIG. 2 (a) or FIG. 2 (b), by mounting a thin ridge extending in the depth direction on the side wall of the recessed portion 3 or 8, the mounting component 2 or 7 can be mounted. There has also been proposed one that can be held elastically.

By the way, in the above-mentioned mounting structure, the size of the recessed portion of the printed circuit board must be almost exactly the same as the size of the mounted component, and the bottom surface of the recessed portion must be provided with a connection pad continuous to the pattern. Therefore, there is a drawback that high precision and a lot of complicated processing are required in the manufacturing process of the printed circuit board. Moreover, when the printed circuit board is thin, the recessed part cannot be formed and the above-mentioned mounting is not possible. There was a drawback that the structure could not be adopted.

In order to solve such a defect, a through hole (hereinafter, referred to as a component mounting hole) slightly larger than a mounted component is provided in the printed circuit board instead of the recessed portion, and the mounted component is mounted in the component mounting hole. There has been proposed a structure in which a mounting component is mounted on a printed board by inserting the mounting component into the printed circuit board and soldering electrodes of the mounting component to a pattern around the component mounting hole.

(Problems to be Solved by the Invention) However, since the mounting structure does not have a function of holding mounted components in the mounting structure,
For example, a complicated work such as temporarily mounting the mounted component in the component mounting hole with an adhesive tape, soldering in this state, and then removing the adhesive tape must be performed. In this case, the mounting position of the mounted component may be displaced due to the bending of the adhesive tape, etc., and it may not be possible to reliably solder, or the mounted component or solder may protrude from the printed circuit board more than originally expected, and the overall thickness may become thicker than originally expected. There were some problems.

SUMMARY OF THE INVENTION It is an object of the present invention to eliminate the above-mentioned problems, and to provide a soldering device capable of reliably soldering a mounted component inserted in a component mounting hole of a printed circuit board and making the thickness of the solder uniform or the like. To do.

(Means for Solving Problems) In the present invention, in order to solve the above problems, a mounting component provided with a plurality of electrodes is slightly larger than the mounting component provided on a printed circuit board, and the plurality of electrodes are provided around the mounting component. Inserted in a component mounting hole having a connection pattern corresponding to, in a soldering device for mounting components for soldering each of the electrodes and each connection pattern, made of a material having good thermal conductivity,
The printed circuit board has a concave portion at a position corresponding to the component mounting hole, the recess being slightly larger than the component mounting hole and having a depth when combined with the printed circuit board sandwiched therebetween being larger than the thickness of the mounting component, A pair of jig plates having solder non-adhesiveness in and around the recess, and the printed circuit board in which the mounting component is inserted into a component mounting hole and solder is filled between each electrode and each connection pattern. A clamp that sandwiches and fixes between the pair of jig plates, a pair of heating heads that heat the pair of jig plates that sandwich and mount the mounting component, the printed circuit board, and the solder, respectively, and at least the pair of heating And a drive device for driving one of the heads so as to move toward or away from the other.

(Operation) According to the present invention, the printed circuit board and the mounting parts thereof are filled between the pair of jig plates and between the component mounting holes of the printed circuit board and the mounting parts inserted therein and the electrodes and the connection patterns thereof. The solder thus soldered is sandwiched so as to correspond to the respective concave portions of the pair of jig plates, the pair of jig plates are fixed by a clamp, and the pair of fixed jig plates are driven by a driving device. It is sandwiched between a pair of heating heads that are
This melts the solder and connects the plurality of connection patterns and the plurality of electrodes.

(Embodiment) FIG. 1 shows an embodiment of a soldering apparatus for mounted parts according to the present invention. In the figure, 10 and 20 are mounted parts, 30 is a printed circuit board, and 40 and 50 are a pair of jig plates. , 60 is a jig spacer, 61 is a clamp, 62 and 63 are a pair of heating heads, 64 is a cooling head, 65 is a driving device for the heating head 62 and the cooling head 64, and 66 and 67 are the heating heads 6.
2, 63 are temperature control devices, 68 is a cooling device for the cooling head 64, and 69 is a control device.

FIG. 3 shows a detailed configuration of the mounting components 10 and 20, the printed circuit board 30, the jig plates 40 and 50, and the jig spacer 60.

The mounting components 10 and 20 are of a so-called flip chip type without lead wires, and electrodes 11 and 12 and electrodes 21 and 22 are provided at one end and the other end thereof, respectively.

