JPH0694587B2 - Method for manufacturing conductor for image display device and audio device - Google Patents
Method for manufacturing conductor for image display device and audio deviceInfo
- Publication number
- JPH0694587B2 JPH0694587B2 JP23329583A JP23329583A JPH0694587B2 JP H0694587 B2 JPH0694587 B2 JP H0694587B2 JP 23329583 A JP23329583 A JP 23329583A JP 23329583 A JP23329583 A JP 23329583A JP H0694587 B2 JPH0694587 B2 JP H0694587B2
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- image display
- copper
- display device
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004020 conductor Substances 0.000 title claims description 17
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 238000000034 method Methods 0.000 title description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 25
- 229910052802 copper Inorganic materials 0.000 claims description 16
- 239000010949 copper Substances 0.000 claims description 16
- 238000000137 annealing Methods 0.000 claims description 5
- 238000005096 rolling process Methods 0.000 claims description 4
- 238000005482 strain hardening Methods 0.000 claims description 4
- 238000005266 casting Methods 0.000 claims description 3
- 230000001590 oxidative effect Effects 0.000 claims description 2
- 239000013078 crystal Substances 0.000 description 17
- 230000007547 defect Effects 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 230000008054 signal transmission Effects 0.000 description 3
- 238000005491 wire drawing Methods 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000001953 recrystallisation Methods 0.000 description 2
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
Description
【発明の詳細な説明】 (技術分野) 本発明は、例えばTV、CRT{Cathode Ray Tube(ブラウ
ン管)等の画像表示機器や、例えばステレオ等の音響機
器の高周波信号伝達回路が必要な機器の配線に用いられ
る導体の製造方法に関するものである。Description: TECHNICAL FIELD The present invention relates to wiring of image display devices such as TVs and CRTs (Cathode Ray Tubes) and devices requiring high-frequency signal transmission circuits of audio devices such as stereos. The present invention relates to a method for manufacturing a conductor used in.
(背景技術) これらの電子機器は、信号が正確に、位相差を生じるこ
となく伝達されないと、画像や音響において像がぼやけ
たり、音が鮮明でなかったりする。(Background Art) In these electronic devices, if signals are not accurately transmitted without causing a phase difference, an image or sound may be blurred or sound may not be clear.
従来、タフピッチ銅(酸素200〜500ppm程度含有する純
銅)や無酸素銅(酸素をほとんど含まない純銅)を冷間
加工後焼鈍軟化して再結晶させた軟銅線や、時として冷
間加工したままの硬銅線、又はこれらに錫等のめつきを
施した線がこれらの用途に使用されてきた。Conventionally, tough pitch copper (pure copper containing about 200 to 500 ppm oxygen) or oxygen-free copper (pure copper containing almost no oxygen) is cold-worked, then annealed and softened to recrystallize annealed copper wire or sometimes as cold-worked. The hard copper wire of the above, or the wire to which tin or the like is plated has been used for these applications.
しかし、これらの線は次の理由により必ずしも信号の正
確な伝達に好都合なものではなかった。However, these lines have not always been convenient for the accurate transmission of signals for the following reasons.
軟銅線は、しなやかさが優れるので、多用されるが、焼
鈍による再結晶で結晶粒は通常等軸に近い形状に分布す
るため、導体の長手方向に電流が流れる際、横切るであ
ろう結晶粒界の数が多くなり、結晶粒界は特に高周波成
分信号にとって位相差発生等の原因として大きく作動す
ると考えられる。The annealed copper wire is often used because it is excellent in flexibility, but since the crystal grains are usually distributed in a shape close to the equiaxed shape by recrystallization by annealing, the crystal grains that will cross when a current flows in the longitudinal direction of the conductor. It is considered that the number of boundaries increases and the crystal grain boundaries act significantly as a cause of phase difference generation, especially for high frequency component signals.
硬銅線の場合、軟銅線に比べて繊維状に長手方向に伸び
た結晶の形を呈しているので、長手方向に電流が流れる
際、横切るであろう結晶粒界は見掛け上少ない点より、
結晶粒界の悪影響は受けにくいが、原子空孔(点欠
陥)、転位(線状の結晶欠陥)の密度が、軟銅線に比べ
て極端に多く、電気伝導に不適当な電子密度の不均質な
どが多く、これも高周波成分信号にとって位相差発生の
原因となると考えられる。In the case of a hard copper wire, since it has a shape of a crystal that extends in the longitudinal direction in a fibrous shape compared to an annealed copper wire, when an electric current flows in the longitudinal direction, the crystal grain boundaries that will cross are apparently less than the point.
Although it is not easily affected by crystal grain boundaries, the density of atomic vacancies (point defects) and dislocations (linear crystal defects) is much higher than that of annealed copper wire, and the electron density is inhomogeneous, which is inappropriate for electrical conduction. It is considered that this also causes a phase difference for a high frequency component signal.
