JPH07100877B2 - Amorphous iron-tungsten alloy coating electrodeposition method - Google Patents
Amorphous iron-tungsten alloy coating electrodeposition methodInfo
- Publication number
- JPH07100877B2 JPH07100877B2 JP7806889A JP7806889A JPH07100877B2 JP H07100877 B2 JPH07100877 B2 JP H07100877B2 JP 7806889 A JP7806889 A JP 7806889A JP 7806889 A JP7806889 A JP 7806889A JP H07100877 B2 JPH07100877 B2 JP H07100877B2
- Authority
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- Japan
- Prior art keywords
- plating
- tungsten
- iron
- film
- amorphous
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、非晶質鉄−タングステン合金皮膜の電析方法
に関する。The present invention relates to a method for depositing an amorphous iron-tungsten alloy coating.
タングステンは、水溶液中から単独では電析し得ない
が、鉄族金属と共析することができる誘起共析型金属で
あることが知られており、従来から種々の鉄−タングス
テン合金めっき方法が提案されている。Tungsten cannot be electrodeposited alone from an aqueous solution, but it is known that it is an induced eutectoid metal that can be co-deposited with an iron group metal, and various iron-tungsten alloy plating methods have been conventionally used. Proposed.
しかし、従来の鉄−タングステン合金めっき方法により
得られるめっき皮膜は結晶構造のものが多く、耐食性等
の面から非晶質の鉄−タングステン合金めっき皮膜が望
まれるが、従来、かかる非晶質構造の鉄−タングステン
合金皮膜を工業的に電析し得る方法についての提案は少
ない。However, many of the plating films obtained by the conventional iron-tungsten alloy plating method have a crystalline structure, and an amorphous iron-tungsten alloy plating film is desired from the viewpoint of corrosion resistance and the like. There are few proposals for a method capable of industrially electrodepositing the iron-tungsten alloy coating.
また、特に従来報告されている鉄−タングステン合金め
っきは、浴温度が約80℃としているものが多く、作業性
等の点で難点がある。Further, in particular, many of the iron-tungsten alloy platings that have been conventionally reported have a bath temperature of about 80 ° C., which is problematic in terms of workability and the like.
本発明は上記事情に鑑みなされたもので、非晶質鉄−タ
ングステン合金皮膜を確実にしかも工業的有利に電析す
る方法を提供することを目的とする。The present invention has been made in view of the above circumstances, and an object thereof is to provide a method for reliably and industrially electrodepositing an amorphous iron-tungsten alloy coating.
〔課題を解決するための手段及び作用〕 本発明者らは、上記目的を達成するため種々検討を行な
った結果、水溶性第1鉄塩と水溶性タングステン酸塩と
の水溶性酒石酸塩とを含有し、タングステンと鉄との合
計量に対しタングステンを20モル%以上含有する弱アル
カリ性のめっき浴を使用し、被めっき物を浴温度50℃以
下で電気めっきして、タングステン含有量が40重量%以
上の鉄−タングステン合金めっき皮膜を得ることによ
り、非晶質化が達成されると共に、かかる非晶質鉄−タ
ングステン合金めっき皮膜が高い耐食性を有し、また上
記方法はめっき温度が低いので、コストメリットが大き
く、実用性の高いものであることを知見したものであ
る。[Means and Actions for Solving the Problem] As a result of various studies to achieve the above-mentioned object, the present inventors have found that a water-soluble tartrate salt of a water-soluble ferrous salt and a water-soluble tungstate salt is obtained. Contained, and using a weak alkaline plating bath containing 20 mol% or more of tungsten relative to the total amount of tungsten and iron, the object to be plated is electroplated at a bath temperature of 50 ° C or less, and the tungsten content is 40% by weight. % Of the iron-tungsten alloy plating film achieves amorphization, the amorphous iron-tungsten alloy plating film has high corrosion resistance, and the above method has a low plating temperature. It was found that the cost merit is large and the practicability is high.
以下、本発明につき更に詳述する。Hereinafter, the present invention will be described in more detail.