The printed circuit board 30 is a well-known one having a pattern on both sides, corresponding to the mounting components 10 and 20, respectively, and component mounting holes 31 and 32 having inner dimensions slightly larger than outer dimensions thereof, and Electrode 1 of mounting parts 10 and 20
1 and 12 and 21 and 22, respectively, and patterns formed on the front surface and the back surface around the component mounting holes 31 and 32 and through-hole plating so as to continue these (hereinafter referred to as a connection pattern. Called.)
33, 34 and 35, 36.

Although the connection patterns 33 to 36 actually include wiring patterns for connection with other components, they are omitted here.

The jig plates 40 and 50 are made of a material having good thermal conductivity, for example, aluminum or brass, and are slightly larger than the component mounting holes 31 and 32 at positions corresponding to the component mounting holes 31 and 32 of the printed circuit board 30. And the printed circuit board 3
The depth when combined with 0 sandwiched is the mounting components 10 and 2 described above.
It has recesses 41, 42 and 51, 52 with a thickness greater than zero. The recesses 41, 42 and 51, 52 and their surroundings are anodized or toughened when the material forming the jig plates 40 and 50 is aluminum, and chrome treated when they are brass. Is given,
Non-adhesiveness of solder is given. Note that only the above portion may be made of a material having non-adhesiveness of solder.

The jig spacer 60 is made of the same material as that of the jig plate, has the same thickness as the printed board 30, and its outer shape is substantially the same as that of the jig plates 40 and 50, so that the printed board 30 can be accommodated just right. The opening 60a is provided. The clamp 61 is a well-known one using a screw or a spring.

The heating heads 62 and 63 are well known in which a heater is attached to a metal having good thermal conductivity, and temperature control devices 66 and 6 are used.
7 keeps a predetermined constant temperature, for example, 300 ° C. and 170 ° C., respectively. Cooling head 64
Is a well-known one in which a large number of outlets for cooling air are provided in a metal having good heat dissipation, and the cooling air supplied from the cooling device 68 is continuously discharged.

The heating head 62 and the cooling head 64 are movably supported in the vertical and horizontal directions by a well-known drive device 65 that operates by hydraulic pressure and the like, and the heating head 63 is fixed to a pedestal 70.

The control device 69 controls the drive device 65 and the cooling device 68 according to a preset sequence.

Next, the manner of soldering by the device of the present invention will be described.

First, the mounting components 10 and 20 are placed in the component mounting holes 31 and 32 of the printed circuit board 30, and the electrodes 11, 12 and 21,
22 is inserted so as to correspond to the connection patterns 33, 34 and 35, 36, and between the electrodes 11, 12 and 21, 22 and the connection patterns 33, 34 and 35, 36 in order to connect them. The solder 71 with a sufficient paste strip is filled.

Next, these are mounted between the jig plates 40 and 50, the mounting component 10, the component mounting hole 31, and the connection pattern 3.
3, 34 and a portion of the solder 71 are located between the recesses 41 and 51, and the mounting component 20, the component mounting hole 32, a portion of the connection patterns 35 and 36 and the solder 71 are located between the recesses 42 and 52. Moreover, the entire substrate plate 30 is the jig spacer 60.
It is sandwiched so as to be housed in the opening 60a of the above, and further, a plurality of places on the outer periphery of the jig plates 40 and 50 sandwiching the mounting components 10, 20, the printed board 30, and the solder 71 are fixed by clamps 61. Hereinafter, these will be referred to as jig blocks A.

Next, the jig block A is placed on the heating head 63 so that one jig plate, for example, 50 is in contact with the heating head 63, and the operation of the control device 69 is started by operating a switch or the like (not shown).

The control device 69 keeps the mounting components 10, 20, the printed board 30, and the solder 71 for 15 hours while keeping the same state.
After preheating to about 0 ° C., the driving device 65 is controlled to lower the heating head 62 until it contacts the upper surface of the other jig plate of the jig block A, here the upper surface of the jig block 40, and the state is maintained for a predetermined time. As the main heating for soldering.

At this time, the joint portions, that is, the electrodes 11, 12, 21 and 22
The temperature between the connection patterns 33, 34, 35 and 36 reaches approximately 230 ° C., the solder 71 melts, and the electrode 1
1, 12 and 21, 22 and the connection patterns 33, 34 and 35, 36 are soldered.

FIG. 4 shows the state of the mounted components, such as 10, the printed circuit board 30 and the solder 71 at this time.