(発明の開示) 本発明は、上述の問題点を解決するため成されたもの
で、結晶組織を硬銅のそれに類似させて長手方向に電流
が流れる時通過しなければならない結晶粒界を少なく
し、かつ点欠陥や転位の密度を小さくして電流が流れる
際の位相差の発生を防止し得る画像表示機器、音響機器
用導体を製造する方法を提供せんとするものである。DISCLOSURE OF THE INVENTION The present invention has been made in order to solve the above-mentioned problems, and makes the crystal structure similar to that of hard copper to reduce the number of crystal grain boundaries that must pass when a current flows in the longitudinal direction. The present invention also provides a method for producing a conductor for an image display device and an audio device, which can reduce the density of point defects and dislocations and prevent the occurrence of a phase difference when a current flows.
本発明は、純度99.95%以上の純銅を、鋳造後、冷間加
工後、熱間加工後又は中間焼鈍後、温間加工を施すこと
を特徴とする画像表示機器、音響機器用導体の製造方法
である。The present invention is a pure copper having a purity of 99.95% or higher, after casting, after cold working, after hot working or after intermediate annealing, image display equipment characterized by performing warm working, a method for producing a conductor for audio equipment. Is.
本発明の対象となる導体は、例えばTV、CRT等の画像表
示機器又は例えばステレオ等の音響機器の配線に用いら
れる導体であるが、信号伝達回路用に限定されるもので
はなく、単線、これに錫、半田等のめつきを施した単線
又はこれらの複数本を撚合せた撚線の状態で使用され
る。導体の断面形状は円形、楕円形、四角形、その他の
異形等のいずれでも良い。The conductor to which the present invention is applied is, for example, a conductor used for wiring an image display device such as a TV or CRT or an audio device such as a stereo, but is not limited to a signal transmission circuit, and a single wire, It is used in the state of a single wire plated with tin, solder or the like or a twisted wire formed by twisting a plurality of these wires. The cross-sectional shape of the conductor may be circular, elliptical, quadrangular, or any other irregular shape.
本発明において、純度99.95%以上の純銅としては、無
酸素銅、タフピッチ銅(酸素200〜500ppm)等が用いら
れ、純度99.95%以上と規定したのは、99.95%未満では
点欠隔や転位の密度が減少されにくく、又固溶状態で存
在している不純物が電子密度分布の不均質を招き易いた
めである。In the present invention, as pure copper having a purity of 99.95% or more, oxygen-free copper, tough pitch copper (oxygen 200 to 500 ppm) and the like are used, and the purity of 99.95% or more is defined as less than 99.95% of point gaps and dislocations. This is because the density is less likely to be reduced, and the impurities existing in a solid solution state are likely to cause inhomogeneity in the electron density distribution.
以下、本発明を図面を用いて実施例により説明する。第
1図〜第6図はそれぞれ本発明方法の実施例の製造工程
を示す工程図である。本発明では、温間加工は、鋳造後
(第1図)、熱間加工後(第2図)、冷間加工後(第3,
5図)、中間焼鈍後(第4,6図)行なわれる。Hereinafter, the present invention will be described by way of examples with reference to the drawings. 1 to 6 are process diagrams showing the manufacturing process of an embodiment of the method of the present invention. In the present invention, warm working is performed after casting (Fig. 1), after hot working (Fig. 2), and after cold working (3rd,
(Fig. 5) and after intermediate annealing (Figs. 4 and 6).
本発明において、温間加工は再結晶以下の温度に加熱し
た状態で圧延又は伸線加工することを意味する。実際上
の加工温度は、それまでの冷間加工等、温間加工度、加
工速度等により異なるが、100゜〜300℃、好ましくは15
0゜〜250℃程度が適当である。100℃未満では加工中に
原子空孔濃度や転位密度が増加し、又300℃を越える
と、結晶組織が粒状となり、前述の軟銅線の場合に発生
する問題点を生じる結果となる。本発明の導体は表面に
半導体的な、信号の位相差を生じ易い原因となる銅酸化
物の生成をさけるのが賢明であり、温間加工中、導体の
表面の酸化を防止するため、非酸化性雰囲気で行なわれ
ることが好ましい。In the present invention, warm working means rolling or wire drawing while being heated to a temperature of recrystallization or lower. The actual working temperature varies depending on the cold working, warm working degree, working speed, etc., but is 100 ° to 300 ° C, preferably 15 ° C.
About 0 ° to 250 ° C is suitable. If it is less than 100 ° C., the atomic vacancy concentration and dislocation density increase during processing, and if it exceeds 300 ° C., the crystal structure becomes grainy, resulting in the problem that occurs in the case of the annealed copper wire. The conductor of the present invention is wise to avoid the formation of copper oxide, which is a cause for easily causing a signal phase difference on the surface of the conductor, and prevents the surface of the conductor from being oxidized during warm working. It is preferably carried out in an oxidizing atmosphere.
このような温間における圧延又は伸線加工により、結晶
組織は結晶粒の形状が硬銅に類似した長手方向に平行な
状態となり、かつ結晶中の点欠陥や転位の密度が硬銅よ
り少なくなる。By such warm rolling or wire drawing, the crystal structure is in a state in which the shape of crystal grains is parallel to the longitudinal direction similar to hard copper, and the density of point defects and dislocations in the crystal is less than that of hard copper. .