本発明方法において使用するめっき浴は、上述したよう
に水溶性第1鉄塩と水溶性タングステン酸塩と錯化剤と
しての水溶性酒石酸塩とを含有し、タングステンと鉄と
の合計量に対しタングステンを20モル%以上含有する弱
アルカリ性のめっき浴とするものであり、かかるめっき
浴を用いてタングステン量が40重量%以上の鉄−タング
ステン合金めっき皮膜を得るものである。As described above, the plating bath used in the method of the present invention contains the water-soluble ferrous salt, the water-soluble tungstate and the water-soluble tartrate as a complexing agent, and the total amount of tungsten and iron is A weak alkaline plating bath containing 20 mol% or more of tungsten is used to obtain an iron-tungsten alloy plating film having a tungsten content of 40% by weight or more.
ここで、水溶性第1鉄塩としては、従来から鉄−タング
ステン合金めっきに用いられる硫酸第1鉄が使用され、
水溶性タングステン酸塩としては、タングステン酸ナト
リウム等のタングステン酸アルカリ金属塩が使用され、
水溶性酒石塩としては、酒石酸アルミニウム、酒石酸ナ
トリウム、酒石酸カリウム、酒石酸ナトリウムカリウム
が使用される。Here, as the water-soluble ferrous iron salt, ferrous sulfate conventionally used for iron-tungsten alloy plating is used,
As the water-soluble tungstate, an alkali metal tungstate such as sodium tungstate is used,
As the water-soluble tartrate salt, aluminum tartrate, sodium tartrate, potassium tartrate and sodium potassium tartrate are used.
上記成分の濃度は、目的とするめっき皮膜組成に応じて
選定され、この場合めっき浴量のタングステン量が多く
なる程、めっき皮膜中のタングステン量が多くなるもの
であるが、本発明においては、非晶質化の点からめっき
皮膜中のタングステン量が40%以上になるようにめっき
浴組成を選定する。従って、かかる点から本発明のめっ
き浴は、浴中のタングステン量が鉄とタングステンとの
合計量に対して20モル%以上、より好ましくは26モル%
以上、更に好ましくは30モル%以上とされ、従って水溶
性第1鉄塩、水溶性タングステン酸塩はW/W+Feが上記
モル濃度になるようにその濃度が選定される。この場
合、水溶性第1鉄塩の濃度は1.8g/l〜36g/l(0.13モル/
l)、水溶性タングステン酸塩の濃度は4g/l〜43g/l(0.
13モル%/l)とするのがよいが、電流効率の点から水溶
性第1鉄塩9g/l以上であることがより好ましい。また、
溶液中の全金属塩と錯化剤との関係は、金属の錯構造と
電着合金の性質からみて、一般に水溶性酒石酸塩が、水
溶性第1鉄塩と水溶性タングステン酸塩との合計モル量
に対し等価となるようにすることが好ましく、通常48g/
l(0.26モル%/l)以下とされる。The concentrations of the above components are selected according to the intended plating film composition, and in this case, as the amount of tungsten in the plating bath increases, the amount of tungsten in the plating film increases, but in the present invention, From the viewpoint of amorphization, the composition of the plating bath is selected so that the amount of tungsten in the plating film is 40% or more. Therefore, from such a point, the plating bath of the present invention, the amount of tungsten in the bath is 20 mol% or more, more preferably 26 mol% with respect to the total amount of iron and tungsten.
As described above, the content is more preferably 30 mol% or more. Therefore, the concentrations of the water-soluble ferrous salt and the water-soluble tungstate are selected so that W / W + Fe has the above-mentioned molar concentration. In this case, the concentration of the water-soluble ferrous salt is 1.8 g / l to 36 g / l (0.13 mol / l
l), the concentration of water-soluble tungstate is 4g / l ~ 43g / l (0.
13 mol% / l) is preferable, but 9 g / l or more of the water-soluble ferrous salt is more preferable from the viewpoint of current efficiency. Also,
The relationship between the total metal salt in the solution and the complexing agent is that the water-soluble tartrate is generally the sum of the water-soluble ferrous salt and the water-soluble tungstate in view of the metal complex structure and the properties of the electrodeposited alloy. It is preferable to be equivalent to the molar amount, usually 48 g /
l (0.26 mol% / l) or less.
また、本発明のめっき浴は、pH7〜9の弱アルカリ性に
調整される。Further, the plating bath of the present invention is adjusted to be weakly alkaline with a pH of 7-9.
