JPH0696222B2 - Wire saw wire - Google Patents
Wire saw wireInfo
- Publication number
- JPH0696222B2 JPH0696222B2 JP15547886A JP15547886A JPH0696222B2 JP H0696222 B2 JPH0696222 B2 JP H0696222B2 JP 15547886 A JP15547886 A JP 15547886A JP 15547886 A JP15547886 A JP 15547886A JP H0696222 B2 JPH0696222 B2 JP H0696222B2
- Authority
- JP
- Japan
- Prior art keywords
- wire
- coating
- diamond
- saw
- carbonaceous
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000576 coating method Methods 0.000 claims description 33
- 239000011248 coating agent Substances 0.000 claims description 30
- 229910003460 diamond Inorganic materials 0.000 claims description 19
- 239000010432 diamond Substances 0.000 claims description 19
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 14
- 238000005229 chemical vapour deposition Methods 0.000 claims description 4
- 229910052735 hafnium Inorganic materials 0.000 claims description 3
- 229910052726 zirconium Inorganic materials 0.000 claims description 3
- 229910052804 chromium Inorganic materials 0.000 claims description 2
- 150000002739 metals Chemical class 0.000 claims description 2
- 229910052715 tantalum Inorganic materials 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- 229910052742 iron Inorganic materials 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 230000003287 optical effect Effects 0.000 claims 1
- 239000007789 gas Substances 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910001026 inconel Inorganic materials 0.000 description 2
- 238000007733 ion plating Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910019589 Cr—Fe Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
- B23D61/18—Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
- B23D61/185—Saw wires; Saw cables; Twisted saw strips
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Description
【発明の詳細な説明】 ［産業上の利用分野］ この発明は、半導体単結晶の塊からウエハ状に切出すた
め使用されるワイヤソーに用いられるワイヤに関するも
のである。TECHNICAL FIELD The present invention relates to a wire used in a wire saw used to cut a semiconductor single crystal mass into a wafer.
［従来の技術および発明が解決しようとする問題点］ 従来、ワイヤソー用ワイヤとしては、高い引張強さと靭
性を有する鋼線などが用いられており、たとえばピアノ
線等が用いられている。[Problems to be Solved by Conventional Techniques and Inventions] Conventionally, a steel wire having high tensile strength and toughness has been used as a wire for a wire saw, and for example, a piano wire has been used.
しかしながら、これらの鋼線では、硬度は未だ不十分で
あり、切断速度などの切断特性の改善されたワイヤー用
ワイヤが従来より望まれていた。切断速度を速め、切断
の際生じる摩擦熱を除去するため、アルミナ懸濁液をか
けながらピアノ線等を被加工物に擦りつけて切断するな
どの方法が、従来より試みられているが、このような方
法によっても十分に満足できる切断特性は得られていな
い。However, the hardness of these steel wires is still insufficient, and a wire for a wire having improved cutting characteristics such as cutting speed has been desired. In order to speed up the cutting speed and remove the frictional heat generated during cutting, a method of rubbing a piano wire or the like on the work piece while applying the alumina suspension to cut the work piece has been conventionally attempted. Even with such a method, satisfactory cutting characteristics have not been obtained.
それゆえに、この発明の目的は、切断速度が速く、また
より硬い材質に対しても切断を容易にするワイヤソー用
ワイヤを提供することにある。Therefore, an object of the present invention is to provide a wire for a wire saw that has a high cutting speed and facilitates cutting even for a harder material.
［問題点を解決するための手段］ この発明のワイヤソー用ワイヤは、第１図に示すよう
に、高抗張力を有する金属線の周囲に、ダイヤモンド被
膜またはＣを主成分としダイヤモンドに近似した硬度を
有する炭素質被膜を設けている。第１図において、１は
金属線、２はダイヤモンド被膜または炭素質被膜を示し
ている。炭素質被膜は、Ｃは主成分としダイヤモンドに
近似した硬度を有するもので、たとえばｉ−カーボンと
称されるアモルファス構造の炭素質の被膜が挙げられ
る。[Means for Solving the Problems] As shown in FIG. 1, the wire for a wire saw of the present invention has a diamond coating or a C-based main component having a hardness similar to that of diamond, around a metal wire having high tensile strength. The carbonaceous coating is provided. In FIG. 1, 1 is a metal wire and 2 is a diamond coating or carbonaceous coating. The carbonaceous coating has C as a main component and has a hardness similar to that of diamond, and examples thereof include an amorphous carbonaceous coating called i-carbon.