Here, as described above, the depths of the recesses 41 and 51 are set so as to be larger than the thickness of the mounting component 10 when the jig plates 40 and 50 are combined with the printed circuit board 30 sandwiched therebetween. The component 10 is held substantially at the center of the printed board 30 in the thickness direction by the surface tension of the solder 71,
The mounting head 10 is not pressed by the heating head 62 and is not damaged.

Further, since the solder 71 does not protrude beyond the space formed by the recesses 41 and 51, its thickness is always constant, and its value can be freely changed by changing the attachment of the recesses 41 and 51. Can be set to. In addition, the recess 41
By setting the depths of the recesses 51 and the recesses 51 to different values without changing the total value thereof, it is possible to change the protrusion amount of the mounting component 10 from the front surface and the back surface of the printed circuit board 30 and the thickness of the solder 71. Note that these matters are
It goes without saying that the same applies to 0.

Next, the control device 69 controls the driving device 65 to raise the heating head 62 to separate it from the upper surface of the jig plate 40 and drive the cooling head 64 to bring it into contact with the upper surface of the jig plate 40. At the same time, the cooling device 68
Is controlled to supply cooling air to the cooling head 64 for a certain time, and the cooling air is blown onto the upper surface of the jig plate 40.
The entire jig block A is cooled, and then the cooling head 6
Return 4

After that, the jig block A is taken out and disassembled, so that the printed circuit board 30 to which the mounting components 10 and 20 are soldered is taken out.

Note that the cooling by the cooling head 64 is not absolutely necessary, and it may take time, but it may be possible to wait until it cools naturally.

Further, the jig spacer 60 aligns the positions of the component mounting holes 31 and 32 of the printed circuit board 30 with the concave portions 41, 51 and 42 and 52 of the jig plates 40 and 50, and the force of the clamp 61 applies to the printed circuit board 30. This is for preventing direct addition and may be formed integrally with the jig plate 40 or 50. Further, the clamp 61 may also be bound to the jig plate 40 or 50.

Further, it goes without saying that the jig plates 40, 50, the jig spacer 60 and the clamp 61 can be repeatedly used.

(Effects of the Invention) According to the present invention as described above, a printed circuit board in which a mounting component is inserted into a component mounting hole is provided between a pair of jig plates provided with recesses corresponding to the mounting component and the component mounting hole. Since the pair of jig plates are sandwiched and formed by the pair of heating heads, the positions of the mounted components in the thickness direction of the printed circuit board and the thickness of the solder can be kept substantially constant. There are advantages that the components can be reliably soldered to the printed circuit board, and that the thickness of the entire printed circuit board including the mounted components can always be made constant.

[Brief description of drawings]

FIG. 1 is a diagram showing an embodiment of a mounting component soldering apparatus of the present invention, FIGS. 2 (a) and 2 (b) are diagrams showing a conventional mounting component mounting structure on a printed circuit board, and FIG. FIG. 4 is an exploded perspective view of the components of the jig block, and FIG. 4 is an enlarged cross-sectional view of the joint portion. 10, 20 ... Mounted components, 11, 12, 21, 22 ... Electrodes, 30 ... Printed circuit boards, 31, 32 ... Component mounting holes, 3
3, 34, 35, 36 ... Connection pattern, 40, 50 ... Jig plate, 41, 42, 51, 52 ... Recessed portion, 61 ... Clamp, 62, 63 ... Heating head, 65 ... Driving device, 7
1 ... Solder.

Claims (1)

[Claims] 1. A mounting component having a plurality of electrodes is inserted into a component mounting hole which is slightly larger than the mounting component provided on a printed circuit board and has a connection pattern around the mounting component corresponding to the plurality of electrodes. In a soldering apparatus for mounting components, which solders electrodes and respective connection patterns, it is made of a material having good thermal conductivity and is slightly larger than the component mounting hole at a position corresponding to the component mounting hole of the printed circuit board. A pair of jig plates having a non-adhesive solder at least in the concave portion and the periphery thereof and having a concave portion whose depth when combined with the board sandwiched is larger than the thickness of the mounting component; Insert the mounting component into the board, and fix the printed circuit board, which is filled with solder between each of these electrodes and each connection pattern, between the pair of jig plates. A clamp, a pair of heating heads for respectively heating the mounting component, the printed circuit board, and a pair of jig plates fixed by sandwiching solder, and at least one of the pair of heating heads to approach or separate from the other. A soldering device for mounted components, which is provided with a driving device for driving.