上記めっき浴を用いて適宜な被めっき物に電気めっきを
行なう場合、めっき温度は50℃以下、より好ましくは40
℃以下とするものであり、本発明においては30℃以下の
室温でも十分めっきが可能である。陰極電流密度は、め
っき温度が40℃以下であれば2〜20A/dm2のいずれの陰
極電流密度でも非晶質皮膜を得ることができるが、それ
以上のめっき温度では3A/dm2以上、特に5A/dm2以上の電
流密度とすることが非晶質化の点から好適に採用され
る。When electroplating an appropriate object to be plated using the plating bath, the plating temperature is 50 ° C or lower, more preferably 40 ° C.
In the present invention, sufficient plating can be performed at room temperature of 30 ° C or lower. The cathode current density can be obtained as an amorphous film at any cathode current density of 2 to 20 A / dm 2 if the plating temperature is 40 ° C. or lower, but at a plating temperature higher than that, 3 A / dm 2 or more, In particular, a current density of 5 A / dm 2 or more is preferably adopted from the viewpoint of amorphization.
なお、撹拌は無撹拌でもよいが、スターラー等で撹拌す
ることが好ましく、また、陽極は通常白金めっきチタン
網等の不溶性陽極が用いられるが、鉄陽極を用いること
も可能である。The stirring may be unstirred, but it is preferable to stir with a stirrer or the like, and an insoluble anode such as a platinum-plated titanium mesh is usually used as the anode, but an iron anode can also be used.
次に実施例により本発明を更に具体的に説明する。Next, the present invention will be described more specifically by way of examples.
めっき浴としてFeSO4・7H2O,Na2WO4・2H2O,(NH4)2C4
H4O6を下記濃度で使用し、pH3〜8,めっき温度28〜80
℃、陰極電流密度2〜20A/dm2でめっきを行なった。FeSO 4 · 7H 2 O as a plating bath, Na 2 WO 4 · 2H 2 O, (NH 4) 2 C 4
Using H 4 O 6 at the following concentrations, pH 3 to 8, plating temperature 28 to 80
Plating was performed at a temperature of 2 ° C. and a cathode current density of 2 to 20 A / dm 2 .
なお、電解槽としては500mlのガラス製円筒容器を用
い、陽極は白金めっきチタン網(95×65mm)とし、陰極
(被めっき物)は円形銅板(6cm2×0.3t)を脱脂、酸
洗して用いた。In addition, a 500 ml glass cylindrical container was used as the electrolytic cell, a platinum plated titanium mesh (95 x 65 mm) was used as the anode, and a circular copper plate (6 cm 2 x 0.3 t ) was degreased and pickled as the cathode (plating object). Used.
なおまた、非晶質構造の判定にはX線回折法を用い、電
着膜中のFe,Mo及びWはプラズマ発光分析法と蛍光X線
法を併用した。皮膜構造はAESを用いて構成成分の分布
状態を求めた。電析膜の電気化学的挙動は北斗電工製自
動分極測定装置を用いた。The X-ray diffraction method was used for the determination of the amorphous structure, and the plasma emission analysis method and the fluorescent X-ray method were used together for Fe, Mo and W in the electrodeposited film. For the film structure, the distribution of constituents was determined using AES. For the electrochemical behavior of the electrodeposited film, an automatic polarization measuring device manufactured by Hokuto Denko was used.
(1)Fe−W合金皮膜の非晶質化に及ぼすめっき皮膜中
のW比率の影響 下記組成 FeSO4・7H2O 36g/l Na2WO4・2H2O 第1図に示す量 (NH4)2C4H4O6 48g/l pH 8 のめっき浴を使用し、めっき温度28℃において種々の陰
極電流密度でめっきを行ない、得られためっき皮膜の組
成を分析すると共に、それが非晶質であるか否かを評価
した。結果を第1図に示す。(1) Fe-W amounts indicated effects following composition FeSO 4 · 7H 2 O 36g / l Na 2 WO 4 · 2H 2 O first diagram W ratio in the plating film on the amorphous alloy film (NH 4 ) 2 C 4 H 4 O 6 48 g / l pH 8 plating bath was used, plating was performed at various cathode current densities at a plating temperature of 28 ° C, and the composition of the obtained plating film was analyzed. It was evaluated whether or not it was amorphous. The results are shown in Fig. 1.
第1図の結果より、Fe−W合金の皮膜中のW量が40重量
%以上である場合、非晶質皮膜が得られることが認めら
れた。From the results shown in FIG. 1, it was confirmed that when the W content in the Fe—W alloy coating was 40% by weight or more, an amorphous coating was obtained.