この発明における高抗張力を有する金属線としては、た
とえばピアノ線、硬鋼線等のFe系や、いわゆるインコネ
ル（Ni−Cr−Fe合金）などのNi系のものが挙げられる。Examples of the metal wire having high tensile strength in the present invention include Fe-based wires such as piano wires and hard steel wires, and Ni-based wires such as so-called Inconel (Ni-Cr-Fe alloy).
金属線とダイヤモンド被膜または炭素質被膜との密着性
が良くない場合には、Ti、Cr、Zr、HfおよびTaからなる
群より選ばれた１種もしくは２種以上の金属を主成分と
する中間層をその間に設けて、第２図に示すような断面
構造のものにすることができる。第２図において、３は
中間層を示している。When the adhesion between the metal wire and the diamond coating or carbonaceous coating is not good, an intermediate containing one or more metals selected from the group consisting of Ti, Cr, Zr, Hf and Ta as the main component Layers can be provided between them to have a cross-sectional structure as shown in FIG. In FIG. 2, 3 indicates an intermediate layer.
［作用］ この発明のワイヤソー用ワイヤは、ダイヤモンド被膜ま
たは炭素質被膜が周囲に設けられているため、その表面
の硬度が高められ、切断特性が著しく改善される。ま
た、これらの被膜は熱伝導性が良好で、連続した被膜で
あるため、切断の際生じる摩擦熱は、これらの被膜によ
って効果的に伝達され除去される。このことから、ワイ
ヤソー用ワイヤの長寿命化を図ることができる。[Operation] Since the wire for wire saw of the present invention is provided with the diamond coating or the carbonaceous coating on the periphery, the hardness of the surface is increased and the cutting characteristics are remarkably improved. Further, since these coatings have good thermal conductivity and are continuous coatings, the frictional heat generated during cutting is effectively transmitted and removed by these coatings. Therefore, the life of the wire for the wire saw can be extended.
また、金属線表面と被膜との間に、中間層を設けた場合
には、金属線と被膜との密着性が向上し、被膜の強度が
さらに高められる。Further, when an intermediate layer is provided between the surface of the metal wire and the coating, the adhesion between the metal wire and the coating is improved, and the strength of the coating is further increased.
［実施例］ 実施例１ ピアノ線にスパッタリング法でTiを0.2μｍの厚みでコ
ーティングして中間層を形成し、その後、エキシマレー
ザ光CVD法により、CH4を原料ガスとしてダイヤモッド被
膜を約１μｍの厚みでコーデイングし、第２図に示すよ
うな構造のワイヤを製造した。[Example] Example 1 A piano wire was coated with Ti to a thickness of 0.2 µm by a sputtering method to form an intermediate layer, and then an excimer laser photo-CVD method was used to form a diamond film of about 1 µm with CH 4 as a source gas. The wire having a structure as shown in FIG. 2 was manufactured by coating the wire with a thickness.
実施例２ ピアノ線にスパッタリング法でZrとHfの混合体を0.3μ
ｍの厚みでコーティングして中間層を形成し、次にこの
中間層の表面をダイヤモンド微粉末を使用して研磨した
後、エキシマレーザ光CVD法により、CH4を原料ガスとし
てダイヤモンド被膜を約1.2μｍの厚みでコーティング
して、第２図に示すように構造のワイヤを製造した。Example 2 0.3 μ of a mixture of Zr and Hf was applied to a piano wire by a sputtering method.
After coating with a thickness of m to form an intermediate layer, and then polishing the surface of this intermediate layer with fine diamond powder, a diamond coating is prepared by excimer laser photo CVD using CH 4 as a source gas to a thickness of about 1.2. A wire having a structure shown in FIG. 2 was manufactured by coating with a thickness of μm.