(実施例) 表1に示す各種銅材料を用い、表1に示す加工方法によ
り0.12mmφの銅線を作成した。(Example) Using various copper materials shown in Table 1, a copper wire having a diameter of 0.12 mm was prepared by the processing method shown in Table 1.
この銅線の11本を撚合せた撚線にポリ塩化ビニルの絶縁
被覆を施し、TVの機内、外の配線用電線として使用し、
画像、音響の鮮明度を100名による評価結果、従来の導
体を用いたものに対比して、80名以上の鮮明との評価を
なしたもについて「画像、音響共鮮明であった」と表示
した。Applying an insulation coating of polyvinyl chloride to the twisted wire made by twisting 11 of this copper wire and using it as an electric wire for wiring inside and outside the TV,
The image and sound clarity was evaluated by 100 people, and compared with the one using the conventional conductor, it was evaluated as clear by more than 80 people. did.
表1により、本発明による導体は、従来例、比較例に比
べ、画像、音響共に鮮明度が優れていることが分る。 From Table 1, it can be seen that the conductor according to the present invention is superior in sharpness in both image and sound as compared with the conventional example and the comparative example.
(発明の効果) 上述のように構成された本発明の画像表示機器、音響機
器用導体の製造方法は次のような効果がある。(Effects of the Invention) The method of manufacturing a conductor for an image display device and an audio device of the present invention configured as described above has the following effects.
(イ)純度99.95%以上の純銅を、鋳造後、冷間加工
後、熱間加工後又は中間焼鈍後、150゜〜250℃の温間に
おける圧延又は伸線を施すので、この温間加工により、
結晶組織は結晶の形状が硬銅に類似した長手方向に平行
の状態となり、信号電流が流れる時通過しなければなら
ない結晶粒界が少なく、かつ結晶中の点欠陥や転位の密
度が硬銅より少なくなるので、画像、音響信号電流が正
確に位相差なく流れるため、画像表示機器の画像が鮮明
で、音響機器の音響が鮮明で美しい音となる導体を製造
し得る。(A) Pure copper with a purity of 99.95% or more is cast, cold-worked, hot-worked or after intermediate annealing, and is subjected to rolling or wire drawing at a temperature of 150 ° to 250 ° C. ,
The crystal structure is similar to that of hard copper in that the shape of the crystal is parallel to the longitudinal direction, there are few crystal grain boundaries that must pass when a signal current flows, and the density of point defects and dislocations in the crystal is higher than that of hard copper. Since the image and acoustic signal currents flow accurately with no phase difference, it is possible to manufacture a conductor in which the image of the image display device is clear and the sound of the audio device is clear and beautiful.
(ロ)特別の材料を使用することなく、又製造も簡単で
容易であるので、導体を工業的に容易に安価に製造し得
る。(B) Since no special material is used and the production is simple and easy, the conductor can be industrially produced easily and inexpensively.
第1図、第2図、第3図、第4図、第5図および第6図
はそれぞれ本発明方法の実施例の製造工程を示す工程図
である。1, FIG. 2, FIG. 3, FIG. 4, FIG. 5, and FIG. 6 are process drawings showing the manufacturing process of the embodiment of the method of the present invention.
Claims (1)
加工後、熱間加工後又は中間焼鈍後、非酸化雰囲気で、
150゜〜250℃にて圧延又は伸線加工を施すことを特徴と
する画像表示機器、音響機器用導体の製造方法。1. Pure copper having a purity of 99.95% or more, after casting, after cold working, after hot working or after intermediate annealing, in a non-oxidizing atmosphere,
A method for producing a conductor for image display equipment and audio equipment, which comprises rolling or drawing at 150 ° to 250 ° C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23329583A JPH0694587B2 (en) | 1983-12-10 | 1983-12-10 | Method for manufacturing conductor for image display device and audio device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23329583A JPH0694587B2 (en) | 1983-12-10 | 1983-12-10 | Method for manufacturing conductor for image display device and audio device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60125358A JPS60125358A (en) | 1985-07-04 |
| JPH0694587B2 true JPH0694587B2 (en) | 1994-11-24 |
Family
ID=16952861
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23329583A Expired - Lifetime JPH0694587B2 (en) | 1983-12-10 | 1983-12-10 | Method for manufacturing conductor for image display device and audio device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0694587B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08958B2 (en) * | 1985-10-16 | 1996-01-10 | 田中電子工業株式会社 | Manufacturing method of finish heat treatment copper wire for bonding of semiconductor element |
| JPH0727729B2 (en) * | 1985-12-10 | 1995-03-29 | 住友電気工業株式会社 | Method for manufacturing conductors for audio / visual equipment |
| JPH08959B2 (en) * | 1988-02-18 | 1996-01-10 | 株式会社ジャパンエナジー | Manufacturing method for audio and image copper wire |
-
1983
- 1983-12-10 JP JP23329583A patent/JPH0694587B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60125358A (en) | 1985-07-04 |
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