(2)Fe−W合金皮膜の非晶質化に及ぼすめっき浴中の
W比率の影響 下記組成 FeSO4・7H2O 36g/l Na2WO4・2H2O Wとして第2図に示す量 (NH4)2C4H4O6 48g/l pH 8 のめっき浴を使用し、めっき温度28℃において8A/dm2で
めっきを行ない、得られためっき皮膜の組成を分析する
と共に、それが非晶質であるか否かを評価した。結果を
第2図に示す。(2) the amount shown in FIG. 2 as Fe-W W ratio of impact following composition FeSO 4 · 7H 2 O 36g / l Na 2 WO 4 · 2H 2 O W in the plating bath on the amorphous alloy film (NH 4 ) 2 C 4 H 4 O 6 48 g / l pH 8 plating bath was used, plating was performed at 8 A / dm 2 at a plating temperature of 28 ° C, and the composition of the obtained plating film was analyzed and It was evaluated whether or not was amorphous. Results are shown in FIG.
第2図の結果より、めっき浴中のW量がW+Fe量の20モ
ル%以上であればW量が40重量%以上のFe−W合金皮膜
が得られ、非晶質皮膜を形成し得ることが認められた。From the results shown in FIG. 2, it is found that if the W content in the plating bath is 20 mol% or more of the W + Fe content, a Fe-W alloy film having a W content of 40% by weight or more can be obtained and an amorphous film can be formed. Was recognized.
なお、第3図に浴中のW/Fe+Wと電流密度との関係を示
す。The relationship between W / Fe + W in the bath and the current density is shown in FIG.
(3)Fe−W合金皮膜の非晶質化に及ぼすpHの影響 下記組成 FeSO4・7H2O 36g/l Na2WO4・2H2O 43 〃 (NH4)2C4H4O6 48 〃 のめっき浴を使用し、pHを変化させて、めっき温度28
℃、陰極電流密度2A/dm2、4A/dm2でめっきを行ない、得
られためっき皮膜の組成を分析すると共に、それが非晶
質であるか否かを評価した。結果を第4図に示す。(3) Fe-W Effect of pH on the amorphous alloy film following composition FeSO 4 · 7H 2 O 36g / l Na 2 WO 4 · 2H 2 O 43 〃 (NH 4) 2 C 4 H 4 O 6 Use a plating bath of 48〃 and change the pH to a plating temperature of 28
Plating was performed at a temperature of 2 ° C. and a cathode current density of 2 A / dm 2 and 4 A / dm 2 , and the composition of the obtained plating film was analyzed, and whether or not it was amorphous was evaluated. Results are shown in FIG.
第4図の結果より、めっき浴のpHが7〜9の弱アルカリ
性である場合、非晶質皮膜が得られることが認められ
た。From the results shown in FIG. 4, it was confirmed that an amorphous film was obtained when the pH of the plating bath was weakly alkaline from 7 to 9.
(4)Fe−W合金皮膜の非晶質化に及ぼすめっき温度の
影響 下記組成 FeSO4・7H2O 36g/l Na2WO4・2H2O 43〃 (NH4)2C4H4O6 48〃 pH 8 のめっき浴を使用し、めっき温度と陰極電流密度を変化
させてめっきを行ない、得られためっき皮膜が非晶質で
あるか否かを評価した。結果を第5図に示す。(4) Fe-W Effect of Plating Temperature on amorphous alloy film following composition FeSO 4 · 7H 2 O 36g / l Na 2 WO 4 · 2H 2 O 43〃 (NH 4) 2 C 4 H 4 O 6 A plating bath of 48 〃 pH 8 was used, plating was performed while changing the plating temperature and the cathode current density, and it was evaluated whether or not the obtained plating film was amorphous. Results are shown in FIG.
第5図の結果より、めっき温度が40℃以下の場合はいず
れの電流密度でも非晶質皮膜が得られ、また50℃では3
〜4A/dm2、特に5A/dm2以上において非晶質皮膜が得られ
ることが認められた。From the results shown in Fig. 5, an amorphous film was obtained at any current density when the plating temperature was 40 ° C or lower, and 3 at 50 ° C.
It was confirmed that an amorphous film was obtained at ˜4 A / dm 2 , especially at 5 A / dm 2 or more.