実施例３ インコネル線にスパッタリング法でTaを0.1μｍの厚み
でコーティングして中間層を形成し、マイクロ波（2450
MHz）プラズマCVD法により、CH4、H2を原料ガスとし
て、ダイヤモンド被膜を約0.8μｍの厚みでコーティン
グし、第２図に示すような構造のワイヤを製造した。Example 3 An Inconel wire was coated with Ta to a thickness of 0.1 μm by a sputtering method to form an intermediate layer, and the microwave (2450
MHz) plasma CVD method using CH 4 and H 2 as raw material gases to coat a diamond film with a thickness of about 0.8 μm to manufacture a wire having a structure shown in FIG.
実施例４ ピアノ線にイオンプレーティング法でCrを0.1μｍの厚
みでコーティングして中間層を形成し、次に高周波（1
3.56MHz）イオンプレーティング法によりC2H4を原料に
して、一般にｉ−カーボンと称される炭素質被膜を１μ
ｍの厚みでコーティングし、第２図に示すような構造の
ワイヤを製造した。Example 4 A piano wire was coated with Cr by an ion plating method to a thickness of 0.1 μm to form an intermediate layer, and then a high frequency wave (1
And the C 2 H 4 as a raw material by 3.56MHz) ion plating method, generally i- carbon called carbonaceous coating 1μ
A wire having a structure as shown in FIG. 2 was manufactured by coating with a thickness of m.
実施例５ ピアノ線に、直接エキシマレーザ光CVD法により、CH4を
原料ガスとして、ダイヤモンド被膜を約１μｍの厚みで
コーティングし、第１図に示すような構造のワイヤを製
造した。Example 5 A piano wire was directly coated with a diamond film with a thickness of about 1 μm using CH 4 as a raw material gas by a direct excimer laser light CVD method to manufacture a wire having a structure shown in FIG.
以上の実施例１〜５で得られたワイヤを、ワイヤソーと
して、GaAs単結晶を切断し、使用テストを行なった。な
お、比較としてピアノ線のままのものをワイヤーとして
用い、使用テストを行なった（比較例）。使用テストの
結果を第１表に示す。Using the wires obtained in the above Examples 1 to 5 as a wire saw, a GaAs single crystal was cut and a usage test was conducted. As a comparison, a piano wire was used as a wire and a usage test was performed (comparative example). The results of the usage test are shown in Table 1.
第１表の結果から明らかなように、この発明の実施例１
〜５をワイヤソーとして用いると、比較例に比べて、切
断速度が速く、また使用の寿命が長くなることが確認さ
れた。 As is clear from the results shown in Table 1, Example 1 of the present invention
It was confirmed that when ~ 5 is used as the wire saw, the cutting speed is faster and the service life is longer than that of the comparative example.
［発明の効果］ 以上説明したように、この発明のワイヤソー用ワイヤに
は、高い硬度を有するダイヤモンド被膜または炭素質被
膜が設けられているため、従来のワイヤソー用ワイヤに
比べ、耐摩耗性に優れている。したがって、切断速度を
著しく速くすることができ、また被加工物への機械的な
歪の導入を抑制することができる。さらに、この発明に
おいて金属線の表面に設けられるダイヤモンド被膜およ
び炭素質被膜は、熱伝導性が優れているため、切断の際
生じる摩擦熱が該被膜によって速やかに除去される。こ
れにより、ワイヤ自身の長寿命化を図ることができ、さ
らに被加工物への熱的な影響を抑制することができる。[Effects of the Invention] As described above, the wire for a wire saw of the present invention is provided with a diamond coating or a carbonaceous coating having a high hardness, and thus has excellent wear resistance as compared with a conventional wire for a wire saw. ing. Therefore, the cutting speed can be significantly increased, and the introduction of mechanical strain into the workpiece can be suppressed. Further, in the present invention, the diamond coating and the carbonaceous coating provided on the surface of the metal wire have excellent thermal conductivity, so that frictional heat generated during cutting is quickly removed by the coating. As a result, the life of the wire itself can be extended and the thermal effect on the workpiece can be suppressed.
実施例のようにエキシマレーザ光CVD法を用いてダイヤ
モンド被膜または炭素質被膜を形成すると、被膜の生成
温度を低くすることができるため、基材となる高抗張力
金属線の強度を下げることなく被膜を形成させることが
できる。さらに、このようにして製造されたワイヤは切
断の際高い張力で使用することができるため、切断加工
の精度を一段と高めることができる。When a diamond film or a carbonaceous film is formed by using the excimer laser photo-CVD method as in the example, the temperature at which the film is formed can be lowered, so that the film can be formed without lowering the strength of the high tensile strength metal wire as the base material Can be formed. Furthermore, since the wire manufactured in this way can be used with high tension during cutting, the accuracy of cutting can be further improved.
第１図は、この発明の一実施例を示す断面図である。第
２図は、この発明の他の実施例を示す断面図である。 図において、１は金属線、２はダイヤモンド被膜または
炭素質被膜、３は中間層を示す。FIG. 1 is a sectional view showing an embodiment of the present invention. FIG. 2 is a sectional view showing another embodiment of the present invention. In the figure, 1 is a metal wire, 2 is a diamond coating or carbonaceous coating, and 3 is an intermediate layer.
Claims (4)
モンド被膜またはＣを主成分としダイヤモンドに近似し
た硬度を有する炭素質被膜が設けられていることを特徴
とする、ワイヤソー用ワイヤ。1. A wire for a wire saw, characterized in that a diamond coating or a carbonaceous coating containing C as a main component and having a hardness similar to diamond is provided around a metal wire having a high tensile strength.
金属線の表面と前記ダイヤモンド被膜または炭素質被膜
との間に、Ti、Cr、Zr、HfおよびTaからなる群より選ば
れた１種もしくは２種以上の金属を主成分とする中間層
が設けられていることを特徴とする、特許請求の範囲第
１項記載のワイヤソー用ワイヤ。2. The metal wire contains Fe or Ni as a main component, and is selected from the group consisting of Ti, Cr, Zr, Hf and Ta between the surface of the metal wire and the diamond coating or carbonaceous coating. The wire for a wire saw according to claim 1, further comprising an intermediate layer containing one or more metals as a main component.
とを特徴とする、特許請求の範囲第２項記載のワイヤソ
ー用ワイヤ。3. The wire for a wire saw according to claim 2, wherein the intermediate layer has a thickness of 0.05 to 1 μm.
が、エキシマレーザによる光CVD法により形成されたも
のであることを特徴とする、特許請求の範囲第1,2また
は３項のいずれかに記載のワイヤソー用ワイヤ。4. The diamond film or the carbonaceous film is formed by an optical CVD method using an excimer laser, according to any one of claims 1, 2 and 3. Wire for wire saw.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15547886A JPH0696222B2 (en) | 1986-07-01 | 1986-07-01 | Wire saw wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15547886A JPH0696222B2 (en) | 1986-07-01 | 1986-07-01 | Wire saw wire |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6311274A JPS6311274A (en) | 1988-01-18 |
| JPH0696222B2 true JPH0696222B2 (en) | 1994-11-30 |
Family
ID=15606927
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15547886A Expired - Lifetime JPH0696222B2 (en) | 1986-07-01 | 1986-07-01 | Wire saw wire |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0696222B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| IT1391254B1 (en) * | 2008-10-16 | 2011-12-01 | Noor S R L | PERFECTED DIAMOND WIRE |
| EP2586557A1 (en) * | 2011-10-26 | 2013-05-01 | Applied Materials Switzerland Sàrl | Saw and sawing element with diamond coating and method for producing the same |
| JP2022189632A (en) * | 2021-06-11 | 2022-12-22 | パナソニックＩｐマネジメント株式会社 | Electrodeposition wire and metal wire for saw wire, and manufacturing method of electrodeposition wire for saw wire |
-
1986
- 1986-07-01 JP JP15547886A patent/JPH0696222B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6311274A (en) | 1988-01-18 |
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