(5)Fe−W合金皮膜の耐食性 W量が28重量%,37重量%,49重量%のFe−W合金めっき
皮膜を1規定塩酸溶液中に30℃において浸漬し、アノー
ド分極曲線を求めた。結果を第6図に示す。(5) Corrosion resistance of Fe-W alloy coatings Fe-W alloy plating coatings with W contents of 28% by weight, 37% by weight and 49% by weight were immersed in a 1N hydrochloric acid solution at 30 ° C to determine the anode polarization curve. . Results are shown in FIG.
第6図の結果より、W量が49重量%の非晶質Fe−W合金
めっき皮膜が良好な耐食性を有していることが認められ
た。From the results shown in FIG. 6, it was confirmed that the amorphous Fe-W alloy plating film having a W content of 49% by weight had good corrosion resistance.
本発明によれば、非晶質で耐食性の優れた鉄−タングス
テン合金めっき皮膜を確実にかつ工業的有利に電析する
ことができる。According to the present invention, an iron-tungsten alloy plating film that is amorphous and has excellent corrosion resistance can be electrodeposited reliably and industrially.
第1図はFe−W合金皮膜中のW量と該皮膜の非晶質化の
関係を示すグラフ、第2図はFe−W合金めっき浴中のW
量とFe−W合金皮膜中のW量と該皮膜の非晶質化の関係
を示すグラフ、第3図はめっき浴中のW/Fe+Wと電流密
度との関係を示すグラフ、第4図はめっき浴のpHとFe−
W合金皮膜の非晶質化の関係を示すグラフ、第5図はめ
っき温度とFe−W合金皮膜の非晶質化の関係を示すグラ
フ、第6図は各種Fe−W合金めっき皮膜の1規定塩酸中
でのアノード分極曲線を示す。Fig. 1 is a graph showing the relationship between the amount of W in the Fe-W alloy coating and the amorphization of the coating, and Fig. 2 is the W in the Fe-W alloy plating bath.
Amount and the amount of W in the Fe-W alloy film and the relationship between the amorphization of the film, FIG. 3 is a graph showing the relationship between W / Fe + W in the plating bath and the current density, and FIG. 4 is Plating bath pH and Fe-
FIG. 5 is a graph showing the relationship between the amorphization of the W alloy film, FIG. 5 is a graph showing the relationship between the plating temperature and the amorphization of the Fe—W alloy film, and FIG. 6 is a graph of various Fe—W alloy plating films. The anodic polarization curve in normal hydrochloric acid is shown.
Claims (1)
と水溶性酒石酸塩とを含有し、タングステンと鉄との合
計量に対しタングステンを20モル%以上含有する弱アル
カリ性のめっき浴を使用し、被めっき物を浴温度50℃以
下で電気めっきして、タングステン量40重量%以上の鉄
−タングステン合金めっき皮膜を得ることを特徴とする
非晶質鉄−タングステン合金皮膜の電析方法。1. A weakly alkaline plating bath containing a water-soluble ferrous salt, a water-soluble tungstate salt and a water-soluble tartrate salt, and containing 20 mol% or more of tungsten with respect to the total amount of tungsten and iron. A method for electrodepositing an amorphous iron-tungsten alloy coating, characterized in that an object to be plated is electroplated at a bath temperature of 50 ° C. or lower to obtain an iron-tungsten alloy coating with a tungsten content of 40% by weight or more. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7806889A JPH07100877B2 (en) | 1989-03-31 | 1989-03-31 | Amorphous iron-tungsten alloy coating electrodeposition method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7806889A JPH07100877B2 (en) | 1989-03-31 | 1989-03-31 | Amorphous iron-tungsten alloy coating electrodeposition method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02258994A JPH02258994A (en) | 1990-10-19 |
| JPH07100877B2 true JPH07100877B2 (en) | 1995-11-01 |
Family
ID=13651529
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7806889A Expired - Lifetime JPH07100877B2 (en) | 1989-03-31 | 1989-03-31 | Amorphous iron-tungsten alloy coating electrodeposition method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07100877B2 (en) |
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|---|---|---|---|---|
| JP4579706B2 (en) * | 2005-02-02 | 2010-11-10 | 株式会社野村鍍金 | Articles with improved zinc erosion resistance |
| US11208731B2 (en) | 2017-06-09 | 2021-12-28 | The Boeing Company | Iron tungsten coating formulations and processes |
-
1989
- 1989-03-31 JP JP7806889A patent/JPH07100877B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02258994A (en) | 1990-10-19 |
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